{"id":2546,"date":"2013-09-10T08:05:26","date_gmt":"2013-09-10T06:05:26","guid":{"rendered":"http:\/\/www.planet3dnow.de\/cms\/?p=2546"},"modified":"2013-09-10T08:07:13","modified_gmt":"2013-09-10T06:07:13","slug":"amd-details-embedded-product-roadmap","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/2546-amd-details-embedded-product-roadmap\/","title":{"rendered":"AMD<\/span> Details Embedded Product Roadmap"},"content":{"rendered":"
AMD<\/span> extends ambi\u00addex\u00adtrous stra\u00adtegy to embedded cus\u00adto\u00admers beco\u00adming the first to offer choice of ARM<\/span> or x86 SoC, APU<\/span> or CPU<\/span> opti\u00adons cou\u00adpled with indus\u00adtry-lea\u00adding AMD<\/span> Rade\u00adon graphics<\/em><\/div>\n


\n<\/em>SUNNYVALE<\/span>, Calif. \u20149\/9\/2013  <\/strong><\/p>\n

AMD<\/span> (NYSE<\/span>: AMD<\/span>) today dis\u00adc\u00adlo\u00adsed its road\u00admap for the fast-gro\u00adwing embedded com\u00adpu\u00adting mar\u00adket, as it beco\u00admes the first com\u00adpa\u00adny to offer both ARM<\/span> and x86 pro\u00adces\u00adsor solu\u00adti\u00adons for low-power and high-per\u00adfor\u00admance embedded com\u00adpu\u00adte designs. The new lin\u00ade\u00adup includes two best-in-class x86 acce\u00adle\u00adra\u00adted pro\u00adces\u00adsing units (APUs) and cen\u00adtral pro\u00adces\u00adsing units (CPUs), a first look at a high-per\u00adfor\u00admance ARM<\/span> sys\u00adtem-on-chip (SoC) and a new fami\u00adly of dis\u00adcrete AMD<\/span> Embedded Rade\u00adon\u2122 gra\u00adphics pro\u00adces\u00adsing units (GPUs) expec\u00adted to launch in 2014. The\u00adse addi\u00adti\u00adons pro\u00advi\u00adde the embedded industry\u2019s engi\u00adnee\u00adring com\u00admu\u00adni\u00adty with more choices to match their exact design needs, and are desi\u00adgned to offer impro\u00adve\u00adments in per\u00adfor\u00admance-per-watt and per\u00adfor\u00admance-per-dol\u00adlar. Tog\u00ade\u00adther with the recent launch of the award-win\u00adning AMD<\/span> Embedded G\u2011Series SoC<\/a> fami\u00adly that set a supe\u00adri\u00ador  bar for per\u00adfor\u00admance-per-watt low-power mul\u00adti\u00adco\u00adre APUs, the\u00adse latest addi\u00adti\u00adons to the embedded pro\u00adduct road\u00admap fur\u00adther signi\u00adfy a stra\u00adte\u00adgic push by AMD<\/span> to focus on the high-growth embedded market.<\/p>\n

The embedded sys\u00adtems mar\u00adket is vast and forms the under\u00adpin\u00adning for the Sur\u00adround Com\u00adpu\u00adting<\/a> era. This mar\u00adket is com\u00adpri\u00adsed of dif\u00adfe\u00adrent seg\u00adments of which intel\u00adli\u00adgent embedded devices \u2013 tho\u00adse enab\u00adled with high-per\u00adfor\u00admance micro\u00adpro\u00adces\u00adsors, IP<\/span> con\u00adnec\u00adti\u00advi\u00adty, and high-level ope\u00adra\u00adting sys\u00adtems \u2013 are quick\u00adly beco\u00adming the most signi\u00adfi\u00adcant. A recent VDC<\/span> Rese\u00adarch report indi\u00adca\u00adtes the mar\u00adket for CPUs in tra\u00addi\u00adtio\u00adnal and intel\u00adli\u00adgent embedded sys\u00adtems will grow 36 per\u00adcent from rough\u00adly 330 mil\u00adli\u00adon units in 2013 to more than 450 mil\u00adli\u00adon units by 2016 with x86 and ARM<\/span> archi\u00adtec\u00adtures accoun\u00adting for 82 per\u00adcent of the total addressa\u00adble mar\u00adket (TAM<\/span>)1<\/sup>.<\/p>\n

