{"id":62118,"date":"2021-03-25T08:55:39","date_gmt":"2021-03-25T07:55:39","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=62118"},"modified":"2021-03-25T08:55:39","modified_gmt":"2021-03-25T07:55:39","slug":"samsung-develops-industrys-first-hkmg-based-ddr5-memory-ideal-for-bandwidth-intensive-advanced-computing-applications","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/62118-samsung-develops-industrys-first-hkmg-based-ddr5-memory-ideal-for-bandwidth-intensive-advanced-computing-applications\/","title":{"rendered":"Samsung Develops Industry\u2019s First HKMG-Based DDR5<\/span> Memory; Ideal for Bandwidth-Intensive Advanced Computing Applications"},"content":{"rendered":"

512GB<\/span> capacity DDR5<\/span> module made possible by an 8\u2011layer TSV<\/span> structure
\nHKMG<\/span> material reduces power by 13 percent while doubling the speed of DDR4<\/span><\/h3>\n

Sam\u00adsung Elec\u00adtro\u00adnics, the world lea\u00adder in advan\u00adced memo\u00adry tech\u00adno\u00adlo\u00adgy, today announ\u00adced that it has expan\u00added its DDR5<\/span> DRAM<\/span> memo\u00adry port\u00adfo\u00adlio with the industry\u2019s first 512GB<\/span> DDR5<\/span> modu\u00adle based on High\u2011K Metal Gate (HKMG<\/span>) pro\u00adcess tech\u00adno\u00adlo\u00adgy. Deli\u00adve\u00adring more than twice the per\u00adfor\u00admance of DDR4<\/span> at up to 7,200 mega\u00adbits per second (Mbps), the new DDR5<\/span> will be capa\u00adble of orchest\u00adra\u00adting the most extre\u00adme com\u00adpu\u00adte-hun\u00adgry, high-band\u00adwidth workloads in super\u00adcom\u00adpu\u00adting, arti\u00adfi\u00adci\u00adal intel\u00adli\u00adgence (AI<\/span>) and machi\u00adne lear\u00adning (ML<\/span>), as well as data ana\u00adly\u00adtics applications.<\/p>\n

 <\/p>\n

\u201c<\/span>Sam\u00adsung is the only semi\u00adcon\u00adduc\u00adtor com\u00adpa\u00adny with logic and memo\u00adry capa\u00adbi\u00adli\u00adties and the exper\u00adti\u00adse to incor\u00adpo\u00adra\u00adte HKMG<\/span> cut\u00adting-edge logic tech\u00adno\u00adlo\u00adgy into memo\u00adry pro\u00adduct deve\u00adlo\u00adp\u00adment,\u201d said Young-Soo Sohn, Vice Pre\u00adsi\u00addent of the DRAM<\/span> Memo\u00adry Planning\/Enabling Group at Sam\u00adsung Elec\u00adtro\u00adnics. \u201cBy brin\u00adging this type of pro\u00adcess inno\u00adva\u00adti\u00adon to DRAM<\/span> manu\u00adfac\u00adtu\u00adring, we are able to offer our cus\u00adto\u00admers high-per\u00adfor\u00admance, yet ener\u00adgy-effi\u00adci\u00adent memo\u00adry solu\u00adti\u00adons to power the com\u00adpu\u00adters nee\u00added for medi\u00adcal rese\u00adarch, finan\u00adcial mar\u00adkets, auto\u00adno\u00admous dri\u00adving, smart cities and beyond.\u201d<\/p>\n

 <\/p>\n

\u201c<\/span>As the amount of data to be moved, stored and pro\u00adces\u00adsed increa\u00adses expo\u00adnen\u00adti\u00adal\u00adly, the tran\u00adsi\u00adti\u00adon to DDR5<\/span> comes at a cri\u00adti\u00adcal inflec\u00adtion point for cloud dat\u00ada\u00adcen\u00adters, net\u00adworks and edge deploy\u00adments,\u201d said Caro\u00adlyn Duran, Vice Pre\u00adsi\u00addent and GM<\/span> of Memo\u00adry and IO<\/span> Tech\u00adno\u00adlo\u00adgy at Intel. \u201cIntel\u2019s engi\u00adnee\u00adring teams clo\u00adse\u00adly part\u00adner with memo\u00adry lea\u00adders like Sam\u00adsung to deli\u00adver fast, power-effi\u00adci\u00adent DDR5<\/span> memo\u00adry that is per\u00adfor\u00admance-opti\u00admi\u00adzed and com\u00adpa\u00adti\u00adble with our upco\u00adming Intel Xeon Sca\u00adlable pro\u00adces\u00adsors, code-named Sap\u00adphi\u00adre Rapids.\u201d<\/p>\n

