{"id":65668,"date":"2022-06-10T02:00:19","date_gmt":"2022-06-10T00:00:19","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=65668"},"modified":"2022-06-10T02:00:19","modified_gmt":"2022-06-10T00:00:19","slug":"amd-details-strategy-to-drive-next-phase-of-growth-across-300-billion-market-for-high-performance-and-adaptive-computing-solutions","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/65668-amd-details-strategy-to-drive-next-phase-of-growth-across-300-billion-market-for-high-performance-and-adaptive-computing-solutions\/","title":{"rendered":"<span class=\"caps\">AMD<\/span> Details Strategy to Drive Next Phase of Growth Across $300 Billion Market for High-Performance and Adaptive Computing Solutions"},"content":{"rendered":"<p><span class=\"caps\">AMD<\/span> unveils next-gene\u00adra\u00adti\u00adon hard\u00adware and soft\u00adware road\u00admaps, expan\u00added pro\u00adduct port\u00adfo\u00adlio addres\u00adsing new mar\u00adkets, and stra\u00adte\u00adgies to acce\u00adle\u00adra\u00adte data cen\u00adter growth and deli\u00adver per\u00adva\u00adsi\u00adve <span class=\"caps\">AI<\/span> leadership<\/p>\n<p align=\"left\"><span class=\"caps\">SANTA<\/span> <span class=\"caps\">CLARA<\/span>, Calif., June 09, 2022 (<span class=\"caps\">GLOBE<\/span> <span class=\"caps\">NEWSWIRE<\/span>) \u2014 Today at its Finan\u00adcial Ana\u00adlyst Day,&nbsp;<a href=\"http:\/\/www.amd.com\/\" target=\"_blank\" rel=\"nofollow noopener\"><span class=\"caps\">AMD<\/span><\/a>&nbsp;(<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>) out\u00adlined its stra\u00adtegy to deli\u00adver its next pha\u00adse of growth dri\u00adven by the company\u2019s expan\u00added port\u00adfo\u00adlio of high-per\u00adfor\u00admance and adap\u00adti\u00adve com\u00adpu\u00adting pro\u00adducts span\u00adning the data cen\u00adter, embedded, cli\u00adent, and gam\u00ading markets.<\/p>\n<p><span class=\"dquo\">\u201c<\/span>From the cloud and PCs to com\u00admu\u00adni\u00adca\u00adti\u00adons and intel\u00adli\u00adgent end\u00adpoints, <span class=\"caps\">AMD<\/span>\u2019s high-per\u00adfor\u00admance and adap\u00adti\u00adve com\u00adpu\u00adting solu\u00adti\u00adons play an incre\u00adasing\u00adly lar\u00adger role in sha\u00adping the capa\u00adbi\u00adli\u00adties of near\u00adly every ser\u00advice and pro\u00adduct defi\u00adning the future of com\u00adpu\u00adting today,\u201d said Dr. Lisa Su, <span class=\"caps\">AMD<\/span> chair and <span class=\"caps\">CEO<\/span>. \u201cThe clo\u00adse of our trans\u00adfor\u00adma\u00adtio\u00adnal acqui\u00adsi\u00adti\u00adon of Xilinx and our expan\u00added port\u00adfo\u00adlio of lea\u00adder\u00adship com\u00adpu\u00adte engi\u00adnes pro\u00advi\u00adde <span class=\"caps\">AMD<\/span> with signi\u00adfi\u00adcant oppor\u00adtu\u00adni\u00adties to deli\u00adver con\u00adtin\u00adued strong reve\u00adnue growth with com\u00adpel\u00adling share\u00adhol\u00adder returns as we cap\u00adtu\u00adre a lar\u00adger share of the diver\u00adse $300 bil\u00adli\u00adon mar\u00adket for our high-per\u00adfor\u00admance and adap\u00adti\u00adve products.\u201d<\/p>\n<p><strong>Tech\u00adno\u00adlo\u00adgy and Pro\u00adduct Port\u00adfo\u00adlio Updates<\/strong><br>\n<span class=\"caps\">AMD<\/span> announ\u00adced expan\u00added mul\u00adti-gene\u00adra\u00adtio\u00adnal <span class=\"caps\">CPU<\/span> core, gra\u00adphics, and adap\u00adti\u00adve com\u00adpu\u00adting archi\u00adtec\u00adtu\u00adre road\u00admaps inclu\u00adding new details on&nbsp;the:<\/p>\n<ul type=\"square\">\n<li><span class=\"dquo\">\u201c<\/span>Zen 4\u201d <span class=\"caps\">CPU<\/span> core expec\u00adted to power the world\u2019s first high-per\u00adfor\u00admance 5nm x86 CPUs later this year. \u201cZen 4\u201d is expec\u00adted to increase <span class=\"caps\">IPC<\/span> 8%-10%<sup>1<\/sup>&nbsp;and deli\u00adver more than a 25% increase in per\u00adfor\u00admance-per-watt<sup>2<\/sup>&nbsp;and 35% over\u00adall per\u00adfor\u00admance increase com\u00adpared to \u201cZen 3\u201d when run\u00adning desk\u00adtop appli\u00adca\u00adti\u00adons<sup>3<\/sup>.<\/li>\n<li><span class=\"dquo\">\u201c<\/span>Zen 5\u201d <span class=\"caps\">CPU<\/span> core plan\u00adned for 2024, which is built from the ground up to deli\u00adver per\u00adfor\u00admance and effi\u00adci\u00aden\u00adcy lea\u00adder\u00adship across a broad ran\u00adge of workloads and fea\u00adtures and includes opti\u00admiza\u00adti\u00adons for <span class=\"caps\">AI<\/span> and machi\u00adne learning.<\/li>\n<li><span class=\"caps\">AMD<\/span> <span class=\"caps\">RDNA<\/span>\u2122 3 gam\u00ading archi\u00adtec\u00adtu\u00adre that com\u00adbi\u00adnes a chip\u00adlet design, next gene\u00adra\u00adti\u00adon <span class=\"caps\">AMD<\/span> Infi\u00adni\u00adty Cache\u2122 tech\u00adno\u00adlo\u00adgy, lea\u00adding-edge 5nm manu\u00adfac\u00adtu\u00adring tech\u00adno\u00adlo\u00adgy, and other enhance\u00adments to deli\u00adver more than 50% grea\u00adter per\u00adfor\u00admance-per-watt com\u00adpared to the pri\u00ador gene\u00adra\u00adti\u00adon<sup>4<\/sup>.<\/li>\n<li>4<sup>th<\/sup>&nbsp;Gen Infi\u00adni\u00adty Archi\u00adtec\u00adtu\u00adre that fur\u00adther extends <span class=\"caps\">AMD<\/span>\u2019s lea\u00adder\u00adship modu\u00adlar SoC design approach with a high-speed inter\u00adcon\u00adnect, allo\u00adwing seam\u00adless inte\u00adgra\u00adti\u00adon of both <span class=\"caps\">AMD<\/span> <span class=\"caps\">IP<\/span> and 3<sup>rd<\/sup>&nbsp;par\u00adty chip\u00adlets to enable an enti\u00adre\u00adly new class of high-per\u00adfor\u00admance and adap\u00adti\u00adve pro\u00adces\u00adsors and pro\u00advi\u00adding a cus\u00adtom-rea\u00addy hete\u00adro\u00adge\u00adnous com\u00adpu\u00adting platform.