{"id":50243,"date":"2019-08-19T08:41:54","date_gmt":"2019-08-19T06:41:54","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=50243"},"modified":"2019-08-19T08:42:18","modified_gmt":"2019-08-19T06:42:18","slug":"hot-chips-31-mit-keynote-von-amd-ceo-dr-lisa-su-vortraege-zu-zen-2-und-navi","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/50243-hot-chips-31-mit-keynote-von-amd-ceo-dr-lisa-su-vortraege-zu-zen-2-und-navi\/","title":{"rendered":"Hot Chips 31 mit Keynote von <span class=\"caps\">AMD<\/span> <span class=\"caps\">CEO<\/span> Dr. Lisa Su \u2014 Vortr\u00e4ge zu Zen 2 und&nbsp;Navi"},"content":{"rendered":"<p>Auf der heu\u00adte an der Uni\u00adver\u00adsi\u00adt\u00e4t Stan\u00adford star\u00adten\u00adden Kon\u00adfe\u00adrenz <a href=\"https:\/\/www.hotchips.org\" target=\"_blank\" rel=\"noopener noreferrer\">Hot Chips 31<\/a> wird Dr. Lisa Su \u2014 <span class=\"caps\">CEO<\/span> und Pr\u00e4\u00adsi\u00addent von <span class=\"caps\">AMD<\/span> \u2014 die Key\u00adnote des ers\u00adten Tages zum The\u00adma \u201cDeli\u00adve\u00adring the Future of High-Per\u00adfor\u00admance Com\u00adpu\u00adting with Sys\u00adtem, Soft\u00adware and Sili\u00adcon Co-Opti\u00admiza\u00adti\u00adon\u201d hal\u00adten. Zus\u00e4tz\u00adlich wird es Vor\u00adtr\u00e4\u00adge zu den The\u00admen Zen 2 und Navi&nbsp;geben.<\/p>\n<h3>Keynote von <span class=\"caps\">AMD<\/span> <span class=\"caps\">CEO<\/span> Lisa&nbsp;Su<\/h3>\n<p>Dr. Lisa Su wird die Key\u00adnote zur Hot Chips 31 um 13.45 Uhr Orts\u00adzeit (22.45 Uhr in Deutsch\u00adland) hal\u00adten und \u00fcber die M\u00f6g\u00adlich\u00adkei\u00adten k\u00fcnf\u00adti\u00adger Gene\u00adra\u00adtio\u00adnen an Com\u00adpu\u00adting- und Gra\u00adfik\u00adpro\u00adduk\u00adten, bes\u00adse\u00adre Per\u00adfor\u00admance mit mehr Effi\u00adzi\u00adenz zu bie\u00adten,&nbsp;reden.&nbsp;<\/p>\n<blockquote>\n<h2 id=\"delivering-the-future-of-high-performance-computing-with-system-software-and-silicon-co-optimization\">Delivering the Future of High-Performance Computing with System, Software and Silicon Co-Optimization<\/h2>\n<ul>\n<li>Dr. Lisa Su, <span class=\"caps\">CEO<\/span>,&nbsp;<span class=\"caps\">AMD<\/span><\/li>\n<li>Mon 8\/19\/2019, 1:45 <span class=\"caps\">PM<\/span> \u2013 2:45&nbsp;<span class=\"caps\">PM<\/span><\/li>\n<\/ul>\n<p><strong>Abs\u00adtract:<\/strong> From medi\u00adci\u00adne to the fron\u00adtiers of sci\u00aden\u00adti\u00adfic rese\u00adarch, manu\u00adfac\u00adtu\u00adring and enter\u00adtain\u00adment \u2013 the demand for com\u00adpu\u00adting and gra\u00adphics tech\u00adno\u00adlo\u00adgies con\u00adti\u00adnues gro\u00adwing. While we are ente\u00adring a gol\u00adden age of high-per\u00adfor\u00admance com\u00adpu\u00adting, it is incre\u00adasing\u00adly clear that the tech\u00adni\u00adques the indus\u00adtry has used to reach this point will not deli\u00adver simi\u00adlar advan\u00adces over the coming years. As the gains from Moore\u2019s Law have slo\u00adwed in recent years, the indus\u00adtry has begun to focus on new are\u00adas of inno\u00adva\u00adti\u00adon to main\u00adtain the his\u00adto\u00adri\u00adcal pace of per\u00adfor\u00admance impro\u00adve\u00adments. <span class=\"caps\">AMD<\/span> <span class=\"caps\">CEO<\/span> Lisa Su will dis\u00adcuss new tech\u00adni\u00adques in sys\u00adtem archi\u00adtec\u00adtu\u00adre, sili\u00adcon design and soft\u00adware that will enable future gene\u00adra\u00adti\u00adons of com\u00adpu\u00adting and gra\u00adphics pro\u00adducts to deli\u00adver more per\u00adfor\u00admance with grea\u00adter efficiency.