Kategorie: Pressemitteilungen

Intel Reports Fourth-Quarter and Full-Year 2022 Financial Results

▪Fourth-quar­ter reve­nue was $14.0 bil­li­on, down 32 per­cent year-over-year (YoY) and down 28 per­cent YoY on a non-GAAP basis. Full-year reve­nue was $63.1 bil­li­on, down 20 per­cent YoY and down 16 per­cent YoY on a non-GAAP basis.

▪Fourth-quar­ter ear­nings (loss) per share (EPS) was $(0.16); non-GAAP EPS was $0.10. Full-year EPS was $1.94; non-GAAP EPS was $1.84.

▪Fore­cas­ting first-quar­ter 2023 reve­nue of $10.5 bil­li­on to $11.5 bil­li­on; expec­ting first-quar­ter EPS of $(0.80) (non-GAAP EPS of $(0.15)).

▪Decla­res quar­ter­ly cash divi­dend of $0.365 per share.

SANTA CLARA, Calif., Jan. 26, 2023 — Intel Cor­po­ra­ti­on today repor­ted fourth-quar­ter and full-year 2022 finan­cial results. The com­pa­ny also announ­ced that its board of direc­tors has declared a quar­ter­ly divi­dend of $0.365 per share on the company’s com­mon stock, which will be paya­ble on March 1, 2023, to share­hol­ders of record as of Febru­ary 7, 2023.

Despi­te the eco­no­mic and mar­ket head­winds, we con­tin­ued to make good pro­gress on our stra­te­gic trans­for­ma­ti­on in Q4, inclu­ding advan­cing our pro­duct road­map and impro­ving our ope­ra­tio­nal struc­tu­re and pro­ces­ses to dri­ve effi­ci­en­ci­es while deli­ve­ring at the low-end of our gui­ded ran­ge,” said Pat Gel­sin­ger, Intel CEO. “In 2023, we will con­ti­nue to navi­ga­te the short-term chal­lenges while stri­ving to meet our long-term com­mit­ments, inclu­ding deli­ve­ring lea­der­ship pro­ducts ancho­red on open and secu­re plat­forms, powered by at-sca­le manu­fac­tu­ring and super­char­ged by our incre­di­ble team.” 

In the fourth quar­ter, we took steps to right-size the orga­niza­ti­on and ratio­na­li­ze our invest­ments, prio­ri­tiz­ing the are­as whe­re we can deli­ver the hig­hest value for the long term,” said David Zins­ner, Intel CFO. “The­se actions under­pin our cost-reduc­tion tar­gets of $3 bil­li­on in 2023, and set the stage to achie­ve $8 bil­li­on to $10 bil­li­on by the end of 2025.” (…) Wei­ter­le­sen »

Noctua präsentiert NH-L9a-AM5 Low-Profile Kühler für AMD Ryzen Prozessoren

Wien, 24. Janu­ar 2023 – Noc­tua prä­sen­tier­te heu­te die jüngs­ten Model­le sei­ner erfolg­rei­chen Low-Pro­fi­le-Küh­ler­se­rie NH-L9: Mit einer Bau­hö­he von nur 37mm stel­len die neu­en NH-L9a-AM5 und NH-L9a-AM5 chromax.black eine her­vor­ra­gen­de Wahl für lei­se, hoch­kom­pak­te HTPCs und Small Form Fac­tor (SFF) Sys­te­me auf der Basis von AMDs neu­es­ten, AM5-basier­ten Ryzen Pro­zes­so­ren dar.

AMDs gera­de vor­ge­stell­ten Ryzen Pro­zes­so­ren mit 65W eig­nen sich ide­al für kom­pak­te aber den­noch leis­tungs­fä­hi­ge Sys­te­me und unser neu­er NH-L9a-AM5 ist der per­fek­te Küh­ler dafür,“ erklärt Roland Mos­sig (Noc­tua CEO). „Er kühlt die neu­en Model­le 7900, 7700 und 7600 pro­blem­los bei flüs­ter­lei­sen Dreh­zahl­ein­stel­lun­gen und bie­tet aus­rei­chend Leis­tungs­re­ser­ven, falls Kun­den sie mit mehr als 65W betrei­ben möch­ten – wir haben auf dem Ryzen 7950X und 7900X bis zu 130W erzielt.“ (…) Wei­ter­le­sen »

AMD Adaptive Computing Technology Enables Next-Generation DENSO LiDAR System, Delivering 20X Improvement in Resolution

── AMD Xilinx Auto­mo­ti­ve Zynq UltraS­ca­le+ MPSoC in DENSO plat­form pro­vi­des hig­hest point-cloud den­si­ty level of any SPAD LiDAR sys­tem in mar­ket today ──