<\/li>\n<li><span class=\"caps\">AMD<\/span> <span class=\"caps\">CDNA<\/span>\u2122 3 archi\u00adtec\u00adtu\u00adre, which com\u00adbi\u00adnes 5nm chip\u00adlets, <span class=\"caps\">3D<\/span> die stack\u00ading, 4<sup>th<\/sup>&nbsp;gene\u00adra\u00adti\u00adon Infi\u00adni\u00adty Archi\u00adtec\u00adtu\u00adre, next-gene\u00adra\u00adti\u00adon <span class=\"caps\">AMD<\/span> Infi\u00adni\u00adty Cache\u2122 tech\u00adno\u00adlo\u00adgy, and <span class=\"caps\">HBM<\/span> memo\u00adry in a sin\u00adgle packa\u00adge with a uni\u00adfied memo\u00adry pro\u00adgramming model. The first <span class=\"caps\">AMD<\/span> <span class=\"caps\">CDNA<\/span> 3 archi\u00adtec\u00adtu\u00adre-based pro\u00adducts are plan\u00adned for 2023 and are expec\u00adted to deli\u00adver more than <span class=\"caps\">5X<\/span> grea\u00adter per\u00adfor\u00admance-per-watt com\u00adpared to <span class=\"caps\">AMD<\/span> <span class=\"caps\">CDNA<\/span> 2 archi\u00adtec\u00adtu\u00adre on <span class=\"caps\">AI<\/span> trai\u00adning workloads<sup>5<\/sup>.<\/li>\n<li><span class=\"caps\">AMD<\/span> <span class=\"caps\">XDNA<\/span>, the foun\u00adda\u00adtio\u00adnal archi\u00adtec\u00adtu\u00adre <span class=\"caps\">IP<\/span> from Xilinx that con\u00adsists of key tech\u00adno\u00adlo\u00adgies inclu\u00adding the <span class=\"caps\">FPGA<\/span> fabric and <span class=\"caps\">AI<\/span> Engi\u00adne (<span class=\"caps\">AIE<\/span>). The <span class=\"caps\">FPGA<\/span> fabric com\u00adbi\u00adnes an adap\u00adti\u00adve inter\u00adcon\u00adnect with <span class=\"caps\">FPGA<\/span> logic and local memo\u00adry, while the <span class=\"caps\">AIE<\/span> pro\u00advi\u00addes a dataf\u00adlow archi\u00adtec\u00adtu\u00adre opti\u00admi\u00adzed for high per\u00adfor\u00admance and ener\u00adgy effi\u00adci\u00adent <span class=\"caps\">AI<\/span> and signal pro\u00adces\u00adsing appli\u00adca\u00adti\u00adons. <span class=\"caps\">AMD<\/span> plans to inte\u00adgra\u00adte <span class=\"caps\">AMD<\/span> <span class=\"caps\">XDNA<\/span> <span class=\"caps\">IP<\/span> across mul\u00adti\u00adple pro\u00adducts in the future, start\u00ading with <span class=\"caps\">AMD<\/span> Ryzen\u2122 pro\u00adces\u00adsors plan\u00adned for&nbsp;2023.<\/li>\n<\/ul>\n<p>Expan\u00added Data Cen\u00adter Solu\u00adti\u00adons Portfolio<br>\n<span class=\"caps\">AMD<\/span> reve\u00ada\u00adled an expan\u00added port\u00adfo\u00adlio of high-per\u00adfor\u00admance, next-gene\u00adra\u00adti\u00adon CPUs, acce\u00adle\u00adra\u00adtors, data pro\u00adces\u00adsing units (DPUs), and adap\u00adti\u00adve com\u00adpu\u00adting pro\u00adducts opti\u00admi\u00adzed for mul\u00adti\u00adple workloads, including:<\/p>\n<ul type=\"disc\">\n<li>4<sup>th<\/sup>&nbsp;Gen <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span>\u2122 pro\u00adces\u00adsors powered by \u201cZen 4\u201d and \u201cZen 4c\u201d&nbsp;cores.&nbsp;<ul type=\"circle\">\n<li><span class=\"dquo\">\u201c<\/span>Gen\u00adoa\u201d powered by \u201cZen 4\u201d: On-track to launch in <span class=\"caps\">Q4<\/span> 2022 as the hig\u00adhest per\u00adfor\u00admance gene\u00adral pur\u00adpo\u00adse ser\u00adver pro\u00adces\u00adsor available, with the top-of-stack pro\u00adduct deli\u00adve\u00adring grea\u00adter than 75% fas\u00adter enter\u00adpri\u00adse Java\u00ae per\u00adfor\u00admance com\u00adpared to top-of-stack 3<sup>rd<\/sup>&nbsp;Gen <span class=\"caps\">EPYC<\/span> pro\u00adces\u00adsors<sup>6<\/sup>.<\/li>\n<li><span class=\"dquo\">\u201c<\/span>Ber\u00adga\u00admo\u201d powered by \u201cZen 4c\u201d: Expec\u00adted to be the hig\u00adhest per\u00adfor\u00admance ser\u00adver pro\u00adces\u00adsors for cloud nati\u00adve com\u00adpu\u00adting, offe\u00adring more than dou\u00adble the con\u00adtai\u00adner den\u00adsi\u00adty of 3<sup>rd<\/sup>&nbsp;Gen <span class=\"caps\">EPYC<\/span> pro\u00adces\u00adsors at their launch plan\u00adned for the first half of 2023<sup>7<\/sup>.<\/li>\n<li><span class=\"dquo\">\u201c<\/span>Genoa\u2011X\u201d powered by \u201cZen 4\u201d: An opti\u00admi\u00adzed ver\u00adsi\u00adon of 4<sup>th<\/sup>&nbsp;Gen <span class=\"caps\">EPYC<\/span> pro\u00adces\u00adsors with <span class=\"caps\">AMD<\/span> <span class=\"caps\">3D<\/span> V\u2011Cache\u2122 tech\u00adno\u00adlo\u00adgy to enable lea\u00adder\u00adship per\u00adfor\u00admance in rela\u00adtio\u00adnal data\u00adba\u00adse and tech\u00adni\u00adcal com\u00adpu\u00adting workloads<sup>8<\/sup>.<\/li>\n<li><span class=\"dquo\">\u201c<\/span>Sie\u00adna\u201d powered by \u201cZen 4\u201d: The first <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span> pro\u00adces\u00adsor opti\u00admi\u00adzed for intel\u00adli\u00adgent edge and com\u00admu\u00adni\u00adca\u00adti\u00adons deploy\u00adments that requi\u00adre hig\u00adher com\u00adpu\u00adte den\u00adsi\u00adties in a cost and power opti\u00admi\u00adzed platform.<\/li>\n<\/ul>\n<\/li>\n<li><span class=\"caps\">AMD<\/span> Instinct\u2122 <span class=\"caps\">MI300<\/span> acce\u00adle\u00adra\u00adtors, the world\u2019s first data cen\u00adter APUs, expec\u00adted to deli\u00adver a grea\u00adter than 8x increase in <span class=\"caps\">AI<\/span> trai\u00adning per\u00adfor\u00admance com\u00adpared to the <span class=\"caps\">AMD<\/span> Instinct <span class=\"caps\">MI200<\/span> acce\u00adle\u00adra\u00adtor<sup>9<\/sup>. <span class=\"caps\">MI300<\/span> acce\u00adle\u00adra\u00adtors levera\u00adge a ground\u00adbrea\u00adking <span class=\"caps\">3D<\/span> chip\u00adlet design com\u00adbi\u00adning <span class=\"caps\">AMD<\/span> <span class=\"caps\">CDNA<\/span> 3 <span class=\"caps\">GPU<\/span>, \u201cZen 4\u201d <span class=\"caps\">CPU<\/span>, cache memo\u00adry, and <span class=\"caps\">HBM<\/span> chip\u00adlets that are desi\u00adgned to pro\u00advi\u00adde lea\u00adder\u00adship memo\u00adry band\u00adwidth and appli\u00adca\u00adti\u00adon laten\u00adcy for <span class=\"caps\">AI<\/span> trai\u00adning and <span class=\"caps\">HPC<\/span> workloads.