{"id":52857,"date":"2019-11-18T17:08:10","date_gmt":"2019-11-18T16:08:10","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=52857"},"modified":"2019-11-18T17:08:10","modified_gmt":"2019-11-18T16:08:10","slug":"tyan-launches-amd-epyc-7002-series-processor-based-hpc-and-storage-server-platforms-at-sc19","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/52857-tyan-launches-amd-epyc-7002-series-processor-based-hpc-and-storage-server-platforms-at-sc19\/","title":{"rendered":"TYAN<\/span> Launches AMD<\/span> EPYC<\/span>\u2122 7002 Series Processor-Based HPC<\/span> and Storage Server Platforms at SC19<\/span>"},"content":{"rendered":"
TYAN<\/span>\u2019s Trans\u00adport Pro\u00adduct Line Desi\u00adgned to Deli\u00adver Maxi\u00admum Per\u00adfor\u00admance with AMD<\/span> EPYC<\/span>\u2122 7002 Series Pro\u00adces\u00adsors to Power the Datacenter<\/div>\n
 <\/div>\n
Pro\u00adducts:<\/strong> S8020<\/span><\/a> S8030<\/span><\/a> S8036<\/span><\/a> TN83B8251<\/span><\/a> TS65B8036<\/span><\/a> 
\nTS75AB8252<\/span> TS75B8252<\/span><\/a> <\/div>\n

 <\/p>\n

Den\u00adver, Colo\u00adra\u00addo \u2013 Super\u00adcom\u00adpu\u00adting 2019 \u2013 Nov 18, 2019 \u2013 TYAN<\/span>\u00ae<\/sup>, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, rol\u00adled out the latest lin\u00ade\u00adup of HPC<\/span> and sto\u00adrage ser\u00adver plat\u00adforms based on the AMD<\/span> EPYC<\/span>\u2122<\/sup><\/strong>7002 Series pro\u00adces\u00adsors that are aimed at the dat\u00ada\u00adcen\u00adter mar\u00adket at SC19<\/span> in Den\u00adver, Colo\u00adra\u00addo, Novem\u00adber 18\u201321.
\n 
\n\u201cLever\u00adaging AMD<\/span>\u2019s inno\u00adva\u00adti\u00adon in 7nm pro\u00adcess tech\u00adno\u00adlo\u00adgy, PCIe\u00ae<\/sup> 4.0 I\/O, and an embedded secu\u00adri\u00adty archi\u00adtec\u00adtu\u00adre, TYAN<\/span>\u2019s new 2nd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsor-based plat\u00adforms<\/a>are desi\u00adgned to address the most deman\u00adding chal\u00adlenges facing the dat\u00ada\u00adcen\u00adter\u201d, said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s TYAN<\/span> Busi\u00adness Unit. \u201cDat\u00ada\u00adcen\u00adter cus\u00adto\u00admers can trans\u00adform their infra\u00adstruc\u00adtu\u00adre with our latest HPC<\/span> and sto\u00adrage solu\u00adti\u00adons to dri\u00adve per\u00adfor\u00admance and redu\u00adce bottlenecks.\u201d
\n 
\n\u201cThe 2nd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsor was desi\u00adgned to pro\u00advi\u00adde cus\u00adto\u00admers with lea\u00adder\u00adship in archi\u00adtec\u00adtu\u00adre, per\u00adfor\u00admance, and secu\u00adri\u00adty,\u201d said Scott Aylor, cor\u00adpo\u00adra\u00adte vice pre\u00adsi\u00addent and gene\u00adral mana\u00adger, Data Cen\u00adter Solu\u00adti\u00adons Group, AMD<\/span>. \u201cWe\u2019re exci\u00adted to see our part\u00adners, like TYAN<\/span>, con\u00adti\u00adnue to build their port\u00adfo\u00adli\u00ados around 2nd Gen EPYC<\/span> to pro\u00advi\u00adde new capa\u00adbi\u00adli\u00adties for their cus\u00adto\u00admers and partners.\u201d<\/div>\n
\n 
\nTrans\u00adport HX<\/span> Pro\u00adduct Line to Sca\u00adle the Most Deman\u00adding HPC<\/span> and AI<\/span> Applications<\/strong><\/div>\n
\nPowered by dual AMD<\/span> EPYC<\/span> 7002 Series pro\u00adces\u00adsors, TYAN<\/span>\u2019s Trans\u00adport HX<\/span> pro\u00adduct line is desi\u00adgned to deli\u00adver excep\u00adtio\u00adnal per\u00adfor\u00admance for most deman\u00adding and mis\u00adsi\u00adon-cri\u00adti\u00adcal workloads. TYAN<\/span>\u2019s 2U<\/span> Trans\u00adport HX<\/span> TN83-B8251<\/span><\/a>ser\u00adver plat\u00adform fea\u00adtures sup\u00adport for eight 3.5\u201d hot-swap SATA<\/span> or NVMe U.2 tool-less dri\u00adve bays, and is ide\u00adal for AI<\/span> trai\u00adning and infe\u00adrence appli\u00adca\u00adti\u00adons deploy\u00ading 4 dou\u00adble-width or 8 sin\u00adgle-width GPU<\/span> cards, and 2 PCIe 4.0 x16 high-speed net\u00adwor\u00adking cards.
