{"id":67656,"date":"2023-02-22T15:38:47","date_gmt":"2023-02-22T14:38:47","guid":{"rendered":"https:\/\/www.planet3dnow.de\/cms\/?p=67656"},"modified":"2023-02-22T15:38:47","modified_gmt":"2023-02-22T14:38:47","slug":"amd-expands-5g-telco-market-leadership-with-new-high-performance-and-adaptive-computing-products-and-testing-services-at-mwc-2023","status":"publish","type":"post","link":"https:\/\/www.planet3dnow.de\/cms\/67656-amd-expands-5g-telco-market-leadership-with-new-high-performance-and-adaptive-computing-products-and-testing-services-at-mwc-2023\/","title":{"rendered":"<span class=\"caps\">AMD<\/span> Expands <span class=\"caps\">5G<\/span> Telco Market Leadership with New High-Performance and Adaptive Computing Products and Testing Services at <span class=\"caps\">MWC<\/span>&nbsp;2023"},"content":{"rendered":"<p>\u2500\u2500 For\u00adma\u00adti\u00adon of Tel\u00adco Solu\u00adti\u00adons test\u00ading lab with <span class=\"caps\">VIAVI<\/span> unders\u00adcores <span class=\"caps\">AMD<\/span> <span class=\"caps\">5G<\/span> lea\u00adder\u00adship and gro\u00adwing momen\u00adtum with eco\u00adsys\u00adtem part\u00adners inclu\u00adding&nbsp;Nokia&nbsp;\u2500\u2500<\/p>\n<p>&nbsp;<\/p>\n<p>\u2500\u2500 New <span class=\"caps\">4G<\/span>\/<span class=\"caps\">5G<\/span> Zynq UltraS\u00adca\u00adle+ RFSoC digi\u00adtal front-end devices unvei\u00adled to expand com\u00admu\u00adni\u00adca\u00adti\u00adons oppor\u00adtu\u00adni\u00adties and acce\u00adle\u00adra\u00adte radio deploy\u00adments into cost-sen\u00adsi\u00adti\u00adve markets&nbsp;\u2500\u2500<\/p>\n<p>&nbsp;<\/p>\n<p><span class=\"caps\">SANTA<\/span> <span class=\"caps\">CLARA<\/span>, Calif., Feb. 22, 2023 (<span class=\"caps\">GLOBE<\/span> <span class=\"caps\">NEWSWIRE<\/span>) \u2014 Today, <span class=\"caps\">AMD<\/span> (<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>) announ\u00adced it will be expan\u00adding sup\u00adport of its gro\u00adwing <span class=\"caps\">5G<\/span> part\u00adner eco\u00adsys\u00adtem span\u00adning from core to radio access net\u00adworks (<span class=\"caps\">RAN<\/span>) appli\u00adca\u00adti\u00adons, deli\u00adve\u00adring addi\u00adtio\u00adnal new test capa\u00adbi\u00adli\u00adties and unvei\u00adling new <span class=\"caps\">5G<\/span> pro\u00adducts. The <span class=\"caps\">AMD<\/span> wire\u00adless tele\u00adcom part\u00adner eco\u00adsys\u00adtem has more than dou\u00adbled in the past year, bols\u00adte\u00adred by the inte\u00adgra\u00adti\u00adon of the <span class=\"caps\">AMD<\/span> and Xilinx pro\u00adduct lines as well as the crea\u00adti\u00adon of its new Tel\u00adco Solu\u00adti\u00adons test\u00ading lab in col\u00adla\u00adbo\u00adra\u00adti\u00adon with&nbsp;<span class=\"caps\">VIAVI<\/span>.<\/p>\n<p>&nbsp;<\/p>\n<p>Tel\u00adco Solu\u00adti\u00adons Test\u00ading&nbsp;Lab<\/p>\n<p>The for\u00adma\u00adti\u00adon of the Tel\u00adco Solu\u00adti\u00adons test\u00ading lab is vital for ope\u00adra\u00adtors and tel\u00adco solu\u00adti\u00adon pro\u00advi\u00adders to test, vali\u00adda\u00adte and sca\u00adle com\u00adpu\u00adting resour\u00adces to deli\u00adver on the ever-incre\u00adasing demands from <span class=\"caps\">RAN<\/span> and edge-to-core. The test\u00ading lab sup\u00adports vali\u00adda\u00adti\u00adon of end-to-end solu\u00adti\u00adons, inclu\u00adding both hard\u00adware to soft\u00adware to levera\u00adge the per\u00adfor\u00admance and power effi\u00adci\u00aden\u00adci\u00ades of the latest <span class=\"caps\">AMD<\/span> pro\u00adces\u00adsors, Adap\u00adti\u00adve SoCs, Smart\u00adNICs, FPGAs and&nbsp;DPUs.