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AMD Details Embedded Product Roadmap

Verfasst vonDr@
AMD extends ambi­dex­trous stra­tegy to embedded cus­to­mers beco­ming the first to offer choice of ARM or x86 SoC, APU or CPU opti­ons cou­pled with indus­try-lea­ding AMD Rade­on graphics


SUNNYVALE, Calif. —9/9/2013 

AMD (NYSE: AMD) today dis­c­lo­sed its road­map for the fast-gro­wing embedded com­pu­ting mar­ket, as it beco­mes the first com­pa­ny to offer both ARM and x86 pro­ces­sor solu­ti­ons for low-power and high-per­for­mance embedded com­pu­te designs. The new lin­e­up includes two best-in-class x86 acce­le­ra­ted pro­ces­sing units (APUs) and cen­tral pro­ces­sing units (CPUs), a first look at a high-per­for­mance ARM sys­tem-on-chip (SoC) and a new fami­ly of dis­crete AMD Embedded Rade­on™ gra­phics pro­ces­sing units (GPUs) expec­ted to launch in 2014. The­se addi­ti­ons pro­vi­de the embedded industry’s engi­nee­ring com­mu­ni­ty with more choices to match their exact design needs, and are desi­gned to offer impro­ve­ments in per­for­mance-per-watt and per­for­mance-per-dol­lar. Tog­e­ther with the recent launch of the award-win­ning AMD Embedded G‑Series SoC fami­ly that set a supe­ri­or  bar for per­for­mance-per-watt low-power mul­ti­co­re APUs, the­se latest addi­ti­ons to the embedded pro­duct road­map fur­ther signi­fy a stra­te­gic push by AMD to focus on the high-growth embedded market.

The embedded sys­tems mar­ket is vast and forms the under­pin­ning for the Sur­round Com­pu­ting era. This mar­ket is com­pri­sed of dif­fe­rent seg­ments of which intel­li­gent embedded devices – tho­se enab­led with high-per­for­mance micro­pro­ces­sors, IP con­nec­ti­vi­ty, and high-level ope­ra­ting sys­tems – are quick­ly beco­ming the most signi­fi­cant. A recent VDC Rese­arch report indi­ca­tes the mar­ket for CPUs in tra­di­tio­nal and intel­li­gent embedded sys­tems will grow 36 per­cent from rough­ly 330 mil­li­on units in 2013 to more than 450 mil­li­on units by 2016 with x86 and ARM archi­tec­tures accoun­ting for 82 per­cent of the total addressa­ble mar­ket (TAM)1.

“AMD is com­mit­ted to pro­vi­ding the embedded com­mu­ni­ty with the solu­ti­ons requi­red to suc­ceed in today’s trans­for­ma­ti­ve mar­ket as it con­ti­nues to expand at an unpre­ce­den­ted rate,” said Arun Iyen­gar, vice pre­si­dent and gene­ral mana­ger, AMD Embedded Solu­ti­ons. “The­re are dif­fe­rent cus­to­mer needs in dif­fe­rent seg­ments of this mar­ket — from low-power to high-per­for­mance, Linux to Win­dows, x86 to ARM — and now with our upco­ming pro­duct port­fo­lio, we are addres­sing them by pro­vi­ding embedded design engi­neers with a ran­ge of solu­ti­ons backed by our embedded lon­ge­vi­ty pro­gram for sup­p­ly sta­bi­li­ty assu­rance to fit their every need.”

“The unpre­ce­den­ted rise of intel­li­gent con­nec­ted solu­ti­ons over the next seve­ral years will requi­re a myri­ad of ultra low-power to ultra high-per­for­mance solu­ti­ons con­nec­ting devices to the cloud,” said Jim McGre­gor, Prin­ci­pal Ana­lyst with TIRIAS Rese­arch. “With their new road­map, AMD lever­a­ges both ARM and x86 com­pu­ting and gra­phics archi­tec­tures to ful­fill the company’s visi­on of crea­ting an ambi­dex­trous eco­sys­tem. The cur­rent pro­ducts com­bi­ned with the new road­map offer pri­ce, per­for­mance and power opti­ons to meet the needs of embedded designers.”

