{"id":5783,"date":"2013-11-14T14:18:53","date_gmt":"2013-11-14T13:18:53","guid":{"rendered":"http:\/\/www.planet3dnow.de\/cms\/?p=5783"},"modified":"2013-11-14T14:18:53","modified_gmt":"2013-11-14T13:18:53","slug":"designed-for-big-data-applications-amd-announces-industrys-first-supercomputing-server-graphics-card-with-12gb-memory","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/5783-designed-for-big-data-applications-amd-announces-industrys-first-supercomputing-server-graphics-card-with-12gb-memory\/","title":{"rendered":"Designed for Big Data Applications, <span class=\"caps\">AMD<\/span> Announces Industry\u2019s First \u201cSupercomputing\u201d Server Graphics Card With <span class=\"caps\">12GB<\/span> Memory"},"content":{"rendered":"<p>New <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon Gra\u00adphics Card Is Desi\u00adgned for Hete\u00adro\u00adge\u00adneous Com\u00adpu\u00adte Appli\u00adca\u00adti\u00adons Built on Open\u00adCL and Deli\u00advers Peak Dou\u00adble Pre\u00adcis\u00adi\u00adon Performance<\/p>\n<p><strong><span class=\"caps\">SUNNYVALE<\/span>, <span class=\"caps\">CA<\/span> \u2014 11\/14\/13 \u2013<\/strong> <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649270&amp;type=1&amp;url=http%3a%2f%2fwww.amd.com%2f\" rel=\"nofollow\"><span class=\"caps\">AMD<\/span><\/a> (<span class=\"caps\">NYSE<\/span>: <span class=\"caps\">AMD<\/span>) today announ\u00adced the new <span class=\"caps\">AMD<\/span> Fire\u00adPro\u2122 <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon gra\u00adphics card, desi\u00adgned for big data high-per\u00adfor\u00admance com\u00adpu\u00adting (<span class=\"caps\">HPC<\/span>) workloads for sin\u00adgle pre\u00adcis\u00adi\u00adon and dou\u00adble pre\u00adcis\u00adi\u00adon per\u00adfor\u00admance. With full sup\u00adport for <span class=\"caps\">PCI<\/span> Express\u00ae 3.0 and opti\u00admi\u00adzed for use with the Open\u00adCL\u2122 com\u00adpu\u00adte pro\u00adgramming lan\u00adguage, the <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon <span class=\"caps\">GPU<\/span> fea\u00adtures <span class=\"caps\">ECC<\/span> memo\u00adry plus DirectGMA sup\u00adport allo\u00adwing deve\u00adlo\u00adpers working with lar\u00adge models and assem\u00adblies to take advan\u00adta\u00adge of the mas\u00adsi\u00adve\u00adly par\u00adal\u00adlel pro\u00adces\u00adsing capa\u00adbi\u00adli\u00adties of <span class=\"caps\">AMD<\/span> GPUs based on the latest <span class=\"caps\">AMD<\/span> Gra\u00adphics Core Next (<span class=\"caps\">GCN<\/span>) archi\u00adtec\u00adtu\u00adre. <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon <span class=\"caps\">GPU<\/span> is sla\u00adted for avai\u00adla\u00adbi\u00adli\u00adty in Spring 2014.