{"id":57660,"date":"2020-08-14T13:23:01","date_gmt":"2020-08-14T11:23:01","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=57660"},"modified":"2020-08-14T13:23:01","modified_gmt":"2020-08-14T11:23:01","slug":"samsung-announces-availability-of-its-silicon-proven-3d-ic-technology-for-high-performance-applications","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/57660-samsung-announces-availability-of-its-silicon-proven-3d-ic-technology-for-high-performance-applications\/","title":{"rendered":"Samsung Announces Availability of its Silicon-Proven <span class=\"caps\">3D<\/span> <span class=\"caps\">IC<\/span> Technology for High-Performance Applications"},"content":{"rendered":"<h3 class=\"subtitle\">Samsung \u2018X\u2011Cube\u2019 enables industry-first <span class=\"caps\">3D<\/span> SRAM-logic working silicon at 7nm and beyond.<br>\nBandwidth and density can be scaled to suit diverse design requirements in emerging applications.<\/h3>\n<p>Korea on August 13, 2020 \u2014 Sam\u00adsung Elec\u00adtro\u00adnics, a world lea\u00adder in advan\u00adced semi\u00adcon\u00adduc\u00adtor tech\u00adno\u00adlo\u00adgy, today announ\u00adced the imme\u00addia\u00adte avai\u00adla\u00adbi\u00adli\u00adty of its sili\u00adcon-pro\u00adven <span class=\"caps\">3D<\/span> <span class=\"caps\">IC<\/span> pack\u00ada\u00adging tech\u00adno\u00adlo\u00adgy, eXten\u00added-Cube (X\u2011Cube), for today\u2019s most advan\u00adced pro\u00adcess nodes. Lever\u00adaging Samsung\u2019s through-sili\u00adcon via (<span class=\"caps\">TSV<\/span>) tech\u00adno\u00adlo\u00adgy, X\u2011Cube enables signi\u00adfi\u00adcant leaps in speed and power effi\u00adci\u00aden\u00adcy to help address the rigo\u00adrous per\u00adfor\u00admance demands of next-gene\u00adra\u00adti\u00adon appli\u00adca\u00adti\u00adons inclu\u00adding <span class=\"caps\">5G<\/span>, arti\u00adfi\u00adci\u00adal intel\u00adli\u00adgence, high-pe<\/p>\n<p><span class=\"dquo\">\u201c<\/span>Samsung\u2019s new <span class=\"caps\">3D<\/span> inte\u00adgra\u00adti\u00adon tech\u00adno\u00adlo\u00adgy ensu\u00adres relia\u00adble <span class=\"caps\">TSV<\/span> inter\u00adcon\u00adnec\u00adtions even at the cut\u00adting-edge <span class=\"caps\">EUV<\/span> pro\u00adcess nodes,\u201d said Moon\u00adsoo Kang, seni\u00ador vice pre\u00adsi\u00addent of Foundry Mar\u00adket Stra\u00adtegy at Sam\u00adsung Elec\u00adtro\u00adnics. \u201cWe are com\u00admit\u00adted to brin\u00adging more <span class=\"caps\">3D<\/span> <span class=\"caps\">IC<\/span> inno\u00adva\u00adti\u00adon that can push the boun\u00adda\u00adries of semiconductors.\u201d<\/p>\n<figure id=\"attachment_57661\" aria-describedby=\"caption-attachment-57661\" style=\"width: 650px\" class=\"wp-caption aligncenter\"><a href=\"https:\/\/www.planet3dnow.de\/cms\/wp-content\/uploads\/2020\/08\/Samsung-Foundry_X-Cube-Press-Release_main-2D-IC-vs-3D-IC_FF.jpg\"><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-57661\" src=\"https:\/\/www.planet3dnow.de\/cms\/wp-content\/uploads\/2020\/08\/Samsung-Foundry_X-Cube-Press-Release_main-2D-IC-vs-3D-IC_FF.jpg\" alt width=\"650\" height=\"217\" srcset=\"https:\/\/www.planet3dnow.de\/cms\/wp-content\/uploads\/2020\/08\/Samsung-Foundry_X-Cube-Press-Release_main-2D-IC-vs-3D-IC_FF.jpg 1000w, https:\/\/www.planet3dnow.de\/cms\/wp-content\/uploads\/2020\/08\/Samsung-Foundry_X-Cube-Press-Release_main-2D-IC-vs-3D-IC_FF-300x100.jpg 300w, https:\/\/www.planet3dnow.de\/cms\/wp-content\/uploads\/2020\/08\/Samsung-Foundry_X-Cube-Press-Release_main-2D-IC-vs-3D-IC_FF-768x257.jpg 768w\" sizes=\"auto, (max-width: 650px) 100vw, 650px\"><\/a><figcaption id=\"caption-attachment-57661\" class=\"wp-caption-text\">*The image shown is for illus\u00adtra\u00adti\u00adon pur\u00adpo\u00adse&nbsp;only.