{"id":64788,"date":"2022-03-21T16:32:56","date_gmt":"2022-03-21T15:32:56","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=64788"},"modified":"2022-03-21T16:32:56","modified_gmt":"2022-03-21T15:32:56","slug":"tyan-drives-innovation-in-the-data-center-with-3rd-gen-amd-epyc-processors-with-amd-3d-v-cache-technology","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/64788-tyan-drives-innovation-in-the-data-center-with-3rd-gen-amd-epyc-processors-with-amd-3d-v-cache-technology\/","title":{"rendered":"TYAN<\/span> Drives Innovation in the Data Center with 3rd Gen AMD<\/span> EPYC<\/span>\u2122 Processors with AMD<\/span> 3D<\/span> V\u2011Cache\u2122 Technology"},"content":{"rendered":"

TYAN<\/span> HPC<\/span>, Cloud, and Sto\u00adrage Ser\u00adver Plat\u00adforms to Deli\u00adver Breakth\u00adrough Per\u00adfor\u00admance and Modern Secu\u00adri\u00adty Fea\u00adtures for Tech\u00adni\u00adcal Com\u00adpu\u00adting Workloads<\/strong>
\n<\/a><\/p>\n

Newark, Calif. \u2013 March 21, 2022 \u2013 TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, today announ\u00adced avai\u00adla\u00adbi\u00adli\u00adty of high-per\u00adfor\u00admance ser\u00adver plat\u00adforms<\/a> sup\u00adport\u00ading new 3rd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache\u2122 tech\u00adno\u00adlo\u00adgy for the modern data center.<\/p>\n

\u201c<\/span>The modern data cen\u00adter requi\u00adres a powerful foun\u00adda\u00adti\u00adon to balan\u00adce com\u00adpu\u00adte, sto\u00adrage, memo\u00adry and IO<\/span> that can effi\u00adci\u00adent\u00adly mana\u00adge gro\u00adwing volu\u00admes in the digi\u00adtal trans\u00adfor\u00adma\u00adti\u00adon trend,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre Busi\u00adness Unit. \u201cTYAN<\/span>\u2019s indus\u00adtry-lea\u00adding ser\u00adver plat\u00adforms powered by 3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy give our cus\u00adto\u00admers bet\u00adter ener\u00adgy effi\u00adci\u00aden\u00adcy and increased per\u00adfor\u00admance for a cur\u00adrent and future of high\u00adly com\u00adplex workloads.\u201d<\/p>\n

\u201c<\/span>3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy con\u00adti\u00adnue to dri\u00adve a new stan\u00addard for the modern data cen\u00adter with breakth\u00adrough per\u00adfor\u00admance for tech\u00adni\u00adcal com\u00adpu\u00adting workloads due to 768 MB<\/span> of L3<\/span> cache, enab\u00adling fas\u00adter time-to-results on tar\u00adge\u00adted workloads. Ful\u00adly socket com\u00adpa\u00adti\u00adble with our 3rd Gen AMD<\/span> EPYC<\/span> plat\u00adforms, cus\u00adto\u00admers can adopt the\u00adse pro\u00adces\u00adsors to trans\u00adform their data cen\u00adter ope\u00adra\u00adti\u00adons to achie\u00adve fas\u00adter pro\u00adduct deve\u00adlo\u00adp\u00adment along with excep\u00adtio\u00adnal ener\u00adgy savings,\u201d said Ram Ped\u00addib\u00adhot\u00adla, cor\u00adpo\u00adra\u00adte vice pre\u00adsi\u00addent, EPYC<\/span> pro\u00adduct manage\u00adment, AMD<\/span>.<\/p>\n

Optimized for technical computing workloads to boost performance<\/h2>\n

Lever\u00adaging breakth\u00adrough per\u00adfor\u00admance of 3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy, the TYAN<\/span> Trans\u00adport HX<\/span> pro\u00adduct line is built to opti\u00admi\u00adze workloads like EDA<\/span>, CFD<\/span>, and FEA<\/span> soft\u00adware and solu\u00adti\u00adons. The Trans\u00adport HX<\/span> FT65T-B8030<\/span><\/a> is a 4U<\/span> pedes\u00adtal ser\u00adver plat\u00adform fea\u00adturing a sin\u00adgle pro\u00adces\u00adsor, eight DDR4-3200<\/span> DIMM<\/span> slots, eight 3.5\u2011inch SATA<\/span>, and two NVMe U.2 hot-swap, tool-less dri\u00adve bays. The FT65T-B8030<\/span> sup\u00adports four dou\u00adble-wide PCIe 4.0 x16 slots for pro\u00adfes\u00adsio\u00adnal GPUs to acce\u00adle\u00adra\u00adte HPC<\/span> applications.<\/p>\n