<\/p><\/blockquote>\n<p>Einen Web\u00adcast dazu d\u00fcrf\u00adte es nicht geben, da die Hot Chips eine kos\u00adten\u00adpflich\u00adti\u00adge Ver\u00adan\u00adstal\u00adtung ist, bei der die Teil\u00adnah\u00adme bis zu 750 US-Dol\u00adlar kos\u00adten kann. Vide\u00ados von den Vor\u00adtr\u00e4\u00adgen der letzt\u00adj\u00e4h\u00adri\u00adgen Hot Chips 30 wur\u00adden so zum Bei\u00adspiel erst im letz\u00adten Dezem\u00adber ver\u00ad\u00f6f\u00adfent\u00adlicht (<a href=\"https:\/\/www.planet3dnow.de\/cms\/42107-amd-raven-ridge-apu-praesentation-hot-chips-30-vom-20-8-2018\/\">Raven Ridge Pr\u00e4\u00adsen\u00adta\u00adti\u00adon Hot Chips 30<\/a>). Aller\u00addings sind eini\u00adge Pres\u00adse\u00adver\u00adtre\u00adter vor Ort, bei Anand\u00adtech d\u00fcrf\u00adte es eine zeit\u00adna\u00adhe Bericht\u00aderstat\u00adtung&nbsp;geben<\/p>\n<h3><strong>Vortr\u00e4ge zu Zen 2 und&nbsp;Navi<\/strong><\/h3>\n<p>Im <a href=\"https:\/\/www.hotchips.org\/program\/\" target=\"_blank\" rel=\"noopener noreferrer\">Pro\u00adgramm der Hot Chips 31<\/a> wer\u00adden dann die kom\u00admen\u00adde Pro\u00adduk\u00adte von <span class=\"caps\">AMD<\/span> in Form von Zen 2 und der \u201cNavi\u201d-Architektur in sepa\u00adra\u00adten Vor\u00adtr\u00e4\u00adgen behandelt:<\/p>\n<ul>\n<li>Zen 2 \u2014 Mon\u00adtag, 19. August 2019 um 09:00 Uhr Orts\u00adzeit: <span class=\"caps\">AMD<\/span> gibt einen \u00dcber\u00adblick zur n\u00e4chs\u00adten Gene\u00adra\u00adti\u00adon der 7nm \u201eZen 2\u201c Kern\u00adar\u00adchi\u00adtek\u00adtur, die in der drit\u00adten Gene\u00adra\u00adti\u00adon der Ryzen Desk\u00adtop-Pro\u00adzes\u00adso\u00adren und der zwei\u00adten Gene\u00adra\u00adti\u00adon der EPYC-Ser\u00adver zum Ein\u00adsatz kom\u00admen&nbsp;wird<\/li>\n<li>Navi&nbsp; Diens\u00adtag, 20. August um 18:15 Uhr Orts\u00adzeit: <span class=\"caps\">AMD<\/span> zeigt eine Pr\u00e4\u00adsen\u00adta\u00adti\u00adon zur \u201eNavi\u201c GPU-Archi\u00adtek\u00adtur und der Imple\u00admen\u00adtie\u00adrung der 7nm-Technologie<\/li>\n<\/ul>\n<p>Die Key\u00adnote des zwei\u00adten Tages wird von Dr. Phil\u00adip Wong, Vize\u00adpr\u00e4\u00adsi\u00addent Cor\u00adpo\u00adra\u00adte Rese\u00adarch bei <span class=\"caps\">TSMC<\/span> \u2014 dem Pro\u00addu\u00adzen\u00adten der 7nm-Pro\u00adduk\u00adte von <span class=\"caps\">AMD<\/span> \u2014 zum The\u00adma \u201cWhat Will the Next Node Offer Us?\u201d gehalten.<\/p>\n<blockquote>\n<h2 id=\"what-will-the-next-node-offer-us\">What Will the Next Node Offer&nbsp;Us?<\/h2>\n<ul>\n<li>Dr. Phil\u00adip Wong, <span class=\"caps\">VP<\/span> Cor\u00adpo\u00adra\u00adte Rese\u00adarch,&nbsp;<span class=\"caps\">TSMC<\/span><\/li>\n<li>Tue 8\/20\/2019, 1:45 <span class=\"caps\">PM<\/span> \u2013 2:45&nbsp;<span class=\"caps\">PM<\/span><\/li>\n<\/ul>\n<p><strong>Abs\u00adtract:<\/strong> The power-per\u00adfor\u00admance-area (and cost) advan\u00adces in the last five deca\u00addes have most\u00adly been achie\u00adved through dimen\u00adsio\u00adnal sca\u00adling of the tran\u00adsis\u00adtor. What will the semi\u00adcon\u00adduc\u00adtor indus\u00adtry do after dimen\u00adsio\u00adnal sca\u00adling of the sili\u00adcon tran\u00adsis\u00adtor cros\u00adses the nano\u00adme\u00adter thres\u00adhold, from 16\/12 nm, 10 nm, 7 nm, 5 nm, 3 nm, 2 nm, 1.4 nm to sizes below a nano\u00adme\u00adter? Will the\u00adse advan\u00adced logic tech\u00adno\u00adlo\u00adgies con\u00adti\u00adnue to pro\u00advi\u00adde the ener\u00adgy effi\u00adci\u00aden\u00adcy requi\u00adred of future com\u00adpu\u00adting sys\u00adtems? Will new appli\u00adca\u00adti\u00adons and com\u00adpu\u00adta\u00adti\u00adon workloads demand new device tech\u00adno\u00adlo\u00adgies and their inte\u00adgra\u00adti\u00adon into future sys\u00adtems? The\u00adse are some of the most pres\u00adsing ques\u00adti\u00adons facing the semi\u00adcon\u00adduc\u00adtor indus\u00adtry&nbsp;today.