{"id":49406,"date":"2019-08-07T17:41:51","date_gmt":"2019-08-07T15:41:51","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=49406"},"modified":"2019-08-07T17:41:51","modified_gmt":"2019-08-07T15:41:51","slug":"globalfoundries-and-arm-demonstrate-high-density-3d-stack-test-chip-for-high-performance-compute-applications","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/49406-globalfoundries-and-arm-demonstrate-high-density-3d-stack-test-chip-for-high-performance-compute-applications\/","title":{"rendered":"GLOBALFOUNDRIES<\/span> and Arm Demonstrate High-Density 3D<\/span> Stack Test Chip for High Performance Compute Applications"},"content":{"rendered":"

Aug 07, 2019<\/p>\n

\n
\n
\n
\n
\n
\n
\n
\n

Arm\u2019s inter\u00adcon\u00adnect tech\u00adno\u00adlo\u00adgy on GF<\/span>\u2019s 12LP<\/span> pro\u00adcess enables high per\u00adfor\u00admance and low laten\u00adcy, while incre\u00adasing band\u00adwidth for high core designs in AI<\/span>, Cloud Com\u00adpu\u00adting and Mobi\u00adle SoCs<\/em><\/p>\n

San\u00adta Cla\u00adra, Calif. and Cam\u00adbridge, UK<\/span>, August 7, 2019 <\/strong>\u2013 GLOBALFOUNDRIES<\/span>, the world\u2019s lea\u00adding spe\u00adcial\u00adty foundry, today announ\u00adced that it has taped-out an Arm\u00ae-based 3D<\/span> high-den\u00adsi\u00adty test chip that will enable a new level of sys\u00adtem per\u00adfor\u00admance and power effi\u00adci\u00aden\u00adcy for com\u00adpu\u00adting appli\u00adca\u00adti\u00adons such as AI<\/span>\/ML<\/span> and high-end con\u00adsu\u00admer mobi\u00adle and wire\u00adless solu\u00adti\u00adons. The new chip was fabri\u00adca\u00adted using GF<\/span>\u2019s 12nm Lea\u00adding-Per\u00adfor\u00admance (12LP<\/span>) Fin\u00adFET pro\u00adcess and fea\u00adtures Arm\u2019s mesh inter\u00adcon\u00adnect tech\u00adno\u00adlo\u00adgy in 3D<\/span> that allows data to take a more direct path to other cores, mini\u00admi\u00adzing laten\u00adcy while incre\u00adasing data trans\u00adfer rates as deman\u00added by data cen\u00adters, edge com\u00adpu\u00adting and high-end con\u00adsu\u00admer applications. <\/p>\n

The deli\u00advery of this chip demons\u00adtra\u00adtes the fast pro\u00adgress that Arm and GF<\/span> are making in rese\u00adar\u00adching and deve\u00adlo\u00adping dif\u00adfe\u00adren\u00adtia\u00adted solu\u00adti\u00adons that enable impro\u00adve\u00adments in device den\u00adsi\u00adty and per\u00adfor\u00admance for sca\u00adlable high-per\u00adfor\u00admance com\u00adpu\u00adting. Moreo\u00adver, the com\u00adpa\u00adnies vali\u00adda\u00adted a 3D<\/span> Design-for-Test (DFT<\/span>) metho\u00addo\u00adlo\u00adgy, using GF<\/span>\u2019s hybrid wafer-to-wafer bon\u00adding that can enable up to 1 mil\u00adli\u00adon 3D<\/span> con\u00adnec\u00adtions per mm2, exten\u00adding the abili\u00adty to sca\u00adle 12nm designs long into the future.<\/p>\n