&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>In sup\u00adport of this mis\u00adsi\u00adon, the <span class=\"caps\">VIAVI<\/span> end-to-end test\u00ading suite was sel\u00adec\u00adted to pro\u00advi\u00adde the net\u00adwork test solu\u00adti\u00adon to ana\u00adly\u00adze, deve\u00adlop and vali\u00adda\u00adte the impact of real-life con\u00addi\u00adti\u00adons across an enti\u00adre tel\u00adco net\u00adwork. The Tel\u00adco Solu\u00adti\u00adons test\u00ading lab will enable traf\u00adfic simu\u00adla\u00adti\u00adon and gene\u00adra\u00adti\u00adon across core, <span class=\"caps\">CU<\/span>\/<span class=\"caps\">DU<\/span>, edge and <span class=\"caps\">RAN<\/span> using both cur\u00adrent and future <span class=\"caps\">AMD<\/span> tech\u00adno\u00adlo\u00adgies to allow full func\u00adtion\u00adal and per\u00adfor\u00admance test\u00ading that meets cur\u00adrent and future gene\u00adra\u00adti\u00adon eco\u00adsys\u00adtem requi\u00adre\u00adments. Based in San\u00adta Cla\u00adra, Calif., the Tel\u00adco Solu\u00adti\u00adons test\u00ading lab will bring in its first <span class=\"caps\">5G<\/span> eco\u00adsys\u00adtem part\u00adners begin\u00adning <span class=\"caps\">Q2<\/span> of&nbsp;2023.<\/p>\n<p>&nbsp;<\/p>\n<p>New Zynq UltraS\u00adca\u00adle+ RFSoC Devices for Emer\u00adging <span class=\"caps\">4G<\/span>\/<span class=\"caps\">5G<\/span> Growth Markets<\/p>\n<p>The strong adop\u00adti\u00adon of <span class=\"caps\">4G<\/span>\/<span class=\"caps\">5G<\/span> <span class=\"caps\">AMD<\/span> Zynq\u2122 UltraS\u00adca\u00adle+\u2122 RFSoC and MPSoC radio tech\u00adno\u00adlo\u00adgy has enab\u00adled new inte\u00adgra\u00adted remo\u00adte radio unit designs and ope\u00adned new busi\u00adness oppor\u00adtu\u00adni\u00adties for <span class=\"caps\">AMD<\/span> and its part\u00adner eco\u00adsys\u00adtem. <span class=\"caps\">AMD<\/span> is now expan\u00adding its Zynq UltraS\u00adca\u00adle+ RFSoC digi\u00adtal front-end (<span class=\"caps\">DFE<\/span>) port\u00adfo\u00adlio with two addi\u00adti\u00adons to the fami\u00adly: the Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">ZU63DR<\/span> and Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">ZU64DR<\/span> devices. The\u00adse new RFSoCs will enable the expan\u00adsi\u00adon and deploy\u00adment of <span class=\"caps\">4G<\/span>\/<span class=\"caps\">5G<\/span> radi\u00ados into mar\u00adkets around the glo\u00adbe whe\u00adre lower cost, power and spec\u00adtrum-effi\u00adci\u00adent radi\u00ados are requi\u00adred to address increased wire\u00adless connectivity.<\/p>\n<p>&nbsp;<\/p>\n<p><span class=\"dquo\">\u201c<\/span><span class=\"caps\">AMD<\/span> has made incre\u00addi\u00adble pro\u00adgress in the radio mar\u00adket and is proud to be show\u00adca\u00adsing at <span class=\"caps\">MWC<\/span> Bar\u00adce\u00adlo\u00adna our col\u00adla\u00adbo\u00adra\u00adti\u00adon with over 15 radio sys\u00adtem eco\u00adsys\u00adtem part\u00adners desig\u00adning O\u2011RAN-based remo\u00adte radio units for open inter\u00adfaces using <span class=\"caps\">AMD<\/span> Zynq UltraS\u00adca\u00adle+ RFSoCs and MPSoCs,\u201d said Salil Raje, seni\u00ador vice pre\u00adsi\u00addent and gene\u00adral mana\u00adger, Adap\u00adti\u00adve and Embedded Com\u00adpu\u00adting Group, <span class=\"caps\">AMD<\/span>. \u201cWith our focus toward incre\u00adasing <span class=\"caps\">5G<\/span> deploy\u00adments around the world, the new <span class=\"caps\">AMD<\/span> Zynq UltraS\u00adca\u00adle+ RFSoCs are espe\u00adci\u00adal\u00adly cost-effec\u00adti\u00adve and ener\u00adgy-effi\u00adci\u00adent, making them ide\u00adal for emer\u00adging glo\u00adbal mar\u00adkets inclu\u00adding rural and out\u00addoor deployments.