{"id":67590,"date":"2023-02-05T08:53:59","date_gmt":"2023-02-05T07:53:59","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=67590"},"modified":"2023-02-05T08:53:59","modified_gmt":"2023-02-05T07:53:59","slug":"tsmc-offers-the-industrys-most-successful-finfet-technology-to-academia","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/67590-tsmc-offers-the-industrys-most-successful-finfet-technology-to-academia\/","title":{"rendered":"<span class=\"caps\">TSMC<\/span> Offers the Industry\u2019s Most Successful FinFET Technology to Academia"},"content":{"rendered":"<p><span class=\"caps\">HSINCHU<\/span>, Tai\u00adwan, R.O.C., Feb. 3, 2023 \u2013 <span class=\"caps\">TSMC<\/span> (<span class=\"caps\">TWSE<\/span>: 2330, <span class=\"caps\">NYSE<\/span>: <span class=\"caps\">TSM<\/span>) today announ\u00adced the launch of its \u201c<span class=\"caps\">TSMC<\/span> Uni\u00adver\u00adsi\u00adty Fin\u00adFET Pro\u00adgram\u201d, aimed at deve\u00adlo\u00adping future <span class=\"caps\">IC<\/span> design talent for the indus\u00adtry and empowe\u00adring aca\u00adde\u00admic inno\u00adva\u00adti\u00adon around the world. The pro\u00adgram will pro\u00advi\u00adde broad edu\u00adca\u00adtio\u00adnal access for uni\u00adver\u00adsi\u00adty stu\u00addents, facul\u00adty, and aca\u00adde\u00admic rese\u00adar\u00adchers to the pro\u00adcess design kit (<span class=\"caps\">PDK<\/span>) of the industry\u2019s most suc\u00adcessful fin field-effect tran\u00adsis\u00adtor (Fin\u00adFET) tech\u00adno\u00adlo\u00adgy at 16nm, brin\u00adging the <span class=\"caps\">IC<\/span> design lear\u00adning expe\u00adri\u00adence to the advan\u00adced Fin\u00adFET level. The pro\u00adgram will also pro\u00advi\u00adde access for lea\u00adding <span class=\"caps\">IC<\/span> rese\u00adar\u00adchers in uni\u00adver\u00adsi\u00adties to both 16nm (<span class=\"caps\">N16<\/span>) and 7nm (<span class=\"caps\">N7<\/span>) sili\u00adcon through mul\u00adti-pro\u00adject wafer (<span class=\"caps\">MPW<\/span>) ser\u00advices to acce\u00adle\u00adra\u00adte impactful rese\u00adarch inno\u00adva\u00adtions towards real-world applications.<\/p>\n<p><span lang=\"EN-US\" xml:lang=\"EN-US\">Working with ser\u00advice part\u00adners in Asia, Euro\u00adpe and North Ame\u00adri\u00adca, <span class=\"caps\">TSMC<\/span> is offe\u00adring uni\u00adver\u00adsi\u00adties the fol\u00adlo\u00adwing resour\u00adces \u2013 for tea\u00adching pur\u00adpo\u00adses, and for rese\u00adarch pro\u00adjects lea\u00adding to sili\u00adcon test&nbsp;chips:<\/span><\/p>\n<ul>\n<li><span lang=\"EN-US\" xml:lang=\"EN-US\">Design col\u00adla\u00adte\u00adral for tea\u00adching is based on <span class=\"caps\">TSMC<\/span>\u2019s <span class=\"caps\">N16<\/span> pro\u00adcess, and includes tuto\u00adri\u00adal design cases, trai\u00adning mate\u00adri\u00adals and ins\u00adtruc\u00adtion\u00adal vide\u00ados, brin\u00adging stu\u00addents from the con\u00adven\u00adtio\u00adnal pla\u00adnar tran\u00adsis\u00adtor struc\u00adtu\u00adre into the Fin\u00adFET&nbsp;era.<\/span><\/li>\n<li><span lang=\"EN-US\" xml:lang=\"EN-US\">For impactful rese\u00adarch pro\u00adjects, <span class=\"caps\">TSMC<\/span> is pro\u00advi\u00adding both <span class=\"caps\">N16<\/span> and <span class=\"caps\">N7<\/span> pro\u00adcess design col\u00adla\u00adte\u00adral for test chips to be manu\u00adfac\u00adtu\u00adred via <span class=\"caps\">MPW<\/span>. The\u00adse include rese\u00adarch designs in logic, ana\u00adlog, and&nbsp;radio fre\u00adquen\u00adcy (<span class=\"caps\">RF<\/span>).