{"id":55284,"date":"2020-02-25T16:01:55","date_gmt":"2020-02-25T15:01:55","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=55284"},"modified":"2020-02-25T16:01:55","modified_gmt":"2020-02-25T15:01:55","slug":"tyan-shows-embedded-server-motherboards-to-scale-iot-analytics-for-network-edge-at-embedded-world-2020","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/55284-tyan-shows-embedded-server-motherboards-to-scale-iot-analytics-for-network-edge-at-embedded-world-2020\/","title":{"rendered":"TYAN<\/span> Shows Embedded Server Motherboards to Scale IoT Analytics for Network Edge at Embedded World 2020"},"content":{"rendered":"

TYAN<\/span>\u2019s Tem\u00adpest EX<\/span> mother\u00adboards to address data ana\u00adly\u00adtics in mixed-cri\u00adti\u00adcal\u00adi\u00adty envi\u00adron\u00adments with com\u00adpact size, sca\u00adla\u00adbi\u00adli\u00adty, and ease of deployment<\/p>\n

Nurem\u00adberg, Ger\u00adma\u00adny \u2013 Embedded World 2020 \u2013 Febru\u00adary 25, 2020 \u2013TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a sub\u00adsi\u00addia\u00adry of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon, is exhi\u00adbi\u00adting their latest embedded mother\u00adboards opti\u00admi\u00adzed for the intel\u00adli\u00adgent edge to ser\u00advice a wide ran\u00adge of ver\u00adti\u00adcal mar\u00adkets inclu\u00adding secu\u00adri\u00adty, indus\u00adtri\u00adal auto\u00adma\u00adti\u00adon, com\u00admu\u00adni\u00adca\u00adti\u00adon and net\u00adwor\u00adking at Embedded World 2020 from Febru\u00adary 25th~27th, booth 2\u2013311in Nurem\u00adberg, Germany.<\/p>\n

\u201c<\/span>Based on the Intel\u00ae Xeon\u00ae E\u20112200 pro\u00adces\u00adsor and 9th Gene\u00adra\u00adti\u00adon Intel\u00ae Core\u2122 i3\/i5\/i7 series pro\u00adces\u00adsor, TYAN<\/span>\u2019s embedded mother\u00adboards demons\u00adtra\u00adte how stan\u00addard-based plat\u00adforms powered by robust pro\u00adces\u00adsors effi\u00adci\u00adent\u00adly meet the demands of data ana\u00adly\u00adtics at the IoT edge,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s TYAN<\/span> Busi\u00adness Unit. Hsu added, \u201cWith key fea\u00adtures inclu\u00adding com\u00adpact form fac\u00adtors, a wide ran\u00adge of ope\u00adra\u00adting tem\u00adpe\u00adra\u00adtures, and long pro\u00adduct sup\u00adp\u00adly life\u00adtime, our Tem\u00adpest EX<\/span> mother\u00adboards are the ide\u00adal choice to build up edge sys\u00adtems that can bridge com\u00adpu\u00adte, sto\u00adrage, and net\u00adwor\u00adking resources.\u201d<\/p>\n

TYAN<\/span>\u2019s embedded pro\u00adducts pro\u00advi\u00adde 7\u2011year sup\u00adp\u00adly life\u00adcy\u00adcle, wide ope\u00adra\u00adting tem\u00adpe\u00adra\u00adtu\u00adre ran\u00adge of 0\u201355\u00b0C and optio\u00adnal EMC<\/span> Class B cer\u00adti\u00adfi\u00adca\u00adti\u00adon on sel\u00adec\u00adted boards, which are high\u00adly requi\u00adred for most embedded IoT appli\u00adca\u00adti\u00adons. The Tem\u00adpest EX<\/span> S5550-EX<\/span> is equip\u00adped with up to four 1000Base\u2011T LAN<\/span> ports, three stan\u00addard PCIe slots, eight SATA<\/span> 6G<\/span> ports, HD<\/span> audio and dis\u00adplay port inter\u00adfaces in Micro-ATX form fac\u00adtor; the Tem\u00adpest EX<\/span> S5552-EX<\/span> sup\u00adports four 1000Base\u2011T LAN<\/span> ports, 8\u2011port SAS<\/span> 12G<\/span> con\u00adtrol\u00adler, four stan\u00addard PCIe and an optio\u00adnal 32-bit lega\u00adcy PCI<\/span> slot in ATX<\/span> form fac\u00adtor. Both S5550-EX<\/span> and S5552-EX<\/span> boards are well sui\u00adted for indus\u00adtri\u00adal auto\u00adma\u00adti\u00adon ser\u00adver appli\u00adca\u00adti\u00adons. The Tem\u00adpest EX<\/span> S5555-EX<\/span> with two dis\u00adplay ports, one DVI<\/span>\u2011D port, and 7.1 chan\u00adnel high defi\u00adni\u00adti\u00adon audio in Micro-ATX form fac\u00adtor is ide\u00adal for embedded work\u00adsta\u00adtion applications.<\/p>\n