<\/li>\n<li><span class=\"caps\">AMD<\/span> Pen\u00adsan\u00addo DPUs that com\u00adbi\u00adne a robust soft\u00adware stack with \u201czero trust secu\u00adri\u00adty\u201d throug\u00adhout and an indus\u00adtry-lea\u00adding packet pro\u00adces\u00adsor to crea\u00adte the world\u2019s most intel\u00adli\u00adgent and per\u00adfor\u00admant <span class=\"caps\">DPU<\/span>, which is alre\u00ada\u00addy deploy\u00aded at sca\u00adle across cloud and enter\u00adpri\u00adse customers.<\/li>\n<li>Alveo\u2122 Smart\u00adNICs deploy\u00aded by hypers\u00adca\u00adle cus\u00adto\u00admers to acce\u00adle\u00adra\u00adte cus\u00adtom workloads and extend con\u00adfi\u00adden\u00adti\u00adal com\u00adpu\u00adting to the net\u00adwor\u00adking interface.<\/li>\n<\/ul>\n<p>Acce\u00adle\u00adra\u00adting Lea\u00adder\u00adship in Per\u00adva\u00adsi\u00adve&nbsp;<span class=\"caps\">AI<\/span><br>\n<span class=\"caps\">AMD<\/span> is uni\u00adque\u00adly posi\u00adtio\u00adned with its broad pro\u00adduct port\u00adfo\u00adlio and expe\u00adri\u00adence ser\u00adving diver\u00adse embedded mar\u00adkets to help cus\u00adto\u00admers deve\u00adlop and deploy appli\u00adca\u00adti\u00adons with mul\u00adti\u00adple forms of&nbsp;<span class=\"caps\">AI<\/span>.<\/p>\n<p>The trans\u00adfor\u00adma\u00adti\u00adve acqui\u00adsi\u00adti\u00adon of Xilinx pro\u00advi\u00addes <span class=\"caps\">AMD<\/span> with an unmat\u00adched set of hard\u00adware and soft\u00adware capa\u00adbi\u00adli\u00adties, inte\u00adgra\u00adting the lea\u00adder\u00adship Xilinx <span class=\"caps\">AI<\/span> Engi\u00adne (<span class=\"caps\">AIE<\/span>) across <span class=\"caps\">AMD<\/span> Ryzen, <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span> and Xilinx Ver\u00adsal\u2122 pro\u00adducts for small and mid-size <span class=\"caps\">AI<\/span> models to com\u00adple\u00adment next-gene\u00adra\u00adti\u00adon <span class=\"caps\">AMD<\/span> Instinct acce\u00adle\u00adra\u00adtors and adap\u00adti\u00adve SoCs, enab\u00adling lea\u00adder\u00adship per\u00adfor\u00admance on sca\u00adle-out trai\u00adning and infe\u00adrence workloads.<\/p>\n<p>To uni\u00adfy <span class=\"caps\">AI<\/span> pro\u00adgramming tools, <span class=\"caps\">AMD<\/span> also announ\u00adced a mul\u00adti-gene\u00adra\u00adti\u00adon Uni\u00adfied <span class=\"caps\">AI<\/span> Soft\u00adware road\u00admap that will allow <span class=\"caps\">AI<\/span> deve\u00adlo\u00adpers to pro\u00adgram across its <span class=\"caps\">CPU<\/span>, <span class=\"caps\">GPU<\/span>, and Adap\u00adti\u00adve SoC pro\u00adduct port\u00adfo\u00adlio from machi\u00adne lear\u00adning (<span class=\"caps\">ML<\/span>) frame\u00adworks with the same set of tools and pre-opti\u00admi\u00adzed models.<\/p>\n<p>Expan\u00adding <span class=\"caps\">PC<\/span> Leadership<br>\n<span class=\"caps\">AMD<\/span> show\u00adca\u00adsed its lea\u00adder\u00adship in the glo\u00adbal <span class=\"caps\">PC<\/span> mar\u00adket, detail\u00ading how it con\u00adti\u00adnues to deepen <span class=\"caps\">OEM<\/span> part\u00adner\u00adships and dri\u00adve con\u00adtin\u00adued growth across pre\u00admi\u00adum, gam\u00ading, and com\u00admer\u00adcial mar\u00adkets, and pro\u00advi\u00added a pre\u00adview of its cli\u00adent road\u00admap over the next seve\u00adral years, including:<\/p>\n<ul type=\"disc\">\n<li>The \u201cPhoe\u00adnix Point\u201d mobi\u00adle pro\u00adces\u00adsor plan\u00adned for 2023 will bring tog\u00ade\u00adther the <span class=\"caps\">AMD<\/span> \u201cZen 4\u201d core archi\u00adtec\u00adtu\u00adre with <span class=\"caps\">AMD<\/span> <span class=\"caps\">RDNA<\/span> 3 gra\u00adphics archi\u00adtec\u00adtu\u00adre and <span class=\"caps\">AIE<\/span>, fol\u00adlo\u00adwed by the \u201cStrix Point\u201d pro\u00adces\u00adsor plan\u00adned for 2024. \u201cPhoe\u00adnix Point\u201d inno\u00adva\u00adtions include the <span class=\"caps\">AIE<\/span> infe\u00adrence acce\u00adle\u00adra\u00adtor, image signal pro\u00adces\u00adsor, advan\u00adced dis\u00adplay for refresh and respon\u00adse, <span class=\"caps\">AMD<\/span> chip\u00adlet archi\u00adtec\u00adtu\u00adre, and extre\u00adme power management.<\/li>\n<li>The \u201cZen 4\u201d-based Ryzen 7000 Series desk\u00adtop pro\u00adces\u00adsors, which are expec\u00adted to deli\u00adver fas\u00adter clock speeds and grea\u00adter sin\u00adgle and mul\u00adti-threa\u00added per\u00adfor\u00admance com\u00adpared to Ryzen 6000 pro\u00adces\u00adsors<sup>10<\/sup>, will be fol\u00adlo\u00adwed by \u201cZen 5\u201d-based \u201cGra\u00adni\u00adte Ridge\u201d processors.<\/li>\n<\/ul>\n<p>Dri\u00adving Gra\u00adphics Momentum<br>\n<span class=\"caps\">AMD<\/span> announ\u00adced the latest deve\u00adlo\u00adp\u00adments desi\u00adgned to con\u00adti\u00adnue brin\u00adging world-class gra\u00adphics solu\u00adti\u00adons to cus\u00adto\u00admers world\u00adwi\u00adde, including:<\/p>\n<ul type=\"disc\">\n<li><span class=\"dquo\">\u201c<\/span>Navi 3x\u201d pro\u00adducts are expec\u00adted to launch later this year, built on the next-gene\u00adra\u00adti\u00adon <span class=\"caps\">AMD<\/span> <span class=\"caps\">RDNA<\/span> 3 gam\u00ading architecture.<\/li>\n<li>More than 50 new gam\u00ading <span class=\"caps\">PC<\/span> plat\u00adforms are expec\u00adted to launch in 2022, ele\u00advat\u00ading gam\u00ading to new levels of per\u00adfor\u00admance and visu\u00adal fide\u00adli\u00adty by com\u00adbi\u00adning <span class=\"caps\">AMD<\/span> Rade\u00adon\u2122 <span class=\"caps\">RX<\/span> Series gra\u00adphics with <span class=\"caps\">AMD<\/span> Ryzen processors.