{"id":13733,"date":"2014-12-09T22:53:26","date_gmt":"2014-12-09T21:53:26","guid":{"rendered":"http:\/\/www.planet3dnow.de\/cms\/?p=13733"},"modified":"2014-12-09T22:53:26","modified_gmt":"2014-12-09T21:53:26","slug":"iec-and-usb-if-expand-cooperation-to-support-next-generation-high-speed-data-delivery-and-device-charging-applications","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/13733-iec-and-usb-if-expand-cooperation-to-support-next-generation-high-speed-data-delivery-and-device-charging-applications\/","title":{"rendered":"<span class=\"caps\">IEC<\/span> and <span class=\"caps\">USB-IF<\/span> Expand Cooperation to Support Next-Generation High-Speed Data Delivery and Device Charging Applications"},"content":{"rendered":"<p>Decem\u00adber 08, 2014 08:00 <span class=\"caps\">AM<\/span> Eas\u00adtern Stan\u00addard&nbsp;Time<\/p>\n<p><span class=\"caps\">GENEVA<\/span> <span class=\"amp\">&amp;<\/span> <span class=\"caps\">BEAVERTON<\/span>, Ore.\u2013(<a href=\"http:\/\/www.businesswire.com\/\" rel=\"nofollow\"><span class=\"caps\">BUSINESS<\/span> <span class=\"caps\">WIRE<\/span><\/a>) \u2014 The <span class=\"caps\">IEC<\/span> (Inter\u00adna\u00adtio\u00adnal Elec\u00adtro\u00adtech\u00adni\u00adcal Com\u00admis\u00adsi\u00adon) and the <span class=\"caps\">USB<\/span> Imple\u00adment\u00aders Forum (<span class=\"caps\">USB-IF<\/span>) today announ\u00adced that they have expan\u00added inter\u00adna\u00adtio\u00adnal stan\u00addards coope\u00adra\u00adti\u00adon to include the latest <span class=\"caps\">USB-IF<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons for high-speed data deli\u00advery and enhan\u00adced usa\u00adges for device char\u00adging. In par\u00adti\u00adcu\u00adlar, the <span class=\"caps\">USB-IF<\/span> has sub\u00admit\u00adted to the <span class=\"caps\">IEC<\/span> the <span class=\"caps\">USB<\/span> Power Deli\u00advery (Rev. 2.0, v1.0), <span class=\"caps\">USB<\/span> 3.1 (Super\u00adSpeed <span class=\"caps\">USB<\/span> 10 Gbps), and <span class=\"caps\">USB<\/span> Type\u2011C Cable and Con\u00adnec\u00adtor specifications.<\/p>\n<p><span class=\"caps\">USB<\/span> Power Deli\u00advery was deve\u00adlo\u00adped with a visi\u00adon of deli\u00adve\u00adring uni\u00adver\u00adsal char\u00adging to extend ease of use for con\u00adsu\u00admers and redu\u00adce elec\u00adtro\u00adnic was\u00adte by offe\u00adring an alter\u00adna\u00adti\u00adve to pro\u00adprie\u00adta\u00adry, plat\u00adform spe\u00adci\u00adfic char\u00adgers. The <span class=\"caps\">USB<\/span> Power Deli\u00advery spe\u00adci\u00adfi\u00adca\u00adti\u00adon defi\u00adnes fea\u00adtures that sup\u00adport the glo\u00adbal adop\u00adti\u00adon of inter\u00adope\u00adra\u00adble exter\u00adnal power sup\u00adpli\u00ades, including:<\/p>\n<ul>\n<li class=\"bwlistitemmargb\">Increased power levels from exis\u00adting <span class=\"caps\">USB<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons up to&nbsp;<span class=\"caps\">100W<\/span><\/li>\n<li class=\"bwlistitemmargb\">Bi-direc\u00adtion\u00adal power capa\u00adbi\u00adli\u00adties to enable eit\u00adher a host or device