""The Wafer Supply Agreement will govern the terms by which the Company (AMD) will purchase products manufactured by The Foundry Company. Pursuant to the Wafer Supply Agreement, the Company will, subject to limited exceptions, purchase all of its microprocessor unit (“MPU”) product requirements from The Foundry Company. If the Company acquires a third-party business that manufactures MPU products, the Company will have up to two years to transition the manufacture of such MPU products to The Foundry Company. In addition, once The Foundry Company establishes a 32nm-qualified process, the Company will purchase from Foundry Company sales entities, where competitive, specified percentages of its graphics processor unit (“GPU”) requirements at all process nodes, which percentage will increase linearly over a five-year period. At the Company’s request, The Foundry Company will also provide sort services to the Company on a product-by-product basis. The Company will provide The Foundry Company with product forecasts of its MPU and GPU product requirements. The price for MPU products is related to the percentage of the Company’s MPU-specific total cost of goods sold. The price for GPU products will be determined by the parties when The Foundry Company is able to begin manufacturing GPU products for the Company...""

"We're killing the latency between Intel and us in 32nm. AMD was late with 65nm and introduced 45nm with a nine month delay. With 32nm we are reducing this on just a single quarter or three months. Also, please note that we are implementing this model for a fraction of the cost, thanks to the shared cost model inside the IBM alliance."

"The Fab1 Module 1 [ex-Fab36] is currently configured as a 100% 45nm High-Performance SOI Fab production. The move to 32nm SOI is in progress and we're moving closely aligned with AMD"

"Fab1 Module 2, formerly known as Fab30 and Fab38 is bringing up the 32nm bulk-technology. We are currently installing the equipment in the F1M2 and adding more units than there were in the past. We are on track to be ready for initial customer designs in 4Q09 with products available in mid-2010. From 32nm bulk, we are going to introduce a 28nm half-node die-shrink, so that our customers can extract enhanced performance from their original 32nm bulk silicon."

"Our competition plans to bring only 1% of WSPM in 45/40nm, while we want to ramp-up aggressively in 32nm, 28nm and moving on forwards, bring 22nm process in both SOI and bulk silicon flavors to the foundry market."

"Right now, we have two priorities. Our number one priority is Fab 1 Module 2 and its ramp up with 32nm bulk technology. This is a key for swift transition to future manufacturing processes, such as 28nm "half-node" shrink. Our second priority is getting our initial Fab in place in Saratoga County."

"High Performance SOI for CPU & GPU, Performance Bulk for GPUs and Low Power bulk for the wireless chips."

"with 32nm we are also going to introduce both High-K and Ultra-Low-K technologies."

• Prozessoren von AMD ab sofort von GLOBALFOUNDRIES
• NVIDIA bald mit Fertigung bei "AMD"?
• GLOBALFOUNDRIES mit 32nm Bulk-Produkten noch in diesem Jahr?