<\/li>\n<li><span class=\"caps\">AMD<\/span> expan\u00added its lea\u00adder\u00adship posi\u00adti\u00adon in the gam\u00ading con\u00adso\u00adle space with the addi\u00adti\u00adon of Valve\u2019s Steam Deck\u2122 gam\u00ading hand\u00adheld, powered by <span class=\"caps\">AMD<\/span> \u201cZen 2\u201d archi\u00adtec\u00adtu\u00adre- based pro\u00adces\u00adsors and <span class=\"caps\">AMD<\/span> <span class=\"caps\">RDNA<\/span> 2 archi\u00adtec\u00adtu\u00adre-based graphics.<\/li>\n<li>New growth oppor\u00adtu\u00adni\u00adties in 2022 and bey\u00adond, inclu\u00adding pro\u00advi\u00adding a ran\u00adge of gra\u00adphics tech\u00adno\u00adlo\u00adgies to acce\u00adle\u00adra\u00adte next-gene\u00adra\u00adti\u00adon meta\u00adver\u00adse appli\u00adca\u00adti\u00adons, ran\u00adging from <span class=\"caps\">3D<\/span> con\u00adtent crea\u00adti\u00adon bey\u00adond games and movies, to cloud gam\u00ading and inter\u00adac\u00adti\u00advi\u00adty within meta\u00adver\u00adse environments.<\/li>\n<\/ul>\n<p><strong>New Finan\u00adcial Report\u00ading Segments<\/strong><br>\nStart\u00ading with second quar\u00adter 2022 results, <span class=\"caps\">AMD<\/span> is updating its finan\u00adcial report\u00ading seg\u00adments to ali\u00adgn with its stra\u00adte\u00adgic end markets:<\/p>\n<ul type=\"disc\">\n<li>Data Cen\u00adter: Inclu\u00adding ser\u00adver CPUs, data cen\u00adter GPUs, and the por\u00adti\u00adons of Xilinx reve\u00adnue rela\u00adted to the data cen\u00adter business<\/li>\n<li>Embedded: Inclu\u00adding the Xilinx embedded busi\u00adness plus the <span class=\"caps\">AMD<\/span> embedded business<\/li>\n<li>Cli\u00adent: Inclu\u00adding the tra\u00addi\u00adtio\u00adnal desk\u00adtop and note\u00adbook <span class=\"caps\">PC<\/span> business<\/li>\n<li>Gam\u00ading: Inclu\u00adding the dis\u00adcrete gra\u00adphics gam\u00ading busi\u00adness and the semi-cus\u00adtom game con\u00adso\u00adle business.<\/li>\n<\/ul>\n<p><strong>Tog\u00ade\u00adther We Advance<\/strong><br>\nTo com\u00adple\u00adment the evo\u00adlu\u00adti\u00adon of its stra\u00adte\u00adgic end mar\u00adkets and lea\u00adder\u00adship pro\u00adduct port\u00adfo\u00adlio, <span class=\"caps\">AMD<\/span> also show\u00adca\u00adsed a new evo\u00adlu\u00adti\u00adon of its brand. The new brand plat\u00adform, \u201ctog\u00ade\u00adther we advance_\u201d demons\u00adtra\u00adtes how, tog\u00ade\u00adther with its part\u00adners, cus\u00adto\u00admers, and employees, <span class=\"caps\">AMD<\/span> is advan\u00adcing inno\u00adva\u00adti\u00adon to crea\u00adte solu\u00adti\u00adons to the world\u2019s toug\u00adhest chal\u00adlenges. The new brand cam\u00adpaign is the lar\u00adgest in <span class=\"caps\">AMD<\/span> histo\u00adry and sees the <span class=\"caps\">AMD<\/span> arrow mark beco\u00adming more pro\u00admi\u00adnent in all com\u00admu\u00adni\u00adca\u00adti\u00adons assets, illus\u00adt\u00adra\u00adting how per\u00adva\u00adsi\u00adve <span class=\"caps\">AMD<\/span> tech\u00adno\u00adlo\u00adgy is by powe\u00adring lar\u00adge, diver\u00adse, and gro\u00adwing markets.<\/p>\n<p><strong>Sup\u00adport\u00ading Resources<\/strong><\/p>\n<ul type=\"disc\">\n<li>Watch the&nbsp;<a href=\"https:\/\/ir.amd.com\/news-events\/financial-analyst-day\" target=\"_blank\" rel=\"nofollow noopener\">event replay<\/a><\/li>\n<li>Access&nbsp;<a href=\"https:\/\/ir.amd.com\/news-events\/financial-analyst-day\" target=\"_blank\" rel=\"nofollow noopener\">event pre\u00adsen\u00adta\u00adti\u00adons<\/a><\/li>\n<li>Read more about&nbsp;<a href=\"https:\/\/community.amd.com\/t5\/corporate\/evolving-our-brand-to-reflect-our-vision\/ba-p\/529278\" target=\"_blank\" rel=\"nofollow noopener\"><span class=\"caps\">AMD<\/span> brand updates<\/a><\/li>\n<li>Fol\u00adlow <span class=\"caps\">AMD<\/span> on&nbsp;<a href=\"https:\/\/twitter.com\/AMD\" target=\"_blank\" rel=\"nofollow noopener\">Twit\u00adter<\/a><\/li>\n<\/ul>\n<p><strong>About <span class=\"caps\">AMD<\/span><\/strong><br>\nFor more than 50 years <span class=\"caps\">AMD<\/span> has dri\u00adven inno\u00adva\u00adti\u00adon in high-per\u00adfor\u00admance com\u00adpu\u00adting, gra\u00adphics, and visua\u00adliza\u00adti\u00adon tech\u00adno\u00adlo\u00adgies. <span class=\"caps\">AMD<\/span> employees are focu\u00adsed on buil\u00adding lea\u00adder\u00adship high-per\u00adfor\u00admance and adap\u00adti\u00adve pro\u00adducts that push the boun\u00adda\u00adries of what is pos\u00adsi\u00adble. Bil\u00adli\u00adons of peo\u00adp\u00adle, lea\u00adding For\u00adtu\u00adne 500 busi\u00adnesses, and cut\u00adting-edge sci\u00aden\u00adti\u00adfic rese\u00adarch insti\u00adtu\u00adti\u00adons around the world rely on <span class=\"caps\">AMD<\/span> tech\u00adno\u00adlo\u00adgy dai\u00adly to impro\u00adve how they live, work, and play. For more infor\u00adma\u00adti\u00adon about how <span class=\"caps\">AMD<\/span> is enab\u00adling today and inspi\u00adring tomor\u00adrow, visit the <span class=\"caps\">AMD<\/span> (<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>)&nbsp;<a href=\"http:\/\/www.amd.com\/\" target=\"_blank\" rel=\"nofollow noopener\">web\u00adsite<\/a>,&nbsp;<a href=\"http:\/\/community.amd.com\/\" target=\"_blank\" rel=\"nofollow noopener\">blog<\/a>,&nbsp;<a href=\"https:\/\/www.linkedin.com\/company\/amd\" target=\"_blank\" rel=\"nofollow noopener\">Lin\u00adke\u00addIn<\/a>, and&nbsp;<a href=\"https:\/\/twitter.com\/amd\" target=\"_blank\" rel=\"nofollow noopener\">Twit\u00adter<\/a>&nbsp;pages.