<\/p>\n<p>The <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon gra\u00adphics card is a com\u00adpel\u00adling solu\u00adti\u00adon for a varie\u00adty of scenarios:<\/p>\n<ul>\n<li>Compute\/Visualization Ser\u00adver: finan\u00adce, oil explo\u00adra\u00adti\u00adon, aero\u00adnau\u00adtics and auto\u00admo\u00adti\u00adve, design and engi\u00adnee\u00adring, geo\u00adphy\u00adsics, life sci\u00aden\u00adces, medi\u00adci\u00adne and defense<\/li>\n<li>Dou\u00adble pre\u00adcis\u00adi\u00adon: gene\u00adtic sequen\u00adcing, com\u00adpu\u00adta\u00adtio\u00adnal flu\u00adid dyna\u00admics, struc\u00adtu\u00adral mecha\u00adnics, nume\u00adral ana\u00adly\u00adtics, reser\u00advoir simu\u00adla\u00adti\u00adon, auto\u00adma\u00adted reaso\u00adning and wea\u00adther forecasting<\/li>\n<li>Sin\u00adgle pre\u00adcis\u00adi\u00adon: seis\u00admic pro\u00adces\u00adsing, mole\u00adcu\u00adlar dyna\u00admics, satel\u00adli\u00adte ima\u00adging, expli\u00adcit crash test simu\u00adla\u00adti\u00adon, video enhance\u00adment, signal pro\u00adces\u00adsing, video trans\u00adco\u00adding, digi\u00adtal ren\u00adde\u00adring and medi\u00adcal imaging<\/li>\n<li>Ultra High-end Work\u00adsta\u00adtion (Requi\u00adring <span class=\"caps\">GPU<\/span> com\u00adpu\u00adte and <span class=\"caps\">3D<\/span> gra\u00adphics per\u00adfor\u00admance): Oil and gas, com\u00adpu\u00adter aided engineering<\/li>\n<\/ul>\n<p><span class=\"dquo\">\u201c<\/span>Our com\u00adpu\u00adte appli\u00adca\u00adti\u00adon cus\u00adto\u00admers asked for a solu\u00adti\u00adon that offers increased memo\u00adry to sup\u00adport lar\u00adger data sets as they crea\u00adte new pro\u00adducts and ser\u00advices,\u201d said David Cum\u00admings, seni\u00ador direc\u00adtor and gene\u00adral mana\u00adger, Pro\u00adfes\u00adsio\u00adnal Gra\u00adphics, <span class=\"caps\">AMD<\/span>. \u201cIn respon\u00adse, we\u2019\u00adre announ\u00adcing the <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon gra\u00adphics card to meet that addi\u00adtio\u00adnal memo\u00adry demand with sup\u00adport for Open\u00adCL and high-end com\u00adpu\u00adte and gra\u00adphics technologies.\u201d<\/p>\n<p><span class=\"dquo\">\u201c<\/span><span class=\"caps\">AMD<\/span> is pro\u00adving again to be a key play\u00ader in pro\u00advi\u00adding out\u00adstan\u00adding <span class=\"caps\">3D<\/span> gra\u00adphics and <span class=\"caps\">GPGPU<\/span> com\u00adpu\u00adte solu\u00adti\u00adons based on the Open\u00adCL Khro\u00adnos Group stan\u00addard for the indus\u00adtry with the announce\u00adment of the new <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> gra\u00adphics card,\u201d said Nico\u00adlas Duny, <span class=\"caps\">VP<\/span> R<span class=\"amp\">&amp;<\/span>D Tech\u00adno\u00adlo\u00adgies, Das\u00adsault Sys\u00adt\u00e8\u00admes. \u201c<span class=\"caps\">AMD<\/span> is an indus\u00adtry inno\u00adva\u00adtor by respon\u00adding to our cus\u00adto\u00admers\u2019 needs with cut\u00adting edge tech\u00adno\u00adlo\u00adgy. The <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> card will be a wel\u00adco\u00adme addi\u00adti\u00adon to the mar\u00adket and to our customers.\u201d<\/p>\n<p><span class=\"dquo\">\u201c<\/span>Our cus\u00adto\u00admers are always eager for addi\u00adtio\u00adnal memo\u00adry, so the intro\u00adduc\u00adtion of the <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon gra\u00adphics card means key appli\u00adca\u00adti\u00adons will final\u00adly be able to take advan\u00adta\u00adge of the gra\u00adphics com\u00adpu\u00adte capa\u00adbi\u00adli\u00adties,\u201d said Lau\u00adrent Ber\u00adtaux, <span class=\"caps\">CEO<\/span>, <span