{"id":56381,"date":"2020-06-12T12:35:24","date_gmt":"2020-06-12T10:35:24","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=56381"},"modified":"2020-06-12T12:35:24","modified_gmt":"2020-06-12T10:35:24","slug":"nxp-selects-tsmc-5nm-process-for-next-generation-high-performance-automotive-platform","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/56381-nxp-selects-tsmc-5nm-process-for-next-generation-high-performance-automotive-platform\/","title":{"rendered":"<span class=\"caps\">NXP<\/span> Selects <span class=\"caps\">TSMC<\/span> 5nm Process for Next Generation High Performance Automotive Platform"},"content":{"rendered":"<ul type=\"disc\">\n<li><em>Col\u00adla\u00adbo\u00adra\u00adti\u00adon com\u00adbi\u00adnes <span class=\"caps\">NXP<\/span>\u2019s auto\u00admo\u00adti\u00adve qua\u00adli\u00adty and func\u00adtion\u00adal safe\u00adty with <span class=\"caps\">TSMC<\/span>\u2019s indus\u00adtry-lea\u00adding 5nm tech\u00adno\u00adlo\u00adgy to fur\u00adther dri\u00adve the trans\u00adfor\u00adma\u00adti\u00adon of auto\u00admo\u00adbi\u00adles into powerful com\u00adpu\u00adting sys\u00adtems for the&nbsp;road<\/em><br>\n&nbsp;<\/li>\n<li><em><span class=\"caps\">NXP<\/span>\u2019s breakth\u00adrough SoC plat\u00adform, devo\u00adted to auto\u00admo\u00adti\u00adve, aims to sim\u00adpli\u00adfy and acce\u00adle\u00adra\u00adte rapid inno\u00adva\u00adti\u00adon in vehic\u00adle archi\u00adtec\u00adtures with a focus on safe\u00adty, secu\u00adri\u00adty and data integrity<\/em><br>\n&nbsp;<\/li>\n<li><em><span class=\"caps\">TSMC<\/span>\u2019s 5nm pro\u00adcess pro\u00advi\u00addes world-class power, per\u00adfor\u00admance and gate den\u00adsi\u00adty for a com\u00adpel\u00adling tech\u00adno\u00adlo\u00adgy offering<\/em><\/li>\n<\/ul>\n<p align=\"justify\"><span class=\"caps\">EINDHOVEN<\/span>, The Net\u00adher\u00adlands and <span class=\"caps\">HSINCHU<\/span>, Tai\u00adwan, June 12, 2020 (<span class=\"caps\">GLOBE<\/span> <span class=\"caps\">NEWSWIRE<\/span>) \u2014 <span class=\"caps\">NXP<\/span> Semi\u00adcon\u00adduc\u00adtors N.V. (<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">NXPI<\/span>) and <span class=\"caps\">TSMC<\/span> (<span class=\"caps\">TWSE<\/span>: 2330, <span class=\"caps\">NYSE<\/span>: <span class=\"caps\">TSM<\/span>) today announ\u00adced a col\u00adla\u00adbo\u00adra\u00adti\u00adon agree\u00adment to adopt <span class=\"caps\">TSMC<\/span>\u2019s 5\u2011nanometer (5nm) tech\u00adno\u00adlo\u00adgy for <span class=\"caps\">NXP<\/span>\u2019s next gene\u00adra\u00adti\u00adon, high-per\u00adfor\u00admance auto\u00admo\u00adti\u00adve plat\u00adform. This col\u00adla\u00adbo\u00adra\u00adti\u00adon com\u00adbi\u00adnes <span class=\"caps\">NXP<\/span>\u2019s auto\u00admo\u00adti\u00adve design exper\u00adti\u00adse with <span class=\"caps\">TSMC<\/span>\u2019s indus\u00adtry-lea\u00adding 5nm tech\u00adno\u00adlo\u00adgy to fur\u00adther dri\u00adve the trans\u00adfor\u00adma\u00adti\u00adon of auto\u00admo\u00adbi\u00adles into powerful com\u00adpu\u00adting sys\u00adtems for the&nbsp;road.<\/p>\n<p align=\"justify\">Buil\u00adding upon mul\u00adti\u00adple suc\u00adcessful 16nm designs, <span class=\"caps\">TSMC<\/span> and <span class=\"caps\">NXP<\/span> are expan\u00adding their col\u00adla\u00adbo\u00adra\u00adti\u00adon to crea\u00adte a Sys\u00adtem-on-Chip (SoC) plat\u00adform in 5nm to deli\u00adver the next gene\u00adra\u00adti\u00adon of auto\u00admo\u00adti\u00adve pro\u00adces\u00adsors. Using <span class=\"caps\">TSMC<\/span>\u2019s 5nm pro\u00adcess, <span class=\"caps\">NXP<\/span>\u2019s offe\u00adrings will address a wide varie\u00adty of func\u00adtions and workloads, such as con\u00adnec\u00adted cock\u00adpits, high-per\u00adfor\u00admance domain con\u00adtrol\u00adlers, auto\u00adno\u00admous dri\u00adving, advan\u00adced net\u00adwor\u00adking, hybrid pro\u00adpul\u00adsi\u00adon con\u00adtrol and inte\u00adgra\u00adted chas\u00adsis management.