{"id":67031,"date":"2022-11-15T19:07:06","date_gmt":"2022-11-15T18:07:06","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=67031"},"modified":"2022-11-15T19:07:06","modified_gmt":"2022-11-15T18:07:06","slug":"tyan-introduces-hpc-cloud-and-storage-server-platforms-featuring-4th-gen-amd-epyc-processors-at-sc22","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/67031-tyan-introduces-hpc-cloud-and-storage-server-platforms-featuring-4th-gen-amd-epyc-processors-at-sc22\/","title":{"rendered":"TYAN<\/span> Introduces HPC<\/span>, Cloud and Storage Server Platforms Featuring 4th Gen AMD<\/span> EPYC<\/span>\u2122 Processors at SC22<\/span>"},"content":{"rendered":"

New 2\u2011GPU<\/span> pedestal design, high-density with front I\/O and all-flash storage servers maximize performance and energy efficiency for the data center<\/h4>\n
<\/a>
Pro\u00adducts : S8050<\/span> FT65TB8050<\/span> GC68AB8056<\/span> TS70AB8056<\/span> TS70B8056<\/span><\/figcaption><\/figure>\n

Dal\u00adlas, Texas \u2013 Super\u00adcom\u00adpu\u00adting 2022 \u2013 Nov 15, 2022 \u2013<\/strong> TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, brings the latest HPC<\/span>, cloud and sto\u00adrage plat\u00adforms powered by AMD<\/span> EPYC<\/span>\u2122 9004 Series pro\u00adces\u00adsors<\/a> for the next gene\u00adra\u00adti\u00adon ser\u00adver archi\u00adtec\u00adtu\u00adre and ener\u00adgy effi\u00adci\u00aden\u00adcy at SC22<\/span>, Booth #2000 in the Kay Bai\u00adley Hut\u00adchison Con\u00adven\u00adti\u00adon Cen\u00adter Dal\u00adlas on Novem\u00adber 14\u201317.<\/p>\n

\u201c<\/span>Facing the post-COVID eco\u00adno\u00admy world, data cen\u00adters are requi\u00adred to build on more envi\u00adron\u00admen\u00adtal\u00adly fri\u00adend\u00adly, secu\u00adre and fle\u00adxi\u00adble fea\u00adtures to respond to the gro\u00adwing of tele\u00adwor\u00adking, video strea\u00adming, IoT and 5G<\/span>,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre BU<\/span>. \u201cTYAN<\/span>\u2019s new ser\u00adver plat\u00adforms, powered by 4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors, effi\u00adci\u00adent\u00adly enable data cen\u00adters by doing more tasks with the same num\u00adber of servers.\u201d<\/p>\n

\u201c<\/span>4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors are the world\u2019s hig\u00adhest per\u00adfor\u00admance ser\u00adver CPUs that deli\u00adver lea\u00adder\u00adship ener\u00adgy effi\u00adci\u00aden\u00adcy as well as low total cost of owner\u00adship across workloads and indus\u00adtries. By adop\u00adting 4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors, enter\u00adpri\u00adses can opti\u00admi\u00adze their data cen\u00adter foot\u00adprint to do more with less, acce\u00adle\u00adra\u00adting their core busi\u00adness while hel\u00adping address their sus\u00adtaina\u00adbi\u00adli\u00adty goals,\u201d said Ram Ped\u00addib\u00adhot\u00adla, cor\u00adpo\u00adra\u00adte vice pre\u00adsi\u00addent, EPYC<\/span> pro\u00adduct manage\u00adment, AMD<\/span>.<\/p>\n

Optimized for the most demanding workloads in today\u2019s HPC<\/span> data centers<\/h1>\n

Lever\u00adaging 4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors\u2019 sup\u00adport for high per\u00adfor\u00admance DDR5<\/span> memo\u00adry and fast PCIe\u00ae Gen 5 I\/O, TYAN<\/span>\u2019s HPC<\/span> plat\u00adforms enable the high per\u00adfor\u00admance demands of today\u2019s AI<\/span> and machi\u00adne lear\u00adning appli\u00adca\u00adti\u00adons. The Tom\u00adcat HX<\/span> S8050<\/span><\/a> ser\u00adver mother\u00adboard pro\u00advi\u00addes eight DDR5<\/span> DIMM<\/span> slots, five PCIe 5.0 x16 slots, four MCIO<\/span> con\u00adnec\u00adtors, two NVMe M.2 slots, two 10GbE and two GbE onboard Ether\u00adnet ports in CEB<\/span> (12\u2033 x 10.5\u2033) form factor.<\/p>\n