The Tem\u00adpest EX<\/span> S5557<\/span> fea\u00adtures two 1000Base\u2011T LAN<\/span> ports, 12V<\/span> DC<\/span> power input and two dis\u00adplay ports in Thin Mini-ITX form fac\u00adtor. The ultra-slim embedded mother\u00adboard is a per\u00adfect fit for IoT appli\u00adance deploy\u00adment. Moreo\u00adver, the Thun\u00adder CX<\/span> GX38-B5550<\/span> is a 1U<\/span> sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor-based com\u00adpact ser\u00adver with shal\u00adlow chas\u00adsis for IoT and edge com\u00adpu\u00adting. Fea\u00adturing up 4 DDR4<\/span> DIMM<\/span> slots, up to 4 onboard GbE LAN<\/span> ports, 1 PCIe x8 slot and two 3.5\u2033 inter\u00adnal SATA<\/span> 6G<\/span> dri\u00adve bays within a 15\u201d deep chas\u00adsis, Thun\u00adder CX<\/span> GX38-B5550<\/span> makes it a top choice for dat\u00ada\u00adcen\u00adters with space constraints.<\/p>\n

TYAN<\/span> Pro\u00adduct Exhi\u00adbits @ Embedded World 2020<\/p>\n

- Tem\u00adpest EX<\/span> S5550-EX<\/span>: Sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor or 9th Gene\u00adra\u00adti\u00adon Intel Core i3 pro\u00adces\u00adsor-based ser\u00adver board in Micro-ATX (9.6\u2033 x 9.6\u2033) form fac\u00adtor with 7\u2011year lon\u00adge\u00advi\u00adty sup\u00adp\u00adly and wide-ran\u00adge ope\u00adra\u00adting tem\u00adpe\u00adra\u00adtu\u00adre for embedded and IoT applications
\n\u2014 Tem\u00adpest EX<\/span> S5552-EX<\/span>: Sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor or 9th Gene\u00adra\u00adti\u00adon Intel Core i3 pro\u00adces\u00adsor-based ser\u00adver board in ATX<\/span> (12\u2033 x 9.6\u2033) form fac\u00adtor with 7\u2011year lon\u00adge\u00advi\u00adty sup\u00adp\u00adly, wide-ran\u00adge ope\u00adra\u00adting tem\u00adpe\u00adra\u00adtu\u00adre and EMC<\/span> class B com\u00adpli\u00adant for embedded and IoT applications
\n\u2014 Tem\u00adpest EX<\/span> S5555-EX<\/span>: 9th Gene\u00adra\u00adti\u00adon Intel Core i3\/i5\/i7 series pro\u00adces\u00adsor-based work\u00adsta\u00adtion board in Micro-ATX (9.6\u2033 x 9.6\u2033) form fac\u00adtor with 7\u2011year lon\u00adge\u00advi\u00adty sup\u00adp\u00adly, wide-ran\u00adge ope\u00adra\u00adting tem\u00adpe\u00adra\u00adtu\u00adre and EMC<\/span> class B com\u00adpli\u00adant for embedded work\u00adsta\u00adtion and IoT applications
\n\u2014 Tem\u00adpest CX<\/span> S5550<\/span>:Single-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor or 9th Gene\u00adra\u00adti\u00adon Intel Core i3 pro\u00adces\u00adsor-based ser\u00adver board in Micro-ATX (9.6\u2033 x 9.6\u2033) form fac\u00adtor for ent\u00adry ser\u00adver applications
\n\u2014 Tem\u00adpest CX<\/span> S5552<\/span>: Sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor\u00ador 9th Gene\u00adra\u00adti\u00adon Intel Core i3 pro\u00adces\u00adsor-based ser\u00adver board in ATX<\/span> (12\u2033 x 9.6\u2033) form fac\u00adtor for ser\u00adver sto\u00adrage applications
\n\u2014 Tem\u00adpest EX<\/span> S5555-HE<\/span>: Sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor-based work\u00adsta\u00adtion board in Micro-ATX (9.6\u2033 x 9.6\u2033) form fac\u00adtor for embedded work\u00adsta\u00adtion and IoT applications
\n\u2014 Tem\u00adpest EX<\/span> S5557<\/span>: 9th Gene\u00adra\u00adti\u00adon Intel Core i3\/i5\/i7 series pro\u00adces\u00adsor-based ultra-slim mother\u00adboard in Thin Mini-ITX (6.7\u201d x 6.7\u201d) form fac\u00adtor for IoT appli\u00adance deployment
\n\u2014 Thun\u00adder CX<\/span> GX38-B5550<\/span>: 1U<\/span> sin\u00adgle-socket Intel Xeon E\u20112200 pro\u00adces\u00adsor-based ser\u00adver plat\u00adform with sup\u00adport for up to 4 DDR4<\/span> DIMM<\/span> slots and two 3.5\u2033 inter\u00adnal SATA<\/span> 6Gb\/s drives<\/p>\n