\u201c<\/span>AMD<\/span> is com\u00admit\u00adted to pro\u00advi\u00adding the embedded com\u00admu\u00adni\u00adty with the solu\u00adti\u00adons requi\u00adred to suc\u00adceed in today\u2019s trans\u00adfor\u00adma\u00adti\u00adve mar\u00adket as it con\u00adti\u00adnues to expand at an unpre\u00adce\u00adden\u00adted rate,\u201d said Arun Iyen\u00adgar, vice pre\u00adsi\u00addent and gene\u00adral mana\u00adger, AMD<\/span> Embedded Solu\u00adti\u00adons. \u201cThe\u00adre are dif\u00adfe\u00adrent cus\u00adto\u00admer needs in dif\u00adfe\u00adrent seg\u00adments of this mar\u00adket \u2014 from low-power to high-per\u00adfor\u00admance, Linux to Win\u00addows, x86 to ARM<\/span> \u2014 and now with our upco\u00adming pro\u00adduct port\u00adfo\u00adlio, we are addres\u00adsing them by pro\u00advi\u00adding embedded design engi\u00adneers with a ran\u00adge of solu\u00adti\u00adons backed by our embedded lon\u00adge\u00advi\u00adty pro\u00adgram for sup\u00adp\u00adly sta\u00adbi\u00adli\u00adty assu\u00adrance to fit their every need.\u201d<\/p>\n

\u201c<\/span>The unpre\u00adce\u00adden\u00adted rise of intel\u00adli\u00adgent con\u00adnec\u00adted solu\u00adti\u00adons over the next seve\u00adral years will requi\u00adre a myri\u00adad of ultra low-power to ultra high-per\u00adfor\u00admance solu\u00adti\u00adons con\u00adnec\u00adting devices to the cloud,\u201d said Jim McGre\u00adgor, Prin\u00adci\u00adpal Ana\u00adlyst with TIRIAS<\/span> Rese\u00adarch. \u201cWith their new road\u00admap, AMD<\/span> lever\u00ada\u00adges both ARM<\/span> and x86 com\u00adpu\u00adting and gra\u00adphics archi\u00adtec\u00adtures to ful\u00adfill the company\u2019s visi\u00adon of crea\u00adting an ambi\u00addex\u00adtrous eco\u00adsys\u00adtem. The cur\u00adrent pro\u00adducts com\u00adbi\u00adned with the new road\u00admap offer pri\u00adce, per\u00adfor\u00admance and power opti\u00adons to meet the needs of embedded designers.\u201d<\/p>\n

2014 AMD<\/span> Embedded Roadmap<\/strong><\/h3>\n

In 2014, AMD<\/span>  plans to bring to mar\u00adket two new high-per\u00adfor\u00admance AMD<\/span> Embedded R\u2011Series pro\u00adces\u00adsor fami\u00adlies: the \u201cHier\u00adofal\u00adcon\u201d CPU<\/span> SoC fami\u00adly based on the ARM<\/span> Cortex\u2122-A57 archi\u00adtec\u00adtu\u00adre and the \u201cBald Eagle\u201d APU<\/span> and CPU<\/span> offe\u00adring based on the x86 micro\u00adpro\u00adces\u00adsor archi\u00adtec\u00adtu\u00adre code\u00adna\u00admed \u201cSteam\u00adrol\u00adler.\u201d The upco\u00adming \u201cStep\u00adpe Eagle\u201d APU<\/span> SoC is desi\u00adgned to pro\u00advi\u00adde impro\u00adved per\u00adfor\u00admance while exten\u00adding the low-power cha\u00adrac\u00adte\u00adristics of the cur\u00adrent AMD<\/span> Embedded G\u2011Series SoC fami\u00adly. In addi\u00adti\u00adon, \u201cAdel\u00ada\u00adar\u201d will bring to mar\u00adket the first dis\u00adcrete GPU<\/span> based on AMD<\/span> Gra\u00adphics Core Next archi\u00adtec\u00adtu\u00adre for embedded systems.<\/p>\n