The Trans\u00adport HX<\/span> FT65T-B8050<\/span><\/a> is a rack-con\u00adver\u00adti\u00adble pedes\u00adtal ser\u00adver plat\u00adform fea\u00adturing a sin\u00adgle AMD<\/span> EYPC<\/span> 9004 Series pro\u00adces\u00adsor, eight DDR5<\/span> DIMM<\/span> slots, eight 3.5\u2033 SATA<\/span> and two 2.5\u2033 NVMe U.2 hot-swap, tool-less dri\u00adve bays. The FT65T-B8050<\/span> sup\u00adports up to two dou\u00adble-wide PCIe 5.0 x16 pro\u00adfes\u00adsio\u00adnal GPUs along with two addi\u00adtio\u00adnal high-speed net\u00adwor\u00adking adap\u00adters for par\u00adal\u00adlel clus\u00adte\u00adred workloads.<\/p>\n

Data cache and high-density with front I\/O servers to power the cloud<\/h1>\n

TYAN<\/span>\u2019s cloud plat\u00adforms bene\u00adfit from the inno\u00adva\u00adtions of AMD<\/span> EPYC<\/span> 9004 Series pro\u00adces\u00adsors and are desi\u00adgned for cloud and data ana\u00adly\u00adtics appli\u00adca\u00adti\u00adons that help move data fas\u00adter. The Trans\u00adport CX<\/span> GC68A-B8056<\/span><\/a> is a cost-opti\u00admi\u00adzed sin\u00adgle-socket ser\u00adver plat\u00adform fea\u00adturing 24 DDR5<\/span> DIMM<\/span> slots, a pair of PCIe 5.0 x16 expan\u00adsi\u00adon slots, one OCP<\/span> 3.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot and two 10GbE onboard Ether\u00adnet ports in 1U<\/span> con\u00adfi\u00adgu\u00adra\u00adti\u00adon. The GC68A-B8056<\/span> accom\u00admo\u00adda\u00adtes twel\u00adve 2.5\u2033 tool-less dri\u00adve bays sup\u00adport\u00ading NVMe U.2 devices for appli\u00adca\u00adti\u00adons which requi\u00adre out\u00adstan\u00adding com\u00adpu\u00adte cores as well as high per\u00adfor\u00admance sto\u00adrage I\/Os.<\/p>\n

The Trans\u00adport CX<\/span> TD76-B8058<\/span> is a 2U<\/span> mul\u00adti-node ser\u00adver plat\u00adform with four front-ser\u00advice nodes. Each node sup\u00adports one AMD<\/span> EPYC<\/span> 9004 Series pro\u00adces\u00adsor, 16 DDR5<\/span> DIMM<\/span> slots, four hot-swap E1<\/span>.S dri\u00adve bays, two inter\u00adnal NVMe M.2 slots, one stan\u00addard PCIe 5.0 x16 expan\u00adsi\u00adon, and one OCP<\/span> 3.0 LAN<\/span> mez\u00adza\u00adni\u00adne slot. The plat\u00adform is sui\u00adted for high-den\u00adsi\u00adty data cen\u00adter deploy\u00adment, front-end web ser\u00advers, and varie\u00adty of sca\u00adle-out appli\u00adca\u00adti\u00adons with lar\u00adge num\u00adbers of nodes.<\/p>\n

