{"id":61243,"date":"2021-02-17T11:44:34","date_gmt":"2021-02-17T10:44:34","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=61243"},"modified":"2021-02-17T11:44:34","modified_gmt":"2021-02-17T10:44:34","slug":"samsung-develops-industrys-first-high-bandwidth-memory-with-ai-processing-power","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/61243-samsung-develops-industrys-first-high-bandwidth-memory-with-ai-processing-power\/","title":{"rendered":"Samsung Develops Industry\u2019s First High Bandwidth Memory with <span class=\"caps\">AI<\/span> Processing Power"},"content":{"rendered":"<div class=\"meta\">Korea&nbsp;on Febru\u00adary 17,&nbsp;2021<\/div>\n<div class=\"etc\">&nbsp;<\/div>\n<div>\n<h3 class=\"subtitle\">The new architecture will deliver over twice the system performance<br>\nand reduce energy consumption by more than&nbsp;70%<\/h3>\n<p>Sam\u00adsung Elec\u00adtro\u00adnics, the world lea\u00adder in advan\u00adced memo\u00adry tech\u00adno\u00adlo\u00adgy, today announ\u00adced that it has deve\u00adlo\u00adped the industry\u2019s first High Band\u00adwidth Memo\u00adry (<span class=\"caps\">HBM<\/span>) inte\u00adgra\u00adted with arti\u00adfi\u00adci\u00adal intel\u00adli\u00adgence (<span class=\"caps\">AI<\/span>) pro\u00adces\u00adsing power \u2014 the <span class=\"caps\">HBM-PIM<\/span>. The new pro\u00adces\u00adsing-in-memo\u00adry (<span class=\"caps\">PIM<\/span>) archi\u00adtec\u00adtu\u00adre brings powerful <span class=\"caps\">AI<\/span> com\u00adpu\u00adting capa\u00adbi\u00adli\u00adties insi\u00adde high-per\u00adfor\u00admance memo\u00adry, to acce\u00adle\u00adra\u00adte lar\u00adge-sca\u00adle pro\u00adces\u00adsing in data cen\u00adters, high per\u00adfor\u00admance com\u00adpu\u00adting (<span class=\"caps\">HPC<\/span>) sys\u00adtems and AI-enab\u00adled mobi\u00adle applications.<\/p>\n<p>&nbsp;<\/p>\n<p>Kwan\u00adgil Park, seni\u00ador vice pre\u00adsi\u00addent of Memo\u00adry Pro\u00adduct Plan\u00adning at Sam\u00adsung Elec\u00adtro\u00adnics sta\u00adted, \u201cOur ground\u00adbrea\u00adking <span class=\"caps\">HBM-PIM<\/span> is the industry\u2019s first pro\u00adgramma\u00adble <span class=\"caps\">PIM<\/span> solu\u00adti\u00adon tail\u00ado\u00adred for diver\u00adse AI-dri\u00adven workloads such as <span class=\"caps\">HPC<\/span>, trai\u00adning and infe\u00adrence. We plan to build upon this breakth\u00adrough by fur\u00adther col\u00adla\u00adbo\u00adra\u00adting with <span class=\"caps\">AI<\/span> solu\u00adti\u00adon pro\u00advi\u00adders for even more advan\u00adced PIM-powered applications.\u201d<\/p>\n<p>&nbsp;<\/p>\n<p>Rick Ste\u00advens, Argonne\u2019s Asso\u00adcia\u00adte Labo\u00adra\u00adto\u00adry Direc\u00adtor for Com\u00adpu\u00adting, Envi\u00adron\u00adment and Life Sci\u00aden\u00adces com\u00admen\u00adted, \u201cI\u2019m deligh\u00adted to see that Sam\u00adsung is addres\u00adsing the memo\u00adry bandwidth\/power chal\u00adlenges for <span class=\"caps\">HPC<\/span> and <span class=\"caps\">AI<\/span> com\u00adpu\u00adting. <span class=\"caps\">HBM-PIM<\/span> design has demons\u00adtra\u00adted impres\u00adsi\u00adve per\u00adfor\u00admance and power gains on important clas\u00adses of <span class=\"caps\">AI<\/span> appli\u00adca\u00adti\u00adons, so we look for\u00adward to working tog\u00ade\u00adther to eva\u00adlua\u00adte its per\u00adfor\u00admance on addi\u00adtio\u00adnal pro\u00adblems of inte\u00adrest to Argon\u00adne Natio\u00adnal Laboratory.\u201d<\/p>\n<p>&nbsp;<\/p>\n<p>Most of today\u2019s com\u00adpu\u00adting sys\u00adtems are based on the von Neu\u00admann archi\u00adtec\u00adtu\u00adre, which uses sepa\u00adra\u00adte pro\u00adces\u00adsor and memo\u00adry units to car\u00adry out mil\u00adli\u00adons of intri\u00adca\u00adte data pro\u00adces\u00adsing tasks. This sequen\u00adti\u00adal pro\u00adces\u00adsing approach requi\u00adres data to con\u00adstant\u00adly move back and forth, resul\u00adting in a sys\u00adtem-slo\u00adwing bot\u00adt\u00adlen\u00adeck espe\u00adci\u00adal\u00adly when hand\u00adling ever-incre\u00adasing volu\u00admes of&nbsp;data.