&nbsp;<\/p>\n<p><strong>Cau\u00adtio\u00adna\u00adry Statement<\/strong><br>\nThis press release con\u00adta\u00adins for\u00adward-loo\u00adking state\u00adments con\u00adcer\u00adning Advan\u00adced Micro Devices, Inc. (<span class=\"caps\">AMD<\/span>) such as the fea\u00adtures, func\u00adtion\u00ada\u00adli\u00adty, per\u00adfor\u00admance, avai\u00adla\u00adbi\u00adli\u00adty, timing and expec\u00adted bene\u00adfits of <span class=\"caps\">AMD<\/span> pro\u00adducts; <span class=\"caps\">AMD<\/span>\u2019s next pha\u00adse of growth; <span class=\"caps\">AMD<\/span>\u2019s signi\u00adfi\u00adcant oppor\u00adtu\u00adni\u00adty to deli\u00adver strong growth and share\u00adhol\u00adder returns over the next five years; expec\u00adted bene\u00adfits of <span class=\"caps\">AMD<\/span>\u2019s acqui\u00adsi\u00adti\u00adon of Pen\u00adsan\u00addo Sys\u00adtems; and <span class=\"caps\">AMD<\/span>\u2019s new growth oppor\u00adtu\u00adni\u00adties in 2022 and bey\u00adond, which are made pur\u00adsu\u00adant to the Safe Har\u00adbor pro\u00advi\u00adsi\u00adons of the Pri\u00adva\u00adte Secu\u00adri\u00adties Liti\u00adga\u00adti\u00adon Reform Act of 1995. For\u00adward-loo\u00adking state\u00adments are com\u00admon\u00adly iden\u00adti\u00adfied by words such as \u201cwould,\u201d \u201cmay,\u201d \u201cexpects,\u201d \u201cbelie\u00adves,\u201d \u201cplans,\u201d \u201cintends,\u201d \u201cpro\u00adjects\u201d and other terms with simi\u00adlar mea\u00adning. Inves\u00adtors are cau\u00adtio\u00adned that the for\u00adward-loo\u00adking state\u00adments in this press release are based on cur\u00adrent beliefs, assump\u00adti\u00adons and expec\u00adta\u00adti\u00adons, speak only as of the date of this press release and invol\u00adve risks and uncer\u00adtain\u00adties that could cau\u00adse actu\u00adal results to dif\u00adfer mate\u00adri\u00adal\u00adly from cur\u00adrent expec\u00adta\u00adti\u00adons. Such state\u00adments are sub\u00adject to cer\u00adtain known and unknown risks and uncer\u00adtain\u00adties, many of which are dif\u00adfi\u00adcult to pre\u00addict and gene\u00adral\u00adly bey\u00adond <span class=\"caps\">AMD<\/span>\u2019s con\u00adtrol, that could cau\u00adse actu\u00adal results and other future events to dif\u00adfer mate\u00adri\u00adal\u00adly from tho\u00adse expres\u00adsed in, or impli\u00aded or pro\u00adjec\u00adted by, the for\u00adward-loo\u00adking infor\u00adma\u00adti\u00adon and state\u00adments. Mate\u00adri\u00adal fac\u00adtors that could cau\u00adse actu\u00adal results to dif\u00adfer mate\u00adri\u00adal\u00adly from cur\u00adrent expec\u00adta\u00adti\u00adons include, wit\u00adhout limi\u00adta\u00adti\u00adon, the fol\u00adlo\u00adwing: Intel Corporation\u2019s domi\u00adnan\u00adce of the micro\u00adpro\u00adces\u00adsor mar\u00adket and its aggres\u00adsi\u00adve busi\u00adness prac\u00adti\u00adces; glo\u00adbal eco\u00adno\u00admic uncer\u00adtain\u00adty; loss of a signi\u00adfi\u00adcant cus\u00adto\u00admer; impact of the <span class=\"caps\">COVID-19<\/span> pan\u00adde\u00admic on <span class=\"caps\">AMD<\/span>\u2019s busi\u00adness, finan\u00adcial con\u00addi\u00adti\u00adon and results of ope\u00adra\u00adti\u00adons; com\u00adpe\u00adti\u00adti\u00adve mar\u00adkets in which <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts are sold; mar\u00adket con\u00addi\u00adti\u00adons of the indus\u00adtries in which <span class=\"caps\">AMD<\/span> pro\u00adducts are sold; cycli\u00adcal natu\u00adre of the semi\u00adcon\u00adduc\u00adtor indus\u00adtry; quar\u00adter\u00adly and sea\u00adso\u00adnal sales pat\u00adterns; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to ade\u00adqua\u00adte\u00adly pro\u00adtect its tech\u00adno\u00adlo\u00adgy or other intellec\u00adtu\u00adal pro\u00adper\u00adty; unfa\u00advorable cur\u00adren\u00adcy exch\u00adan\u00adge rate fluc\u00adtua\u00adtions; abili\u00adty of third par\u00adty manu\u00adfac\u00adtu\u00adr\u00aders to manu\u00adfac\u00adtu\u00adre <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts on a time\u00adly basis in suf\u00adfi\u00adci\u00adent quan\u00adti\u00adties and using com\u00adpe\u00adti\u00adti\u00adve tech\u00adno\u00adlo\u00adgies; avai\u00adla\u00adbi\u00adli\u00adty of essen\u00adti\u00adal equip\u00adment, mate\u00adri\u00adals, sub\u00adstra\u00adtes or manu\u00adfac\u00adtu\u00adring pro\u00adces\u00adses; abili\u00adty to achie\u00adve expec\u00adted manu\u00adfac\u00adtu\u00adring yields for <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to intro\u00addu\u00adce pro\u00adducts on a time\u00adly basis with expec\u00adted fea\u00adtures and per\u00adfor\u00admance levels; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to gene\u00adra\u00adte reve\u00adnue from its semi-cus\u00adtom SoC pro\u00adducts; poten\u00adti\u00adal secu\u00adri\u00adty vul\u00adnerabi\u00adli\u00adties; poten\u00adti\u00adal secu\u00adri\u00adty inci\u00addents inclu\u00adding <span class=\"caps\">IT<\/span> outa\u00adges, data loss, data brea\u00adches and cyber-attacks; uncer\u00adtain\u00adties invol\u00adving the orde\u00adring and ship\u00adment of <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts; <span class=\"caps\">AMD<\/span>\u2019s reli\u00adance on third-par\u00adty intellec\u00adtu\u00adal pro\u00adper\u00adty to design and intro\u00addu\u00adce new pro\u00adducts in a time\u00adly man\u00adner; <span class=\"caps\">AMD<\/span>\u2019s reli\u00adance on third-par\u00adty com\u00adpa\u00adnies for design, manu\u00adfac\u00adtu\u00adre and sup\u00adp\u00adly of mother\u00adboards, soft\u00adware and other com\u00adpu\u00adter plat\u00adform com\u00adpon\u00adents; <span class=\"caps\">AMD<\/span>\u2019s reli\u00adance on Micro\u00adsoft and other soft\u00adware ven\u00addors\u2019 sup\u00adport to design and deve\u00adlop