<\/p>\n<p align=\"justify\"><span class=\"caps\">TSMC<\/span>\u2019s 5nm tech\u00adno\u00adlo\u00adgy is curr\u00adent\u00adly the world\u2019s most advan\u00adced pro\u00adcess in volu\u00adme pro\u00adduc\u00adtion. <span class=\"caps\">NXP<\/span> will adopt <span class=\"caps\">N5P<\/span>, an enhan\u00adced ver\u00adsi\u00adon of <span class=\"caps\">TSMC<\/span>\u2019s 5nm tech\u00adno\u00adlo\u00adgy, which pro\u00advi\u00addes about 20 per\u00adcent fas\u00adter speed or about 40 per\u00adcent power reduc\u00adtion com\u00adpared to the pre\u00adce\u00adding 7nm gene\u00adra\u00adti\u00adon, and is sup\u00adport\u00aded by the industry\u2019s most com\u00adpre\u00adhen\u00adsi\u00adve design ecosystem.<\/p>\n<p align=\"justify\"><span class=\"caps\">NXP<\/span> is a lea\u00adding glo\u00adbal auto\u00admo\u00adti\u00adve sup\u00adpli\u00ader with a rich histo\u00adry in vehic\u00adle con\u00adtrol, vehic\u00adle safe\u00adty, vehic\u00adle info\u00adtain\u00adment and digi\u00adtal clus\u00adters. <span class=\"caps\">NXP<\/span>\u2019s deve\u00adlo\u00adp\u00adments on 5nm, initi\u00adal\u00adly based on its estab\u00adlished <span class=\"caps\">S32<\/span> archi\u00adtec\u00adtu\u00adre, will lead to new archi\u00adtec\u00adtures offe\u00adring sca\u00adla\u00adbi\u00adli\u00adty and a com\u00admon soft\u00adware envi\u00adron\u00adment, fur\u00adther sim\u00adpli\u00adfy\u00ading and enab\u00adling the signi\u00adfi\u00adcant increase in soft\u00adware per\u00adfor\u00admance requi\u00adred in the future car. Lever\u00adaging the com\u00adpu\u00adting power and power effi\u00adci\u00aden\u00adcy of the 5nm tech\u00adno\u00adlo\u00adgy, <span class=\"caps\">NXP<\/span> will meet the high levels of inte\u00adgra\u00adti\u00adon, power manage\u00adment and com\u00adpu\u00adte power requi\u00adred for advan\u00adced vehic\u00adle archi\u00adtec\u00adtures as well as their strin\u00adgent safe\u00adty and secu\u00adri\u00adty needs with its renow\u00adned&nbsp;<span class=\"caps\">IP<\/span>.<\/p>\n<p align=\"justify\"><span class=\"dquo\">\u201c<\/span>Modern vehic\u00adle archi\u00adtec\u00adtures need to har\u00admo\u00adni\u00adze soft\u00adware infra\u00adstruc\u00adtu\u00adre across domains to levera\u00adge invest\u00adments, sca\u00adle deploy\u00adments and share resour\u00adces,\u201d said Hen\u00adri Arde\u00advol, Exe\u00adcu\u00adti\u00adve Vice Pre\u00adsi\u00addent and <span class=\"caps\">GM<\/span>, Auto\u00admo\u00adti\u00adve Pro\u00adces\u00adsing at <span class=\"caps\">NXP<\/span>. \u201c<span class=\"caps\">NXP<\/span> aims to deli\u00adver the pre\u00admier auto\u00admo\u00adti\u00adve pro\u00adces\u00adsing plat\u00adform based on <span class=\"caps\">TSMC<\/span>\u2019s 5nm pro\u00adcess, with a con\u00adsis\u00adtent archi\u00adtec\u00adtu\u00adre across domains and with dif\u00adfe\u00adren\u00adtia\u00adti\u00adon in per\u00adfor\u00admance, power, and world-class safe\u00adty and secu\u00adri\u00adty. Car OEMs need a simp\u00adler coor\u00addi\u00adna\u00adti\u00adon of advan\u00adced func\u00adtions across con\u00adtrol-units, the fle\u00adxi\u00adbi\u00adli\u00adty to loca\u00adte and port appli\u00adca\u00adti\u00adons seam\u00adless\u00adly, and the cer\u00adtain\u00adty of exe\u00adcu\u00adti\u00adon in a cri\u00adti\u00adcal safe\u00adty and secu\u00adri\u00adty con\u00adtext. <span class=\"caps\">NXP<\/span> is powerful\u00adly posi\u00adtio\u00adned to deli\u00adver tho\u00adse auto\u00admo\u00adti\u00adve-spe\u00adci\u00adfic bene\u00adfits, now with lea\u00adding-edge metrics through the <span class=\"caps\">TSMC<\/span> partnership.