class=\"caps\">CAPS<\/span>. \u201cAs a lea\u00adding pro\u00advi\u00adder of soft\u00adware and solu\u00adti\u00adons for the <span class=\"caps\">HPC<\/span> com\u00admu\u00adni\u00adty, <span class=\"caps\">CAPS<\/span> reco\u00adgni\u00adzes that this is a gre\u00adat oppor\u00adtu\u00adni\u00adty for cus\u00adto\u00admers to redu\u00adce the poten\u00adti\u00adal for the bot\u00adt\u00adlen\u00adeck of data trans\u00adfer, thus impro\u00adving over\u00adall appli\u00adca\u00adti\u00adon per\u00adfor\u00admance. <span class=\"caps\">CAPS<\/span> is a long-time <span class=\"caps\">AMD<\/span> sup\u00adport\u00ader so we\u2019\u00adre plea\u00adsed that <span class=\"caps\">CAPS<\/span> <span class=\"caps\">FORTAN<\/span> and C com\u00adpi\u00adlers for Open\u00adCL can imme\u00addia\u00adte\u00adly make full use of the <span class=\"caps\">12GB<\/span> memo\u00adry offe\u00adred in this new <span class=\"caps\">AMD<\/span> Fire\u00adPro solution.\u201d<\/p>\n<p>The cur\u00adrent <span class=\"caps\">AMD<\/span> Fire\u00adPro\u2122 <span class=\"caps\">S10000<\/span> gra\u00adphics solu\u00adti\u00adon with <span class=\"caps\">6GB<\/span> of <span class=\"caps\">GDDR5<\/span> memo\u00adry has recei\u00adved gre\u00adat accla\u00adim. For exam\u00adp\u00adle, the Uni\u00adver\u00adsi\u00adty of Frankfurt\u2019s Insti\u00adtu\u00adti\u00adon of Advan\u00adced Stu\u00addies use of the card with the <span class=\"caps\">SANAM<\/span> super\u00adcom\u00adpu\u00adter ranks in the top five on the <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649273&amp;type=1&amp;url=http%3a%2f%2fwww.green500.org%2flists%2fgreen201306\" rel=\"nofollow\">Green500\u2122 List<\/a> as one of the most powerful and ener\u00adgy-effi\u00adci\u00adent super\u00adcom\u00adpu\u00adters powered by gra\u00adphics processors.<\/p>\n<p>The <span class=\"caps\">AMD<\/span> Fire\u00adPro\u2122 <span class=\"caps\">S10000<\/span> with <span class=\"caps\">6GB<\/span> of memo\u00adry is curr\u00adent\u00adly available for purcha\u00adse while the <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon gra\u00adphics card is sla\u00adted for avai\u00adla\u00adbi\u00adli\u00adty in Spring 2014.<\/p>\n<p>Plea\u00adse visit <span class=\"caps\">AMD<\/span> at <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649276&amp;type=1&amp;url=http%3a%2f%2fsc13.supercomputing.org%2f\" rel=\"nofollow\">Super\u00adcom\u00adpu\u00adting 13<\/a>, booth #1113, to see the <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> for the latest in <span class=\"caps\">GPU<\/span> com\u00adpu\u00adte technology.<\/p>\n<p><em><strong>Sup\u00adport\u00ading Resour\u00adces<\/strong> <\/em><\/p>\n<ul>\n<li><a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649279&amp;type=1&amp;url=http%3a%2f%2fwww.amd.com%2ffirepro\" rel=\"nofollow\">Learn more<\/a> about <span class=\"caps\">AMD<\/span> FirePro<\/li>\n<li><a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649282&amp;type=1&amp;url=http%3a%2f%2fwww.amd.com%2fus%2fproducts%2fworkstation%2fgraphics%2ffirepro-remote-graphics%2fPages%2fgpu_compute.aspx\" rel=\"nofollow\">Learn more<\/a> about <span class=\"caps\">AMD<\/span> Fire\u00adPro