{"id":40837,"date":"2018-10-18T12:31:08","date_gmt":"2018-10-18T10:31:08","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=40837"},"modified":"2018-10-18T12:31:08","modified_gmt":"2018-10-18T10:31:08","slug":"samsung-electronics-starts-production-of-euv-based-7nm-lpp-process","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/40837-samsung-electronics-starts-production-of-euv-based-7nm-lpp-process\/","title":{"rendered":"Samsung Electronics Starts Production of EUV-Based 7nm LPP<\/span> Process"},"content":{"rendered":"

Samsung\u2019s new 7LPP<\/span> allows up to 40% increase in area effi\u00adci\u00aden\u00adcy with 20% hig\u00adher per\u00adfor\u00admance or 50% lower power con\u00adsump\u00adti\u00adon, resul\u00adting in bet\u00adter yields with signi\u00adfi\u00adcant\u00adly fewer layers<\/i><\/p>\n

SEOUL<\/span>, South Korea\u2013(BUSINESS<\/span> WIRE<\/span><\/a>)\u2013Sam\u00adsung Elec\u00adtro\u00adnics Co., Ltd., a world lea\u00adder in advan\u00adced semi\u00adcon\u00adduc\u00adtor tech\u00adno\u00adlo\u00adgy, today announ\u00adced that it has com\u00adple\u00adted all pro\u00adcess tech\u00adno\u00adlo\u00adgy deve\u00adlo\u00adp\u00adment and has star\u00adted wafer pro\u00adduc\u00adtion of its revo\u00adlu\u00adtio\u00adna\u00adry pro\u00adcess node, 7LPP<\/span>, the 7\u2011nanometer (nm) LPP<\/span> (Low Power Plus) with extre\u00adme ultra\u00advio\u00adlet (EUV<\/span>) litho\u00adgra\u00adphy tech\u00adno\u00adlo\u00adgy. The intro\u00adduc\u00adtion of 7LPP<\/span> is a clear demons\u00adtra\u00adti\u00adon of Sam\u00adsung Foundry\u2019s tech\u00adno\u00adlo\u00adgy road\u00admap evo\u00adlu\u00adti\u00adon and pro\u00advi\u00addes cus\u00adto\u00admers with a defi\u00adni\u00adte path to 3nm.<\/p>\n

The com\u00admer\u00adcia\u00adliza\u00adti\u00adon of its newest pro\u00adcess node, 7LPP<\/span> gives cus\u00adto\u00admers the abili\u00adty to build a full ran\u00adge of exci\u00adting new pro\u00adducts that will push the boun\u00adda\u00adries of appli\u00adca\u00adti\u00adons such as 5G<\/span>, Arti\u00adfi\u00adci\u00adal Intel\u00adli\u00adgence, Enter\u00adpri\u00adse and Hypers\u00adca\u00adle Dat\u00ada\u00adcen\u00adter, IoT, Auto\u00admo\u00adti\u00adve, and Networking.<\/p>\n

\u201c<\/span>With the intro\u00adduc\u00adtion of its EUV<\/span> pro\u00adcess node, Sam\u00adsung has led a quiet revo\u00adlu\u00adti\u00adon in the semi\u00adcon\u00adduc\u00adtor indus\u00adtry,\u201d said Char\u00adlie Bae, exe\u00adcu\u00adti\u00adve vice pre\u00adsi\u00addent of foundry sales and mar\u00adke\u00adting team at Sam\u00adsung Elec\u00adtro\u00adnics. \u201cThis fun\u00adda\u00admen\u00adtal shift in how wafers are manu\u00adfac\u00adtu\u00adred gives our cus\u00adto\u00admers the oppor\u00adtu\u00adni\u00adty to signi\u00adfi\u00adcant\u00adly impro\u00adve their pro\u00adducts\u2019 time to mar\u00adket with supe\u00adri\u00ador through\u00adput, redu\u00adced lay\u00aders, and bet\u00adter yields. We\u2019re con\u00adfi\u00addent that 7LPP<\/span> will be an opti\u00admal choice not only for mobi\u00adle and HPC<\/span>, but also for a wide ran\u00adge of cut\u00adting-edge applications.\u201d<\/p>\n