\u201c<\/span>Arm\u2019s inter\u00adcon\u00adnect tech\u00adno\u00adlo\u00adgy in 3D<\/span> enables the semi\u00adcon\u00adduc\u00adtor indus\u00adtry to aug\u00adment Moore\u2019s Law to address a grea\u00adter diver\u00adsi\u00adty of com\u00adpu\u00adting appli\u00adca\u00adti\u00adons,\u201d said Eric Hen\u00adnen\u00adhoe\u00adfer, vice pre\u00adsi\u00addent, Arm Rese\u00adarch. \u201cGF<\/span>\u2019s exper\u00adti\u00adse in fabri\u00adca\u00adti\u00adon and advan\u00adced pack\u00ada\u00adging capa\u00adbi\u00adli\u00adties, com\u00adbi\u00adned with Arm tech\u00adno\u00adlo\u00adgy, gives our mutu\u00adal part\u00adners addi\u00adtio\u00adnal dif\u00adfe\u00adren\u00adtia\u00adti\u00adon to ven\u00adture into new para\u00addigms for next gene\u00adra\u00adti\u00adon, high-per\u00adfor\u00admance computing.\u201d<\/p>\n

\u201c<\/span>In the era of big data and cogni\u00adti\u00adve com\u00adpu\u00adting, advan\u00adced pack\u00ada\u00adging is play\u00ading a much lar\u00adger role than it has in the past. The use of AI<\/span> and the need for power-effi\u00adci\u00adent, high-through\u00adput inter\u00adcon\u00adnect is dri\u00adving the growth of acce\u00adle\u00adra\u00adtors through advan\u00adced pack\u00ada\u00adging,\u201d said John Pel\u00adle\u00adrin, chief tech\u00adno\u00adlo\u00adgist, plat\u00adforms at GF<\/span>.   \u201cWe are deligh\u00adted to be working with inno\u00adva\u00adti\u00adve part\u00adners such as Arm to deli\u00adver advan\u00adced pack\u00ada\u00adging solu\u00adti\u00adons which fur\u00adther enable inte\u00adgra\u00adting various node tech\u00adno\u00adlo\u00adgies opti\u00admi\u00adzed for logic sca\u00adling, memo\u00adry band\u00adwidth and RF<\/span> per\u00adfor\u00admance in a small form fac\u00adtor. This work will allow us to unco\u00adver new insights in advan\u00adced pack\u00ada\u00adging that will enable our mutu\u00adal cli\u00adents to crea\u00adte com\u00adple\u00adte, dif\u00adfe\u00adren\u00adtia\u00adted solu\u00adti\u00adons more efficiently.\u201d<\/p>\n

GF<\/span>\u2019s busi\u00adness model has trans\u00adfor\u00admed to enable its cli\u00adents to deve\u00adlop new mar\u00adket and appli\u00adca\u00adti\u00adon-focu\u00adsed solu\u00adti\u00adons spe\u00adci\u00adfi\u00adcal\u00adly desi\u00adgned to meet the requi\u00adre\u00adments of today\u2019s deman\u00adding mar\u00adkets. GF<\/span>\u2019s 3D<\/span> face-to-face (F2F<\/span>) pack\u00ada\u00adging solu\u00adti\u00adon not only pro\u00advi\u00addes desi\u00adgners a path to hete\u00adro\u00adge\u00adneous logic and logic\/memory inte\u00adgra\u00adti\u00adon, but can be manu\u00adfac\u00adtu\u00adred using an opti\u00admum pro\u00adduc\u00adtion node that enables lower laten\u00adcy, hig\u00adher band\u00adwidth and smal\u00adler fea\u00adture sizes. This approach, along with enga\u00adging ear\u00adly with part\u00adners such as Arm, gives cli\u00adents maxi\u00admum choice and fle\u00adxi\u00adbi\u00adli\u00adty, while deli\u00adve\u00adring cost savings and fas\u00adter time-to-volu\u00adme for their next-gene\u00adra\u00adti\u00adon products.<\/p>\n