to be eit\u00adher the pro\u00advi\u00adder of power or the con\u00adsu\u00admer of&nbsp;power<\/li>\n<li class=\"bwlistitemmargb\">Opti\u00admi\u00adzed power manage\u00adment across mul\u00adti\u00adple peri\u00adpherals to allow each device to take only the power it requires<\/li>\n<li class=\"bwlistitemmargb\">Intel\u00adli\u00adgent and fle\u00adxi\u00adble sys\u00adtem level manage\u00adment of&nbsp;power<\/li>\n<li class=\"bwlistitemmargb\"><span class=\"caps\">USB<\/span> Power Deli\u00advery and <span class=\"caps\">USB<\/span> per\u00adfor\u00admance capa\u00adbi\u00adli\u00adties can be deli\u00adver\u00aded over a single-cable<\/li>\n<\/ul>\n<p>The new <span class=\"caps\">USB<\/span> Type\u2011C spe\u00adci\u00adfi\u00adca\u00adti\u00adon, built on exis\u00adting <span class=\"caps\">USB<\/span> 3.1 and <span class=\"caps\">USB<\/span> 2.0 tech\u00adno\u00adlo\u00adgies, was deve\u00adlo\u00adped to faci\u00adli\u00adta\u00adte thin\u00adner and slee\u00adker pro\u00adduct designs, enhan\u00adce usa\u00adbi\u00adli\u00adty and pro\u00advi\u00adde a growth path for per\u00adfor\u00admance enhance\u00adments for future ver\u00adsi\u00adons of&nbsp;<span class=\"caps\">USB<\/span>.<\/p>\n<p>Key cha\u00adrac\u00adte\u00adristics of the <span class=\"caps\">USB<\/span> Type\u2011C con\u00adnec\u00adtor and cable solu\u00adti\u00adon include:<\/p>\n<ul>\n<li class=\"bwlistitemmargb\">An enti\u00adre\u00adly new design tail\u00ado\u00adred to work well with emer\u00adging pro\u00adduct designs<\/li>\n<li class=\"bwlistitemmargb\">New smal\u00adler size \u2013 simi\u00adlar in size to the exis\u00adting <span class=\"caps\">USB<\/span> 2.0 Micro\u2011B<\/li>\n<li class=\"bwlistitemmargb\">Usa\u00adbi\u00adli\u00adty enhance\u00adments \u2013 users will no lon\u00adger need to be con\u00adcer\u00adned with plug orientation\/cable direc\u00adtion, making it easier to plug&nbsp;in<\/li>\n<li class=\"bwlistitemmargb\">The <span class=\"caps\">USB<\/span> Type\u2011C con\u00adnec\u00adtor and cable will sup\u00adport sca\u00adlable power charging<\/li>\n<li class=\"bwlistitemmargb\">Sca\u00adla\u00adbi\u00adli\u00adty \u2013 the con\u00adnec\u00adtor design will sca\u00adle for future <span class=\"caps\">USB<\/span> bus performance<\/li>\n<\/ul>\n<p><span class=\"caps\">USB<\/span> 3.1 deli\u00advers speeds up to 10 Gbps, pro\u00advi\u00adding sup\u00adport for audio\/video that can dri\u00adve Ultra-HD (<span class=\"caps\">4K<\/span>) dis\u00adplays. <span class=\"caps\">USB<\/span> hosts, hubs and devices can be built to sup\u00adport a ran\u00adge of <span class=\"caps\">USB<\/span> Power Deli\u00advery and per\u00adfor\u00admance capa\u00adbi\u00adli\u00adties to meet the needs of OEMs. Along with the new <span class=\"caps\">USB<\/span> Type\u2011C cable and con\u00adnec\u00adtor, <span class=\"caps\">USB<\/span> 3.1 and <span class=\"caps\">USB<\/span> Power Deli\u00advery will bring enhan\u00adced appli\u00adca\u00adti\u00adons for a tru\u00adly sin\u00adgle-cable solu\u00adti\u00adon for data and power deli\u00advery, buil\u00adding on the exis\u00adting glo\u00adbal eco\u00adsys\u00adtem of <span class=\"caps\">USB<\/span> \/ <span class=\"caps\">IEC<\/span> 62680 series of Inter\u00adna\u00adtio\u00adnal Stan\u00addards com\u00adpli\u00adant devices. Devices sup\u00adport\u00ading the\u00adse new spe\u00adci\u00adfi\u00adca\u00adti\u00adons are expec\u00adted to come to mar\u00adket in&nbsp;2015.