S\u2011series<\/li>\n<li><a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649285&amp;type=1&amp;url=http%3a%2f%2fwww.fireprographics.com%2fws%2ftech%2fopencl%2findex.asp\" rel=\"nofollow\">Learn more<\/a> about <span class=\"caps\">AMD<\/span> and OpenCL<\/li>\n<li>Beco\u00adme a fan of <span class=\"caps\">AMD<\/span> on <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649288&amp;type=1&amp;url=http%3a%2f%2fwww.facebook.com%2fAMD\" rel=\"nofollow\">Face\u00adbook<\/a><\/li>\n<li>Fol\u00adlow <span class=\"caps\">AMD<\/span> pro\u00adfes\u00adsio\u00adnal gra\u00adphics on Twit\u00adter <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649291&amp;type=1&amp;url=http%3a%2f%2fwww.twitter.com%2famdfirepro\" rel=\"nofollow\">@AMDFirePro<\/a><\/li>\n<\/ul>\n<p><span style=\"font-size: x-small;\"><strong>About <span class=\"caps\">AMD<\/span><\/strong> <em><br>\n<\/em><span class=\"caps\">AMD<\/span> (<span class=\"caps\">NYSE<\/span>: <span class=\"caps\">AMD<\/span>) designs and inte\u00adgra\u00adtes tech\u00adno\u00adlo\u00adgy that powers mil\u00adli\u00adons of intel\u00adli\u00adgent devices, inclu\u00adding per\u00adso\u00adnal com\u00adpu\u00adters, tablets, game con\u00adso\u00adles and cloud ser\u00advers that defi\u00adne the new era of sur\u00adround com\u00adpu\u00adting. <span class=\"caps\">AMD<\/span> solu\u00adti\u00adons enable peo\u00adp\u00adle ever\u00ady\u00adwhe\u00adre to rea\u00adli\u00adze the full poten\u00adti\u00adal of their favo\u00adri\u00adte devices and appli\u00adca\u00adti\u00adons to push the boun\u00adda\u00adries of what is pos\u00adsi\u00adble. For more infor\u00adma\u00adti\u00adon, visit <a href=\"http:\/\/ctt.marketwire.com\/?release=1068089&amp;id=3649294&amp;type=1&amp;url=http%3a%2f%2fwww.amd.com%2f\" rel=\"nofollow\">www.amd.com<\/a>.<\/span><\/p>\n<p><strong><span style=\"font-size: x-small;\"><em><em><span class=\"caps\">AMD<\/span>, the <span class=\"caps\">AMD<\/span> Arrow logo and Rade\u00adon are trade\u00admarks of Advan\u00adced Micro Devices, Inc. Open\u00adCL is a trade\u00admark of Apple, Inc. and used by per\u00admis\u00adsi\u00adon of Khro\u00adnos. Other names are for infor\u00adma\u00adtio\u00adnal pur\u00adpo\u00adses only and may be trade\u00admarks of their respec\u00adti\u00adve owners.<\/em><\/em><\/span><\/strong><\/p>\n<p><span style=\"font-size: x-small;\">This Press Release con\u00adta\u00adins for\u00adward-loo\u00adking state\u00adments con\u00adcer\u00adning Advan\u00adced Micro Devices, Inc. (\u201c<span class=\"caps\">AMD<\/span>\u201d or the \u201cCom\u00adpa\u00adny\u201d) inclu\u00adding, among other things, <span class=\"caps\">AMD<\/span>\u2019s ser\u00adver gra\u00adphics pro\u00adduct inclu\u00adding stra\u00adtegy, the timing, avai\u00adla\u00adbi\u00adli\u00adty, fea\u00adtures and func\u00adtion\u00ada\u00adli\u00adty of such future pro\u00adducts, which are made pur\u00adsu\u00adant to the safe har\u00adbor pro\u00advi\u00adsi\u00adons of the Pri\u00adva\u00adte Secu\u00adri\u00adties Liti\u00adga\u00adti\u00adon Reform Act. For\u00adward-loo\u00adking state\u00adments are com\u00admon\u00adly iden\u00adti\u00adfied by words such as \u201cwould,\u201d \u201cmay,\u201d \u201cexpects,\u201d \u201cbelie\u00adves,\u201d \u201cplans,\u201d \u201cintends,\u201d \u201cpro\u00adjects,\u201d and other terms with simi\u00adlar mea\u00adning. Inves\u00adtors are cau\u00adtio\u00adned that the for\u00adward-loo\u00adking state\u00adments in this pre\u00adsen\u00adta\u00adti\u00adon are based on cur\u00adrent beliefs, assump\u00adti\u00adons and expec\u00adta\u00adti\u00adons, speak only as of the date of this announce\u00adment and invol\u00adve risks and uncer\u00adtain\u00adties that could cau\u00adse actu\u00adal results to dif\u00adfer mate\u00adri\u00adal\u00adly from cur\u00adrent expec\u00adta\u00adti\u00adons. Risks include the pos\u00adsi\u00adbi\u00adli\u00adty that Intel Corporation\u2019s pri\u00adcing, mar\u00adke\u00adting and reba\u00adting pro\u00adgrams, pro\u00adduct bund\u00adling, stan\u00addard set\u00adting, new pro\u00adduct intro\u00adduc\u00adtions or other acti\u00advi\u00adties may nega\u00adtively impact the Company\u2019s plans; that the Com\u00adpa\u00adny will requi\u00adre addi\u00adtio\u00adnal fun\u00adding and may be unable to rai\u00adse suf\u00adfi\u00adci\u00adent capi\u00adtal on favorable terms, or at all; that cus\u00adto\u00admers stop buy\u00ading the Company\u2019s pro\u00adducts or mate\u00adri\u00adal\u00adly redu\u00adce their ope\u00adra\u00adti\u00adons or demand for its pro\u00adducts; that the Com\u00adpa\u00adny may be unable to deve\u00adlop, launch and ramp new pro\u00adducts and tech\u00adno\u00adlo\u00adgies in the volu\u00admes that are requi\u00adred by the mar\u00adket at matu\u00adre yields on a time\u00adly basis; that the company\u2019s third-par\u00adty foundry sup\u00adpli\u00aders will be unable to tran\u00adsi\u00adti\u00adon the Company\u2019s pro\u00adducts to advan\u00adced manu\u00adfac\u00adtu\u00adring pro\u00adcess tech\u00adno\u00adlo\u00adgies in a time\u00adly and effec\u00adti\u00adve way or to manu\u00adfac\u00adtu\u00adre the Company\u2019s pro\u00adducts on a time\u00adly basis in suf\u00adfi\u00adci\u00adent quan\u00adti\u00adties and using com\u00adpe\u00adti\u00adti\u00adve pro\u00adcess tech\u00adno\u00adlo\u00adgies; that the Com\u00adpa\u00adny will be unable to obtain suf\u00adfi\u00adci\u00adent manu\u00adfac\u00adtu\u00adring capa\u00adci\u00adty or com\u00adpon\u00adents to meet demand for its pro\u00adducts or will not ful\u00adly uti\u00adli\u00adze the Company\u2019s pro\u00adjec\u00adted manu\u00adfac\u00adtu\u00adring capa\u00adci\u00adty needs at <span class=\"caps\">GLOBALFOUNDRIES<\/span> Inc. (<span class=\"caps\">GF<\/span>) micro\u00adpro\u00adces\u00adsor manu\u00adfac\u00adtu\u00adring faci\u00adli\u00adties; that the Company\u2019s requi\u00adre\u00adments for wafers will be less than the fixed num\u00adber of wafers that we agreed to purcha\u00adse from <span class=\"caps\">GF<\/span> or <span class=\"caps\">GF<\/span> encoun\u00adters pro\u00adblems that signi\u00adfi\u00adcant\u00adly redu\u00adce the num\u00adber of func\u00adtion\u00adal die the Com\u00adpa\u00adny recei\u00adves from each wafer; that the Com\u00adpa\u00adny is unable to suc\u00adcessful\u00adly imple\u00adment its long-term busi\u00adness stra\u00adtegy; that the Com\u00adpa\u00adny inac\u00adcu\u00adra\u00adte\u00adly