<\/span><\/li>\n<\/ul>\n<p><span lang=\"EN-US\" xml:lang=\"EN-US\"><span class=\"dquo\">\u201c<\/span>At <span class=\"caps\">TSMC<\/span>, we are always loo\u00adking towards the future \u2013 not only the future rese\u00adarch that will beco\u00adme tomorrow\u2019s tech\u00adno\u00adlo\u00adgy breakth\u00adroughs, but the future talent who will beco\u00adme tomorrow\u2019s inno\u00adva\u00adtors,\u201d said Dr. Kevin Zhang, seni\u00ador vice pre\u00adsi\u00addent of busi\u00adness deve\u00adlo\u00adp\u00adment at <span class=\"caps\">TSMC<\/span>. \u201cBy offe\u00adring our 16nm and 7nm tech\u00adno\u00adlo\u00adgy through the <span class=\"caps\">TSMC<\/span> Uni\u00adver\u00adsi\u00adty Fin\u00adFET Pro\u00adgram, we open a who\u00adle new are\u00adna for rese\u00adar\u00adchers and stu\u00addents to explo\u00adre their ide\u00adas, and fuel their curio\u00adsi\u00adty and pas\u00adsi\u00adon for the exci\u00adting and fast-gro\u00adwing field of semiconductors.\u201d<\/span><\/p>\n<p><span class=\"caps\">TSMC<\/span>\u2019s tech\u00adno\u00adlo\u00adgy and manu\u00adfac\u00adtu\u00adring is sup\u00adport\u00aded by a vibrant and com\u00adpre\u00adhen\u00adsi\u00adve design ena\u00adblem\u00adent eco\u00adsys\u00adtem, the Open Inno\u00adva\u00adti\u00adon Plat\u00adform\u00ae. Our eco\u00adsys\u00adtem of ser\u00advices part\u00adners is rea\u00addy to con\u00adnect scho\u00adlars with the <span class=\"caps\">TSMC<\/span> Uni\u00adver\u00adsi\u00adty Fin\u00adFET Pro\u00adgram, and aca\u00adde\u00admic insti\u00adtu\u00adti\u00adons inte\u00adres\u00adted in joi\u00adning the pro\u00adgram are invi\u00adted to cont\u00adact ser\u00advice part\u00adners in their regi\u00adon at&nbsp;<a href=\"https:\/\/www.tsmc.com\/english\/dedicatedFoundry\/services\/university_program\">https:\/\/www.tsmc.com\/english\/dedicatedFoundry\/services\/university_program<\/a>&nbsp;.<\/p>\n","protected":false},"excerpt":{"rendered":"<p><span class=\"caps\">HSINCHU<\/span>, Tai\u00adwan, R.O.C., Feb. 3, 2023 \u2013 <span class=\"caps\">TSMC<\/span> (<span class=\"caps\">TWSE<\/span>: 2330, <span class=\"caps\">NYSE<\/span>: <span class=\"caps\">TSM<\/span>) today announ\u00adced the launch of its \u201c<span class=\"caps\">TSMC<\/span> Uni\u00adver\u00adsi\u00adty Fin\u00adFET Pro\u00adgram\u201d, aimed at deve\u00adlo\u00adping future <span class=\"caps\">IC<\/span> design talent for the indus\u00adtry and empowe\u00adring aca\u00adde\u00admic inno\u00adva\u00adti\u00adon around the world. The pro\u00adgram will pro\u00advi\u00adde broad edu\u00adca\u00adtio\u00adnal access for uni\u00adver\u00adsi\u00adty stu\u00addents, facul\u00adty, and aca\u00adde\u00admic rese\u00adar\u00adchers to the pro\u00adcess design kit (<span class=\"caps\">PDK<\/span>) of the industry\u2019s most suc\u00adcessful fin field-effect tran\u00adsis\u00adtor (Fin\u00adFET) tech\u00adno\u00adlo\u00adgy at 16nm, brin\u00adging the <span class=\"caps\">IC<\/span> design lear\u00adning expe\u00adri\u00adence to the advan\u00adced Fin\u00adFET level. The pro\u00adgram will also pro\u00advi\u00adde access for lea\u00adding <span class=\"caps\">IC<\/span> rese\u00adar\u00adchers in uni\u00adver\u00adsi\u00adties to both 16nm (<span class=\"caps\">N16<\/span>) and 7nm (<span class=\"caps\">N7<\/span>) sili\u00adcon through mul\u00adti-pro\u00adject wafer (<span class=\"caps\">MPW<\/span>) ser\u00advices to acce\u00adle\u00adra\u00adte impactful rese\u00adarch inno\u00adva\u00adtions towards real-world appli\u00adca\u00adti\u00adons. (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/67590-tsmc-offers-the-industrys-most-successful-finfet-technology-to-academia\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[370,1037,2830],"class_list":["post-67590","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-finfet","tag-tsmc","tag-universities","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67590","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=67590"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67590\/revisions"}],"predecessor-version":[{"id":67591,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67590\/revisions\/67591"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=67590"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=67590"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=67590"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}