Hybrid and all-flash storage server to maximize application performance<\/h1>\n

TYAN<\/span>\u2019s sto\u00adrage plat\u00adforms are desi\u00adgned to deli\u00adver mas\u00adsi\u00adve data I\/O bet\u00adween memo\u00adry and sto\u00adrage devices for cloud appli\u00adca\u00adti\u00adons. TYAN<\/span>\u2019s Trans\u00adport SX<\/span> TS70-B8056<\/span><\/a> and Trans\u00adport SX<\/span> TS70A-B8056<\/span><\/a> are 2U<\/span> sin\u00adgle-socket sto\u00adrage ser\u00advers with sup\u00adport for 24 DDR5<\/span> DIMM<\/span> slots, three PCIe 5.0 and one OCP<\/span> 3.0 LAN<\/span> mez\u00adza\u00adni\u00adne slots. The TS70-B8056<\/span> accom\u00admo\u00adda\u00adtes twel\u00adve front 3.5\u2033 dri\u00adve bays with up to four NVMe U.2 sup\u00adport, and two rear 2.5\u2033 NVMe U.2 hot-swap, tool-less dri\u00adve bays for boot dri\u00adve deploy\u00adment; the TS70A-B8056<\/span> offers 26 2.5\u2033 NVMe U.2 hot-swap, tool-less dri\u00adve bays for high IOPs requi\u00adre\u00adment in high-per\u00adfor\u00admance data strea\u00adming applications.<\/p>\n

Supporting Resources:<\/h2>\n

Plea\u00adse watch this video<\/a> about TYAN<\/span> 4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsor-based ser\u00advers<\/a> desi\u00adgned for modern data centers.<\/p>\n","protected":false},"excerpt":{"rendered":"

<\/p>

New 2\u2011GPU<\/span> pedestal design, high-density with front I\/O and all-flash storage servers maximize performance and energy efficiency for the data center<\/h4>\n[cap\u00adti\u00adon id=\u201cattachment_67032\u201d align=\u201caligncenter\u201d width=\u201c900\u201d]<\/a> Pro\u00adducts : S8050<\/span> FT65TB8050<\/span> GC68AB8056<\/span> TS70AB8056<\/span> TS70B8056<\/span>[\/caption]\n

Dal\u00adlas, Texas \u2013 Super\u00adcom\u00adpu\u00adting 2022 \u2013 Nov 15, 2022 \u2013<\/strong> TYAN<\/span>\u00ae, an indus\u00adtry-lea\u00adding ser\u00adver plat\u00adform design manu\u00adfac\u00adtu\u00adrer and a MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Cor\u00adpo\u00adra\u00adti\u00adon sub\u00adsi\u00addia\u00adry, brings the latest HPC<\/span>, cloud and sto\u00adrage plat\u00adforms powered by AMD<\/span> EPYC<\/span>\u2122 9004 Series pro\u00adces\u00adsors<\/a> for the next gene\u00adra\u00adti\u00adon ser\u00adver archi\u00adtec\u00adtu\u00adre and ener\u00adgy effi\u00adci\u00aden\u00adcy at SC22<\/span>, Booth #2000 in the Kay Bai\u00adley Hut\u00adchison Con\u00adven\u00adti\u00adon Cen\u00adter Dal\u00adlas on Novem\u00adber 14\u201317.<\/p>\n

\u201c<\/span>Facing the post-COVID eco\u00adno\u00admy world, data cen\u00adters are requi\u00adred to build on more envi\u00adron\u00admen\u00adtal\u00adly fri\u00adend\u00adly, secu\u00adre and fle\u00adxi\u00adble fea\u00adtures to respond to the gro\u00adwing of tele\u00adwor\u00adking, video strea\u00adming, IoT and 5G<\/span>,\u201d said Dan\u00adny Hsu, Vice Pre\u00adsi\u00addent of MiT\u00adAC Com\u00adpu\u00adting Tech\u00adno\u00adlo\u00adgy Corporation\u2019s Ser\u00adver Infra\u00adstruc\u00adtu\u00adre BU<\/span>. \u201cTYAN<\/span>\u2019s new ser\u00adver plat\u00adforms, powered by 4th Gen AMD<\/span> EPYC<\/span> pro\u00adces\u00adsors, effi\u00adci\u00adent\u00adly enable data cen\u00adters by doing more tasks with the same num\u00adber of ser\u00advers.\u201d (\u2026) Wei\u00adter\u00adle\u00adsen \u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[966,2786,2279,1343],"class_list":["post-67031","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-amd","tag-epyc-9004","tag-genoa","tag-tyan","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67031","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=67031"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67031\/revisions"}],"predecessor-version":[{"id":67033,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67031\/revisions\/67033"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=67031"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=67031"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=67031"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}