2014 AMD Embedded Roadmap

In 2014, AMD  plans to bring to mar­ket two new high-per­for­mance AMD Embedded R‑Series pro­ces­sor fami­lies: the “Hier­ofal­con” CPU SoC fami­ly based on the ARM Cortex™-A57 archi­tec­tu­re and the “Bald Eagle” APU and CPU offe­ring based on the x86 micro­pro­ces­sor archi­tec­tu­re code­na­med “Steam­rol­ler.” The upco­ming “Step­pe Eagle” APU SoC is desi­gned to pro­vi­de impro­ved per­for­mance while exten­ding the low-power cha­rac­te­ristics of the cur­rent AMD Embedded G‑Series SoC fami­ly. In addi­ti­on, “Adel­a­ar” will bring to mar­ket the first dis­crete GPU based on AMD Gra­phics Core Next archi­tec­tu­re for embedded systems.

“Hierofalcon” CPU SoC

“Hier­ofal­con” is the first 64-bit ARM-based plat­form from AMD tar­ge­ting embedded data cen­ter appli­ca­ti­ons, com­mu­ni­ca­ti­ons infra­struc­tu­re and indus­tri­al solu­ti­ons. It will include up to eight ARM Cortex™-A57 CPUs expec­ted to run up to 2.0 GHz, and pro­vi­des high-per­for­mance memo­ry with two 64-bit DDR3/4 chan­nels with error cor­rec­tion code (ECC) for high relia­bi­li­ty appli­ca­ti­ons. The high­ly inte­gra­ted SoC includes 10 Gb KR Ether­net and PCI-Express Gen 3 for high-speed net­work con­nec­ti­vi­ty, making it ide­al for con­trol pla­ne appli­ca­ti­ons. The “Hier­ofal­con” series also pro­vi­des enhan­ced secu­ri­ty with sup­port for ARM Trust­Zo­ne® tech­no­lo­gy and a dedi­ca­ted cryp­to­gra­phic secu­ri­ty co-pro­ces­sor, alig­ning to the increased need for net­work­ed, secu­re sys­tems. “Hier­ofal­con” is expec­ted to be sam­pling in the second quar­ter of 2014 with pro­duc­tion in the second half of the year.

“Bald Eagle” APU/CPU

With “Bald Eagle,” AMD con­ti­nues to build on its heri­ta­ge as a lea­ding pro­vi­der of x86 solu­ti­ons for the embedded mar­ket. “Bald Eagle” is the next gene­ra­ti­on high-per­for­mance x86-based embedded pro­ces­sor available as both an APU and CPU fea­turing up to four new “Steam­rol­ler” CPU cores within a 35W TDP. The APU pro­ducts will pro­vi­de the new power-opti­mi­zed AMD Rade­on™ Gra­phics Core Next GPU archi­tec­tu­re and HSA enhance­ments for high-per­for­mance embedded appli­ca­ti­ons, making it a supe­ri­or solu­ti­on for next-gene­ra­ti­on digi­tal signage and embedded digi­tal gam­ing. The “Bald Eagle” fami­ly will also intro­du­ce new power manage­ment fea­tures, such as con­fi­gura­ble TDP, allo­wing engi­neers more design fle­xi­bi­li­ty. “Bald Eagle” is expec­ted to be available in the first half of 2014.

“Steppe Eagle” APU SoC

“Step­pe Eagle” will fur­ther extend the per­for­mance and low-power ran­ge of the cur­rent award-win­ning AMD Embedded G‑Series APU SoC plat­form with an enhan­ced “Jagu­ar” CPU core archi­tec­tu­re and AMD Gra­phics Core Next GPU archi­tec­tu­re that include new fea­tures for increased CPU and GPU fre­quen­cy. Desi­gned for low-power embedded appli­ca­ti­ons, “Step­pe Eagle” is desi­gned to offer increased per­for­mance-per-watt both at a lower TDP than the cur­rent AMD Embedded G‑Series APU SoC, as well as exten­ding the high-end per­for­mance abo­ve 2 GHz. “Step­pe Eagle” also pro­vi­des embedded design engi­neers the fle­xi­bi­li­ty to levera­ge the cur­rent AMD Embedded G‑Series APU SoC board design and soft­ware stack for a varie­ty of appli­ca­ti­ons with foot­print com­pa­ti­bi­li­ty. “Step­pe Eagle” is expec­ted to be available in the first half of 2014.

