{"id":65391,"date":"2022-05-27T11:12:01","date_gmt":"2022-05-27T09:12:01","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=65391"},"modified":"2022-05-27T11:16:56","modified_gmt":"2022-05-27T09:16:56","slug":"tyan-brings-modern-hpc-server-platforms-for-data-centers-at-isc-2022","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/65391-tyan-brings-modern-hpc-server-platforms-for-data-centers-at-isc-2022\/","title":{"rendered":"TYAN<\/span> Brings Modern HPC<\/span> Server Platforms for Data Centers at ISC<\/span> 2022"},"content":{"rendered":"

Tai\u00adpei, Tai\u00adwan, May 27, 2022 \u2014 TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, will exhi\u00adbit its latest HPC<\/span> plat\u00adforms powered by 3rd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache\u2122 tech\u00adno\u00adlo\u00adgy for data cen\u00adters deploy\u00adments at ISC<\/span> 2022 event from May 30th to June 1st at booth#D400<\/span> in Ham\u00adburg, Germany.<\/p>\n

\u201c<\/span>The amount of data gene\u00adra\u00adted by humans and machi\u00adnes has increased expo\u00adnen\u00adti\u00adal\u00adly and this requi\u00adres a ste\u00adady increase of data cen\u00adter com\u00adpu\u00adte per\u00adfor\u00admance, the\u00adr\u00ade\u00adfo\u00adre, modern data cen\u00adters need balan\u00adced hard\u00adware to effi\u00adci\u00adent\u00adly mana\u00adge gro\u00adwing data volu\u00admes\u201d, said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre Busi\u00adness Unit. \u201cTYAN<\/span>\u2019s ser\u00adver plat\u00adforms built upon AMD<\/span> EPYC<\/span>\u2122 7003 Series pro\u00adces\u00adsors pro\u00advi\u00adde the best foun\u00adda\u00adti\u00adon for dat\u00ada\u00adcen\u00adters that can be tail\u00ado\u00adred to spe\u00adci\u00adfic workloads with balan\u00adcing hard\u00adware design.\u201d<\/p>\n

Opti\u00admi\u00adzing for HPC<\/span> com\u00adpu\u00adta\u00adti\u00adon, data\u00adba\u00adse per\u00adfor\u00admance, and high data through\u00adput at the edge<\/p>\n

Powered by 3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy, the Trans\u00adport HX<\/span> TN83-B8251<\/span><\/a> is a 2U<\/span> dual-socket ser\u00adver with 16 DDR4-3200<\/span> DIMM<\/span> slots and eight 3.5\u2011inch hot-swap SATA<\/span> or NVMe U.2 tool-less dri\u00adve bays. The plat\u00adform sup\u00adports up to four dou\u00adble-wide GPU<\/span> cards and two addi\u00adtio\u00adnal low-pro\u00adfi\u00adle PCIe 4.0 x16 slots that pro\u00advi\u00adde opti\u00admi\u00adzed topo\u00adlo\u00adgy to impro\u00adve HPC<\/span> and deep lear\u00adning performance.<\/p>\n

The Trans\u00adport CX<\/span> TN73-B8037-X4<\/span><\/a>S is a 2U<\/span> mul\u00adti-node ser\u00adver plat\u00adform with four front-ser\u00adviced com\u00adpu\u00adte nodes. Each node sup\u00adports one AMD<\/span> EPYC<\/span> 7003 Series pro\u00adces\u00adsor, four 2.5\u2011inch tool-less NVMe\/SATA<\/span> dri\u00adve bays, eight DDR4<\/span> DIMM<\/span> slots, three inter\u00adnal coo\u00adling fans, two stan\u00addard PCIe 4.0 x16 expan\u00adsi\u00adon slots, two inter\u00adnal NVMe M.2, and one OCP<\/span> 2.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The plat\u00adform is sui\u00adted for high-den\u00adsi\u00adty data cen\u00adter deploy\u00adments and tar\u00adgets sca\u00adle-out appli\u00adca\u00adti\u00adons with lar\u00adge num\u00adbers of nodes.<\/p>\n

 <\/p>\n

The new Trans\u00adport EX<\/span> TE45-B8030<\/span> is a 2U<\/span> edge ser\u00adver plat\u00adform fea\u00adturing a sin\u00adgle AMD<\/span> EPYC<\/span> 7003 Series pro\u00adces\u00adsor, eight DDR4-3200<\/span> DIMM<\/span> slots and five PCIe 4.0 x16 slots. The plat\u00adform accom\u00admo\u00adda\u00adtes six 2.5\u2011inch SATA<\/span> tool-less dri\u00adve bays with up to two NVMe U.2 sup\u00adport. The TE45-B8030<\/span> can deli\u00adver high data through\u00adput and address data acqui\u00adred at the edge. Inclu\u00adsi\u00adon in this exhi\u00adbit is the M7129-M942-2V<\/span> net\u00adwork modu\u00adle with two SFP28<\/span> 25GbE LAN<\/span> ports that fit into a stan\u00addard 2.5\u2011inch dri\u00adve bay.<\/p>\n

 <\/p>\n

Taking advan\u00adta\u00adge of AMD<\/span> EPYC<\/span> CPU<\/span> I\/O capa\u00adbi\u00adli\u00adties, the Tom\u00adcat HX<\/span> S8030<\/span><\/a> ser\u00adver mother\u00adboard brings full PCIe 4.0 sup\u00adport in a small ATX<\/span> (12\u2033 x 9.8\u2033) form fac\u00adtor. The mother\u00adboard pro\u00advi\u00addes eight DDR4<\/span> DIMM<\/span> slots, five PCIe 4.0 x16 slots, two SlimS\u00adAS 8x con\u00adnec\u00adtors for four NVMe, two NVMe M.2 slots, two 10GbE, and two GbE LAN<\/span> ports.<\/p>\n