<\/p>\n<p>The\u00adse new stan\u00addards are also expec\u00adted to advan\u00adce glo\u00adbal action on redu\u00adcing e\u2011waste and impro\u00adving re-usa\u00adbi\u00adli\u00adty of power sup\u00adpli\u00ades with a ran\u00adge of elec\u00adtro\u00adnic devices. <span class=\"caps\">IEC<\/span>\u2019s approach for ongo\u00ading stan\u00addar\u00addiza\u00adti\u00adon work in this space is dri\u00adven by the ulti\u00adma\u00adte goals of incre\u00adasing exter\u00adnal power sup\u00adp\u00adly re-usa\u00adbi\u00adli\u00adty, sup\u00adport\u00ading con\u00adsu\u00admer con\u00adve\u00adni\u00adence, main\u00adtai\u00adning pro\u00adduct relia\u00adbi\u00adli\u00adty and safe\u00adty, and pro\u00advi\u00adding for future tech\u00adno\u00adlo\u00adgy inno\u00adva\u00adtions. In addi\u00adti\u00adon, wide\u00adspread adop\u00adti\u00adon of the resul\u00adting Inter\u00adna\u00adtio\u00adnal Stan\u00addards will help to redu\u00adce the encroach\u00adment of poor\u00adly desi\u00adgned or manu\u00adfac\u00adtu\u00adred after\u00admar\u00adket sub\u00adsti\u00adtu\u00adtes which may affect the ope\u00adra\u00adti\u00adon of elec\u00adtro\u00adnic devices in com\u00adpli\u00adance with regu\u00adla\u00adto\u00adry requirements.<\/p>\n<p>The three <span class=\"caps\">USB-IF<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons have been sub\u00admit\u00adted to the <span class=\"caps\">IEC<\/span> <span class=\"caps\">TC<\/span> (Tech\u00adni\u00adcal Com\u00admit\u00adtee) 100: Audio, video and mul\u00adti\u00adme\u00addia sys\u00adtems and equip\u00adment, to be con\u00adside\u00adred for inclu\u00adsi\u00adon in the new\u00adly appro\u00adved <span class=\"caps\">IEC<\/span> Inter\u00adna\u00adtio\u00adnal Stan\u00addard <a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.iec.ch%2Fdyn%2Fwww%2Ff%3Fp%3D103%3A38%3A0%3A%3A%3A%3AFSP_ORG_ID%2CFSP_LANG_ID%2CFSP_PROJECT%3A1297%2C25%2CIEC%252062680%2520Ed.%25201.0&amp;esheet=50996349&amp;newsitemid=20141208005016&amp;lan=en-US&amp;anchor=IEC+62680+series&amp;index=1&amp;md5=70603ebf8a18315e454ccfbb55d5e601\" target=\"_blank\" rel=\"nofollow\"><span class=\"caps\">IEC<\/span> 62680 series<\/a>, <i>Uni\u00adver\u00adsal Seri\u00adal Bus inter\u00adfaces for data and power <\/i>in sup\u00adport of the sta\u00adted&nbsp;goal.<\/p>\n<p><span class=\"dquo\">\u201c<\/span><span class=\"caps\">IEC<\/span> has a long\u00adstan\u00adding rela\u00adti\u00adonship with the <span class=\"caps\">USB-IF<\/span> and belie\u00adves in the bene\u00adfit of alig\u00adning with <span class=\"caps\">USB<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons becau\u00adse of the strong world\u00adwi\u00adde and cross-indus\u00adtry sup\u00adport behind the tech\u00adno\u00adlo\u00adgy,\u201d says Frans Vrees\u00adwi\u00adjk, Gene\u00adral Secre\u00adta\u00adry and <span class=\"caps\">CEO<\/span> of the&nbsp;<span class=\"caps\">IEC<\/span>.