“Adelaar” discrete GPU

“Adel­a­ar” is the next-gene­ra­ti­on dis­crete AMD Embedded Rade­on GPU based on Gra­phics Core Next archi­tec­tu­re spe­ci­fi­cal­ly desi­gned for embedded appli­ca­ti­ons. Brin­ging indus­try-lea­ding per­for­mance to embedded appli­ca­ti­ons, “Adel­a­ar” comes as a mar­ket-dif­fe­ren­tia­ting mul­ti-chip modu­le (MCM) with pre-qua­li­fied and inte­gra­ted 2 GB of gra­phics memo­ry. The “Adel­a­ar” GPU fami­ly will deli­ver rich 3D gra­phics, mul­ti-dis­play sup­port and sup­port for DirectX® 11.1, OpenGL 4.2 and both Win­dows and Linux. “Adel­a­ar” is expec­ted to be available in the first half of 2014 with seven years of plan­ned sup­p­ly avai­la­bi­li­ty as an MCM, mobi­le PCI express modu­le (MXM) and stan­dard PC gra­phics card2.

With cur­rent and future offe­rings, AMD is actively pur­suing the intel­li­gent embedded device mar­ket with a broad eco­sys­tem of soft­ware and hard­ware part­ners sup­port­ing mul­ti­ple ope­ra­ting sys­tems inclu­ding Win­dows and Linux. In par­ti­cu­lar, the com­pa­ny is focu­sing on:

  • Indus­tri­al Con­trol & Automation
  • Digi­tal Gaming
  • Com­mu­ni­ca­ti­on Infrastructure
  • “Visu­al Embedded”: 
    • Digi­tal Signage
    • Thin Cli­ent
    • Medi­cal Imaging
    • Auto Info­tain­ment
  • Set-top-Box/In­ter­net-enab­led smart TV
  • Printing/Imaging
  • Digi­tal Surveillance
  • Sto­rage
  • Military/Aero

“AMD has quick­ly embra­ced the need to deli­ver the right SoC for the right task in one of the industry’s most com­pre­hen­si­ve pro­duct port­fo­li­os for the embedded com­mu­ni­ty,” said Tom Cronk, exe­cu­ti­ve vice pre­si­dent and gene­ral mana­ger, Pro­ces­sor Divi­si­on, ARM. “The addi­ti­on of devices based on the 64-bit ARM Cor­tex-A57 pro­ces­sor to their embedded road­map gives desi­gners of high-per­for­mance embedded sys­tems a solu­ti­on that deli­vers incre­di­ble savings in terms of both ener­gy and sys­tem cost.”

Resources

About AMD

AMD (NYSE: AMD) designs and inte­gra­tes tech­no­lo­gy that powers mil­li­ons of intel­li­gent devices, inclu­ding per­so­nal com­pu­ters, tablets, game con­so­les and cloud ser­vers that defi­ne the new era of sur­round com­pu­ting. AMD solu­ti­ons enable peo­p­le ever­y­whe­re to rea­li­ze the full poten­ti­al of their favo­ri­te devices and appli­ca­ti­ons to push the boun­da­ries of what is possible.

