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AMD Processors Power Leading Research and Academic Supercomputers

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AMD Processors Power Leading Research and Academic Supercomputers

– HPC systems grab early edge with AMD’s “Interlagos” processors, AMD Fusion APUs and award-winning AMD Opteron™ 6100 Series Processors –

SUNNYVALE, Calif. -- 11/2/2011

AMD (NYSE: AMD) today announced several new installations of advanced research and academic supercomputers will run on a wide range of AMD technology including the upcoming 16-core processor codenamed “Interlagos,” the AMD Fusion Accelerated Processing Unit (APU) and the AMD Opteron™ 6100 Series processor. Included among the latest deployments are Cray Inc. (Nasdaq: CRAY) supercomputers at the university of Edinburgh (HECToR), Oak Ridge National Laboratory (ORNL), University of Stuttgart (HLRS) and Swiss National Supercomputing Centre (CSCS).

“HPC is not a one-size-fits-all environment, and requires new technologies to keep pace with customer demands,” said Paul Struhsaker, corporate vice president and general manager, Commercial Business at AMD. “Whether it’s our upcoming “Interlagos” processor or our energy-efficient APU, AMD’s unique x86 and world-class graphics IP place us at the heart of some of the fastest systems as we push well beyond the petaflop towards the exaflop.”

ORNL is upgrading its “Jaguar” system to the Cray XK6 supercomputer nicknamed “Titan.” Powered by AMD’s “Interlagos” processors, Titan will have peak performance between 10 and 20 petaflops (quadrillion mathematical calculations per second) of high performance computing power.

"ORNL is deploying more than 25,000 of AMD’s ‘Interlagos’ processors over the next few months as we upgrade Jaguar to the new Titan system," said Buddy Bland, project director of ORNL's Leadership Computing Facility. “Our users are excited about the increase in performance over previous-generation processors, and our sponsors are delighted with the power savings that will make Titan one of the world’s most powerful and efficient research tools."

In addition to the Titan supercomputer, Cray is utilizing the exceptional performance, scalability and efficiency of AMD’s “Interlagos” processors and the new “Bulldozer” x86 core architecture to build HPC systems for leading research and academic institutions, including:
  • NAMEM – Located in Ulaanbaatar, Mongolia, NAMEM specializes in weather forecasting and climate projection integration and performs regional weather and climate models for operational and research purposes;
  • CSCS – Located in Manno, Switzerland, CSCS is the national HPC center in Switzerland and operates leading-edge Cray supercomputers based on AMD technologies;
  • HECToR – Operated by the University of Edinburgh and funded by the Engineering and Physical Sciences Research Council, HECToR is the UK national HPC service and serves a broad community of scientific users across Europe;
  • HLRS – The High Performance Computing Center at the University of Stuttgart provides a Partnership for Advanced Computing in Europe (PRACE) tier-0 supercomputing resource for researchers, scientists and engineers throughout Europe with a particular focus on CFD and other engineering disciplines.
“When designing a supercomputer, we meticulously evaluate the best combination of performance and efficiency for our customers,” said Barry Bolding, vice president of Cray’s product division. “AMD’s ‘Interlagos’ processors offer incredible performance for highly parallel applications, and customer interest continues to grow for our Cray XE6 and Cray XK6 supercomputers featuring the world’s first 16-core x86 processor and AMD’s powerful Flex FP architecture.”

Additionally, Penguin Computing has successfully installed the world’s first HPC cluster powered by AMD APUs at Sandia National Labs in Albuquerque, NM. Designed with power efficiency in mind, the AMD A8-3850 APU-based Altus 2A00 will support exploration of advanced programming models and has the potential to become a key component of future exascale systems.

The award-winning AMD Opteron 6100 Series processor is also powering new deployments at Los Alamos National Laboratory (LANL) near Santa Fe, NM and the University of São Paulo. Used for scientific computing, the Appro Xtreme-X™ Supercomputer at LANL will feature more than 38,000 AMD Opteron processor cores with a performance of 353 Tflops. The Astronomy Department of the University of Sao Paulo will leverage the SGI® Altix® ICE 8400 high performance computing system to enable advanced scientific astronomical research in Brazil with more than 1,500 AMD Opteron processor cores in a single rack.

Supporting Resources
About AMD

AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its groundbreaking AMD Fusion Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD’s server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD’s superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.

Cautionary Statement

This release contains forward-looking statements concerning AMD, its customers’ future plans for their high performance computing systems, the features and functionality of AMD’s upcoming server processors codenamed “Interlagos,” and demand for these products, which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements are commonly identified by words such as “would,” “may,” “expects,” “believes,” “plans,” “intends,” “projects,” and other terms with similar meaning. Investors are cautioned that the forward-looking statements in this release are based on current beliefs, assumptions and expectations, speak only as of the date of this release and involve risks and uncertainties that could cause actual results to differ materially from current expectations. Risks include the possibility that Intel Corporation’s pricing, marketing and rebating programs, product bundling, standard setting, new product introductions or other activities targeting the company’s business will prevent attainment of the company’s current plans; the company will be unable to develop, launch and ramp new products and technologies in the volumes and mix required by the market and at mature yields on a timely basis; GLOBALFOUNDRIES will be unable to manufacture the company’s products on a timely basis in sufficient quantities and using competitive technologies; the company will be unable to obtain sufficient manufacturing capacity or components to meet demand for its products or will under-utilize its commitment with respect to GLOBALFOUNDRIES’ microprocessor manufacturing facilities; the company will be unable to transition its products to advanced manufacturing process technologies in a timely and effective way; global business and economic conditions will not continue to improve or will worsen resulting in lower than currently expected demand; demand for computers and consumer electronics products and, in turn, demand for the company’s products will be lower than currently expected; customers stop buying the company’s products or materially reduce their demand for its products; the company will require additional funding and may not be able to raise funds on favorable terms or at all; there will be unexpected variations in market growth and demand for the company’s products and technologies in light of the product mix that it may have available at any particular time or a decline in demand; and the company will be unable to maintain the level of investment in research and development that is required to remain competitive. Investors are urged to review in detail the risks and uncertainties in the company’s Securities and Exchange Commission filings, including but not limited to the Quarterly Report on Form 10-Q for the quarter ended July 2, 2011.

AMD, the AMD Arrow logo, AMD Opteron and combinations thereof, are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
 
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