\u201c<\/span>Hierofalcon\u201d CPU<\/span> SoC<\/strong><\/h3>\n

\u201c<\/span>Hier\u00adofal\u00adcon\u201d is the first 64-bit ARM-based plat\u00adform from AMD<\/span> tar\u00adge\u00adting embedded data cen\u00adter appli\u00adca\u00adti\u00adons, com\u00admu\u00adni\u00adca\u00adti\u00adons infra\u00adstruc\u00adtu\u00adre and indus\u00adtri\u00adal solu\u00adti\u00adons. It will include up to eight ARM<\/span> Cortex\u2122-A57 CPUs expec\u00adted to run up to 2.0 GHz, and pro\u00advi\u00addes high-per\u00adfor\u00admance memo\u00adry with two 64-bit DDR3<\/span>\/4 chan\u00adnels with error cor\u00adrec\u00adtion code (ECC<\/span>) for high relia\u00adbi\u00adli\u00adty appli\u00adca\u00adti\u00adons. The high\u00adly inte\u00adgra\u00adted SoC includes 10 Gb KR<\/span> Ether\u00adnet and PCI-Express Gen 3 for high-speed net\u00adwork con\u00adnec\u00adti\u00advi\u00adty, making it ide\u00adal for con\u00adtrol pla\u00adne appli\u00adca\u00adti\u00adons. The \u201cHier\u00adofal\u00adcon\u201d series also pro\u00advi\u00addes enhan\u00adced secu\u00adri\u00adty with sup\u00adport for ARM<\/span> Trust\u00adZo\u00adne\u00ae tech\u00adno\u00adlo\u00adgy and a dedi\u00adca\u00adted cryp\u00adto\u00adgra\u00adphic secu\u00adri\u00adty co-pro\u00adces\u00adsor, alig\u00adning to the increased need for net\u00adwork\u00aded, secu\u00adre sys\u00adtems. \u201cHier\u00adofal\u00adcon\u201d is expec\u00adted to be sam\u00adpling in the second quar\u00adter of 2014 with pro\u00adduc\u00adtion in the second half of the year.<\/p>\n

\u201c<\/span>Bald Eagle\u201d APU<\/span>\/CPU<\/span><\/strong><\/h3>\n

With \u201cBald Eagle,\u201d AMD<\/span> con\u00adti\u00adnues to build on its heri\u00adta\u00adge as a lea\u00adding pro\u00advi\u00adder of x86 solu\u00adti\u00adons for the embedded mar\u00adket. \u201cBald Eagle\u201d is the next gene\u00adra\u00adti\u00adon high-per\u00adfor\u00admance x86-based embedded pro\u00adces\u00adsor available as both an APU<\/span> and CPU<\/span> fea\u00adturing up to four new \u201cSteam\u00adrol\u00adler\u201d CPU<\/span> cores within a 35W<\/span> TDP<\/span>. The APU<\/span> pro\u00adducts will pro\u00advi\u00adde the new power-opti\u00admi\u00adzed AMD<\/span> Rade\u00adon\u2122 Gra\u00adphics Core Next GPU<\/span> archi\u00adtec\u00adtu\u00adre and HSA<\/span> enhance\u00adments for high-per\u00adfor\u00admance embedded appli\u00adca\u00adti\u00adons, making it a supe\u00adri\u00ador solu\u00adti\u00adon for next-gene\u00adra\u00adti\u00adon digi\u00adtal signage and embedded digi\u00adtal gam\u00ading. The \u201cBald Eagle\u201d fami\u00adly will also intro\u00addu\u00adce new power manage\u00adment fea\u00adtures, such as con\u00adfi\u00adgura\u00adble TDP<\/span>, allo\u00adwing engi\u00adneers more design fle\u00adxi\u00adbi\u00adli\u00adty. \u201cBald Eagle\u201d is expec\u00adted to be available in the first half of 2014.<\/p>\n