AMD, the AMD Arrow logo, AMD Opte­ron and com­bi­na­ti­ons the­reof, are trade­marks of Advan­ced Micro Devices, Inc. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

  1. VDC Rese­arch — Stra­te­gic Insights 2012: Embedded Pro­ces­sing Technologies
  2. Part avai­la­bi­li­ty is plan­ned for seven years from date of announce­ment, sub­ject to chan­ge wit­hout noti­ce. Fur­ther sup­port available under contract

Cautionary Statement

This press release con­ta­ins for­ward-loo­king state­ments con­cer­ning AMD, its embedded pro­duct road­map and stra­tegy and the timing, fea­tures and func­tion­a­li­ty of AMD’s future pro­ducts, which are made pur­su­ant to the safe har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “belie­ves, “expects,” “may,” “will,” “should,” “seeks,” “intends,” “pro for­ma,” “esti­ma­tes,” “anti­ci­pa­tes,” “plans,” “pro­jects,” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this release are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Risks include the pos­si­bi­li­ty that Intel Corp.’s pri­cing, mar­ke­ting and reba­ting pro­grams, pro­duct bund­ling, stan­dard set­ting, new pro­duct intro­duc­tions or other acti­vi­ties may nega­tively impact the company’s plans that the com­pa­ny will requi­re addi­tio­nal fun­ding and may be unable to rai­se suf­fi­ci­ent capi­tal on favorable terms, or at all; that cus­to­mers stop buy­ing the company’s pro­ducts or mate­ri­al­ly redu­ce their ope­ra­ti­ons or demand for the company’s pro­ducts; that the com­pa­ny may be unable to deve­lop, launch and ramp new pro­ducts and tech­no­lo­gies in the volu­mes that are requi­red by the mar­ket at matu­re yields on a time­ly basis; that the company’s third par­ty foundry sup­pli­ers will be unable to tran­si­ti­on the company’s pro­ducts to advan­ced manu­fac­tu­ring pro­cess tech­no­lo­gies in a time­ly and effec­ti­ve way or to manu­fac­tu­re the company’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve pro­cess tech­no­lo­gies; that the com­pa­ny will be unable to obtain suf­fi­ci­ent manu­fac­tu­ring capa­ci­ty or com­pon­ents to meet demand for its pro­ducts or will not ful­ly uti­li­ze its pro­jec­ted manu­fac­tu­ring capa­ci­ty needs at GLOBALFOUNDRIES (GF) micro­pro­ces­sor manu­fac­tu­ring faci­li­ties; that the company’s requi­re­ments for wafers will be less than the fixed num­ber of wafers that it agreed to purcha­se from GF or GF encoun­ters pro­blems that signi­fi­cant­ly redu­ce the num­ber of func­tion­al die it recei­ves from each wafer; that the com­pa­ny is unable to suc­cessful­ly imple­ment its long-term busi­ness stra­tegy; that the com­pa­ny inac­cu­ra­te­ly esti­ma­tes the quan­ti­ty or type of pro­ducts that its cus­to­mers will want in the future or will ulti­m­ate­ly end up purcha­sing, resul­ting in excess or obso­le­te inven­to­ry; that the com­pa­ny is unable to mana­ge the risks rela­ted to the use of its third-par­ty dis­tri­bu­tors and add-in-board (AIB) part­ners or offer the appro­pria­te incen­ti­ves to focus them on the sale of the company’s pro­ducts; that the com­pa­ny may be unable to main­tain the level of invest­ment in rese­arch and deve­lo­p­ment that is requi­red to remain com­pe­ti­ti­ve; that the­re may be unex­pec­ted varia­ti­ons in mar­ket growth and demand for the company’s pro­ducts and tech­no­lo­gies in light of the pro­duct mix that it may have available at any par­ti­cu­lar time; that glo­bal busi­ness and eco­no­mic con­di­ti­ons, inclu­ding PC mar­ket con­di­ti­ons, will not impro­ve or will wor­sen; that demand for com­pu­ters will be lower than curr­ent­ly expec­ted; and the effect of poli­ti­cal or eco­no­mic insta­bi­li­ty, dome­sti­cal­ly or inter­na­tio­nal­ly, on the company’s sales or sup­p­ly chain. Inves­tors are urged to review in detail the risks and uncer­tain­ties in the company’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to the Quar­ter­ly Report on Form 10‑Q for the quar­ter ended June 29, 2013.