soft\u00adware to run on <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts; <span class=\"caps\">AMD<\/span>\u2019s reli\u00adance on third-par\u00adty dis\u00adtri\u00adbu\u00adtors and add-in-board part\u00adners; impact of modi\u00adfi\u00adca\u00adti\u00adon or inter\u00adrup\u00adti\u00adon of <span class=\"caps\">AMD<\/span>\u2019s inter\u00adnal busi\u00adness pro\u00adces\u00adses and infor\u00adma\u00adti\u00adon sys\u00adtems; com\u00adpa\u00adti\u00adbi\u00adli\u00adty of <span class=\"caps\">AMD<\/span>\u2019s pro\u00adducts with some or all indus\u00adtry-stan\u00addard soft\u00adware and hard\u00adware; cos\u00adts rela\u00adted to defec\u00adti\u00adve pro\u00adducts; effi\u00adci\u00aden\u00adcy of <span class=\"caps\">AMD<\/span>\u2019s sup\u00adp\u00adly chain; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to rely on third par\u00adty sup\u00adp\u00adly-chain logi\u00adstics func\u00adtions; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to effec\u00adtively con\u00adtrol sales of its pro\u00adducts on the gray mar\u00adket; impact of govern\u00adment actions and regu\u00adla\u00adti\u00adons such as export admi\u00adnis\u00adtra\u00adti\u00adon regu\u00adla\u00adti\u00adons, tariffs and trade pro\u00adtec\u00adtion mea\u00adsu\u00adres; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to rea\u00adli\u00adze its defer\u00adred tax assets; poten\u00adti\u00adal tax lia\u00adbi\u00adli\u00adties; cur\u00adrent and future claims and liti\u00adga\u00adti\u00adon; impact of envi\u00adron\u00admen\u00adtal laws, con\u00adflict mine\u00adrals-rela\u00adted pro\u00advi\u00adsi\u00adons and other laws or regu\u00adla\u00adti\u00adons; impact of acqui\u00adsi\u00adti\u00adons, joint ven\u00adtures and\/or invest\u00adments on <span class=\"caps\">AMD<\/span>\u2019s busi\u00adness, and abili\u00adty to inte\u00adgra\u00adte acqui\u00adred busi\u00adnesses, such as Xilinx; impact of any impair\u00adment of the com\u00adbi\u00adned company\u2019s assets on the com\u00adbi\u00adned company\u2019s finan\u00adcial posi\u00adti\u00adon and results of ope\u00adra\u00adti\u00adon; rest\u00adric\u00adtions impo\u00adsed by agree\u00adments gover\u00adning <span class=\"caps\">AMD<\/span>\u2019s notes, the gua\u00adran\u00adtees of Xilinx\u2019s notes and the revol\u00adving cre\u00addit faci\u00adli\u00adty; <span class=\"caps\">AMD<\/span>\u2019s indeb\u00adted\u00adness; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to gene\u00adra\u00adte suf\u00adfi\u00adci\u00adent cash to meet its working capi\u00adtal requi\u00adre\u00adments or gene\u00adra\u00adte suf\u00adfi\u00adci\u00adent reve\u00adnue and ope\u00adra\u00adting cash flow to make all of its plan\u00adned R<span class=\"amp\">&amp;<\/span>D or stra\u00adte\u00adgic invest\u00adments; poli\u00adti\u00adcal, legal, eco\u00adno\u00admic risks and natu\u00adral dis\u00adas\u00adters; future impairm\u00adents of good\u00adwill and tech\u00adno\u00adlo\u00adgy licen\u00adse purcha\u00adses; <span class=\"caps\">AMD<\/span>\u2019s abili\u00adty to attract and retain qua\u00adli\u00adfied per\u00adson\u00adnel; <span class=\"caps\">AMD<\/span>\u2019s stock pri\u00adce vola\u00adti\u00adli\u00adty; and world\u00adwi\u00adde poli\u00adti\u00adcal con\u00addi\u00adti\u00adons. Inves\u00adtors are urged to review in detail the risks and uncer\u00adtain\u00adties in <span class=\"caps\">AMD<\/span>\u2019s Secu\u00adri\u00adties and Exch\u00adan\u00adge Com\u00admis\u00adsi\u00adon filings, inclu\u00adding but not limi\u00adt\u00aded to <span class=\"caps\">AMD<\/span>\u2019s most recent reports on Forms 10\u2011K and 10\u2011Q.<\/p>\n<p><strong>\u00a92022 Advan\u00adced Micro Devices, Inc. All rights reser\u00adved. <span class=\"caps\">AMD<\/span>, the <span class=\"caps\">AMD<\/span> Arrow logo, <span class=\"caps\">AMD<\/span> <span class=\"caps\">CDNA<\/span>, <span class=\"caps\">EPYC<\/span>, Infi\u00adni\u00adty Cache, Rade\u00adon, <span class=\"caps\">RDNA<\/span>, Ryzen and com\u00adbi\u00adna\u00adti\u00adons the\u00adreof, are trade\u00admarks of Advan\u00adced Micro Devices, Inc. Other names are for infor\u00adma\u00adtio\u00adnal pur\u00adpo\u00adses only and may be trade\u00admarks of their respec\u00adti\u00adve owners.<\/strong><\/p>\n<p><sup>1<\/sup>&nbsp;<span class=\"caps\">Z4-001<\/span>: <span class=\"caps\">IPC<\/span> uplift based on the avera\u00adge of estimated\/published 2017 SPE\u00adC\u00adint<sup>\u00ae<\/sup>&nbsp;and 2017 SPECfp<sup>\u00ae<\/sup>&nbsp;scores and inter\u00adnal estimates\/testing on Cine\u00adbench <span class=\"caps\">R23<\/span> <span class=\"caps\">1T<\/span> and Geek\u00adbench 5 <span class=\"caps\">1T<\/span>.for \u201cZen4\u201d and \u201cZen 3\u201d processors<br>\n<sup>2<\/sup>&nbsp;<span class=\"caps\">Z4-003<\/span>: Test\u00ading as of May 31, 2022, by <span class=\"caps\">AMD<\/span> Per\u00adfor\u00admance Labs. Power mea\u00adsu\u00adred at <span class=\"caps\">CPU<\/span> socket only (Watts), <span class=\"caps\">CPU<\/span> per\u00adfor\u00admance (\u201cpoints\u201d) mea\u00adsu\u00adred with Cine\u00adbench <span class=\"caps\">R23<\/span> nT. <span class=\"caps\">AMD<\/span> Ryzen 9 <span class=\"caps\">5950X<\/span> Sys\u00adtem: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X570<\/span> Mother\u00adboard, 2x8 <span class=\"caps\">DDR4-3200<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 7000 Series: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X670<\/span> Mother\u00adboard, Ryzen 7000 Series 16-core pre-pro\u00adduc\u00adtion pro\u00adces\u00adsor sam\u00adple, 2x16GB <span class=\"caps\">DDR5-5200<\/span>. All sys\u00adtems con\u00adfi\u00adgu\u00adred with Rade\u00adon\u2122 <span class=\"caps\">RX<\/span> <span class=\"caps\">6950XT<\/span> <span class=\"caps\">GPU<\/span> (dri\u00adver: 22.10 Prime), Win\u00addows 11 Build 22000.593, Sam\u00adsung 980 Pro <span class=\"caps\">1TB<\/span> <span class=\"caps\">SSD<\/span>, Ase\u00adtek <span class=\"caps\">280MM<\/span> liquid coo\u00adler. Results may vary when final pro\u00adducts are released in market.