{"id":59805,"date":"2020-11-13T07:24:12","date_gmt":"2020-11-13T06:24:12","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=59805"},"modified":"2020-11-13T07:24:12","modified_gmt":"2020-11-13T06:24:12","slug":"tyan-unleashes-new-cloud-and-storage-servers-at-sc20","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/59805-tyan-unleashes-new-cloud-and-storage-servers-at-sc20\/","title":{"rendered":"TYAN<\/span> Unleashes New Cloud and Storage Servers at SC20<\/span>"},"content":{"rendered":"

Fea\u00adturing Memo\u00adry-Based Com\u00adpu\u00adting, Sca\u00adle-Out Appli\u00adca\u00adti\u00adons, and Soft\u00adware-Defi\u00adned Sto\u00adrage with sup\u00adport for 2nd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors for Data Centers<\/a><\/p>\n

Eure\u00adka, Calif. \u2013 Novem\u00adber 12, 2020 \u2013<\/strong> TYAN<\/span>\u00ae<\/sup>, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, will intro\u00addu\u00adce its latest cloud and sto\u00adrage ser\u00adver plat\u00adforms<\/a> powered by 2nd Gen AMD<\/span> EPYC<\/span>\u2122 pro\u00adces\u00adsors, which tar\u00adget modern data cen\u00adters and enter\u00adpri\u00adse mar\u00adkets, at SC20<\/span> vir\u00adtu\u00adal event<\/a> during Novem\u00adber 17\u201319.<\/p>\n

\u201c<\/span>The acce\u00adle\u00adra\u00adting deploy\u00adment of AI<\/span>, deep lear\u00adning, and 5G<\/span> tech\u00adno\u00adlo\u00adgies are powe\u00adring cloud ser\u00advices we use every day, and the\u00adr\u00ade\u00adfo\u00adre data cen\u00adter pro\u00advi\u00adders need to respond to the\u00adse chal\u00adlenges and oppor\u00adtu\u00adni\u00adties,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s TYAN<\/span> Busi\u00adness Unit. \u201cTYAN<\/span>\u2019s new cloud and sto\u00adrage plat\u00adforms pro\u00advi\u00adde a diver\u00adse ran\u00adge of high\u00adly capa\u00adble opti\u00adons that meet modern appli\u00adca\u00adti\u00adon per\u00adfor\u00admance and power-effi\u00adci\u00aden\u00adcy requirements.\u201d<\/p>\n