The Trans\u00adport HX<\/span> TN83-B8251<\/span><\/a> is a 2U<\/span> dual-socket ser\u00adver plat\u00adform with eight 3.5\u2011inch hot-swap SATA<\/span> or NVMe U.2 tool-less dri\u00adve bays. The plat\u00adform sup\u00adports up to four dou\u00adble-wide GPU<\/span> cards and two addi\u00adtio\u00adnal low-pro\u00adfi\u00adle PCIe 4.0 x16 slots that pro\u00advi\u00addes opti\u00admi\u00adzed topo\u00adlo\u00adgy to impro\u00adve HPC<\/span> and deep lear\u00adning performance.<\/p>\n

Opti\u00admi\u00adzed for HPC<\/span> and vir\u00adtua\u00adliza\u00adti\u00adon appli\u00adca\u00adti\u00adons, the Trans\u00adport HX<\/span> TS75-B8252<\/span><\/a> and Trans\u00adport HX<\/span> TS75A-B8252<\/span><\/a> are 2U<\/span> dual-socket ser\u00adver plat\u00adforms with sup\u00adport for 32 DIMM<\/span> slots and two dou\u00adble-wide, acti\u00adve-coo\u00adled GPU<\/span> cards. The TS75-B8252<\/span> accom\u00admo\u00adda\u00adtes twel\u00adve hot-swap, tool-less 3.5\u2011inch dri\u00adve bays with up to four NVMe U.2 sup\u00adport; TS75A-B8252<\/span> accom\u00admo\u00adda\u00adtes 26 hot-swap, tool-less 2.5\u2011inch dri\u00adve bays with up to eight NVMe U.2 devices.<\/p>\n

High memory footprints, multi-node servers to power big data computing<\/h2>\n

TYAN<\/span>\u2019s Trans\u00adport CX<\/span> lin\u00ade\u00adup is desi\u00adgned for cloud and data ana\u00adly\u00adtics that requi\u00adre lar\u00adge memo\u00adry capa\u00adci\u00adty and fast data pro\u00adces\u00adsing. The Trans\u00adport CX<\/span> GC79-B8252<\/span><\/a> and Trans\u00adport CX<\/span> GC79A-B8252<\/span><\/a> are 1U<\/span> dual-socket ser\u00adver plat\u00adforms that are ide\u00adal for high-den\u00adsi\u00adty data cen\u00adter deploy\u00adment with a varie\u00adty of memo\u00adry-based com\u00adpu\u00adting appli\u00adca\u00adti\u00adons. The\u00adse sys\u00adtems fea\u00adture 32 DDR4<\/span> DIMM<\/span> slots, two stan\u00addard PCIe Gen.4 x16 expan\u00adsi\u00adon slots, and one OCP<\/span> 3.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The GC79-B8252<\/span> plat\u00adform offers four 3.5\u2011inch SATA<\/span> dri\u00adve bays and four 2.5\u2011inch NVMe dri\u00adve bays with tool-less car\u00adri\u00aders, while the GC79A-B8252<\/span> plat\u00adform offers twel\u00adve 2.5\u2011inch dri\u00adve bays with all NVMe U.2 support.<\/p>\n

The Trans\u00adport CX<\/span> TN73-B8037-X4S<\/span><\/a> is a 2U<\/span> mul\u00adti-node ser\u00adver plat\u00adform with four front-ser\u00adviced com\u00adpu\u00adte nodes. Each node sup\u00adports one AMD<\/span> EPYC<\/span> 7003 Series pro\u00adces\u00adsor with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy, four 2.5\u2011inch tool-less NVMe\/SATA<\/span> dri\u00adve bays, eight DDR4<\/span> DIMM<\/span> slots, three inter\u00adnal coo\u00adling fans, two stan\u00addard PCIe Gen.4 x16 expan\u00adsi\u00adon slots, two inter\u00adnal NVMe M.2 and one OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The plat\u00adform is sui\u00adted for high-den\u00adsi\u00adty data cen\u00adter deploy\u00adments and tar\u00adgets sca\u00adle-out appli\u00adca\u00adti\u00adons with lar\u00adge num\u00adbers of nodes.<\/p>\n