<\/figcaption><\/figure>\n<p>With Samsung\u2019s X\u2011Cube, chip desi\u00adgners can enjoy grea\u00adter fle\u00adxi\u00adbi\u00adli\u00adty to build cus\u00adtom solu\u00adti\u00adons that best suit their uni\u00adque requi\u00adre\u00adments. The X\u2011Cube test chip built on 7nm uses <span class=\"caps\">TSV<\/span> tech\u00adno\u00adlo\u00adgy to stack <span class=\"caps\">SRAM<\/span> on top of a logic die, free\u00ading up space to pack more memo\u00adry into a smal\u00adler foot\u00adprint. Enab\u00adled by <span class=\"caps\">3D<\/span> inte\u00adgra\u00adti\u00adon, the ultra-thin packa\u00adge design fea\u00adtures signi\u00adfi\u00adcant\u00adly shorter signal paths bet\u00adween the dies for maxi\u00admi\u00adzed data trans\u00adfer speed and ener\u00adgy effi\u00adci\u00aden\u00adcy. Cus\u00adto\u00admers can also sca\u00adle the memo\u00adry band\u00adwidth and den\u00adsi\u00adty to their desi\u00adred specifications.<\/p>\n<p>Sam\u00adsung X\u2011Cube\u2019s sili\u00adcon-pro\u00adven design metho\u00addo\u00adlo\u00adgy and flow are available now for advan\u00adced nodes inclu\u00adding 7nm and 5nm. Buil\u00adding on the initi\u00adal design, Sam\u00adsung plans to con\u00adti\u00adnue col\u00adla\u00adbo\u00adra\u00adting with glo\u00adbal fab\u00adless cus\u00adto\u00admers to faci\u00adli\u00adta\u00adte the deploy\u00adment of <span class=\"caps\">3D<\/span> <span class=\"caps\">IC<\/span> solu\u00adti\u00adons in next-gene\u00adra\u00adti\u00adon high-per\u00adfor\u00admance applications.<\/p>\n<p>More details on Sam\u00adsung X\u2011Cube will be pre\u00adsen\u00adted at&nbsp;<a href=\"https:\/\/www.hotchips.org\/\" target=\"_blank\" rel=\"noopener noreferrer\">Hot Chips<\/a>, an annu\u00adal con\u00adfe\u00adrence on high-per\u00adfor\u00admance com\u00adpu\u00adting, which will be live\u00adstrea\u00admed Aug. 16\u201318.<\/p>\n<p style=\"text-align: center;\"><iframe loading=\"lazy\" src=\"https:\/\/www.youtube.com\/embed\/-RvXJVHG4jE\" width=\"560\" height=\"315\" frameborder=\"0\" allowfullscreen=\"allowfullscreen\"><\/iframe><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Sam\u00adsung \u2018X\u2011Cube\u2019 enables indus\u00adtry-first <span class=\"caps\">3D<\/span> SRAM-logic working sili\u00adcon at 7nm and bey\u00adond. Band\u00adwidth and den\u00adsi\u00adty can be sca\u00adled to suit diver\u00adse design requi\u00adre\u00adments in emer\u00adging appli\u00adca\u00adti\u00adons. Korea on August 13, 2020 \u2014 Sam\u00adsung Elec\u00adtro\u00adnics, a world lea\u00adder in advan\u00adced semi\u00adcon\u00adduc\u00adtor tech\u00adno\u00adlo\u00adgy, today announ\u00adced the imme\u00addia\u00adte avai\u00adla\u00adbi\u00adli\u00adty of its sili\u00ad\u00adcon-pro\u00ad\u00adven <span class=\"caps\">3D<\/span> <span class=\"caps\">IC<\/span> pack\u00ada\u00adging tech\u00adno\u00adlo\u00adgy, eXten\u00ad\u00added-Cube (X\u2011Cube), (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/57660-samsung-announces-availability-of-its-silicon-proven-3d-ic-technology-for-high-performance-applications\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2375,1445,1022],"class_list":["post-57660","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-3d-sram","tag-7nm","tag-samsung","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/57660","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=57660"}],"version-history":[{"count":2,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/57660\/revisions"}],"predecessor-version":[{"id":57663,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/57660\/revisions\/57663"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=57660"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=57660"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=57660"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}