esti\u00adma\u00adtes the quan\u00adti\u00adty or type of pro\u00adducts that its cus\u00adto\u00admers will want in the future or will ulti\u00adm\u00adate\u00adly end up purcha\u00adsing, resul\u00adting in excess or obso\u00adle\u00adte inven\u00adto\u00adry; that the Com\u00adpa\u00adny is unable to mana\u00adge the risks rela\u00adted to the use of its third-par\u00adty dis\u00adtri\u00adbu\u00adtors and add-in-board (<span class=\"caps\">AIB<\/span>) part\u00adners or offer the appro\u00adpria\u00adte incen\u00adti\u00adves to focus them on the sale of the Company\u2019s pro\u00adducts; that the Com\u00adpa\u00adny may be unable to main\u00adtain the level of invest\u00adment in rese\u00adarch and deve\u00adlo\u00adp\u00adment that is requi\u00adred to remain com\u00adpe\u00adti\u00adti\u00adve; that the\u00adre may be unex\u00adpec\u00adted varia\u00adti\u00adons in mar\u00adket growth and demand for the Company\u2019s pro\u00adducts and tech\u00adno\u00adlo\u00adgies in light of the pro\u00adduct mix that it may have available at any par\u00adti\u00adcu\u00adlar time; that glo\u00adbal busi\u00adness and eco\u00adno\u00admic con\u00addi\u00adti\u00adons, inclu\u00adding con\u00adsu\u00admer <span class=\"caps\">PC<\/span> mar\u00adket con\u00addi\u00adti\u00adons, will not impro\u00adve or will wor\u00adsen; and the effect of poli\u00adti\u00adcal or eco\u00adno\u00admic insta\u00adbi\u00adli\u00adty, dome\u00adsti\u00adcal\u00adly or inter\u00adna\u00adtio\u00adnal\u00adly, on our sales or sup\u00adp\u00adly chain. Inves\u00adtors are urged to review in detail the risks and uncer\u00adtain\u00adties in the Company\u2019s Secu\u00adri\u00adties and Exch\u00adan\u00adge Com\u00admis\u00adsi\u00adon filings, inclu\u00adding but not limi\u00adt\u00aded to the Quar\u00adter\u00adly Report on Form 10\u2011Q for the quar\u00adter ended Sep\u00adtem\u00adber 28,&nbsp;2013.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p>New <span class=\"caps\">AMD<\/span> Fire\u00adPro <span class=\"caps\">S10000<\/span> <span class=\"caps\">12GB<\/span> Edi\u00adti\u00adon Gra\u00adphics Card Is Desi\u00adgned for Hete\u00adro\u00adge\u00adneous Com\u00adpu\u00adte Appli\u00adca\u00adti\u00adons Built on Open\u00adCL and Deli\u00advers Peak Dou\u00adble Pre\u00adcis\u00adi\u00adon Per\u00adfor\u00admance (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/5783-designed-for-big-data-applications-amd-announces-industrys-first-supercomputing-server-graphics-card-with-12gb-memory\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":8,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[],"class_list":["post-5783","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/5783","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/8"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=5783"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/5783\/revisions"}],"predecessor-version":[{"id":5784,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/5783\/revisions\/5784"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=5783"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=5783"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=5783"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}