\n 
\nThe Trans\u00adport HX<\/span> TS75-B8252<\/span><\/a>and\u00adTrans\u00adport HX<\/span> TS75A-B8252<\/span> are 2U<\/span> ser\u00adver plat\u00adforms with sup\u00adport for 32 DIMM<\/span> slots and up to 9 PCIe 4.0 slots. Both ser\u00adver plat\u00adforms are opti\u00admi\u00adzed for HPC<\/span> and Vir\u00adtua\u00adliza\u00adti\u00adon appli\u00adca\u00adti\u00adons. The TS75-B8252<\/span> accom\u00admo\u00adda\u00adtes 12hot-swap, tool-less 3.5\u201d dri\u00adve bays with 4 sup\u00adport\u00ading NVMe U.2 dri\u00adves; TS75A-B8252<\/span> accom\u00admo\u00adda\u00adtes 26 hot-swap, tool-less 2.5\u201d dri\u00adve bays with 8 sup\u00adport\u00ading NVMe U.2 drives.<\/div>\n
\n 
\nTrans\u00adport SX<\/span> Pro\u00adduct Line to Satis\u00adfy Data-dri\u00adven Workloads<\/strong><\/div>\n
\nDesi\u00adgned for data-inten\u00adsi\u00adve workloads, TYAN<\/span>\u2019s Trans\u00adport SX<\/span> pro\u00adduct line sup\u00adports the sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series pro\u00adces\u00adsor and pro\u00advi\u00addes a relia\u00adble, cost-effec\u00adti\u00adve ser\u00adver-based sto\u00adrage solu\u00adti\u00adon for pre\u00advai\u00adling soft\u00adware defi\u00adned sto\u00adrage implementations.TYAN<\/span>\u2019s Trans\u00adport SX<\/span> TS65-S8036<\/span><\/a>is a 2U<\/span> sto\u00adrage ser\u00adver with sup\u00adport for 16 DDR4-3200<\/span> DIMM<\/span> slots, 12 front-access 3.5\u201d and 2 rear-access 2.5\u201d hot-swap, tool-less dri\u00adve bays for data sto\u00adrage appli\u00adca\u00adti\u00adons, the 12 front dri\u00adve bays are pre-con\u00adfi\u00adgu\u00adred to sup\u00adport 10 SATA<\/span> and 2 NVMe U.2 dri\u00adves. The Trans\u00adport SX<\/span> TS65A-S8036<\/span> is the other 2U<\/span> imple\u00admen\u00adta\u00adti\u00adon, which sup\u00adports 26 front-access and 2 rear-access 2.5\u201d hot-swap, tool-less dri\u00adve bays for high-per\u00adfor\u00admance data strea\u00adming appli\u00adca\u00adti\u00adons, the 26 front dri\u00adve bays can be con\u00adfi\u00adgu\u00adred as 26 SATA<\/span>, or 10 SATA<\/span> and 16 NVMe U.2 drives.
