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Dienstag, 23. Mai 2006

11:38 - Autor: Nero24

AM2-Launch: Auch VIA will mitmischen

Zum heutigen Launch der neuen Sockel AM2 Plattform möchte auch Chipsatz-Hersteller VIA nicht mit einer Pressemeldung fehlen. Zwar ist derzeit noch kein einziges Sockel-AM2-Mainboard mit VIA-Chipsatz auf dem Markt, aber die Taiwanesen darf man natürlich dennoch nicht vergessen:

Taipei, Taiwan, 23 May 2006 - VIA Technologies, Inc, a leading innovator and developer of silicon chip technologies and PC platform solutions, today announced top-to-bottom chipset solutions supporting the transition to socket AM2 by AMD (NYSE: AMD).

To accommodate the latest platform features and rising system bandwidth requirements, AMD’s transition to socket AM2 will enable a new wave of innovation on AMD64 based systems featuring AMD Virtualization and high-performance DDR2 memory. Supporting this transition, VIA offers a wide range of chipset solutions that are fully compatible with socket AM2 platforms, including the VIA K8M890, ideal for Windows Vista™-ready systems, and the VIA K8T900 performance chipset with dual X8 PCI Express support.

“VIA is proud to continue our strong collaboration with AMD and support their continued leadership with the acclaimed line of AMD Athlon™ 64 and AMD Sempron™ processors,” commented Chewei Lin, Vice President of Product Marketing, VIA Technologies, Inc. “With leading top-to-bottom solutions for the AMD platform, VIA is well positioned to strengthen our standing as a premier supplier of solutions for the AMD platform.”

“By enabling a top-to-bottom transition of our AMD Athlon 64 FX, AMD Athlon 64 X2, AMD Athlon 64 and AMD Sempron product lines around socket AM2 and by working jointly with allies like VIA, we can maintain our competitive edge through technology leadership and the benefits delivered to customers,” said Bob Brewer, corporate vice president, Desktop Division, AMD. “With VIA’s full range of chipsets compatible with socket AM2 platforms, we feel very confident we can offer customer-focused solutions through open industry standards and leading-edge technologies.”

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