\u201d<\/p>\n<p>&nbsp;<\/p>\n<p>The Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">ZU63DR<\/span> spe\u00adci\u00adfi\u00adcal\u00adly tar\u00adgets four trans\u00admit and four recei\u00adve (<span class=\"caps\">4T4R<\/span>) and dual band ent\u00adry-level O\u2011<span class=\"caps\">RAN<\/span> radio unit (O\u2011<span class=\"caps\">RU<\/span>) appli\u00adca\u00adti\u00adons. The Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">ZU64DR<\/span> is tar\u00adge\u00adted for eight trans\u00admit and eight recei\u00adve (<span class=\"caps\">8T8R<\/span>) O\u2011<span class=\"caps\">RU<\/span> appli\u00adca\u00adti\u00adons using the 3rd Gene\u00adra\u00adti\u00adon Part\u00adner Pro\u00adject (<span class=\"caps\">3GPP<\/span>) split\u20118 opti\u00adon which sup\u00adports alter\u00adna\u00adti\u00adve and lega\u00adcy radio unit architectures.<\/p>\n<p>&nbsp;<\/p>\n<p>Both RFSoC devices levera\u00adge the deep <span class=\"caps\">DFE<\/span> inte\u00adgra\u00adti\u00adon available in the flag\u00adship Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">ZU67DR<\/span> device and are expec\u00adted to be in full pro\u00adduc\u00adtion in <span class=\"caps\">Q2<\/span> of 2023. <span class=\"caps\">AMD<\/span> will show\u00adca\u00adse its Zynq UltraS\u00adca\u00adle+ RFSoC <span class=\"caps\">DFE<\/span> fami\u00adly at the upco\u00adming Mobi\u00adle World Con\u00adgress (<span class=\"caps\">MWC<\/span>) Bar\u00adce\u00adlo\u00adna&nbsp;2023.<\/p>\n<p>&nbsp;<\/p>\n<p><span class=\"caps\">AMD<\/span> Eco\u00adsys\u00adtem Momen\u00adtum with&nbsp;Nokia<\/p>\n<p>As part of the gro\u00adwing <span class=\"caps\">AMD<\/span> tel\u00adco eco\u00adsys\u00adtem, <span class=\"caps\">AMD<\/span> and Nokia are joint\u00adly announ\u00adcing an expan\u00added col\u00adla\u00adbo\u00adra\u00adti\u00adon using 4th Gen <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span>\u2122 pro\u00adces\u00adsor-based ser\u00advers to deli\u00adver Nokia Cloud <span class=\"caps\">RAN<\/span> solu\u00adti\u00adons to help com\u00admu\u00adni\u00adca\u00adti\u00adons ser\u00advice pro\u00advi\u00adders achie\u00adve their most strin\u00adgent ener\u00adgy effi\u00adci\u00aden\u00adcy goals. <span class=\"caps\">AMD<\/span> and Nokia reco\u00adgni\u00adze the chal\u00adlenges faced by ope\u00adra\u00adtors deal\u00ading with spi\u00adra\u00adling ener\u00adgy cos\u00adts and the gro\u00adwing importance of mee\u00adting car\u00adbon reduc\u00adtion tar\u00adgets at the core as well as the net\u00adwork&nbsp;edge.