<\/p>\n<p>The path for <span class=\"caps\">IC<\/span> tech\u00adno\u00adlo\u00adgy deve\u00adlo\u00adp\u00adment going for\u00adward is no lon\u00adger a straight line. The need for out-of-the-box solu\u00adti\u00adons ushers in a gol\u00adden age of inno\u00adva\u00adti\u00adon. I will give an over\u00adview of the memo\u00adry and logic device inno\u00adva\u00adtions that are in the rese\u00adarch pipe\u00adline today. Future elec\u00adtro\u00adnic sys\u00adtems requi\u00adre co-inno\u00adva\u00adti\u00adon of the com\u00adpu\u00adting archi\u00adtec\u00adtu\u00adre and device tech\u00adno\u00adlo\u00adgy. I will spe\u00adcu\u00adla\u00adte on how they will be inte\u00adgra\u00adted into future elec\u00adtro\u00adnic systems.<\/p><\/blockquote>\n<h3><strong>Was gibt es noch auf der Hot Chips&nbsp;31?<\/strong><\/h3>\n<p>Wei\u00adte\u00adre inter\u00ades\u00adsan\u00adte Vor\u00adtr\u00e4\u00adge aus dem Programm&nbsp;:<\/p>\n<ul>\n<li><span class=\"caps\">IBM<\/span>\u2019s Next Gene\u00adra\u00adti\u00adon <span class=\"caps\">POWER<\/span> Processor<\/li>\n<li>Intel Opta\u00adne<\/li>\n<li>Spring Hill \u2013 Intel\u2019s Data Cen\u00adter Infe\u00adrence&nbsp;Chip<\/li>\n<li>A Gen\u2011Z Chip\u00adset for Exas\u00adca\u00adle Fabrics<\/li>\n<li><span class=\"caps\">RTX<\/span> <span class=\"caps\">ON<\/span>: The <span class=\"caps\">NVIDIA<\/span> Turing <span class=\"caps\">GPU<\/span> Architecture<\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>Auf der heu\u00adte an der Uni\u00adver\u00adsi\u00adt\u00e4t Stan\u00adford star\u00adten\u00adden Kon\u00adfe\u00adrenz <a href=\"https:\/\/www.hotchips.org\" target=\"_blank\" rel=\"noopener noreferrer\">Hot Chips 31<\/a> wird Dr. Lisa Su \u2014 <span class=\"caps\">CEO<\/span> und Pr\u00e4\u00adsi\u00addent von <span class=\"caps\">AMD<\/span> \u2014 die Key\u00adnote des ers\u00adten Tages zum The\u00adma \u201cDeli\u00adve\u00adring the Future of High-Per\u00adfor\u00admance Com\u00adpu\u00adting with Sys\u00adtem, Soft\u00adware and Sili\u00adcon Co-Opti\u00admiza\u00adti\u00adon\u201d hal\u00adten. Zus\u00e4tz\u00adlich wird es Vor\u00adtr\u00e4\u00adge zu den The\u00admen Zen 2 und Navi geben. (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/50243-hot-chips-31-mit-keynote-von-amd-ceo-dr-lisa-su-vortraege-zu-zen-2-und-navi\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":80,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[12],"tags":[966,1553,1918,1167,1308],"class_list":["post-50243","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-aktuelles","tag-amd","tag-dr-lisa-su","tag-hot-chips-31","tag-navi","tag-zen-2","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/50243","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=50243"}],"version-history":[{"count":3,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/50243\/revisions"}],"predecessor-version":[{"id":50246,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/50243\/revisions\/50246"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media\/80"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=50243"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=50243"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=50243"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}