<\/p>\n<p><span class=\"dquo\">\u201c<\/span><span class=\"caps\">IEC<\/span> reco\u00adgni\u00adzes the importance of eva\u00adlua\u00adting the new <span class=\"caps\">USB<\/span> Power Deli\u00advery, <span class=\"caps\">USB<\/span> 3.1 and <span class=\"caps\">USB<\/span> Type\u2011C spe\u00adci\u00adfi\u00adca\u00adti\u00adons for inclu\u00adsi\u00adon in the <span class=\"caps\">IEC<\/span> Inter\u00adna\u00adtio\u00adnal Stan\u00addard as they are cle\u00adar\u00adly the right spe\u00adci\u00adfi\u00adca\u00adti\u00adons to sup\u00adport the next gene\u00adra\u00adti\u00adon of <span class=\"caps\">ICT<\/span> and con\u00adsu\u00admer pro\u00adducts,\u201d explains Mr. Shui\u00adchi Mat\u00adsu\u00admura, Mana\u00adger of <span class=\"caps\">IEC<\/span> <span class=\"caps\">TC<\/span> 100 <span class=\"caps\">TA<\/span> (Tech\u00adni\u00adcal Area) 14 and Seni\u00ador Stan\u00addards Expert of the Intellec\u00adtu\u00adal Pro\u00adper\u00adty and Stan\u00addards Stra\u00adtegy Divi\u00adsi\u00adon at Fuji\u00adtsu Limited.<\/p>\n<p><span class=\"dquo\">\u201c<\/span>The <span class=\"caps\">USB-IF<\/span> fos\u00adters high-qua\u00adli\u00adty, con\u00adsu\u00admer-fri\u00adend\u00adly pro\u00adducts and inno\u00adva\u00adti\u00adve <span class=\"caps\">USB<\/span> tech\u00adno\u00adlo\u00adgy,\u201d says Jeff Raven\u00adcraft, <span class=\"caps\">USB-IF<\/span> Pre\u00adsi\u00addent and <span class=\"caps\">COO<\/span>. \u201cAdop\u00adti\u00adon of <span class=\"caps\">USB<\/span> Power Deli\u00advery, <span class=\"caps\">USB<\/span> 3.1, and <span class=\"caps\">USB<\/span> Type\u2011C is gro\u00adwing fast and we are working clo\u00adse\u00adly with <span class=\"caps\">IEC<\/span> to pro\u00admo\u00adte the bene\u00adfits of the\u00adse <span class=\"caps\">USB<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons to enable the goal of a com\u00admon exter\u00adnal power sup\u00adp\u00adly for elec\u00adtro\u00adnic devices.\u201d<\/p>\n<p><b>Resour\u00adces<\/b><\/p>\n<ul>\n<li class=\"bwlistitemmargb\">To learn more about <span class=\"caps\">IEC<\/span>, visit <a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.iec.ch%2F&amp;esheet=50996349&amp;newsitemid=20141208005016&amp;lan=en-US&amp;anchor=http%3A%2F%2Fwww.iec.ch%2F&amp;index=2&amp;md5=df5e48ba7b912ef915969033c6281a88\" target=\"_blank\" rel=\"nofollow\">http:\/\/www.iec.ch\/<\/a>.<\/li>\n<li class=\"bwlistitemmargb\">To learn more about <span class=\"caps\">USB-IF<\/span> and <span class=\"caps\">USB<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons, visit <a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.usb.org&amp;esheet=50996349&amp;newsitemid=20141208005016&amp;lan=en-US&amp;anchor=www.usb.org&amp;index=3&amp;md5=759ed1a132a188bb4a007553670850f1\" target=\"_blank\" rel=\"nofollow\">www.usb.org<\/a>.