\n 
\nAs high den\u00adsi\u00adty ser\u00advers with\u00adpower-effi\u00adci\u00adent com\u00adpu\u00adting fea\u00adture demands are gro\u00adwing in CSP<\/span> IT<\/span> infra\u00adstruc\u00adtu\u00adre, TYAN<\/span>\u2019s Trans\u00adport SX<\/span> GC68-B8036<\/span> and Trans\u00adport SX<\/span> GC68A-B8036<\/span> are both 1U<\/span> ser\u00advers opti\u00admi\u00adzed for typi\u00adcal CSP<\/span> imple\u00admen\u00adta\u00adti\u00adon sce\u00adna\u00adri\u00ados. GC68-B8036<\/span> is a self-con\u00adtai\u00adned ser\u00adver sup\u00adport\u00ading four 3.5\u201d and four 2.5\u201d hot-swap, tool-less dri\u00adve bays that meet most com\u00adpu\u00adte and sto\u00adrage requi\u00adre\u00adments; GC68A-B8036<\/span> sup\u00adports twel\u00adve 2.5\u201d hot-swap, tool-less dri\u00adve bays and by deploy\u00ading 12 NVMe U.2 dri\u00adves. The sys\u00adtem pro\u00advi\u00addes out\u00adstan\u00adding I\/O per\u00adfor\u00admance for data strea\u00adming applications.<\/div>\n
\n 
\nSup\u00adport\u00ading Resources:<\/strong><\/div>\n
\nWatch video about TYAN<\/span>\u2019s Trans\u00adport Pro\u00adduct Line based on AMD<\/span> EPYC<\/span> 7002 Series processors<\/a>
\nLearn more about TYAN<\/span>\u2019s new 2nd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsor-based platforms<\/a><\/div>\n
\n 
\nTYAN<\/span> Pro\u00adduct Exhi\u00adbits @SC19<\/span><\/strong><\/div>\n
\nHPC<\/span> Plat\u00adforms:<\/strong><\/div>\n
\n Trans\u00adport HX<\/span> TN83-B8251<\/span>:<\/a>2U<\/span> dual-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based  plat\u00adform sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 4 dou\u00adble-width PCIe 4.0 x16 GPU<\/span> card slots, 2 spa\u00adreP\u00adCIe 4.0 x16 slots, and eight 3.5\u201d hot-swap, tool-less SATA<\/span> \/ NVMe U.2 dri\u00adve bays
\n Trans\u00adport HX<\/span> TS75-B8252<\/span>:<\/a>2U<\/span> dual-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based  plat\u00adform sup\u00adports 32 DDR4-3200<\/span> DIMM<\/span> slots, 9 PCIe 4.0 x8 slots (2 dou\u00adble-width, acti\u00adve-coo\u00adled pro\u00adfes\u00adsio\u00adnal GPU<\/span> cards are sup\u00adport\u00aded by con\u00adfi\u00adgu\u00adra\u00adti\u00adon), and twel\u00adve 3.5\u201d hot-swap, tool-less SATA<\/span> dri\u00adve bays with 4 bays sup\u00adport\u00ading NVMe U.2 dri\u00adves by configuration
\n Trans\u00adport HX<\/span> TS75A-B8252<\/span>:<\/u>2U<\/span> dual-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based  plat\u00adform sup\u00adports 32 DDR4-3200<\/span> DIMM<\/span> slots, 9 PCIe 4.0 x8 slots (2 dou\u00adble-width, acti\u00adve-coo\u00adled pro\u00adfes\u00adsio\u00adnal GPU<\/span> cards are sup\u00adport\u00aded by con\u00adfi\u00adgu\u00adra\u00adti\u00adon), and 26 hot-swap, tool-less 2.5\u201d SATA<\/span> dri\u00adve bays with 8 bays sup\u00adport\u00ading NVMe U.2 dri\u00adves by configuration<\/div>\n
\nSto\u00adrage Platforms:<\/strong><\/div>\n
\n Trans\u00adport SX<\/span> TS65-B8036<\/span>:<\/a>2U<\/span> sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based plat\u00adform sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 5 PCIe 4.0 x8 slots, 1 OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot, 12 front-access hot-swap, tool-less 3.5\u201d dri\u00adve bays with 2 bays sup\u00adport\u00ading NVMe U.2 dri\u00adves by con\u00adfi\u00adgu\u00adra\u00adti\u00adon, and two 2.5\u201d rear-access hot-swap, tool-less SATA<\/span> dri\u00adve bays<\/div>\n
\n Trans\u00adport SX<\/span> TS65A-S8036<\/span>:<\/u>2U<\/span> sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based plat\u00adform sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 5 PCIe 4.0 x8 slots, 1 OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot, 26 front-access hot-swap, tool-less 2.5\u201ddrive bays with 16 bays sup\u00adport\u00ading NVMe U.2 dri\u00adves by con\u00adfi\u00adgu\u00adra\u00adti\u00adon, and two 2.5\u201d rear-access hot-swap, tool-less SATA<\/span> dri\u00adve bays<\/div>\n
