{"id":18209,"date":"2015-07-20T12:31:16","date_gmt":"2015-07-20T10:31:16","guid":{"rendered":"http:\/\/www.planet3dnow.de\/cms\/?p=18209"},"modified":"2015-07-20T12:31:16","modified_gmt":"2015-07-20T10:31:16","slug":"umc-enters-volume-production-for-tsv-process-used-to-enable-amds-high-performance-radeon-r9-fury-x-gpu","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/18209-umc-enters-volume-production-for-tsv-process-used-to-enable-amds-high-performance-radeon-r9-fury-x-gpu\/","title":{"rendered":"UMC<\/span> Enters Volume Production for TSV<\/span> Process Used to Enable AMD<\/span>\u2019s High-Performance Radeon R9<\/span> Fury X GPU<\/span>"},"content":{"rendered":"

Through-Sili\u00adcon-Via tech\u00adno\u00adlo\u00adgy fuses memo\u00adry + GPU<\/span> to enable cut\u00adting-edge performance<\/em><\/p>\n

Hsin\u00adchu, Tai\u00adwan, July 20, 2015 \u2013 <\/b>United Microelec\u00adtro\u00adnics Cor\u00adpo\u00adra\u00adti\u00adon (NYSE<\/span>:UMC<\/span>;TWSE<\/span>: 2303) (\u201cUMC<\/span>\u201d), a lea\u00adding glo\u00adbal semi\u00adcon\u00adduc\u00adtor foundry, today announ\u00adced that it has ente\u00adred volu\u00adme pro\u00adduc\u00adtion for the Through-Sili\u00adcon-Via (TSV<\/span>) tech\u00adno\u00adlo\u00adgy used on the AMD<\/span> Rade\u00adon\u2122 R9<\/span> Fury X, the flag\u00adship GPU<\/span> in the recent\u00adly announ\u00adced Rade\u00adon\u2122 R 300 Series of gra\u00adphics cards. The AMD<\/span> Rade\u00adon\u2122 R9<\/span> Fury X GPU<\/span> uti\u00adli\u00adzes UMC<\/span>\u2019s TSV<\/span> pro\u00adcess tech\u00adno\u00adlo\u00adgy and die-stack\u00ading to fuse HBM<\/span> DRAM<\/span> with AMD<\/span>\u2019s GPU<\/span> on a sili\u00adcon inter\u00adpo\u00adser, enab\u00adling the GPU<\/span> to deli\u00adver unmat\u00adched memo\u00adry band\u00adwidth of 4096-bit and qua\u00addru\u00adple the per\u00adfor\u00admance-per-watt over the cur\u00adrent GDDR5<\/span> indus\u00adtry standard.<\/p>\n

\u201c<\/span>AMD<\/span> has a suc\u00adcessful histo\u00adry of deli\u00adve\u00adring cut\u00adting-edge GPU<\/span> pro\u00adducts to mar\u00adket,\u201d said S.C. Chien, vice pre\u00adsi\u00addent of Cor\u00adpo\u00adra\u00adte Mar\u00adke\u00adting and co-chair of the TSV<\/span> com\u00admit\u00adtee at UMC<\/span>. \u201cThis volu\u00adme pro\u00adduc\u00adtion mile\u00adstone is the cul\u00admi\u00adna\u00adti\u00adon of UMC<\/span>\u2019s clo\u00adse TSV<\/span> col\u00adla\u00adbo\u00adra\u00adti\u00adon with AMD<\/span>, and we are hap\u00adpy to bring the per\u00adfor\u00admance bene\u00adfits of this tech\u00adno\u00adlo\u00adgy to help power their new gene\u00adra\u00adti\u00adon of GPU<\/span> pro\u00adducts. We look for\u00adward to con\u00adti\u00adnuing this fruitful part\u00adner\u00adship with AMD<\/span> for years to come.\u201d<\/p>\n