The Cha\u00adrac\u00adte\u00adristics and Bene\u00adfits of EUV<\/span> Technology<\/b><\/p>\n

EUV<\/span> uses 13.5nm wave\u00adlength light to expo\u00adse sili\u00adcon wafers as oppo\u00adsed to con\u00adven\u00adtio\u00adnal argon fluo\u00adri\u00adde (ArF) immersi\u00adon tech\u00adno\u00adlo\u00adgies that are only able to achie\u00adve 193nm wave\u00adlengths and requi\u00adre expen\u00adsi\u00adve mul\u00adti-pat\u00adter\u00adning mask sets. EUV<\/span> enables the use of a sin\u00adgle mask to crea\u00adte a sili\u00adcon wafer lay\u00ader whe\u00adre ArF can requi\u00adre up to 4 masks to crea\u00adte that same lay\u00ader. Con\u00adse\u00adquent\u00adly Samsung\u2019s 7LPP<\/span> pro\u00adcess can redu\u00adce the total num\u00adber of masks by about 20% com\u00adpared to non-EUV pro\u00adcess, enab\u00adling cus\u00adto\u00admers to save time and cost.<\/p>\n

The EUV<\/span> litho\u00adgra\u00adphy impro\u00adve\u00adments also deli\u00adver increased per\u00adfor\u00admance, lower power and smal\u00adler area while impro\u00adving design pro\u00adduc\u00adti\u00advi\u00adty by redu\u00adcing mul\u00adti-pat\u00adter\u00adning com\u00adple\u00adxi\u00adty. Com\u00adpared to its 10nm Fin\u00adFET pre\u00adde\u00adces\u00adsors, Samsung\u2019s 7LPP<\/span> tech\u00adno\u00adlo\u00adgy not only great\u00adly redu\u00adces the pro\u00adcess com\u00adple\u00adxi\u00adty with fewer lay\u00aders and bet\u00adter yields, but also deli\u00advers up to a 40% increase in area effi\u00adci\u00aden\u00adcy with 20% hig\u00adher per\u00adfor\u00admance or up to 50% lower power consumption.<\/p>\n

The Road to EUV<\/span> Technology<\/b><\/p>\n

Sin\u00adce Samsung\u2019s rese\u00adarch and deve\u00adlo\u00adp\u00adment in EUV<\/span> began in the 2000s, the com\u00adpa\u00adny has made out\u00adstan\u00adding pro\u00adgress through col\u00adla\u00adbo\u00adra\u00adti\u00adve part\u00adner\u00adships with indus\u00adtry-lea\u00adding tool pro\u00advi\u00adders to design and install com\u00adple\u00adte\u00adly new equip\u00adment in its manu\u00adfac\u00adtu\u00adring faci\u00adli\u00adties to ensu\u00adre the sta\u00adbi\u00adli\u00adty of EUV<\/span> wafers. The initi\u00adal EUV<\/span> pro\u00adduc\u00adtion has star\u00adted in Samsung\u2019s S3<\/span> Fab in Hwa\u00adse\u00adong, Korea.<\/p>\n

By 2020, Sam\u00adsung expects to secu\u00adre addi\u00adtio\u00adnal capa\u00adci\u00adty with a new EUV<\/span> line for cus\u00adto\u00admers who need high-volu\u00adme manu\u00adfac\u00adtu\u00adring for next-gene\u00adra\u00adti\u00adon chip designs. As an EUV<\/span> pio\u00adneer, Sam\u00adsung has also deve\u00adlo\u00adped pro\u00adprie\u00adta\u00adry capa\u00adbi\u00adli\u00adties such as a uni\u00adque mask inspec\u00adtion tool that per\u00adforms ear\u00adly defect detec\u00adtion in EUV<\/span> masks, allo\u00adwing tho\u00adse defects to be eli\u00admi\u00adna\u00adted ear\u00adly in the manu\u00adfac\u00adtu\u00adring cycle.<\/p>\n