\n Trans\u00adport SX<\/span> GC68-B8036<\/span>:<\/u>1U<\/span> sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based plat\u00adform sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 2 PCIe 4.0 x16 slots, 1 OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot, four 3.5\u201d SATA<\/span> dri\u00adve bays and four 2.5\u201d NVMe U.2 dri\u00adve bays. All dri\u00adve bays are tool-less and hot-swappable<\/div>\n
\n Trans\u00adport SX<\/span> GC68A-B8036<\/span>:<\/u>1U<\/span> sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based plat\u00adform sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 2 PCIe 4.0 x16 slots, 1 OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot, twel\u00adve 2.5\u201d hot-swap, tool-less dri\u00adve bays. The 12 dri\u00adve bays sup\u00adport SAS<\/span>\/SATA<\/span> or NVMe U.2 dri\u00adves by configuration<\/div>\n
\nSer\u00adver Motherboards:<\/strong><\/div>\n
\n Tom\u00adcat SX<\/span> S8036<\/span>:<\/a>sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based ser\u00adver mother\u00adboard in EATX<\/span> (12\u201d x 13\u201d) form fac\u00adtor sup\u00adports 16 DDR4-3200<\/span> DIMM<\/span> slots, 2 PCIe 4.0 x24 slots for risers, 8 PCIe 4.0 x8 SlimS\u00adAS con\u00adnec\u00adtors, 2 PCIe 4.0 NVMe M.2, and 1 OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot for rack-opti\u00admi\u00adzed ser\u00adver deployment<\/div>\n
\n Tom\u00adcat HX<\/span> S8030<\/span>:<\/a>sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 Series Pro\u00adces\u00adsor-based ser\u00adver mother\u00adboard in ATX<\/span> (12\u201d x 9.6\u201d) form fac\u00adtor\u00adsup\u00adports 8 DDR4-3200<\/span> DIMM<\/span> slots, 5 PCIe 4.0 x16 slots, 2 PCIe 4.0 x8 SlimS\u00adAS con\u00adnec\u00adtors, and 2 PCIe 4.0 NVMe M.2 for com\u00adpact GPGPU<\/span> ser\u00adver or CSP<\/span> ent\u00adry ser\u00adver deployment<\/div>\n
\n Tom\u00adcat EX<\/span> S8020<\/span>:<\/a>sin\u00adgle-socket 2nd Gen AMD<\/span> Ryzen\u2122 Thre\u00adad\u00adrip\u00adper\u2122 Pro\u00adces\u00adsor-based work\u00adsta\u00adtion mother\u00adboard in ATX<\/span> (12\u201d x 9.6\u201d) form fac\u00adtor sup\u00adports 8 DDR4-2933<\/span> DIMM<\/span> slots, 4 PCIe 3.0 x16 slots, and 2 PCIe 3.0 NVMe M.2 for com\u00adpact data sci\u00adence work\u00adsta\u00adtion deployment<\/div>\n","protected":false},"excerpt":{"rendered":"

TYAN<\/span>\u2019s Trans\u00adport Pro\u00adduct Line Desi\u00adgned to Deli\u00adver Maxi\u00admum Per\u00adfor\u00admance with AMD<\/span> EPYC<\/span>\u2122 7002 Series Pro\u00adces\u00adsors to Power the Dat\u00ada\u00adcen\u00adter   Pro\u00adducts: S8020<\/span> S8030<\/span> S8036<\/span> TN83B8251<\/span> TS65B8036<\/span>  TS75AB8252<\/span> TS75B8252<\/span>    Den\u00adver, Colo\u00adra\u00addo \u2013 Super\u00adcom\u00adpu\u00adting 2019 \u2013 Nov 18, 2019 \u2013 TYAN<\/span>\u00ae, an indus\u00ad\u00adtry-lea\u00ad\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, rol\u00adled out the latest lin\u00ade\u00adup of HPC<\/span> and (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[966,2019,1343],"class_list":["post-52857","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-amd","tag-epyc-7002","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/52857","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=52857"}],"version-history":[{"count":2,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/52857\/revisions"}],"predecessor-version":[{"id":52859,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/52857\/revisions\/52859"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=52857"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=52857"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=52857"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}