Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wie­der.

Mittwoch, 19. Juni 2019

PCI-SIG® Announces Upcoming PCI Express® 6.0 Specification to Reach 64 GT/s

SANTA CLARA, Calif.–(BUSINESS WIRE)–PCI-SIG Deve­lo­pers Con­fe­rence 2019 – PCI-SIG® today announ­ced that PCI Express® (PCIe®) 6.0 tech­no­lo­gy will dou­ble the data rate to 64 GT/s while main­tai­ning back­wards com­pa­ti­bi­li­ty with pre­vious genera­ti­ons and deli­vering power effi­ci­en­cy and cost-effec­­ti­ve per­for­mance. The PCIe 6.0 spe­ci­fi­ca­ti­on is actively tar­ge­ted for release in 2021. PCIe 6.0 Spe­ci­fi­ca­ti­on Fea­tures Deli­vers 64 GT/s raw bit (…) Wei­ter­le­sen »

GIGABYTE Releases The AORUS NVMe Gen4 SSD Bringing Forth The PCIe 4.0 Era

Bla­zing Fast Read/Write Speeds With A Full Body Cop­per Heat­sink For The Best SSD Per­for­mance   Tai­pei, Tai­wan, May 29th, 2019 – GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards and gra­phics cards, today announ­ced the new NVMe archi­tec­tu­re and PCIe 4.0 inter­face based M.2 SSD. The new SSD comes in 3 dif­fe­rent capa­ci­ty (…) Wei­ter­le­sen »

StorMagic®: SvSAN is now certified with AMD EPYC™ 7000 processors

BRISTOL, Eng­land –18 June, 2019– Stor­Ma­gic®, sim­pli­fy­ing sto­rage at the edge, announ­ced today that its sof­t­­wa­re-defi­­ned sto­rage solu­ti­on, SvSAN, is now cer­ti­fied with AMD EPYC™ 7000 pro­ces­sors. SvSAN lets edge and small dat­a­cen­ters afford­a­b­ly opti­mi­ze their sto­rage envi­ron­ments by adding data secu­ri­ty while ensu­ring upti­me and per­for­mance. Custo­mers are able to con­so­li­da­te com­pu­te, sto­rage and hyper­vi­sor (…) Wei­ter­le­sen »

Dienstag, 18. Juni 2019

NEC to Deploy Direct-Liquid Cooled, AMD EPYC Processor Powered Supercomputer for the German Aerospace Center (DLR)

Düs­sel­dorf and Tokyo, June 18, 2019 — NEC Cor­po­ra­ti­on (NEC; TSE: 6701) today announ­ced that Deut­sches Zen­trum für Luft- und Raum­fahrt (DLR) — the Ger­man Aero­space Cen­ter — has awar­ded NEC with the deli­very and instal­la­ti­on of a new High Per­for­mance Com­pu­ting (HPC) clus­ter solu­ti­on, which con­sti­tu­tes one of the lar­gest recent HPC ten­ders in Euro­pe. NEC will (…) Wei­ter­le­sen »

Freitag, 14. Juni 2019

Experience The Exascale Era with AMD at ISC’19

SANTA CLARA, Calif., June 14, 2019 (GLOBE NEWSWIRE) — At the 2019 Inter­na­tio­nal Super­com­pu­ting Con­fe­rence (ISC), AMD invi­tes you to explo­re future archi­tec­tu­re and eco­sys­tem tech­no­lo­gies that are Powering the Exas­ca­le Era, and to hear how AMD will help unleash new realms of dis­co­very for HPC with AMD EPYC™ pro­ces­sors, Rade­on Instinct™ acce­le­ra­tors and the (…) Wei­ter­le­sen »