Bryan Black, seni\u00ador fel\u00adlow at AMD<\/span> said, \u201cUMC<\/span>\u2019s long track record of brin\u00adging inno\u00adva\u00adti\u00adve tech\u00adno\u00adlo\u00adgies from the R&<\/span>D stage to volu\u00adme pro\u00adduc\u00adtion for cus\u00adto\u00admer pro\u00adducts was a com\u00adpel\u00adling reason for us to enga\u00adge with them as our foundry for the inter\u00adpo\u00adser and asso\u00adcia\u00adted TSV<\/span> tech\u00adno\u00adlo\u00adgy. They have again pro\u00adven their abili\u00adty to exe\u00adcu\u00adte suc\u00adcessful\u00adly with TSV<\/span> on our latest high-per\u00adfor\u00admance GPU<\/span>, and we are plea\u00adsed to have them as a valuable sup\u00adp\u00adly-chain part\u00adner for our exci\u00adting new line of Rade\u00adon products.\u201d<\/p>\n

AMD<\/span>\u2019s GPU<\/span> and sta\u00adcked HBM<\/span> dies are pla\u00adced on top of UMC<\/span>\u2019s inter\u00adpo\u00adser that employs a TSV<\/span> pro\u00adcess. Through a CMOS<\/span> redis\u00adtri\u00adbu\u00adti\u00adon lay\u00ader and advan\u00adced micro-bum\u00adping, the\u00adse ICs com\u00admu\u00adni\u00adca\u00adte with each other on the inter\u00adpo\u00adser, thus enab\u00adling the cut\u00adting-edge per\u00adfor\u00admance and form fac\u00adtor of AMD<\/span>\u2019s Rade\u00adon\u2122 R9<\/span> Fury X. AMD<\/span>\u2019s sili\u00adcon inter\u00adpo\u00adser with TSV<\/span> is manu\u00adfac\u00adtu\u00adred at UMC<\/span>\u2019s spe\u00adcial\u00adty 300mm Fab 12i in Singapore.<\/p>\n

About UMC<\/span><\/b> <\/span>
\nUMC<\/span> (NYSE<\/span>: UMC<\/span>, TWSE<\/span>: 2303) is a lea\u00adding glo\u00adbal semi\u00adcon\u00adduc\u00adtor foundry that pro\u00advi\u00addes advan\u00adced IC<\/span> pro\u00adduc\u00adtion for appli\u00adca\u00adti\u00adons span\u00adning every major sec\u00adtor of the elec\u00adtro\u00adnics indus\u00adtry. UMC<\/span>\u2019s robust foundry solu\u00adti\u00adons enable chip desi\u00adgners to levera\u00adge the company\u2019s sophisti\u00adca\u00adted tech\u00adno\u00adlo\u00adgy and manu\u00adfac\u00adtu\u00adring, which include 28nm gate-last High\u2011K\/Metal Gate tech\u00adno\u00adlo\u00adgy, ultra-low power plat\u00adform pro\u00adces\u00adses spe\u00adci\u00adfi\u00adcal\u00adly engi\u00adnee\u00adred for Inter\u00adnet of Things (IoT) appli\u00adca\u00adti\u00adons and the hig\u00adhest-rated AEC-Q11<\/span> Grade\u20110 auto\u00admo\u00adti\u00adve indus\u00adtry manu\u00adfac\u00adtu\u00adring capa\u00adbi\u00adli\u00adties. UMC<\/span>\u2019s 10 wafer fabs are loca\u00adted throug\u00adhout Asia and are able to pro\u00addu\u00adce over 500,000 wafers per month. The com\u00adpa\u00adny employs over 17,000 peo\u00adp\u00adle world\u00adwi\u00adde, with offices in Tai\u00adwan, main\u00adland Chi\u00adna, Euro\u00adpe, Japan, Korea, Sin\u00adga\u00adpo\u00adre, and the United Sta\u00adtes. UMC<\/span> can be found on the web at http:\/\/www.umc.com<\/span><\/a>.<\/span><\/p>\n

