{"id":55395,"date":"2020-03-03T14:43:25","date_gmt":"2020-03-03T13:43:25","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=55395"},"modified":"2020-03-03T14:43:25","modified_gmt":"2020-03-03T13:43:25","slug":"tsmc-and-broadcom-enhance-the-cowos-platform-with-worlds-first-2x-reticle-size-interposer","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/55395-tsmc-and-broadcom-enhance-the-cowos-platform-with-worlds-first-2x-reticle-size-interposer\/","title":{"rendered":"TSMC<\/span> and Broadcom Enhance the CoWoS Platform with World\u2019s First 2X<\/span> Reticle Size Interposer"},"content":{"rendered":"

Hsin\u00adchu, Tai\u00adwan, R.O.C., Mar. 3, 2020 \u2013 <\/b>TSMC<\/span> (TWSE<\/span>: 2330, NYSE<\/span>: TSM<\/span>) today announ\u00adced it has col\u00adla\u00adbo\u00adra\u00adted with Broad\u00adcom (NASDAQ<\/span>: AVGO<\/span>) on enhan\u00adcing the Chip-on-Wafer-on-Sub\u00adstra\u00adte (CoWoS\u00ae<\/sup>) plat\u00adform to sup\u00adport the industry\u2019s first and lar\u00adgest 2X<\/span> retic\u00adle size inter\u00adpo\u00adser. With an area of appro\u00adxi\u00adm\u00adate\u00adly 1,700mm2<\/sup>, this next gene\u00adra\u00adti\u00adon CoWoS inter\u00adpo\u00adser tech\u00adno\u00adlo\u00adgy signi\u00adfi\u00adcant\u00adly boosts com\u00adpu\u00adting power for advan\u00adced HPC<\/span> sys\u00adtems by sup\u00adport\u00ading more SoCs as well as being rea\u00addy to sup\u00adport TSMC<\/span>\u2019s next-gene\u00adra\u00adti\u00adon five-nano\u00adme\u00adter (N5<\/span>) pro\u00adcess technology.<\/p>\n

This new gene\u00adra\u00adti\u00adon CoWoS tech\u00adno\u00adlo\u00adgy can accom\u00admo\u00adda\u00adte mul\u00adti\u00adple logic sys\u00adtem-on-chip (SoC) dies, and up to 6 cubes of high-band\u00adwidth memo\u00adry (HBM<\/span>), offe\u00adring as much as 96GB<\/span> of memo\u00adry. It also pro\u00advi\u00addes band\u00adwidth of up to 2.7 tera\u00adbytes per second, 2.7 times fas\u00adter than TSMC<\/span>\u2019s pre\u00advious\u00adly offe\u00adred CoWoS solu\u00adti\u00adon in 2016. With hig\u00adher memo\u00adry capa\u00adci\u00adty and band\u00adwidth, this CoWoS solu\u00adti\u00adon is well-sui\u00adted for memo\u00adry-inten\u00adsi\u00adve workloads such as deep lear\u00adning, as well as workloads for 5G<\/span> net\u00adwor\u00adking, power-effi\u00adci\u00adent dat\u00ada\u00adcen\u00adters, and more. In addi\u00adti\u00adon to offe\u00adring addi\u00adtio\u00adnal area to increase com\u00adpu\u00adte, I\/O, and HBM<\/span> inte\u00adgra\u00adti\u00adon, this enhan\u00adced CoWoS tech\u00adno\u00adlo\u00adgy pro\u00advi\u00addes grea\u00adter design fle\u00adxi\u00adbi\u00adli\u00adty and yield for com\u00adplex ASIC<\/span> designs in advan\u00adced pro\u00adcess nodes.<\/p>\n

In this TSMC<\/span> and Broad\u00adcom CoWoS plat\u00adform col\u00adla\u00adbo\u00adra\u00adti\u00adon, Broad\u00adcom defi\u00adned the com\u00adplex top-die, inter\u00adpo\u00adser and HBM<\/span> con\u00adfi\u00adgu\u00adra\u00adti\u00adon while TSMC<\/span> deve\u00adlo\u00adped the robust manu\u00adfac\u00adtu\u00adring pro\u00adcess to maxi\u00admi\u00adze yield and per\u00adfor\u00admance and meet the uni\u00adque chal\u00adlenges of the 2X<\/span> retic\u00adle size inter\u00adpo\u00adser. Through the expe\u00adri\u00adence of mul\u00adti\u00adple gene\u00adra\u00adti\u00adons of deve\u00adlo\u00adp\u00adment of the CoWoS plat\u00adform, TSMC<\/span> inno\u00adva\u00adted and deve\u00adlo\u00adped a uni\u00adque mask-stit\u00adching pro\u00adcess enab\u00adling expan\u00adsi\u00adon bey\u00adond full retic\u00adle size, to bring this enhance\u00adment to volu\u00adme production.<\/p>\n