Memo\u00adry-based com\u00adpu\u00adting in 1U<\/span> dual-socket server<\/strong>
\nThe Trans\u00adport CX<\/span> GC79-B8252<\/span><\/a> and Trans\u00adport CX<\/span> GC79A-B8252<\/span><\/a> are 1U<\/span> dual-socket AMD<\/span> EPYC<\/span> 7002 series pro\u00adces\u00adsor-based ser\u00adver plat\u00adforms fea\u00adturing 32 DDR4<\/span> DIMM<\/span> slots, two stan\u00addard PCIe Gen.4 x16 expan\u00adsi\u00adon slots, and an OCP<\/span> 3.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The GC79-B8252<\/span> plat\u00adform pro\u00advi\u00addes four 3.5\u2011inch SATA<\/span> dri\u00adve bays and four 2.5\u2011inch NVMe dri\u00adve bays with tool-less car\u00adri\u00aders, while the GC79A-B8252<\/span> plat\u00adform offers twel\u00adve 2.5\u2011inch dri\u00adve bays with up to twel\u00adve NVMe U.2 sup\u00adport. The\u00adse two sys\u00adtems accom\u00admo\u00adda\u00adte two inter\u00adnal NVMe M.2 slots for secu\u00adre boot dri\u00adve instal\u00adla\u00adti\u00adon. Both GC79-B8252<\/span> and GC79A-B8252<\/span> are ide\u00adal for high-den\u00adsi\u00adty data cen\u00adter deploy\u00adment with a varie\u00adty of memo\u00adry-based com\u00adpu\u00adting applications.
\n 
\nHigh-den\u00adsi\u00adty, 2U<\/span> ser\u00adver plat\u00adform with four front-ser\u00adviced com\u00adpu\u00adte nodes<\/strong>
\nThe Trans\u00adport CX<\/span> TN73-B8037-X4S<\/span><\/a> is a 2U<\/span> mul\u00adti-node ser\u00adver plat\u00adform with four front-ser\u00adviced com\u00adpu\u00adte nodes, which offers bet\u00adter ser\u00advicea\u00adbi\u00adli\u00adty and mini\u00admi\u00adze\u00adson\u00adsite ser\u00advicing hours. Each node sup\u00adports one AMD<\/span> EPYC<\/span> 7002 series pro\u00adces\u00adsor, four 2.5\u2011inch tool-less NVMe\/SATAdrive bays, eight DDR4<\/span> DIMM<\/span> slots, three inter\u00adnal coo\u00adling fans, two stan\u00addard PCIe Gen.4 x16 expan\u00adsi\u00adon slots, two inter\u00adnal NVMe M.2 slots and one OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The TN73-B8037-X4S<\/span> plat\u00adform is desi\u00adgned for high-den\u00adsi\u00adty, sca\u00adle-out ser\u00adver deploy\u00adments in HPC<\/span> and CSP<\/span> (Cloud Ser\u00advice Pro\u00advi\u00adder) front-end pro\u00adces\u00adsing ser\u00adver applications.
\n 
\nCost<\/strong>-<\/strong>opti\u00admi\u00adzed 1U<\/span> com\u00adpu\u00adting server<\/strong>
\nFor deploy\u00adments that requi\u00adre cost-opti\u00admi\u00adzed com\u00adpu\u00adting and appli\u00adca\u00adti\u00adon caching, the Trans\u00adport CX<\/span> GC68-B8036-LE<\/span><\/a>is a 1U<\/span> sin\u00adgle-socket AMD<\/span> EPYC<\/span> 7002 series pro\u00adces\u00adsor-based ser\u00adver plat\u00adform, fea\u00adturing four 3.5\u2011inch and four 2.5\u2011inch tool-less NVMe U.2 dri\u00adve bays, is a direct fit for the workload. The expan\u00adsi\u00adon capa\u00adbi\u00adli\u00adty\u00adof the ser\u00adver includes a pair of PCIe Gen.4 x16 expan\u00adsi\u00adon and an OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slots.The GC68-B8036-LE<\/span> plat\u00adform can sup\u00adport up to 4TB<\/span> memo\u00adry by popu\u00adla\u00adting 16x 256GB<\/span> DDR4<\/span> DIMMs. Mean\u00adwhile, the Trans\u00adport CX<\/span> GC68A-B8036<\/span><\/a> deploys the same mother\u00adboard asGC68-B8036-LE in a 1U<\/span> chassis;accommodating twel\u00adve 2.5\u2011inch tool-less dri\u00adve bays with sup\u00adport up to twel\u00adve NVMe U.2 devices for deploy\u00adments with an extre\u00adme sto\u00adrage IOPS<\/span> requirement.
\n 
\n2U<\/span> hybrid soft\u00adware-defi\u00adned sto\u00adrage server<\/strong>
\nThe Trans\u00adport SX<\/span> TS65-B8253<\/span><\/a> is a 2U<\/span> dual-socket AMD<\/span> EPYC<\/span> 7002 series pro\u00adces\u00adsor-based sto\u00adrage ser\u00adver sup\u00adport\u00ading 16 DDR4<\/span> DIMM<\/span> slots and seven stan\u00addard PCIe Gen.4 expan\u00adsi\u00adon slots. The plat\u00adform is equip\u00adped with up to two 10GbE and two GbE onboard net\u00adwork con\u00adnec\u00adtions, twel\u00adve front 3.5\u2011inch tool-less SATA<\/span> dri\u00adve bays, up to four NVMe U.2 devices, and two rear 2.5\u2011inch tool-less SATA<\/span> dri\u00adve bays for boot dri\u00adve deploy\u00adment. TS65-B8253<\/span> is a self-con\u00adtai\u00adned, hybrid sto\u00adrage ser\u00adver plat\u00adform desi\u00adgned for soft\u00adware-defi\u00adned sto\u00adrage deploy\u00adments in the data cen\u00adters and enterprises.
\n 
\nPlea\u00adse click here<\/a> for more infor\u00adma\u00adti\u00adon about TYAN<\/span> SC20<\/span> vir\u00adtu\u00adal event.
\n 
\nSup\u00adport\u00ading Resources:<\/strong>
\nPlea\u00adse watch this video<\/a> about TYAN<\/span> 2nd Gen AMD<\/span> EPYC<\/span> ser\u00advers<\/a> desi\u00adgned for modern data cen\u00adters and enterprises.<\/p>\n","protected":false},"excerpt":{"rendered":"

Fea\u00adturing Memo\u00adry-Based Com\u00adpu\u00adting, Sca\u00adle-Out Appli\u00adca\u00adti\u00adons, and Soft\u00adware-Defi\u00adned Sto\u00adrage with sup\u00adport for 2nd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors for Data Centers<\/a><\/p>\n

Eure\u00adka, Calif. \u2013 Novem\u00adber 12, 2020 \u2013<\/strong> TYAN<\/span>\u00ae<\/sup>, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, will intro\u00addu\u00adce its latest cloud and sto\u00adrage ser\u00adver plat\u00adforms<\/a> powered by 2nd Gen AMD<\/span> EPYC<\/span>\u2122 pro\u00adces\u00adsors, which tar\u00adget modern data cen\u00adters and enter\u00adpri\u00adse mar\u00adkets, at SC20<\/span> vir\u00adtu\u00adal event<\/a> during Novem\u00adber 17\u201319.
\n (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[966,1307,1343],"class_list":["post-59805","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-amd","tag-epyc","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/59805","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=59805"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/59805\/revisions"}],"predecessor-version":[{"id":59807,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/59805\/revisions\/59807"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=59805"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=59805"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=59805"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}