\uff03 \uff03 \uff03 \uff03
\nIntel, Xeon and Core are trade\u00admarks or regis\u00adtered trade\u00admarks of Intel Cor\u00adpo\u00adra\u00adti\u00adon in the United Sta\u00adtes and other countries.<\/p>\n

About TYAN<\/span>
\nTYAN<\/span>, as a lea\u00adding ser\u00adver brand of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon under the MiT\u00adAC Group (TSE<\/span>:3706), designs, manu\u00adfac\u00adtures and mar\u00adkets advan\u00adced x86 and x86-64 server\/workstation board tech\u00adno\u00adlo\u00adgy, plat\u00adforms and ser\u00adver solu\u00adti\u00adon pro\u00adducts. Its pro\u00adducts are sold to OEMs, VARs, Sys\u00adtem Inte\u00adgra\u00adtors and Resel\u00adlers world\u00adwi\u00adde for a wide ran\u00adge of appli\u00adca\u00adti\u00adons. TYAN<\/span> enables its cus\u00adto\u00admers to be tech\u00adno\u00adlo\u00adgy lea\u00adders by pro\u00advi\u00adding sca\u00adlable, high\u00adly-inte\u00adgra\u00adted, and relia\u00adble pro\u00adducts for a wide ran\u00adge of appli\u00adca\u00adti\u00adons such as ser\u00adver appli\u00adances and solu\u00adti\u00adons for HPC<\/span>, hyper-sca\u00adle\/\u00adda\u00adta cen\u00adter, ser\u00adver sto\u00adrage and secu\u00adri\u00adty appli\u00adance mar\u00adkets. For more infor\u00adma\u00adti\u00adon, visit MiTAC\u2019s web\u00adsite at http:\/\/www.mic-holdings.com or TYAN<\/span>\u2019s web\u00adsite at http:\/\/www.tyan.com<\/p>\n","protected":false},"excerpt":{"rendered":"

TYAN<\/span>\u2019s Tem\u00adpest EX<\/span> mother\u00adboards to address data ana\u00adly\u00adtics in mixed-cri\u00ad\u00adti\u00ad\u00adcal\u00adi\u00ad\u00adty envi\u00adron\u00adments with com\u00adpact size, sca\u00adla\u00adbi\u00adli\u00adty, and ease of deploy\u00adment Nurem\u00adberg, Ger\u00adma\u00adny \u2013 Embedded World 2020 \u2013 Febru\u00adary 25, 2020 \u2013TYAN<\/span>\u00ae, an indus\u00ad\u00adtry-lea\u00ad\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a sub\u00adsi\u00addia\u00adry of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon, is exhi\u00adbi\u00adting their latest embedded mother\u00adboards opti\u00admi\u00adzed for the intel\u00adli\u00adgent edge (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2271,1343],"class_list":["post-55284","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-embedded-world-2020","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55284","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=55284"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55284\/revisions"}],"predecessor-version":[{"id":55285,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55284\/revisions\/55285"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=55284"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=55284"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=55284"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}