<\/p>\n<p>&nbsp;<\/p>\n<p><span class=\"dquo\">\u201c<\/span>As part of our ambi\u00adti\u00adon to pro\u00advi\u00adde the best Cloud <span class=\"caps\">RAN<\/span> solu\u00adti\u00adons, we are exci\u00adted to extend our col\u00adla\u00adbo\u00adra\u00adti\u00adon with <span class=\"caps\">AMD<\/span>. We are loo\u00adking to take advan\u00adta\u00adge of the 4th Gen <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span> processor\u2019s capa\u00adbi\u00adli\u00adties to fur\u00adther enhan\u00adce Nokia\u2019s Cloud <span class=\"caps\">RAN<\/span> solu\u00adti\u00adons,\u201d said Pasi Toi\u00adva\u00adnen, Head of Part\u00adner Cloud <span class=\"caps\">RAN<\/span> Solu\u00adti\u00adons at Nokia. \u201cCom\u00admu\u00adni\u00adca\u00adti\u00adon ser\u00advice pro\u00advi\u00adders across <span class=\"caps\">5G<\/span> Core and Cloud <span class=\"caps\">RAN<\/span> incre\u00adasing\u00adly demand new levels of per\u00adfor\u00admance and ener\u00adgy effi\u00adci\u00aden\u00adcy within their <span class=\"caps\">5G<\/span> net\u00adworks. Our work with <span class=\"caps\">AMD<\/span> reco\u00adgni\u00adzes the chal\u00adlenges faced by the tele\u00adcom\u00admu\u00adni\u00adca\u00adti\u00adons indus\u00adtry and helps to deli\u00adver on our part\u00adners\u2019 and cus\u00adto\u00admers\u2019 most ambi\u00adtious ener\u00adgy effi\u00adci\u00aden\u00adcy targets.\u201d<\/p>\n<p>&nbsp;<\/p>\n<p><span class=\"caps\">5G<\/span> Inno\u00adva\u00adti\u00adon at <span class=\"caps\">MWC<\/span> Bar\u00adce\u00adlo\u00adna&nbsp;2023<\/p>\n<p>At <span class=\"caps\">MWC<\/span> 2023, <span class=\"caps\">AMD<\/span> will show\u00adca\u00adse the latest 4th Gen <span class=\"caps\">AMD<\/span> <span class=\"caps\">EPYC<\/span> pro\u00adces\u00adsor-powered sys\u00adtems in con\u00adjunc\u00adtion with tech\u00adno\u00adlo\u00adgy part\u00adners inclu\u00adding: Amdocs, Ground\u00adhog, Juni\u00adper and Nokia. <span class=\"caps\">5G<\/span> eco\u00adsys\u00adtem part\u00adners show\u00adca\u00adsing radio solu\u00adti\u00adons with <span class=\"caps\">AMD<\/span> include: Abs\u00adi\u00adde, Astro\u00adme, <span class=\"caps\">AW2S<\/span>, CellXi\u00adca, Com\u00adba, Fuji\u00adtsu, Mave\u00adnir, <span class=\"caps\">NEC<\/span>, Solid, Tejas, Ulak, Viet\u00adtel, <span class=\"caps\">VVDN<\/span> and&nbsp;Zlink.<\/p>\n<p>Visit <span class=\"caps\">AMD<\/span> at <span class=\"caps\">MWC<\/span> in Hall 2, Stand <span class=\"caps\">2M61<\/span> from Febru\u00adary 27 \u2013 March 2,&nbsp;2023.<\/p>\n<p>&nbsp;<\/p>\n<p>Sup\u00adport\u00ading Resources:<\/p>\n<p>&nbsp;<\/p>\n<p>Learn more about <span class=\"caps\">AMD<\/span> solu\u00adti\u00adons for telecommunications<\/p>\n<p>Learn more about the Zynq UltraS\u00adca\u00adle+ RFSoC pro\u00adduct family<\/p>\n<p>Fol\u00adlow <span class=\"caps\">AMD<\/span> on LinkedIn<\/p>\n<p>Fol\u00adlow <span class=\"caps\">AMD<\/span> on Twitter<\/p>\n<p>About <span class=\"caps\">AMD<\/span><\/p>\n<p>For more than 50 years <span class=\"caps\">AMD<\/span> has dri\u00adven inno\u00adva\u00adti\u00adon in high-per\u00adfor\u00admance com\u00adpu\u00adting, gra\u00adphics and visua\u00adliza\u00adti\u00adon tech\u00adno\u00adlo\u00adgies. Bil\u00adli\u00adons of peo\u00adp\u00adle, lea\u00adding For\u00adtu\u00adne 500 busi\u00adnesses and cut\u00adting-edge sci\u00aden\u00adti\u00adfic rese\u00adarch insti\u00adtu\u00adti\u00adons around the world rely on <span class=\"caps\">AMD<\/span> tech\u00adno\u00adlo\u00adgy dai\u00adly to impro\u00adve how they live, work and play. <span class=\"caps\">AMD<\/span> employees are focu\u00adsed on buil\u00adding lea\u00adder\u00adship high-per\u00adfor\u00admance and adap\u00adti\u00adve pro\u00adducts that push the boun\u00adda\u00adries of what is pos\u00adsi\u00adble. For more infor\u00adma\u00adti\u00adon about how <span class=\"caps\">AMD<\/span> is enab\u00adling today and inspi\u00adring tomor\u00adrow, visit the <span class=\"caps\">AMD<\/span> (<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>) web\u00adsite, blog, Lin\u00adke\u00addIn and Twit\u00adter&nbsp;pages.