\u201d<\/p>\n<p align=\"justify\"><span class=\"dquo\">\u201c<\/span><span class=\"caps\">TSMC<\/span>\u2019s latest col\u00adla\u00adbo\u00adra\u00adti\u00adon with <span class=\"caps\">NXP<\/span> tru\u00adly demons\u00adtra\u00adtes how auto\u00admo\u00adti\u00adve semi\u00adcon\u00adduc\u00adtors have evol\u00adved from simp\u00adle micro\u00adcon\u00adtrol\u00adlers to sophisti\u00adca\u00adted pro\u00adces\u00adsors on par with chips used in the most deman\u00adding high-per\u00adfor\u00admance com\u00adpu\u00adting sys\u00adtems,\u201d said Dr. Kevin Zhang, Vice Pre\u00adsi\u00addent of Busi\u00adness Deve\u00adlo\u00adp\u00adment at <span class=\"caps\">TSMC<\/span>. \u201c<span class=\"caps\">TSMC<\/span> has enjoy\u00aded a long histo\u00adry of strong part\u00adner\u00adship with <span class=\"caps\">NXP<\/span>, and we are exci\u00adted to take the auto\u00admo\u00adti\u00adve plat\u00adform ano\u00adther step for\u00adward into the most advan\u00adced tech\u00adno\u00adlo\u00adgy available in the mar\u00adket and unleash the power of <span class=\"caps\">NXP<\/span>\u2019s inno\u00adva\u00adti\u00adve pro\u00adducts for intel\u00adli\u00adgent auto\u00admo\u00adti\u00adve appli\u00adca\u00adti\u00adons and&nbsp;more.\u201d<\/p>\n<p align=\"justify\"><span class=\"caps\">NXP<\/span> and <span class=\"caps\">TSMC<\/span> expect the deli\u00advery of first samples of 5nm devices to <span class=\"caps\">NXP<\/span>\u2019s key cus\u00adto\u00admers in&nbsp;2021.<\/p>\n<p align=\"justify\"><strong>About&nbsp;<span class=\"caps\">NXP<\/span> Semiconductors<\/strong><br>\n<span class=\"caps\">NXP<\/span> Semi\u00adcon\u00adduc\u00adtors N.V. enables secu\u00adre con\u00adnec\u00adtions for a smar\u00adter world, advan\u00adcing solu\u00adti\u00adons that make lives easier, bet\u00adter, and safer. As the world lea\u00adder in secu\u00adre con\u00adnec\u00adti\u00advi\u00adty solu\u00adti\u00adons for embedded appli\u00adca\u00adti\u00adons, <span class=\"caps\">NXP<\/span> is dri\u00adving inno\u00adva\u00adti\u00adon in the auto\u00admo\u00adti\u00adve, indus\u00adtri\u00adal <span class=\"amp\">&amp;<\/span> IoT, mobi\u00adle, and com\u00admu\u00adni\u00adca\u00adti\u00adon infra\u00adstruc\u00adtu\u00adre mar\u00adkets. Built on more than 60 years of com\u00adbi\u00adned expe\u00adri\u00adence and exper\u00adti\u00adse, the com\u00adpa\u00adny has appro\u00adxi\u00adm\u00adate\u00adly 29,000 employees in more than 30 count\u00adries and pos\u00adted reve\u00adnue of $8.88 bil\u00adli\u00adon in 2019. Find out more at&nbsp;<a title=\"www.nxp.com\" href=\"https:\/\/www.globenewswire.com\/Tracker?data=0srIqXkJtuc4BJvkg0BrJdAJKusb5VhsP_Hk4BLoEZqjIQ1YbzkbU3gFnMJAj2L9BSQ1jHng_uxpU8qRCyMFUg==\" target=\"_blank\" rel=\"nofollow noopener noreferrer\">www.nxp.com<\/a>.<\/p>\n<p align=\"justify\"><span class=\"caps\">NXP<\/span> and the <span class=\"caps\">NXP<\/span> logo are trade\u00admarks of <span class=\"caps\">NXP<\/span> B.V. All other pro\u00adducts or ser\u00advice names are the pro\u00adper\u00adty of their respec\u00adti\u00adve owners. All rights reser\u00adved. \u00a9 2020 <span class=\"caps\">NXP<\/span> B.V.