Hybrid storage servers to drive outstanding performance<\/h2>\n

TYAN<\/span> Trans\u00adport SX<\/span> lin\u00ade\u00adup is desi\u00adgned to deli\u00adver mas\u00adsi\u00adve I\/O and memo\u00adry band\u00adwidth for sto\u00adrage appli\u00adca\u00adti\u00adons. The Trans\u00adport SX<\/span> TS65-B8253<\/span><\/a> is a 2U<\/span> hybrid soft\u00adware sto\u00adrage ser\u00adver for various data cen\u00adter and enter\u00adpri\u00adse deploy\u00adment fea\u00adturing dual-socket CPUs, 16 DDR4<\/span> DIMM<\/span> slots and seven stan\u00addard PCIe 4.0 slots. The plat\u00adform is equip\u00adped with up to two 10GbE and two GbE onboard net\u00adwork con\u00adnec\u00adtions, twel\u00adve front 3.5\u2011inch tool-less SATA<\/span> dri\u00adve bays with up to four NVMe U.2 sup\u00adport, and two rear 2.5\u2011inch tool-less SATA<\/span> dri\u00adve bays for boot dri\u00adve deployment.<\/p>\n

TYAN<\/span>\u2019s Trans\u00adport SX<\/span> TS65-B8036<\/span><\/a> and Trans\u00adport SX<\/span> TS65A-B8036<\/span><\/a> are 2U<\/span> sin\u00adgle-socket sto\u00adrage ser\u00advers with sup\u00adport for 16 DDR4<\/span> DIMM<\/span> slots, five PCIe 4.0 and one OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slots. The TS65-S8036<\/span> accom\u00admo\u00adda\u00adtes twel\u00adve front 3.5\u2011inch with up to four NVMe U.2 sup\u00adport, and two rear 2.5\u2011inch hot-swap, tool-less SATA<\/span> dri\u00adve bays for boot dri\u00adve deploy\u00adment; the TS65A-S8036<\/span> offers 26 front and two rear 2.5\u2011inch hot-swap, tool-less dri\u00adve bays for high-per\u00adfor\u00admance data strea\u00adming appli\u00adca\u00adti\u00adons, the 26 front dri\u00adve bays can sup\u00adport up to 24 NVMe U.2 devices by configuration.<\/p>\n

AMD<\/span> EPYC<\/span> 7003 pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy can run on TYAN<\/span>\u2019s exis\u00adting AMD<\/span> EPYC<\/span> 7003 plat\u00adforms through a BIOS<\/span> update. Cus\u00adto\u00admers can enjoy fas\u00adter time-to-results on tar\u00adge\u00adted workloads powered by new AMD<\/span> EPYC<\/span> 7773X<\/span>, 7573X<\/span>, 7473X<\/span>, and 7373X<\/span> processors.<\/p>\n","protected":false},"excerpt":{"rendered":"

TYAN<\/span> HPC<\/span>, Cloud, and Sto\u00adrage Ser\u00adver Plat\u00adforms to Deli\u00adver Breakth\u00adrough Per\u00adfor\u00admance and Modern Secu\u00adri\u00adty Fea\u00adtures for Tech\u00adni\u00adcal Com\u00adpu\u00adting Workloads<\/strong><\/p>\n

Newark, Calif. \u2013 March 21, 2022 \u2013 TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, today announ\u00adced avai\u00adla\u00adbi\u00adli\u00adty of high-per\u00adfor\u00admance ser\u00adver plat\u00adforms<\/a> sup\u00adport\u00ading new 3rd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache\u2122 tech\u00adno\u00adlo\u00adgy for the modern data center.<\/p>\n

\u201c<\/span>The modern data cen\u00adter requi\u00adres a powerful foun\u00adda\u00adti\u00adon to balan\u00adce com\u00adpu\u00adte, sto\u00adrage, memo\u00adry and IO<\/span> that can effi\u00adci\u00adent\u00adly mana\u00adge gro\u00adwing volu\u00admes in the digi\u00adtal trans\u00adfor\u00adma\u00adti\u00adon trend,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre Busi\u00adness Unit. \u201cTYAN<\/span>\u2019s indus\u00adtry-lea\u00adding ser\u00adver plat\u00adforms powered by 3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy give our cus\u00adto\u00admers bet\u00adter ener\u00adgy effi\u00adci\u00aden\u00adcy and increased per\u00adfor\u00admance for a cur\u00adrent and future of high\u00adly com\u00adplex workloads.\u201d (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2583,966,1307,2648,1343],"class_list":["post-64788","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-3d-v-cache","tag-amd","tag-epyc","tag-milan-x","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/64788","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=64788"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/64788\/revisions"}],"predecessor-version":[{"id":64790,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/64788\/revisions\/64790"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=64788"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=64788"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=64788"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}