<\/p>\n<p>&nbsp;<\/p>\n<p>Ins\u00adtead, the <span class=\"caps\">HBM-PIM<\/span> brings pro\u00adces\u00adsing power direct\u00adly to whe\u00adre the data is stored by pla\u00adcing a DRAM-opti\u00admi\u00adzed <span class=\"caps\">AI<\/span> engi\u00adne insi\u00adde each memo\u00adry bank \u2014 a sto\u00adrage sub-unit \u2014 enab\u00adling par\u00adal\u00adlel pro\u00adces\u00adsing and mini\u00admi\u00adzing data move\u00adment. When appli\u00aded to Samsung\u2019s exis\u00adting <span class=\"caps\">HBM2<\/span> Aquabolt solu\u00adti\u00adon, the new archi\u00adtec\u00adtu\u00adre is able to deli\u00adver over twice the sys\u00adtem per\u00adfor\u00admance while redu\u00adcing ener\u00adgy con\u00adsump\u00adti\u00adon by more than 70%. The <span class=\"caps\">HBM-PIM<\/span> also does not requi\u00adre any hard\u00adware or soft\u00adware chan\u00adges, allo\u00adwing fas\u00adter inte\u00adgra\u00adti\u00adon into exis\u00adting systems.<\/p>\n<p>&nbsp;<\/p>\n<p>Samsung\u2019s paper on the <span class=\"caps\">HBM-PIM<\/span> has been sel\u00adec\u00adted for pre\u00adsen\u00adta\u00adti\u00adon at the renow\u00adned Inter\u00adna\u00adtio\u00adnal Solid-Sta\u00adte Cir\u00adcuits Vir\u00adtu\u00adal Con\u00adfe\u00adrence (<span class=\"caps\">ISSCC<\/span>) held through Feb. 22. Samsung\u2019s <span class=\"caps\">HBM-PIM<\/span> is now being tes\u00adted insi\u00adde <span class=\"caps\">AI<\/span> acce\u00adle\u00adra\u00adtors by lea\u00adding <span class=\"caps\">AI<\/span> solu\u00adti\u00adon part\u00adners, with all vali\u00adda\u00adti\u00adons expec\u00adted to be com\u00adple\u00adted within the first half of this&nbsp;year.<\/p>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Korea&nbsp;on Febru\u00adary 17,&nbsp;2021<\/p>\n<p>The new archi\u00adtec\u00adtu\u00adre will deli\u00adver over twice the sys\u00adtem performance<br>\nand redu\u00adce ener\u00adgy con\u00adsump\u00adti\u00adon by more than&nbsp;70%<\/p>\n<p>Sam\u00adsung Elec\u00adtro\u00adnics, the world lea\u00adder in advan\u00adced memo\u00adry tech\u00adno\u00adlo\u00adgy, today announ\u00adced that it has deve\u00adlo\u00adped the industry\u2019s first High Band\u00adwidth Memo\u00adry (<span class=\"caps\">HBM<\/span>) inte\u00adgra\u00adted with arti\u00adfi\u00adci\u00adal intel\u00adli\u00adgence (<span class=\"caps\">AI<\/span>) pro\u00adces\u00adsing power \u2014 the <span class=\"caps\">HBM-PIM<\/span>. The new pro\u00adces\u00adsing-in-memo\u00adry (<span class=\"caps\">PIM<\/span>) archi\u00adtec\u00adtu\u00adre brings powerful <span class=\"caps\">AI<\/span> com\u00adpu\u00adting capa\u00adbi\u00adli\u00adties insi\u00adde high-per\u00adfor\u00admance memo\u00adry, to acce\u00adle\u00adra\u00adte lar\u00adge-sca\u00adle pro\u00adces\u00adsing in data cen\u00adters, high per\u00adfor\u00admance com\u00adpu\u00adting (<span class=\"caps\">HPC<\/span>) sys\u00adtems and AI-enab\u00adled mobi\u00adle appli\u00adca\u00adti\u00adons. (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/61243-samsung-develops-industrys-first-high-bandwidth-memory-with-ai-processing-power\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2164,2506,1022],"class_list":["post-61243","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-ai","tag-hbm-pim","tag-samsung","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/61243","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=61243"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/61243\/revisions"}],"predecessor-version":[{"id":61244,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/61243\/revisions\/61244"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=61243"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=61243"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=61243"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}