\u201c<\/span>Com\u00admer\u00adcia\u00adliza\u00adti\u00adon of EUV<\/span> tech\u00adno\u00adlo\u00adgy is a revo\u00adlu\u00adti\u00adon for the semi\u00adcon\u00adduc\u00adtor indus\u00adtry and will have a huge impact on our ever\u00ady\u00adday lives,\u201d said Peter Jenk\u00adins, vice pre\u00adsi\u00addent of cor\u00adpo\u00adra\u00adte mar\u00adke\u00adting at ASML<\/span>. \u201cIt is our gre\u00adat plea\u00adsu\u00adre to col\u00adla\u00adbo\u00adra\u00adte with Sam\u00adsung and other lea\u00adding chip makers on this fun\u00adda\u00admen\u00adtal shift in semi\u00adcon\u00adduc\u00adtor pro\u00adcess manufacturing.\u201d<\/p>\n

7nm LPP<\/span> EUV<\/span> Ecosystem<\/b><\/p>\n

The Sam\u00adsung Advan\u00adced Foundry Eco\u00adsys\u00adtem\u2122 is also ful\u00adly pre\u00adpared for the intro\u00adduc\u00adtion of 7LPP<\/span> with EUV<\/span>. Eco\u00adsys\u00adtem part\u00adners across the indus\u00adtry will be pro\u00advi\u00adding Foun\u00adda\u00adti\u00adon and Advan\u00adced IP<\/span>, Advan\u00adced Pack\u00ada\u00adging, and Ser\u00advices to ful\u00adly enable Sam\u00adsung cus\u00adto\u00admers to deve\u00adlop their pro\u00adducts on this new plat\u00adform. From high-per\u00adfor\u00admance and high-den\u00adsi\u00adty stan\u00addard cells to HBM2<\/span>\/2e memo\u00adry inter\u00adfaces and 112G<\/span> Ser\u00adDes inter\u00adfaces, SAFE<\/span>\u2122 is rea\u00addy to help cus\u00adto\u00admers imple\u00adment their designs on 7LPP<\/span>.<\/p>\n

Fol\u00adlo\u00adwing its US<\/span>, Chi\u00adna, Korea, and Japan events, Sam\u00adsung will hold the year\u2019s final Foundry Forum on Octo\u00adber 18, in Munich, Ger\u00adma\u00adny for Euro\u00adpean cus\u00adto\u00admers and part\u00adners. For more infor\u00adma\u00adti\u00adon about Sam\u00adsung Foundry, plea\u00adse visit https:\/\/www.samsungfoundry.com<\/a><\/p>\n

About Sam\u00adsung Elec\u00adtro\u00adnics Co., Ltd.<\/b><\/span><\/p>\n

Sam\u00adsung inspi\u00adres the world and shapes the future with trans\u00adfor\u00adma\u00adti\u00adve ide\u00adas and tech\u00adno\u00adlo\u00adgies. The com\u00adpa\u00adny is rede\u00adfi\u00adning the worlds of TVs, smart\u00adphones, weara\u00adble devices, tablets, digi\u00adtal appli\u00adances, net\u00adwork sys\u00adtems, and memo\u00adry, sys\u00adtem LSI<\/span>, foundry and LED<\/span> solu\u00adti\u00adons. For the latest news, plea\u00adse visit the Sam\u00adsung News\u00adroom at http:\/\/news.samsung.com<\/a>.<\/p>\n

 <\/p>\n

 <\/p>\n","protected":false},"excerpt":{"rendered":"

Samsung\u2019s new 7LPP<\/span> allows up to 40% increase in area effi\u00adci\u00aden\u00adcy with 20% hig\u00adher per\u00adfor\u00admance or 50% lower power con\u00adsump\u00adti\u00adon, resul\u00adting in bet\u00adter yields with signi\u00adfi\u00adcant\u00adly fewer lay\u00aders (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[1445,957,1605,1022],"class_list":["post-40837","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-7nm","tag-chipfertigung","tag-euv","tag-samsung","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/40837","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=40837"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/40837\/revisions"}],"predecessor-version":[{"id":40838,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/40837\/revisions\/40838"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=40837"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=40837"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=40837"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}