<br>\n<sup>3<\/sup>&nbsp;<span class=\"caps\">Z4-004<\/span>: Test\u00ading as of May 5, 2022, by <span class=\"caps\">AMD<\/span> Per\u00adfor\u00admance Labs. Sin\u00adgle-thread per\u00adfor\u00admance eva\u00adlua\u00adted with Cine\u00adbench <span class=\"caps\">R23<\/span> <span class=\"caps\">1T<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 9 <span class=\"caps\">5950X<\/span> Sys\u00adtem: <span class=\"caps\">ASUS<\/span> <span class=\"caps\">ROG<\/span> Cross\u00adhair <span class=\"caps\">VIII<\/span> Hero <span class=\"caps\">X570<\/span>, 2x8 <span class=\"caps\">DDR4-3600C16<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 7000 Series: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X670<\/span> Mother\u00adboard, Ryzen 7000 Series 16-core pre-pro\u00adduc\u00adtion pro\u00adces\u00adsor sam\u00adple, 2x16GB <span class=\"caps\">DDR5-6000CL30<\/span>. All sys\u00adtems con\u00adfi\u00adgu\u00adred with Rade\u00adon\u2122 <span class=\"caps\">RX<\/span> <span class=\"caps\">6950XT<\/span> <span class=\"caps\">GPU<\/span> (dri\u00adver: 22.10 Prime), Win\u00addows 11 Build 22000.593, Sam\u00adsung 980 Pro <span class=\"caps\">1TB<\/span> <span class=\"caps\">SSD<\/span>, Ase\u00adtek <span class=\"caps\">280MM<\/span> liquid coo\u00adler. Results may vary when final pro\u00adducts are released in market.<br>\n<sup>4<\/sup>&nbsp;Based on preli\u00admi\u00adna\u00adry inter\u00adnal engi\u00adnee\u00adring esti\u00adma\u00adtes. Actu\u00adal results sub\u00adject to change<br>\n<sup>5<\/sup>&nbsp;<span class=\"caps\">MI300-004<\/span>: Mea\u00adsu\u00adre\u00adments by <span class=\"caps\">AMD<\/span> Per\u00adfor\u00admance Labs June 4, 2022. <span class=\"caps\">MI250X<\/span> (<span class=\"caps\">560W<\/span>) <span class=\"caps\">FP16<\/span> (306.4 esti\u00adma\u00adted deli\u00adver\u00aded <span class=\"caps\">TFLOPS<\/span> based on 80% of peak theo\u00adre\u00adti\u00adcal floa\u00adting-point per\u00adfor\u00admance). <span class=\"caps\">MI300<\/span> <span class=\"caps\">FP8<\/span> per\u00adfor\u00admance based on preli\u00admi\u00adna\u00adry esti\u00adma\u00adtes and expec\u00adta\u00adti\u00adons. <span class=\"caps\">MI300<\/span> <span class=\"caps\">TDP<\/span> power based on preli\u00admi\u00adna\u00adry pro\u00adjec\u00adtions. Final per\u00adfor\u00admance may&nbsp;vary<br>\n<sup>6<\/sup>&nbsp;<span class=\"caps\">SP5-005<\/span>: Ser\u00adver-side Java mul\u00adtiJVM workload demo com\u00adpa\u00adri\u00adson based on <span class=\"caps\">AMD<\/span> mea\u00adsu\u00adred test\u00ading as of 6\/2\/2022. Con\u00adfi\u00adgu\u00adra\u00adti\u00adons: 2x 96-core <span class=\"caps\">AMD<\/span> 4th Gen <span class=\"caps\">EPYC<\/span> (pre-pro\u00adduc\u00adtion sili\u00adcon) on a refe\u00adrence sys\u00adtem ver\u00adsus 2x 64-core <span class=\"caps\">EPYC<\/span> 7763 on a refe\u00adrence sys\u00adtem. Java ver\u00adsi\u00adon <span class=\"caps\">JDK18<\/span>.To fit in demo time per\u00admit\u00adted, the full ser\u00adver-side Java run that typi\u00adcal\u00adly takes about 20 minu\u00adtes was redu\u00adced to a short-pre\u00adset time whe\u00adre both sys\u00adtems were run\u00adning at 99% <span class=\"caps\">CPU<\/span> uti\u00adliza\u00adti\u00adon, eli\u00admi\u00adna\u00adting the \u201cwarm up\u201d peri\u00adod data. <span class=\"caps\">OEM<\/span> published scores will vary based on sys\u00adtem con\u00adfi\u00adgu\u00adra\u00adti\u00adon and use of pro\u00adduc\u00adtion silicon.<br>\n<sup>7<\/sup>&nbsp;<span class=\"caps\">SP5-006<\/span>: 128-core 4th Gen <span class=\"caps\">EPYC<\/span> CPUs com\u00adpared to a 64-core 3rd Gen <span class=\"caps\">EPYC<\/span> 7763 for 2x the con\u00adtai\u00adner density<br>\n<sup>8<\/sup>&nbsp;\u201cTech\u00adni\u00adcal Com\u00adpu\u00adting\u201d or \u201cTech\u00adni\u00adcal Com\u00adpu\u00adting Workloads\u201d as defi\u00adned by <span class=\"caps\">AMD<\/span> can include: elec\u00adtro\u00adnic design auto\u00adma\u00adti\u00adon, com\u00adpu\u00adta\u00adtio\u00adnal flu\u00adid dyna\u00admics, fini\u00adte ele\u00adment ana\u00adly\u00adsis, seis\u00admic tomo\u00adgra\u00adphy, wea\u00adther fore\u00adcas\u00adting, quan\u00adtum mecha\u00adnics, cli\u00adma\u00adte rese\u00adarch, mole\u00adcu\u00adlar mode\u00adling, or simi\u00adlar workloads. <span class=\"caps\">GD-204<\/span><br>\n<sup>9<\/sup>&nbsp;<span class=\"caps\">MI300-03<\/span> \u2014 Mea\u00adsu\u00adre\u00adments by <span class=\"caps\">AMD<\/span> Per\u00adfor\u00admance Labs June 4, 2022 on cur\u00adrent spe\u00adci\u00adfi\u00adca\u00adti\u00adon and\/or esti\u00adma\u00adti\u00adon for deli\u00adver\u00aded <span class=\"caps\">FP8<\/span> floa\u00adting point per\u00adfor\u00admance with struc\u00adtu\u00adre spar\u00adsi\u00adty sup\u00adport\u00aded for <span class=\"caps\">AMD<\/span> Instinct\u2122 <span class=\"caps\">MI300<\/span> vs. <span class=\"caps\">MI250X<\/span> <span class=\"caps\">FP16<\/span> (306.4 esti\u00adma\u00adted deli\u00adver\u00aded <span class=\"caps\">TFLOPS<\/span> based on 80% of peak theo\u00adre\u00adti\u00adcal floa\u00adting-point per\u00adfor\u00admance). <span class=\"caps\">MI300<\/span> per\u00adfor\u00admance based on preli\u00admi\u00adna\u00adry esti\u00adma\u00adtes and expec\u00adta\u00adti\u00adons. Final per\u00adfor\u00admance may vary. <span class=\"caps\">MI300-03<\/span><br>\n<sup>10<\/sup>&nbsp;<span class=\"caps\">Z4-005<\/span>: Test\u00ading as of May 5, 