{"id":51707,"date":"2019-10-07T14:13:10","date_gmt":"2019-10-07T12:13:10","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=51707"},"modified":"2019-10-07T14:13:10","modified_gmt":"2019-10-07T12:13:10","slug":"tsmcs-n7-technology-is-first-euv-process-delivering-customer-products-to-market-in-high-volume","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/51707-tsmcs-n7-technology-is-first-euv-process-delivering-customer-products-to-market-in-high-volume\/","title":{"rendered":"TSMC<\/span>\u2019s N7<\/span>+ Technology is First EUV<\/span> Process Delivering Customer Products to Market in High Volume"},"content":{"rendered":"

Hsin\u00adchu, Tai\u00adwan R.O.C., Oct 7, 2019 \u2013 <\/b>TSMC<\/span> (TWSE<\/span>: 2330, NYSE<\/span>: TSM<\/span>) today announ\u00adced that its seven-nano\u00adme\u00adter plus (N7<\/span>+), the industry\u2019s first com\u00admer\u00adci\u00adal\u00adly available Extre\u00adme Ultra\u00advio\u00adlet (EUV<\/span>) litho\u00adgra\u00adphy tech\u00adno\u00adlo\u00adgy, is deli\u00adve\u00adring cus\u00adto\u00admer pro\u00adducts to mar\u00adket in high volu\u00adme. The N7<\/span>+ pro\u00adcess with EUV<\/span> tech\u00adno\u00adlo\u00adgy is built on TSMC<\/span>\u2019s suc\u00adcessful 7nm node and paves the way for 6nm and more advan\u00adced technologies.<\/p>\n

The N7<\/span>+ volu\u00adme pro\u00adduc\u00adtion is one of the fas\u00adtest on record. N7<\/span>+, which began volu\u00adme pro\u00adduc\u00adtion in the second quar\u00adter of 2019, is matching yields simi\u00adlar to the ori\u00adgi\u00adnal N7<\/span> pro\u00adcess that has been in volu\u00adme pro\u00adduc\u00adtion for more than one year.<\/p>\n

N7<\/span>+ is also pro\u00advi\u00adding impro\u00adved over\u00adall per\u00adfor\u00admance. When com\u00adpared to the N7<\/span> pro\u00adcess, N7<\/span>+ pro\u00advi\u00addes 15% to 20% more den\u00adsi\u00adty and impro\u00adved power con\u00adsump\u00adti\u00adon, making it an incre\u00adasing\u00adly popu\u00adlar choice for the industry\u2019s next-wave pro\u00adducts. TSMC<\/span> has been quick\u00adly deploy\u00ading capa\u00adci\u00adty to meet N7<\/span>+ demand that is being dri\u00adven by mul\u00adti\u00adple customers.<\/p>\n

EUV<\/span> tech\u00adno\u00adlo\u00adgy enables TSMC<\/span> to keep dri\u00adving chip sca\u00adling as the shorter wave\u00adlength of EUV<\/span> light is bet\u00adter able to print the nano\u00adme\u00adter-sca\u00adle fea\u00adtures of advan\u00adced tech\u00adno\u00adlo\u00adgy designs. TSMC<\/span>\u2019s EUV<\/span> tools have rea\u00adched pro\u00adduc\u00adtion matu\u00adri\u00adty, with tool avai\u00adla\u00adbi\u00adli\u00adty rea\u00adching tar\u00adget goals for high-volu\u00adme pro\u00adduc\u00adtion, and out\u00adput power of grea\u00adter than 250 watts for day-to-day operations.<\/p>\n

\u201c<\/span>With AI<\/span> and 5G<\/span> unlo\u00adcking so many new ways for ICs to impro\u00adve our lives, our cus\u00adto\u00admers are full of inno\u00adva\u00adti\u00adve lea\u00adding-edge design ide\u00adas, and they are rely\u00ading on TSMC<\/span>\u2019s tech\u00adno\u00adlo\u00adgy and manu\u00adfac\u00adtu\u00adring to make them real,\u201d said Dr. Kevin Zhang, TSMC<\/span> Vice Pre\u00adsi\u00addent of Busi\u00adness Deve\u00adlo\u00adp\u00adment. \u201cOur suc\u00adcess in EUV<\/span> is ano\u00adther gre\u00adat exam\u00adp\u00adle of how TSMC<\/span> not only makes tho\u00adse lea\u00adding-edge designs pos\u00adsi\u00adble, but also deli\u00advers in high volu\u00adme with our manu\u00adfac\u00adtu\u00adring excellence.\u201d<\/p>\n