<\/li>\n<\/ul>\n<p><span style=\"font-size: 8pt;\"><b>About the <span class=\"caps\">USB-IF<\/span><\/b><\/span><\/p>\n<p><span style=\"font-size: 8pt;\">The non-pro\u00adfit <span class=\"caps\">USB<\/span> Imple\u00adment\u00aders Forum, Inc. was for\u00admed to pro\u00advi\u00adde a sup\u00adport orga\u00adniza\u00adti\u00adon and forum for the advance\u00adment and adop\u00adti\u00adon of <span class=\"caps\">USB<\/span> tech\u00adno\u00adlo\u00adgy as defi\u00adned in the <span class=\"caps\">USB<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons. <span class=\"caps\">USB-IF<\/span> faci\u00adli\u00adta\u00adtes the deve\u00adlo\u00adp\u00adment of high-qua\u00adli\u00adty, com\u00adpa\u00adti\u00adble <span class=\"caps\">USB<\/span> devices through its logo and com\u00adpli\u00adance pro\u00adgram reco\u00adgni\u00adzed around the glo\u00adbe and pro\u00admo\u00adtes the bene\u00adfits of <span class=\"caps\">USB<\/span> and the qua\u00adli\u00adty of pro\u00adducts that have pas\u00adsed com\u00adpli\u00adance test\u00ading. Fur\u00adther infor\u00adma\u00adti\u00adon, inclu\u00adding pos\u00adtings of the most recent pro\u00adduct and tech\u00adno\u00adlo\u00adgy announce\u00adments, is available by visi\u00adting the <span class=\"caps\">USB-IF<\/span> web\u00adsite at <a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.usb.org&amp;esheet=50996349&amp;newsitemid=20141208005016&amp;lan=en-US&amp;anchor=www.usb.org&amp;index=4&amp;md5=56db41cd24c1c0a6cc08a3fc0c272448\" target=\"_blank\" rel=\"nofollow\">www.usb.org<\/a>.<\/span><\/p>\n<p><span style=\"font-size: 8pt;\"><b>About the&nbsp;<span class=\"caps\">IEC<\/span><\/b><\/span><\/p>\n<p><span style=\"font-size: 8pt;\">The <span class=\"caps\">IEC<\/span> (Inter\u00adna\u00adtio\u00adnal Elec\u00adtro\u00adtech\u00adni\u00adcal Com\u00admis\u00adsi\u00adon) brings tog\u00ade\u00adther 166 count\u00adries, repre\u00adsen\u00adting 98% of the world popu\u00adla\u00adti\u00adon and 96% of world ener\u00adgy gene\u00adra\u00adti\u00adon, and clo\u00adse to 15 000 experts who coope\u00adra\u00adte on the glo\u00adbal, neu\u00adtral and inde\u00adpen\u00addent <span class=\"caps\">IEC<\/span> plat\u00adform to ensu\u00adre that pro\u00adducts work ever\u00ady\u00adwhe\u00adre safe\u00adly with each other. The <span class=\"caps\">IEC<\/span> is the world\u2019s lea\u00adding orga\u00adniza\u00adti\u00adon that pre\u00adpa\u00adres and publishes glo\u00adbal\u00adly rele\u00advant Inter\u00adna\u00adtio\u00adnal Stan\u00addards for the who\u00adle ener\u00adgy chain, inclu\u00adding all elec\u00adtri\u00adcal, elec\u00adtro\u00adnic and rela\u00adted tech\u00adno\u00adlo\u00adgies, devices and sys\u00adtems. The <span class=\"caps\">IEC<\/span> also sup\u00adports all forms of con\u00adfor\u00admi\u00adty assess\u00adment and admi\u00adnis\u00adters four Con\u00adfor\u00admi\u00adty Assess\u00adment Sys\u00adtems that cer\u00adti\u00adfy that com\u00adpon\u00adents, equip\u00adment and sys\u00adtems used in homes, offices, health\u00adca\u00adre faci\u00adli\u00adties, public spaces, trans\u00adpor\u00adta\u00adti\u00adon, manu\u00adfac\u00adtu\u00adring, explo\u00adsi\u00adve envi\u00adron\u00adments and ener\u00adgy gene\u00adra\u00adti\u00adon con\u00adform to&nbsp;them.