2022, by <span class=\"caps\">AMD<\/span> Per\u00adfor\u00admance Labs. Sin\u00adgle-thread per\u00adfor\u00admance eva\u00adlua\u00adted with Cine\u00adbench <span class=\"caps\">R23<\/span> <span class=\"caps\">1T<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 9 <span class=\"caps\">5950X<\/span> Sys\u00adtem: <span class=\"caps\">ASUS<\/span> <span class=\"caps\">ROG<\/span> Cross\u00adhair <span class=\"caps\">VIII<\/span> Hero <span class=\"caps\">X570<\/span>, 2x8 <span class=\"caps\">DDR4-3600C16<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 7000 Series: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X670<\/span> Mother\u00adboard, Ryzen 7000 Series 16-core pre-pro\u00adduc\u00adtion pro\u00adces\u00adsor sam\u00adple, 2x16GB <span class=\"caps\">DDR5-6000CL30<\/span>. All sys\u00adtems con\u00adfi\u00adgu\u00adred with Rade\u00adon\u2122 <span class=\"caps\">RX<\/span> <span class=\"caps\">6950XT<\/span> <span class=\"caps\">GPU<\/span> (dri\u00adver: 22.10 Prime), Win\u00addows 11 Build 22000.593, Sam\u00adsung 980 Pro <span class=\"caps\">1TB<\/span> <span class=\"caps\">SSD<\/span>, Ase\u00adtek <span class=\"caps\">280MM<\/span> liquid cooler.<br>\nTest\u00ading as of May 31, 2022 by <span class=\"caps\">AMD<\/span> per\u00adfor\u00admance labs. Mul\u00adti-thread per\u00adfor\u00admance eva\u00adlua\u00adted with Cine\u00adbench <span class=\"caps\">R23<\/span> <span class=\"caps\">1T<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 9 <span class=\"caps\">5950X<\/span> Sys\u00adtem: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X570<\/span> Mother\u00adboard, 2x8 <span class=\"caps\">DDR4-3200<\/span>. <span class=\"caps\">AMD<\/span> Ryzen 7000 Series: <span class=\"caps\">AMD<\/span> Refe\u00adrence <span class=\"caps\">X670<\/span> Mother\u00adboard, Ryzen 7000 Series 16-core pre-pro\u00adduc\u00adtion pro\u00adces\u00adsor sam\u00adple, 2x16GB <span class=\"caps\">DDR5-5200<\/span>. All sys\u00adtems con\u00adfi\u00adgu\u00adred with Rade\u00adon\u2122 <span class=\"caps\">RX<\/span> <span class=\"caps\">6950XT<\/span> <span class=\"caps\">GPU<\/span> (dri\u00adver: 22.10 Prime), Win\u00addows 11 Build 22000.593, Sam\u00adsung 980 Pro <span class=\"caps\">1TB<\/span> <span class=\"caps\">SSD<\/span>, Ase\u00adtek <span class=\"caps\">280MM<\/span> liquid cooler<br>\nResults may vary when final pro\u00adducts are released in market.<\/p>\n","protected":false},"excerpt":{"rendered":"<p><span class=\"caps\">AMD<\/span> unveils next-gene\u00adra\u00adti\u00adon hard\u00adware and soft\u00adware road\u00admaps, expan\u00added pro\u00adduct port\u00adfo\u00adlio addres\u00adsing new mar\u00adkets, and stra\u00adte\u00adgies to acce\u00adle\u00adra\u00adte data cen\u00adter growth and deli\u00adver per\u00adva\u00adsi\u00adve <span class=\"caps\">AI<\/span> leadership<\/p>\n<p align=\"left\"><span class=\"caps\">SANTA<\/span> <span class=\"caps\">CLARA<\/span>, Calif., June 09, 2022 (<span class=\"caps\">GLOBE<\/span> <span class=\"caps\">NEWSWIRE<\/span>) \u2014 Today at its Finan\u00adcial Ana\u00adlyst Day,&nbsp;<a href=\"http:\/\/www.amd.com\/\" target=\"_blank\" rel=\"nofollow noopener\"><span class=\"caps\">AMD<\/span><\/a>&nbsp;(<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>) out\u00adlined its stra\u00adtegy to deli\u00adver its next pha\u00adse of growth dri\u00adven by the company\u2019s expan\u00added port\u00adfo\u00adlio of high-per\u00adfor\u00admance and adap\u00adti\u00adve com\u00adpu\u00adting pro\u00adducts span\u00adning the data cen\u00adter, embedded, cli\u00adent, and gam\u00ading markets.<\/p>\n<p><span class=\"dquo\">\u201c<\/span>From the cloud and PCs to com\u00admu\u00adni\u00adca\u00adti\u00adons and intel\u00adli\u00adgent end\u00adpoints, <span class=\"caps\">AMD<\/span>\u2019s high-per\u00adfor\u00admance and adap\u00adti\u00adve com\u00adpu\u00adting solu\u00adti\u00adons play an incre\u00adasing\u00adly lar\u00adger role in sha\u00adping the capa\u00adbi\u00adli\u00adties of near\u00adly every ser\u00advice and pro\u00adduct defi\u00adning the future of com\u00adpu\u00adting today,\u201d said Dr. Lisa Su, <span class=\"caps\">AMD<\/span> chair and <span class=\"caps\">CEO<\/span>. \u201cThe clo\u00adse of our trans\u00adfor\u00adma\u00adtio\u00adnal acqui\u00adsi\u00adti\u00adon of Xilinx and our expan\u00added port\u00adfo\u00adlio of lea\u00adder\u00adship com\u00adpu\u00adte engi\u00adnes pro\u00advi\u00adde <span class=\"caps\">AMD<\/span> with signi\u00adfi\u00adcant oppor\u00adtu\u00adni\u00adties to deli\u00adver con\u00adtin\u00adued strong reve\u00adnue growth with com\u00adpel\u00adling share\u00adhol\u00adder returns as we cap\u00adtu\u00adre a lar\u00adger share of the diver\u00adse $300 bil\u00adli\u00adon mar\u00adket for our high-per\u00adfor\u00admance and adap\u00adti\u00adve pro\u00adducts.\u201d (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/65668-amd-details-strategy-to-drive-next-phase-of-growth-across-300-billion-market-for-high-performance-and-adaptive-computing-solutions\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[966,2740,2190],"class_list":["post-65668","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-amd","tag-financial-analyst-day","tag-roadmaps","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65668","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=65668"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65668\/revisions"}],"predecessor-version":[{"id":65669,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/65668\/revisions\/65669"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=65668"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=65668"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=65668"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}