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Donnerstag, 13. Juni 2019

Mehr Performance mit ausgereiften Whiskey Lake Prozessoren

Mit dem NANO-ULT5 bringt ICP Deutsch­land ein per­for­man­tes Embed­ded Board mit Intel® Whis­key Lake Pro­zes­so­ren auf den Markt. Der Refresh der 8-te Gen. Intel Core-I Pro­zes­so­ren wird in der aus­ge­reif­ten 14 Nano­me­ter Tech­nik her­ge­stellt. Höhe­re Tur­bo Bost Takt­ra­ten bie­ten hier­bei einen Per­for­mance­ge­winn im Ver­gleich zum Vor­gän­ger. Das NANO-ULT5 Board wird in je einer Vari­an­te mit (…) Wei­ter­le­sen »

Mittwoch, 12. Juni 2019

AMD Reveals Leadership PC Platform for Gamers Worldwide at E3 2019

  – With a new design insi­de and out, the AMD Rade­on™ RX 5700 XT gra­phics card deli­vers ama­zing 1440p gaming, high-fide­­li­­ty visu­als and ultra-respon­­si­­ve game­play – – Har­n­es­sing the ground-bre­a­king new AMD RDNA gaming archi­tec­tu­re and 7nm pro­cess tech­no­lo­gy, the new Rade­on™ RX 5700 Series gra­phics cards deli­ver incredi­ble per­for­mance and effi­ci­en­ci­es – – (…) Wei­ter­le­sen »

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Samstag, 08. Juni 2019

IU to acquire fastest university-owned AI supercomputer

Big Red 200 will power advan­ced machi­ne lear­ning app­li­ca­ti­ons using mas­si­ve data sets and fas­ter sci­en­ti­fic cal­cu­la­ti­ons in a broad ran­ge of fields, inclu­ding medi­ci­ne, cli­ma­te chan­ge, addic­tion and cyber­se­cu­ri­ty   BLOOMINGTON, Ind., and SEATTLE, Wash. — India­na Uni­ver­si­ty and Cray Inc. have announ­ced IU’s acqui­si­ti­on of the fas­test uni­­ver­­­si­­ty-owned super­com­pu­ter in the nati­on to (…) Wei­ter­le­sen »

Freitag, 07. Juni 2019

Atos to deliver most powerful supercomputer in Norway to national e-infrastructure provider Uninett Sigma2

Paris, Fran­ce, June 6, 2019 Atos, a glo­bal lea­der in digi­tal trans­for­ma­ti­on, has signed a 4-year con­tract to deli­ver its latest super­com­pu­ter, the Bull­Se­qua­na XH2000, to Uni­nett Sigma2, the natio­nal e-infra­s­t­­ruc­­tu­­re pro­vi­der in Nor­way. The super­com­pu­ter will be Norway’s most power­ful super­com­pu­ter and pro­vi­de Nor­we­gi­an rese­ar­chers with an enhan­ced com­pu­ting capa­ci­ty to enab­le new inno­va­ti­on bre­akth­roughs. (…) Wei­ter­le­sen »

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Montag, 03. Juni 2019

AMD and Samsung Announce Strategic Partnership in Ultra Low Power, High Performance Graphics Technologies

Sam­sung to inte­gra­te custom AMD Rade­on™ gra­phics IP into future SoCs for mobi­le app­li­ca­ti­ons SEOUL, South Korea & SANTA CLARA, Calif.  06/03/2019 AMD (NASDAQ: AMD) and Sam­sung Elec­tro­nics Co., Ltd. today announ­ced a mul­­ti-year stra­te­gic part­nership in ultra low power, high per­for­mance mobi­le gra­phics IP based on AMD Rade­on gra­phics tech­no­lo­gies. As part of the part­nership, Sam­sung will licen­se (…) Wei­ter­le­sen »