Buil\u00adding on its suc\u00adcessful expe\u00adri\u00adence, N7<\/span>+ sets a path for future advan\u00adced pro\u00adcess technologies.<\/p>\n

TSMC<\/span> will bring N6<\/span> tech\u00adno\u00adlo\u00adgy into risk pro\u00adduc\u00adtion in the first quar\u00adter of 2020 for volu\u00adme pro\u00adduc\u00adtion by the end of the year. With fur\u00adther appli\u00adca\u00adti\u00adon of EUV<\/span>, N6<\/span> will offer 18% hig\u00adher logic den\u00adsi\u00adty over N7<\/span>, and design rules ful\u00adly com\u00adpa\u00adti\u00adble with N7<\/span> enable cus\u00adto\u00admers to great\u00adly shor\u00adten time-to-market.<\/p>\n

About TSMC<\/span><\/b>
\nTSMC<\/span> pio\u00adnee\u00adred the pure-play foundry busi\u00adness model when it was foun\u00added in 1987, and has been the world\u2019s lar\u00adgest dedi\u00adca\u00adted semi\u00adcon\u00adduc\u00adtor foundry ever sin\u00adce. The com\u00adpa\u00adny sup\u00adports a thri\u00adving eco\u00adsys\u00adtem of glo\u00adbal cus\u00adto\u00admers and part\u00adners with the industry\u2019s lea\u00adding pro\u00adcess tech\u00adno\u00adlo\u00adgy and port\u00adfo\u00adlio of design ena\u00adblem\u00adent solu\u00adti\u00adons to unleash inno\u00adva\u00adti\u00adon for the glo\u00adbal semi\u00adcon\u00adduc\u00adtor industry.<\/p>\n

TSMC<\/span> ser\u00adves its cus\u00adto\u00admers with glo\u00adbal capa\u00adci\u00adty of more than 12 mil\u00adli\u00adon 12-inch equi\u00adva\u00adlent wafers per year in 2019, and pro\u00advi\u00addes the broa\u00addest ran\u00adge of tech\u00adno\u00adlo\u00adgies from 0.5 micron plus all the way to foundry\u2019s most advan\u00adced pro\u00adces\u00adses, which is 7\u2011nanometer today. TSMC<\/span> is the first foundry to pro\u00advi\u00adde 7\u2011nanometer pro\u00adduc\u00adtion capa\u00adbi\u00adli\u00adties, and is head\u00adquar\u00adte\u00adred in Hsin\u00adchu, Tai\u00adwan. For more infor\u00adma\u00adti\u00adon about TSMC<\/span> plea\u00adse visit http:\/\/www.tsmc.com.<\/p>\n","protected":false},"excerpt":{"rendered":"

Hsin\u00adchu, Tai\u00adwan R.O.C., Oct 7, 2019 \u2013 TSMC<\/span> (TWSE<\/span>: 2330, NYSE<\/span>: TSM<\/span>) today announ\u00adced that its seven-nano\u00ad\u00adme\u00ad\u00adter plus (N7<\/span>+), the industry\u2019s first com\u00admer\u00adci\u00adal\u00adly available Extre\u00adme Ultra\u00advio\u00adlet (EUV<\/span>) litho\u00adgra\u00adphy tech\u00adno\u00adlo\u00adgy, is deli\u00adve\u00adring cus\u00adto\u00admer pro\u00adducts to mar\u00adket in high volu\u00adme. The N7<\/span>+ pro\u00adcess with EUV<\/span> tech\u00adno\u00adlo\u00adgy is built on TSMC<\/span>\u2019s suc\u00adcessful 7nm node and paves the way for (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2077,2076,1037],"class_list":["post-51707","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-n6","tag-n7","tag-tsmc","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/51707","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=51707"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/51707\/revisions"}],"predecessor-version":[{"id":51708,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/51707\/revisions\/51708"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=51707"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=51707"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=51707"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}