 <\/p>\n

Samsung\u2019s DDR5<\/span> will uti\u00adli\u00adze high\u00adly advan\u00adced HKMG<\/span> tech\u00adno\u00adlo\u00adgy that has been tra\u00addi\u00adtio\u00adnal\u00adly used in logic semi\u00adcon\u00adduc\u00adtors. With con\u00adtin\u00adued sca\u00adling down of DRAM<\/span> struc\u00adtures, the insu\u00adla\u00adti\u00adon lay\u00ader has thin\u00adned, lea\u00adding to a hig\u00adher leaka\u00adge cur\u00adrent. By repla\u00adcing the insu\u00adla\u00adtor with HKMG<\/span> mate\u00adri\u00adal, Samsung\u2019s DDR5<\/span> will be able to redu\u00adce the leaka\u00adge and reach new heights in per\u00adfor\u00admance. This new memo\u00adry will also use appro\u00adxi\u00adm\u00adate\u00adly 13% less power, making it espe\u00adci\u00adal\u00adly sui\u00adta\u00adble for dat\u00ada\u00adcen\u00adters whe\u00adre ener\u00adgy effi\u00adci\u00aden\u00adcy is beco\u00adming incre\u00adasing\u00adly critical.<\/p>\n

 <\/p>\n

The HKMG<\/span> pro\u00adcess was adopted in Samsung\u2019s GDDR6<\/span> memo\u00adry in 2018 for the first time in the indus\u00adtry. By expan\u00adding its use in DDR5<\/span>, Sam\u00adsung is fur\u00adther soli\u00addi\u00adfy\u00ading its lea\u00adder\u00adship in next-gene\u00adra\u00adti\u00adon DRAM<\/span> technology.<\/p>\n

 <\/p>\n

Lever\u00adaging through-sili\u00adcon via (TSV<\/span>) tech\u00adno\u00adlo\u00adgy, Samsung\u2019s DDR5<\/span> stacks eight lay\u00aders of 16Gb DRAM<\/span> chips to offer the lar\u00adgest capa\u00adci\u00adty of 512GB<\/span>. TSV<\/span> was first uti\u00adli\u00adzed in DRAM<\/span> in 2014 when Sam\u00adsung intro\u00addu\u00adced ser\u00adver modu\u00adles with capa\u00adci\u00adties up to 256GB<\/span>.<\/p>\n

 <\/p>\n

Sam\u00adsung is curr\u00adent\u00adly sam\u00adpling dif\u00adfe\u00adrent varia\u00adti\u00adons of its DDR5<\/span> memo\u00adry pro\u00adduct fami\u00adly to cus\u00adto\u00admers for veri\u00adfi\u00adca\u00adti\u00adon and, ulti\u00adm\u00adate\u00adly, cer\u00adti\u00adfi\u00adca\u00adti\u00adon with their lea\u00adding-edge pro\u00adducts to acce\u00adle\u00adra\u00adte AI<\/span>\/ML<\/span>, exas\u00adca\u00adle com\u00adpu\u00adting, ana\u00adly\u00adtics, net\u00adwor\u00adking, and other data-inten\u00adsi\u00adve workloads.<\/p>\n","protected":false},"excerpt":{"rendered":"

512GB<\/span> capa\u00adci\u00adty DDR5<\/span> modu\u00adle made pos\u00adsi\u00adble by an 8\u2011layer TSV<\/span> structure
\nHKMG<\/span> mate\u00adri\u00adal redu\u00adces power by 13 per\u00adcent while doubling the speed of DDR4<\/span><\/p>\n

Sam\u00adsung Elec\u00adtro\u00adnics, the world lea\u00adder in advan\u00adced memo\u00adry tech\u00adno\u00adlo\u00adgy, today announ\u00adced that it has expan\u00added its DDR5<\/span> DRAM<\/span> memo\u00adry port\u00adfo\u00adlio with the industry\u2019s first 512GB<\/span> DDR5<\/span> modu\u00adle based on High\u2011K Metal Gate (HKMG<\/span>) pro\u00adcess tech\u00adno\u00adlo\u00adgy. Deli\u00adve\u00adring more than twice the per\u00adfor\u00admance of DDR4<\/span> at up to 7,200 mega\u00adbits per second (Mbps), the new DDR5<\/span> will be capa\u00adble of orchest\u00adra\u00adting the most extre\u00adme com\u00adpu\u00adte-hun\u00adgry, high-band\u00adwidth workloads in super\u00adcom\u00adpu\u00adting, arti\u00adfi\u00adci\u00adal intel\u00adli\u00adgence (AI<\/span>) and machi\u00adne lear\u00adning (ML<\/span>), as well as data ana\u00adly\u00adtics appli\u00adca\u00adti\u00adons. (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2181,2542,1022],"class_list":["post-62118","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-ddr5","tag-hkmg","tag-samsung","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/62118","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=62118"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/62118\/revisions"}],"predecessor-version":[{"id":62119,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/62118\/revisions\/62119"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=62118"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=62118"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=62118"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}