\u201c<\/span>Broad\u00adcom is hap\u00adpy to have col\u00adla\u00adbo\u00adra\u00adted with TSMC<\/span> on advan\u00adcing the CoWoS plat\u00adform to address a host of design chal\u00adlenges at 7nm and bey\u00adond,\u201d said Greg Dix, Vice Pre\u00adsi\u00addent of Engi\u00adnee\u00adring for the ASIC<\/span> Pro\u00adducts Divi\u00adsi\u00adon at Broad\u00adcom. \u201cTog\u00ade\u00adther, we are dri\u00adving inno\u00adva\u00adti\u00adon with unpre\u00adce\u00adden\u00adted com\u00adpu\u00adte, I\/O and memo\u00adry inte\u00adgra\u00adti\u00adon and paving the way for new and emer\u00adging appli\u00adca\u00adti\u00adons inclu\u00adding AI<\/span>, Machi\u00adne Lear\u00adning, and 5G<\/span> Networking.\u201d<\/p>\n

\u201c<\/span>TSMC<\/span>\u2019s ongo\u00ading R&<\/span>D efforts have enab\u00adled us to dou\u00adble the size of the CoWoS inter\u00adpo\u00adser sin\u00adce this plat\u00adform was first intro\u00addu\u00adced in 2012, demons\u00adt\u00adra\u00adting our unwa\u00adve\u00adring dedi\u00adca\u00adti\u00adon to con\u00adti\u00adnuous inno\u00adva\u00adti\u00adon,\u201d said Dr. Dou\u00adglas Yu, Vice Pre\u00adsi\u00addent of Inte\u00adgra\u00adted Inter\u00adcon\u00adnect &<\/span> Pack\u00ada\u00adging in the R&<\/span>D Orga\u00adniza\u00adti\u00adon of TSMC<\/span>. \u201cOur work with Broad\u00adcom on CoWoS is an excel\u00adlent exam\u00adp\u00adle of how our clo\u00adse col\u00adla\u00adbo\u00adra\u00adti\u00adon with cus\u00adto\u00admers deli\u00advers even grea\u00adter sys\u00adtem-level HPC<\/span> performance.\u201d<\/p>\n

CoWoS is part of TSMC<\/span>\u2019s port\u00adfo\u00adlio of Wafer-Level Sys\u00adtem Inte\u00adgra\u00adti\u00adon (WLSI<\/span>) solu\u00adti\u00adons enab\u00adling sys\u00adtem-level sca\u00adling both com\u00adple\u00admen\u00adta\u00adry to and bey\u00adond shrin\u00adking tran\u00adsis\u00adtors. In addi\u00adti\u00adon to CoWoS, TSMC<\/span>\u2019s inno\u00adva\u00adti\u00adve 3DIC<\/span> tech\u00adno\u00adlo\u00adgy plat\u00adforms, such as Inte\u00adgra\u00adted Fan Out (InFO) and Sys\u00adtem on Inte\u00adgra\u00adted Chips (SoIC) enable inno\u00adva\u00adti\u00adon through chip\u00adlet par\u00adti\u00adtio\u00adning and sys\u00adtems inte\u00adgra\u00adti\u00adon that achie\u00adves grea\u00adter func\u00adtion\u00ada\u00adli\u00adty and enhan\u00adced sys\u00adtem performance.<\/p>\n","protected":false},"excerpt":{"rendered":"

Hsin\u00adchu, Tai\u00adwan, R.O.C., Mar. 3, 2020 \u2013 TSMC<\/span> (TWSE<\/span>: 2330, NYSE<\/span>: TSM<\/span>) today announ\u00adced it has col\u00adla\u00adbo\u00adra\u00adted with Broad\u00adcom (NASDAQ<\/span>: AVGO<\/span>) on enhan\u00adcing the Chip-on-Wafer-on-Sub\u00ad\u00ads\u00adtra\u00ad\u00adte (CoWoS\u00ae) plat\u00adform to sup\u00adport the industry\u2019s first and lar\u00adgest 2X<\/span> retic\u00adle size inter\u00adpo\u00adser. With an area of appro\u00adxi\u00adm\u00adate\u00adly 1,700 mm\u00b2, this next gene\u00adra\u00adti\u00adon CoWoS inter\u00adpo\u00adser tech\u00adno\u00adlo\u00adgy signi\u00adfi\u00adcant\u00adly boosts com\u00adpu\u00adting power for advan\u00adced (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2064,1037],"class_list":["post-55395","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-cowos","tag-tsmc","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55395","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=55395"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55395\/revisions"}],"predecessor-version":[{"id":55396,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/55395\/revisions\/55396"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=55395"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=55395"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=55395"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}