Note from UMC<\/span> Con\u00adcer\u00adning For\u00adward-Loo\u00adking State\u00adments<\/b> <\/span>
\nSome of the state\u00adments in the fore\u00adgo\u00ading announce\u00adment are for\u00adward loo\u00adking within the mea\u00adning of the U.S. Fede\u00adral Secu\u00adri\u00adties laws, inclu\u00adding state\u00adments about future out\u00adsour\u00adcing, wafer capa\u00adci\u00adty, tech\u00adno\u00adlo\u00adgies, busi\u00adness rela\u00adti\u00adonships and mar\u00adket con\u00addi\u00adti\u00adons. Inves\u00adtors are cau\u00adtio\u00adned that actu\u00adal events and results could dif\u00adfer mate\u00adri\u00adal\u00adly from the\u00adse state\u00adments as a result of a varie\u00adty of fac\u00adtors, inclu\u00adding con\u00addi\u00adti\u00adons in the over\u00adall semi\u00adcon\u00adduc\u00adtor mar\u00adket and eco\u00adno\u00admy; accep\u00adtance and demand for pro\u00adducts from UMC<\/span>; and tech\u00adno\u00adlo\u00adgi\u00adcal and deve\u00adlo\u00adp\u00adment risks. Fur\u00adther infor\u00adma\u00adti\u00adon regar\u00adding the\u00adse and other risks is included in UMC<\/span>\u2019s filings with the U.S. Secu\u00adri\u00adties and Exch\u00adan\u00adge Com\u00admis\u00adsi\u00adon, inclu\u00adding its regis\u00adtra\u00adti\u00adon state\u00adments and reports on Forms F\u20111, F\u20113, F\u20116 and 20\u2011F and 6\u2011K, in each case as amen\u00added. UMC<\/span> does not under\u00adta\u00adke any obli\u00adga\u00adti\u00adon to update any for\u00adward-loo\u00adking state\u00adment as a result of new infor\u00adma\u00adti\u00adon, future events or other\u00adwi\u00adse, except as requi\u00adred under appli\u00adca\u00adble law.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

Hsin\u00adchu, Tai\u00adwan, July 20, 2015 \u2013 United Microelec\u00adtro\u00adnics Cor\u00adpo\u00adra\u00adti\u00adon (NYSE<\/span>:UMC<\/span>;TWSE<\/span>: 2303) (\u201cUMC<\/span>\u201d), a lea\u00adding glo\u00adbal semi\u00adcon\u00adduc\u00adtor foundry, today announ\u00adced that it has ente\u00adred volu\u00adme pro\u00adduc\u00adtion for the Through-Sili\u00adcon-Via (TSV<\/span>) tech\u00adno\u00adlo\u00adgy used on the AMD<\/span> Rade\u00adon\u2122 R9<\/span> Fury X, the flag\u00adship GPU<\/span> in the recent\u00adly announ\u00adced Rade\u00adon\u2122 R 300 Series of gra\u00adphics cards. The AMD<\/span> Rade\u00adon\u2122 R9<\/span> Fury X GPU<\/span> uti\u00adli\u00adzes UMC<\/span>\u2019s TSV<\/span> pro\u00adcess tech\u00adno\u00adlo\u00adgy and die-stack\u00ading to fuse HBM<\/span> DRAM<\/span> with AMD<\/span>\u2019s GPU<\/span> on a sili\u00adcon inter\u00adpo\u00adser, enab\u00adling the GPU<\/span> to deli\u00adver unmat\u00adched memo\u00adry band\u00adwidth of 4096-bit and qua\u00addru\u00adple the per\u00adfor\u00admance-per-watt over the cur\u00adrent GDDR5<\/span> indus\u00adtry stan\u00addard. (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[],"class_list":["post-18209","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/18209","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=18209"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/18209\/revisions"}],"predecessor-version":[{"id":18210,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/18209\/revisions\/18210"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=18209"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=18209"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=18209"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}