For more infor\u00adma\u00adti\u00adon, go to globalfoundries.com<\/a>. <\/p>\n

About GLOBALFOUNDRIES<\/span><\/strong><\/p>\n

GLOBALFOUNDRIES<\/span> (GF<\/span>) is the world\u2019s lea\u00adding spe\u00adcial\u00adty foundry. We deli\u00adver dif\u00adfe\u00adren\u00adtia\u00adted fea\u00adture-rich solu\u00adti\u00adons that enable our cli\u00adents to deve\u00adlop inno\u00adva\u00adti\u00adve pro\u00adducts for high-growth mar\u00adket seg\u00adments. GF<\/span> pro\u00advi\u00addes a broad ran\u00adge of plat\u00adforms and fea\u00adtures with a uni\u00adque mix of design, deve\u00adlo\u00adp\u00adment and fabri\u00adca\u00adti\u00adon ser\u00advices. With an at-sca\u00adle manu\u00adfac\u00adtu\u00adring foot\u00adprint span\u00adning the U.S., Euro\u00adpe and Asia, GF<\/span> has the fle\u00adxi\u00adbi\u00adli\u00adty and agi\u00adli\u00adty to meet the dyna\u00admic needs of cli\u00adents across the glo\u00adbe. GF<\/span> is owned by Muba\u00add\u00ada\u00adla Invest\u00adment Com\u00adpa\u00adny. For more infor\u00adma\u00adti\u00adon, visit globalfoundries.com<\/a>.<\/p>\n

About Arm<\/strong><\/p>\n

Arm tech\u00adno\u00adlo\u00adgy is at the heart of a com\u00adpu\u00adting and con\u00adnec\u00adti\u00advi\u00adty revo\u00adlu\u00adti\u00adon that is trans\u00adforming the way peo\u00adp\u00adle live and busi\u00adnesses ope\u00adra\u00adte. Our advan\u00adced, ener\u00adgy-effi\u00adci\u00adent pro\u00adces\u00adsor designs have enab\u00adled intel\u00adli\u00adgent com\u00adpu\u00adting in more than 145 bil\u00adli\u00adon chips and our tech\u00adno\u00adlo\u00adgies now secu\u00adre\u00adly power pro\u00adducts from the sen\u00adsor to the smart\u00adphone and the super\u00adcom\u00adpu\u00adter. In com\u00adbi\u00adna\u00adti\u00adon with our IoT device, con\u00adnec\u00adti\u00advi\u00adty and data manage\u00adment plat\u00adform, we are also enab\u00adling cus\u00adto\u00admers with powerful and actionable busi\u00adness insights that are gene\u00adra\u00adting new value from their con\u00adnec\u00adted devices and data. Tog\u00ade\u00adther with 1,000+ tech\u00adno\u00adlo\u00adgy part\u00adners we are at the fore\u00adfront of desig\u00adning, secu\u00adring and mana\u00adging all are\u00adas of com\u00adpu\u00adte from the chip to the cloud.<\/p>\n

All infor\u00adma\u00adti\u00adon is pro\u00advi\u00added \u201cas is\u201d and wit\u00adhout war\u00adran\u00adty or repre\u00adsen\u00adta\u00adti\u00adon. This docu\u00adment may be shared free\u00adly, attri\u00adbu\u00adted and unmo\u00addi\u00adfied. Arm is a regis\u00adtered trade\u00admark of Arm Limi\u00adt\u00aded (or its sub\u00adsi\u00addia\u00adries). All brands or pro\u00adduct names are the pro\u00adper\u00adty of their respec\u00adti\u00adve hol\u00adders. \u00a9 1995\u20132019 Arm Group.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"

Aug 07, 2019 Arm\u2019s inter\u00adcon\u00adnect tech\u00adno\u00adlo\u00adgy on GF<\/span>\u2019s 12LP<\/span> pro\u00adcess enables high per\u00adfor\u00admance and low laten\u00adcy, while incre\u00adasing band\u00adwidth for high core designs in AI<\/span>, Cloud Com\u00adpu\u00adting and Mobi\u00adle SoCs San\u00adta Cla\u00adra, Calif. and Cam\u00adbridge, UK<\/span>, August 7, 2019 \u2013 GLOBALFOUNDRIES<\/span>, the world\u2019s lea\u00adding spe\u00adcial\u00adty foundry, today announ\u00adced that it has taped-out an Arm\u00ae-based 3D<\/span> high-den\u00ad\u00adsi\u00ad\u00adty test chip (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[1803,1010,1015],"class_list":["post-49406","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-3d-stacking","tag-arm","tag-globalfoundries","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/49406","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=49406"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/49406\/revisions"}],"predecessor-version":[{"id":49407,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/49406\/revisions\/49407"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=49406"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=49406"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=49406"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}