&nbsp;<\/p>\n<p>&nbsp;<\/p>\n<p>\u00a92023 Advan\u00adced Micro Devices, Inc. All rights reser\u00adved. <span class=\"caps\">AMD<\/span>, the <span class=\"caps\">AMD<\/span> Arrow logo, Zynq, UltraS\u00adca\u00adle+, Xilinx, and com\u00adbi\u00adna\u00adti\u00adons the\u00adreof are trade\u00admarks of Advan\u00adced Micro Devices, Inc. Other names are for infor\u00adma\u00adtio\u00adnal pur\u00adpo\u00adses only and may be trade\u00admarks of their respec\u00adti\u00adve owners.<\/p>\n","protected":false},"excerpt":{"rendered":"<p><span class=\"caps\">SANTA<\/span> <span class=\"caps\">CLARA<\/span>, Calif., Feb. 22, 2023 (<span class=\"caps\">GLOBE<\/span> <span class=\"caps\">NEWSWIRE<\/span>) \u2014 Today, <span class=\"caps\">AMD<\/span> (<span class=\"caps\">NASDAQ<\/span>: <span class=\"caps\">AMD<\/span>) announ\u00adced it will be expan\u00adding sup\u00adport of its gro\u00adwing <span class=\"caps\">5G<\/span> part\u00adner eco\u00adsys\u00adtem span\u00adning from core to radio access net\u00adworks (<span class=\"caps\">RAN<\/span>) appli\u00adca\u00adti\u00adons, deli\u00adve\u00adring addi\u00adtio\u00adnal new test capa\u00adbi\u00adli\u00adties and unvei\u00adling new <span class=\"caps\">5G<\/span> pro\u00adducts. The <span class=\"caps\">AMD<\/span> wire\u00adless tele\u00adcom part\u00adner eco\u00adsys\u00adtem has more than dou\u00adbled in the past year, bols\u00adte\u00adred by the inte\u00adgra\u00adti\u00adon of the <span class=\"caps\">AMD<\/span> and Xilinx pro\u00adduct lines as well as the crea\u00adti\u00adon of its new Tel\u00adco Solu\u00adti\u00adons test\u00ading lab in col\u00adla\u00adbo\u00adra\u00adti\u00adon with <span class=\"caps\">VIAVI<\/span> (\u2026) <a class=\"moretag\" href=\"https:\/\/www.planet3dnow.de\/cms\/67656-amd-expands-5g-telco-market-leadership-with-new-high-performance-and-adaptive-computing-products-and-testing-services-at-mwc-2023\/\">Wei\u00adter\u00adle\u00adsen&nbsp;\u00bb<\/a><\/p>\n","protected":false},"author":593,"featured_media":0,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"wp_typography_post_enhancements_disabled":false,"ngg_post_thumbnail":0,"footnotes":""},"categories":[22],"tags":[2605,966,2835,1583],"class_list":["post-67656","post","type-post","status-publish","format-standard","hentry","category-pressemitteilungen","tag-5g","tag-amd","tag-viavi","tag-xilinx","entry"],"share_on_mastodon":{"url":"","error":""},"_links":{"self":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67656","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/users\/593"}],"replies":[{"embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/comments?post=67656"}],"version-history":[{"count":1,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67656\/revisions"}],"predecessor-version":[{"id":67657,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/posts\/67656\/revisions\/67657"}],"wp:attachment":[{"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/media?parent=67656"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/categories?post=67656"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.planet3dnow.de\/cms\/wp-json\/wp\/v2\/tags?post=67656"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}