\u201c<\/span>Adelaar\u201d discrete GPU<\/span><\/strong><\/h3>\n

\u201c<\/span>Adel\u00ada\u00adar\u201d is the next-gene\u00adra\u00adti\u00adon dis\u00adcrete AMD<\/span> Embedded Rade\u00adon GPU<\/span> based on Gra\u00adphics Core Next archi\u00adtec\u00adtu\u00adre spe\u00adci\u00adfi\u00adcal\u00adly desi\u00adgned for embedded appli\u00adca\u00adti\u00adons. Brin\u00adging indus\u00adtry-lea\u00adding per\u00adfor\u00admance to embedded appli\u00adca\u00adti\u00adons, \u201cAdel\u00ada\u00adar\u201d comes as a mar\u00adket-dif\u00adfe\u00adren\u00adtia\u00adting mul\u00adti-chip modu\u00adle (MCM<\/span>) with pre-qua\u00adli\u00adfied and inte\u00adgra\u00adted 2 GB<\/span> of gra\u00adphics memo\u00adry. The \u201cAdel\u00ada\u00adar\u201d GPU<\/span> fami\u00adly will deli\u00adver rich 3D<\/span> gra\u00adphics, mul\u00adti-dis\u00adplay sup\u00adport and sup\u00adport for DirectX\u00ae 11.1, OpenGL 4.2 and both Win\u00addows and Linux. \u201cAdel\u00ada\u00adar\u201d is expec\u00adted to be available in the first half of 2014 with seven years of plan\u00adned sup\u00adp\u00adly avai\u00adla\u00adbi\u00adli\u00adty as an MCM<\/span>, mobi\u00adle PCI<\/span> express modu\u00adle (MXM<\/span>) and stan\u00addard PC<\/span> gra\u00adphics card2<\/sup>.<\/p>\n

With cur\u00adrent and future offe\u00adrings, AMD<\/span> is actively pur\u00adsuing the intel\u00adli\u00adgent embedded device mar\u00adket with a broad eco\u00adsys\u00adtem of soft\u00adware and hard\u00adware part\u00adners sup\u00adport\u00ading mul\u00adti\u00adple ope\u00adra\u00adting sys\u00adtems inclu\u00adding Win\u00addows and Linux. In par\u00adti\u00adcu\u00adlar, the com\u00adpa\u00adny is focu\u00adsing on:<\/p>\n

\u201c<\/span>Steppe Eagle\u201d APU<\/span> SoC<\/strong><\/h3>\n

\u201c<\/span>Step\u00adpe Eagle\u201d will fur\u00adther extend the per\u00adfor\u00admance and low-power ran\u00adge of the cur\u00adrent award-win\u00adning<\/a> AMD<\/span> Embedded G\u2011Series APU<\/span> SoC plat\u00adform with an enhan\u00adced \u201cJagu\u00adar\u201d CPU<\/span> core archi\u00adtec\u00adtu\u00adre and AMD<\/span> Gra\u00adphics Core Next GPU<\/span> archi\u00adtec\u00adtu\u00adre that include new fea\u00adtures for increased CPU<\/span> and GPU<\/span> fre\u00adquen\u00adcy. Desi\u00adgned for low-power embedded appli\u00adca\u00adti\u00adons, \u201cStep\u00adpe Eagle\u201d is desi\u00adgned to offer increased per\u00adfor\u00admance-per-watt both at a lower TDP<\/span> than the cur\u00adrent AMD<\/span> Embedded G\u2011Series APU<\/span> SoC, as well as exten\u00adding the high-end per\u00adfor\u00admance abo\u00adve 2 GHz. \u201cStep\u00adpe Eagle\u201d also pro\u00advi\u00addes embedded design engi\u00adneers the fle\u00adxi\u00adbi\u00adli\u00adty to levera\u00adge the cur\u00adrent AMD<\/span> Embedded G\u2011Series APU<\/span> SoC board design and soft\u00adware stack for a varie\u00adty of appli\u00adca\u00adti\u00adons with foot\u00adprint com\u00adpa\u00adti\u00adbi\u00adli\u00adty. \u201cStep\u00adpe Eagle\u201d is expec\u00adted to be available in the first half of 2014.<\/p>\n