<\/p>\n<p align=\"justify\"><strong>About <span class=\"caps\">TSMC<\/span><\/strong><br>\n<span class=\"caps\">TSMC<\/span> pio\u00adnee\u00adred the pure-play foundry busi\u00adness model when it was foun\u00added in 1987, and has been the world\u2019s lar\u00adgest dedi\u00adca\u00adted semi\u00adcon\u00adduc\u00adtor foundry ever sin\u00adce. The Com\u00adpa\u00adny sup\u00adports a thri\u00adving eco\u00adsys\u00adtem of glo\u00adbal cus\u00adto\u00admers and part\u00adners with the industry\u2019s lea\u00adding pro\u00adcess tech\u00adno\u00adlo\u00adgies and port\u00adfo\u00adlio of design ena\u00adblem\u00adent solu\u00adti\u00adons to unleash inno\u00adva\u00adti\u00adon for the glo\u00adbal semi\u00adcon\u00adduc\u00adtor indus\u00adtry. With glo\u00adbal ope\u00adra\u00adti\u00adons span\u00adning Asia, Euro\u00adpe, and North Ame\u00adri\u00adca, <span class=\"caps\">TSMC<\/span> ser\u00adves as a com\u00admit\u00adted cor\u00adpo\u00adra\u00adte citi\u00adzen around the&nbsp;world.<\/p>\n<p align=\"justify\"><span class=\"caps\">TSMC<\/span> deploy\u00aded 272 distinct pro\u00adcess tech\u00adno\u00adlo\u00adgies, and manu\u00adfac\u00adtu\u00adred 10,761 pro\u00adducts for 499 cus\u00adto\u00admers in 2019 by pro\u00advi\u00adding broa\u00addest ran\u00adge of advan\u00adced, spe\u00adcial\u00adty and advan\u00adced pack\u00ada\u00adging tech\u00adno\u00adlo\u00adgy ser\u00advices. <span class=\"caps\">TSMC<\/span> is the first foundry to pro\u00advi\u00adde 5\u2011nanometer pro\u00adduc\u00adtion capa\u00adbi\u00adli\u00adties, the most advan\u00adced semi\u00adcon\u00adduc\u00adtor pro\u00adcess tech\u00adno\u00adlo\u00adgy available in the world. The Com\u00adpa\u00adny is head\u00adquar\u00adte\u00adred in Hsin\u00adchu, Taiwan.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Col\u00adla\u00adbo\u00adra\u00adti\u00adon com\u00adbi\u00adnes <span class=\"caps\">NXP<\/span>\u2019s auto\u00admo\u00adti\u00adve qua\u00adli\u00adty and func\u00adtion\u00adal safe\u00adty with <span class=\"caps\">TSMC<\/span>\u2019s indus\u00ad\u00adtry-lea\u00ad\u00adding 5nm tech\u00adno\u00adlo\u00adgy to fur\u00adther dri\u00adve the trans\u00adfor\u00adma\u00adti\u00adon of auto\u00admo\u00adbi\u00adles into powerful com\u00adpu\u00adting sys\u00adtems for the&nbsp;road &nbsp; <span class=\"caps\">NXP<\/span>\u2019s breakth\u00adrough SoC plat\u00adform, devo\u00adted to auto\u00admo\u00adti\u00adve, aims to sim\u00adpli\u00adfy and acce\u00adle\u00adra\u00adte rapid inno\u00adva\u00adti\u00adon in vehic\u00adle archi\u00adtec\u00adtures with a focus on safe\u00adty, secu\u00adri\u00adty and data inte\u00adgri\u00adty &nbsp; <span class=\"caps\">TSMC<\/span>\u2019s (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/56381-nxp-selects-tsmc-5nm-process-for-next-generation-high-performance-automotive-platform\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2003,2306,1037],"class_list":["post-56381","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-5nm","tag-nxp","tag-tsmc","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/56381","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=56381"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/56381\/revisions"}],"predecessor-version":[{"id":56382,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/56381\/revisions\/56382"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=56381"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=56381"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=56381"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}