AMD schliesst mehrjährigen Liefervertrag mit Soitec ab
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Der französische Waferhersteller Soitec (Silicon-On-Insulator Technologies) hat bekanntgegeben, dass man mit AMD einen mehrjährigen Vertrag über die Lieferung von UNIBOND™ Silicon-on-Insulator (SOI) Wafern geschlossen hat. Der Vertrag umfasst sowohl die Lieferung von 200, als auch von 300 mm Wafern und wird allein für das Jahr 2005 ein Auftragsvolumen von 50 Millionen Dollar haben. (<a href="http://www.planet3dnow.de/vbulletin/showthread.php3?s=&postid=2041503#post2041503">-> Pressemitteilung</a>)
Die Aktie von Soitec notierte im Laufe des Tages mit über 15% Plus an der Pariser Börse.
Links zum Thema:
<a href="http://de.wikipedia.org/wiki/Wafer" target="b">Was ist ein Wafer</a> (Wikipedia)
<a href="http://www.elektroniknet.de/news/index.php?mode=GE&NewsID=4911&CatID=3" target="b">Soitec: SOI-Wafer für neuste Transistoren</a> (elektroniknet)
Die Aktie von Soitec notierte im Laufe des Tages mit über 15% Plus an der Pariser Börse.
Links zum Thema:
<a href="http://de.wikipedia.org/wiki/Wafer" target="b">Was ist ein Wafer</a> (Wikipedia)
<a href="http://www.elektroniknet.de/news/index.php?mode=GE&NewsID=4911&CatID=3" target="b">Soitec: SOI-Wafer für neuste Transistoren</a> (elektroniknet)
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SOITEC SIGNS MULTI-YEAR AGREEMENT WITH AMD FOR THE SUPPLY OF UNIBOND™ SOI WAFERS
More than $50 million total order projected for 2005 alone
BERNIN, France — January 17, 2005 — The Soitec Group (Euronext, Paris: SOI) today announced the signing of an agreement with AMD (NYSE: AMD) for a long-term supply of UNIBOND™ silicon-on-insulator (SOI) wafers. Under the terms of the multi-year agreement, projected to total more than $50 million for 2005 alone, Soitec will supply AMD with both 200- and 300-mm SOI wafers, manufactured using Soitec’s proprietary Smart Cut™ process.
Soitec, the world’s leading supplier of SOI and other engineered substrates, has been supplying AMD with volume quantities of thin-film UNIBOND SOI substrate solutions for the production of their most advanced microprocessors.
“We are extremely pleased with this follow-on order from our long-time customer, AMD,” said André Auberton-Hervé, president and CEO of the Soitec Group. “It reaffirms a mutual commitment to our relationship, as well as AMD’s continuing recognition and confidence in Soitec’s high-quality SOI material for volume production in both 200- and 300-mm wafer sizes. This order also further validates our decision to invest in 300-mm manufacturing during the last industry downturn, as it has strategically positioned Soitec to deliver the on-demand capacity needed to support our growing customer needs.”
About the Soitec Group :
The Soitec Group is the world’s leading innovator and provider of the engineered substrates that serve as the foundation for today’s most advanced electronic products and nanotechnologies. Headquartered in Bernin, France, the company’s comprehensive portfolio of engineered substrates, including SOI and strained SOI, is manufactured using Soitec’s proprietary Smart Cut™ technology—the de facto industry standard. With its strong global presence, patented technology and industry-leading production capacity, Soitec is helping to drive the performance and power advantages that are key to the smaller, more power-efficient, and increasingly mobile electronic products favored by consumers worldwide. Both shares and two convertible bonds are listed on the Nouveau Marché of Euronext Paris.
UNIBOND and Smart Cut are trademarks of SOITEC Silicon On Insulator Technologies.
More than $50 million total order projected for 2005 alone
BERNIN, France — January 17, 2005 — The Soitec Group (Euronext, Paris: SOI) today announced the signing of an agreement with AMD (NYSE: AMD) for a long-term supply of UNIBOND™ silicon-on-insulator (SOI) wafers. Under the terms of the multi-year agreement, projected to total more than $50 million for 2005 alone, Soitec will supply AMD with both 200- and 300-mm SOI wafers, manufactured using Soitec’s proprietary Smart Cut™ process.
Soitec, the world’s leading supplier of SOI and other engineered substrates, has been supplying AMD with volume quantities of thin-film UNIBOND SOI substrate solutions for the production of their most advanced microprocessors.
“We are extremely pleased with this follow-on order from our long-time customer, AMD,” said André Auberton-Hervé, president and CEO of the Soitec Group. “It reaffirms a mutual commitment to our relationship, as well as AMD’s continuing recognition and confidence in Soitec’s high-quality SOI material for volume production in both 200- and 300-mm wafer sizes. This order also further validates our decision to invest in 300-mm manufacturing during the last industry downturn, as it has strategically positioned Soitec to deliver the on-demand capacity needed to support our growing customer needs.”
About the Soitec Group :
The Soitec Group is the world’s leading innovator and provider of the engineered substrates that serve as the foundation for today’s most advanced electronic products and nanotechnologies. Headquartered in Bernin, France, the company’s comprehensive portfolio of engineered substrates, including SOI and strained SOI, is manufactured using Soitec’s proprietary Smart Cut™ technology—the de facto industry standard. With its strong global presence, patented technology and industry-leading production capacity, Soitec is helping to drive the performance and power advantages that are key to the smaller, more power-efficient, and increasingly mobile electronic products favored by consumers worldwide. Both shares and two convertible bonds are listed on the Nouveau Marché of Euronext Paris.
UNIBOND and Smart Cut are trademarks of SOITEC Silicon On Insulator Technologies.
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Original geschrieben von OBrian
Also nichts wirklich Weltbewegendes, bedeutet nur, daß AMD sein Chipgeschäft nicht nächste Woche aufgibt
Es gaebe eventuell Alternativen: http://www.siltronic.com/internet/noc/Products/SOI/
Fertigen unter ner Soitec Lizenz: http://www.siltronic.com/internet/noc/Press/99_20040223News/?locale=de_DE