<\/span><\/p>\n<p><span style=\"font-size: 8pt;\"><span class=\"caps\">IEC<\/span> work covers a vast ran\u00adge of tech\u00adno\u00adlo\u00adgies: power gene\u00adra\u00adti\u00adon (inclu\u00adding all rene\u00adwa\u00adble ener\u00adgy sources), trans\u00admis\u00adsi\u00adon, dis\u00adtri\u00adbu\u00adti\u00adon, Smart Grid <span class=\"amp\">&amp;<\/span> Smart Cities, bat\u00adte\u00adries, home appli\u00adances, office and medi\u00adcal equip\u00adment, all public and pri\u00adva\u00adte trans\u00adpor\u00adta\u00adti\u00adon, semi\u00adcon\u00adduc\u00adtors, fib\u00adre optics, nano\u00adtech\u00adno\u00adlo\u00adgy, mul\u00adti\u00adme\u00addia, infor\u00adma\u00adti\u00adon tech\u00adno\u00adlo\u00adgy, and more. It also addres\u00adses safe\u00adty, <span class=\"caps\">EMC<\/span>, per\u00adfor\u00admance and the envi\u00adron\u00adment. <a href=\"http:\/\/cts.businesswire.com\/ct\/CT?id=smartlink&amp;url=http%3A%2F%2Fwww.iec.ch&amp;esheet=50996349&amp;newsitemid=20141208005016&amp;lan=en-US&amp;anchor=www.iec.ch&amp;index=5&amp;md5=ab33adc2eeb9af3cad2c9c49155a3a34\" target=\"_blank\" rel=\"nofollow\">www.iec.ch<\/a><\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p><span class=\"caps\">GENEVA<\/span> <span class=\"amp\">&amp;<\/span> <span class=\"caps\">BEAVERTON<\/span>, Ore.\u2013(<span class=\"caps\">BUSINESS<\/span> <span class=\"caps\">WIRE<\/span>) \u2014 The <span class=\"caps\">IEC<\/span> (Inter\u00adna\u00adtio\u00adnal Elec\u00adtro\u00adtech\u00adni\u00adcal Com\u00admis\u00adsi\u00adon) and the <span class=\"caps\">USB<\/span> Imple\u00adment\u00aders Forum (<span class=\"caps\">USB-IF<\/span>) today announ\u00adced that they have expan\u00added inter\u00adna\u00adtio\u00adnal stan\u00addards coope\u00adra\u00adti\u00adon to include the latest <span class=\"caps\">USB-IF<\/span> spe\u00adci\u00adfi\u00adca\u00adti\u00adons for high-speed data deli\u00advery and enhan\u00adced usa\u00adges for device char\u00adging. In par\u00adti\u00adcu\u00adlar, the <span class=\"caps\">USB-IF<\/span> has sub\u00admit\u00adted to the <span class=\"caps\">IEC<\/span> the <span class=\"caps\">USB<\/span> Power Deli\u00advery (Rev. 2.0, v1.0), <span class=\"caps\">USB<\/span> 3.1 (Super\u00adSpeed <span class=\"caps\">USB<\/span> 10 Gbps), and <span class=\"caps\">USB<\/span> Type\u2011C Cable and Con\u00adnec\u00adtor spe\u00adci\u00adfi\u00adca\u00adti\u00adons. (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/13733-iec-and-usb-if-expand-cooperation-to-support-next-generation-high-speed-data-delivery-and-device-charging-applications\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[],"class_list":["post-13733","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/13733","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=13733"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/13733\/revisions"}],"predecessor-version":[{"id":13734,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/13733\/revisions\/13734"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=13733"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=13733"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=13733"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}