High-Performance AMD Radeon GPUs to Power All-New Mac Pro

New super­char­ged 7nm AMD Rade­on™ Pro Vega II GPUs with high-speed HBM2 memo­ry and AMD Infi­ni­ty Fabric Link GPU inter­con­nect tech­no­lo­gy power deman­ding con­tent crea­ti­on San­ta Cla­ra, Calif.   06/03/2019 AMD (NASDAQ: AMD) today announ­ced that its new AMD Rade­on™ Pro Vega II GPUs will be inclu­ded in the all-new Mac Pro. Built on indus­­try-lea­­ding 7nm pro­cess (…) Wei­ter­le­sen »

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Mittwoch, 29. Mai 2019

ASUS kündigt Mainboards der AMD X570-Serie an

Die ROG, ROG Strix, Prime, Pro und TUF Gaming Seri­en kom­men mit ver­bes­ser­ter Strom­ver­sor­gung, groß­ar­ti­ger Küh­lung, Leis­tungs­op­ti­mie­run­gen und sind mit vie­len Funk­tio­nen aus­ge­stat­tet   Die ROG Cross­hair VIII Serie umfasst das Cross­hair VIII For­mu­la, Cross­hair VIII Hero (Wi-Fi) und Cross­hair VIII Impact. Die ROG Strix Gaming-Serie umfasst die Main­boards Strix X570-E, Strix X570-F und Strix (…) Wei­ter­le­sen »

Montag, 27. Mai 2019

The Revolution Continues ASRock Showcases Latest Motherboards, Graphics Cards and Small Form Factor PC at COMPUTEX 2019

TAIPEI, Tai­wan, May 27th, 2019 –The lea­ding glo­bal mother­board ‚gra­phics card and small form fac­tor manu­fac­tu­rer, ASRock, is proud to announ­ce and show­ca­se the latest PC pro­duc­ts, which inclu­de mother­boards, small form fac­tor PC and gra­phics cards, at the upco­m­ing COMPUTEX Tai­pei 2019. ASRock wel­co­mes visi­tors to expe­ri­ence our lea­ding pro­duc­ts and tech­no­lo­gies at booth (…) Wei­ter­le­sen »

Die nächste Generation — MSI X570 Mainboards

Tai­pei, Tai­wan / Frank­furt am Main 27.05.2019 – MSI, die Main­board-Mar­ke der ers­ten Stun­de stellt die brand­neu­en Boards mit X570 Chip­satz für den AMD AM4 Sockel vor. Um die maxi­ma­le Leis­tung zu erzie­len, hat der Her­stel­ler eine Viel­zahl fort­schritt­li­cher Funk­tio­nen inte­griert.  (…) Wei­ter­le­sen »

GIGABYTE Advances To PCIe 4.0 With X570 AORUS Motherboards

Tai­pei, Tai­wan, May 27th, 2019 – GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards and gra­phics cards, announ­ced the launch of the newest X570 AORUS series mother­boards pri­med to unleash the poten­ti­al of the high­ly anti­ci­pa­ted 3rd Gen AMD Ryzen™ desk­top™ pro­ces­sors. Ful­ly com­pa­ti­ble with the­se new pro­ces­sors, X570 AORUS series mother­boards kick off the PCIe® 4.0 era with exten­si­ve fea­ture sets. The flagship X570 AORUS XTREME mother­board is fit­ted with a 16-pha­se digi­tal power design for unmat­ched power manage­ment and a Fins-Array Sta­cked Fin Heat­sink with Direct Touch Heat­pipes for the stron­gest VRM coo­ling. Both fea­tures are aimed towards opti­mi­zing per­for­mance on the 3rd Gen AMD Ryzen desk­top pro­ces­sors. Select X570 AORUS mother­boards also deli­ver ultra fast con­nec­tivi­ty at 2.4Gbps with the WiFi 6 802.11ax wire­less stan­dard and fur­ther impro­ve the user expe­ri­ence with the newest ite­ra­ti­on of Q-Flash Plus Tech­no­lo­gy for users to update the BIOS with ease and con­ve­ni­en­ce. X570 AORUS series mother­boards lead the new era of gaming per­for­mance. (…) Wei­ter­le­sen »