 <\/p>\n

The Tom\u00adcat CX<\/span> S8253<\/span><\/a> is a dual-socket AMD<\/span> EPYC<\/span> 7003 Series pro\u00adces\u00adsor-based ser\u00adver mother\u00adboard desi\u00adgned for 2U<\/span> rack\u00admount chas\u00adsis deploy\u00adment in EATX<\/span> (12\u201d x 13.4\u201d) form fac\u00adtor. The mother\u00adboard sup\u00adports 16 DDR4<\/span> DIMM<\/span> slots, three PCIe 4.0 x16 slots, up to 16 SATA<\/span> ports and two SlimS\u00adAS 8x con\u00adnec\u00adtors for four NVMe deployment.<\/p>\n

 <\/p>\n

Join TYAN<\/span> booth at ISC<\/span> 2022, booth#D400<\/span> or ISC<\/span> Digi\u00adtal 2022 at: https:\/\/bit.ly\/3FhIAYO<\/a><\/p>\n

 <\/p>\n

 <\/p>\n

\uff03 \uff03 \uff03 \uff03<\/p>\n

 <\/p>\n

About TYAN<\/span><\/p>\n

TYAN<\/span>, as a lea\u00adding ser\u00adver brand of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon under the MiT\u00adAC Group (TSE<\/span>:3706), designs, manu\u00adfac\u00adtures and mar\u00adkets advan\u00adced x86 and x86-64 server\/workstation board tech\u00adno\u00adlo\u00adgy, plat\u00adforms and ser\u00adver solu\u00adti\u00adon pro\u00adducts. Its pro\u00adducts are sold to OEMs, VARs, Sys\u00adtem Inte\u00adgra\u00adtors and Resel\u00adlers world\u00adwi\u00adde for a wide ran\u00adge of appli\u00adca\u00adti\u00adons. TYAN<\/span> enables its cus\u00adto\u00admers to be tech\u00adno\u00adlo\u00adgy lea\u00adders by pro\u00advi\u00adding sca\u00adlable, high\u00adly-inte\u00adgra\u00adted, and relia\u00adble pro\u00adducts for a wide ran\u00adge of appli\u00adca\u00adti\u00adons such as ser\u00adver appli\u00adances and solu\u00adti\u00adons for HPC<\/span>, hyper-sca\u00adle\/\u00adda\u00adta cen\u00adter, ser\u00adver sto\u00adrage and secu\u00adri\u00adty appli\u00adance mar\u00adkets. For more infor\u00adma\u00adti\u00adon, visit MiTAC\u2019s web\u00adsite at http:\/\/www.mic-holdings.com or TYAN<\/span>\u2019s web\u00adsite at http:\/\/www.tyan.com<\/p>\n","protected":false},"excerpt":{"rendered":"

Tai\u00adpei, Tai\u00adwan, May 27, 2022 \u2014 TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, will exhi\u00adbit its latest HPC<\/span> plat\u00adforms powered by 3rd Gen AMD<\/span> EPYC<\/span>\u2122 Pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache\u2122 tech\u00adno\u00adlo\u00adgy for data cen\u00adters deploy\u00adments at ISC<\/span> 2022 event from May 30th to June 1st at booth#D400<\/span> in Ham\u00adburg, Germany.<\/p>\n

\u201c<\/span>The amount of data gene\u00adra\u00adted by humans and machi\u00adnes has increased expo\u00adnen\u00adti\u00adal\u00adly and this requi\u00adres a ste\u00adady increase of data cen\u00adter com\u00adpu\u00adte per\u00adfor\u00admance, the\u00adr\u00ade\u00adfo\u00adre, modern data cen\u00adters need balan\u00adced hard\u00adware to effi\u00adci\u00adent\u00adly mana\u00adge gro\u00adwing data volu\u00admes\u201d, said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre Busi\u00adness Unit. \u201cTYAN<\/span>\u2019s ser\u00adver plat\u00adforms built upon AMD<\/span> EPYC<\/span>\u2122 7003 Series pro\u00adces\u00adsors pro\u00advi\u00adde the best foun\u00adda\u00adti\u00adon for dat\u00ada\u00adcen\u00adters that can be tail\u00ado\u00adred to spe\u00adci\u00adfic workloads with balan\u00adcing hard\u00adware design.\u201d<\/p>\n

Opti\u00admi\u00adzing for HPC<\/span> com\u00adpu\u00adta\u00adti\u00adon, data\u00adba\u00adse per\u00adfor\u00admance, and high data through\u00adput at the edge<\/p>\n

Powered by 3rd Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors with AMD<\/span> 3D<\/span> V\u2011Cache tech\u00adno\u00adlo\u00adgy, the Trans\u00adport HX<\/span> TN83-B8251<\/span> is a 2U<\/span> dual-socket ser\u00adver with 16 DDR4-3200<\/span> DIMM<\/span> slots and eight 3.5\u2011inch hot-swap SATA<\/span> or NVMe U.2 tool-less dri\u00adve bays. The plat\u00adform sup\u00adports up to four dou\u00adble-wide GPU<\/span> cards and two addi\u00adtio\u00adnal low-pro\u00adfi\u00adle PCIe 4.0 x16 slots that pro\u00advi\u00adde opti\u00admi\u00adzed topo\u00adlo\u00adgy to impro\u00adve HPC<\/span> and deep lear\u00adning per\u00adfor\u00admance. (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2583,966,1307,1343],"class_list":["post-65391","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-3d-v-cache","tag-amd","tag-epyc","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65391","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=65391"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65391\/revisions"}],"predecessor-version":[{"id":65392,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65391\/revisions\/65392"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=65391"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=65391"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=65391"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}