SANTA CLARA, Calif., Jan. 19, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that its adap­ti­ve com­pu­ting tech­no­lo­gy is powe­ring lea­ding mobi­li­ty sup­pli­er DENSO Corporation’s next-gene­ra­ti­on LiDAR plat­form. The new plat­form will enable over 20X1 impro­ve­ment in reso­lu­ti­on with extre­me­ly low laten­cy for increased pre­cis­i­on in detec­ting pede­stri­ans, vehic­les, free space and more. The DENSO LiDAR plat­form, tar­ge­ted to begin ship­ping in 2025, will levera­ge the AMD Xilinx Auto­mo­ti­ve (XA) Zynq™ UltraS­ca­le+™ adap­ti­ve SoC and its func­tion­al safe­ty suite of deve­lo­per tools to enable ISO 26262 ASIL‑B cer­ti­fi­ca­ti­on. (…) Wei­ter­le­sen »

AMD Promotes Forrest Norrod to Executive Vice President of Data Center Solutions Business

SANTA CLARA, Calif., Jan. 16, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that For­rest Nor­rod has been pro­mo­ted to exe­cu­ti­ve vice pre­si­dent and gene­ral mana­ger of the Data Cen­ter Solu­ti­ons busi­ness group at AMD. The appoint­ment reflects his record of lea­der­ship and mar­ket growth throug­hout his ten­ure with AMD and the stra­te­gic role of the data cen­ter busi­ness to the company’s con­tin­ued growth strategy.

Under Forrest’s lea­der­ship, we have signi­fi­cant­ly grown our data cen­ter busi­ness and deli­ver­ed mul­ti­ple gene­ra­ti­ons of AMD EPYC pro­ces­sors that com­bi­ne lea­der­ship per­for­mance and ener­gy effi­ci­en­cy,” said AMD Chair and CEO Dr. Lisa Su. “The data cen­ter is our lar­gest growth oppor­tu­ni­ty, and we look for­ward to fur­ther expan­ding our pre­sence with cloud, enter­pri­se and edge cus­to­mers dri­ven by the industry’s stron­gest data cen­ter port­fo­lio and Forrest’s lea­der­ship.” (…) Wei­ter­le­sen »

AMD Announces CFO Transition

AMD Chief Finan­cial Offi­cer Devin­der Kumar reti­ring and for­mer Mar­vell CFO Jean Hu to join AMD as exe­cu­ti­ve vice pre­si­dent and CFO —

SANTA CLARA, Calif., Jan. 11, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that chief finan­cial offi­cer and tre­asurer Devin­der Kumar will be reti­ring from the com­pa­ny and that Jean Hu will join on Janu­ary 23 as exe­cu­ti­ve vice pre­si­dent and chief finan­cial offi­cer. Kumar will remain at AMD through April 2023 to ensu­re a smooth tran­si­ti­on. (…) Wei­ter­le­sen »

Intel Launches 4th Gen Xeon Scalable Processors, Max Series CPUs

Intel high­lights broad indus­try adop­ti­on across all major CSPs, OEMs, ODMs and ISVs, and show­ca­ses increased per­for­mance in AI, net­wor­king and high per­for­mance computing.

NEWS HIGHLIGHTS
 

  • Expan­si­ve cus­to­mer and part­ner adop­ti­on from AWS, Cis­co, Clou­de­ra, Core­Wea­ve, Dell Tech­no­lo­gies, Drop­box, Erics­son, Fuji­tsu, Goog­le Cloud, Hew­lett Packard Enter­pri­se, IBM Cloud, Inspur Infor­ma­ti­on, IONOS, Leno­vo, Los Ala­mos Natio­nal Labo­ra­to­ry, Micro­soft Azu­re, NVIDIA, Ora­cle Cloud, OVH­cloud, phoe­nix­NAP, Red­Hat, SAP, Super­Mi­cro, Tele­fo­ni­ca and VMware, among others.
  • With the most built-in acce­le­ra­tors of any CPU in the world for key workloads such as AI, ana­ly­tics, net­wor­king, secu­ri­ty, sto­rage and high per­for­mance com­pu­ting (HPC), 4th Gen Intel Xeon Sca­lable and Intel Max Series fami­lies deli­ver lea­der­ship per­for­mance in a pur­po­se-built workload-first approach.
  • 4th Gen Intel Xeon Sca­lable pro­ces­sors are Intel’s most sus­tainable data cen­ter pro­ces­sors, deli­ve­ring a ran­ge of fea­tures for opti­mi­zing power and per­for­mance, making opti­mal use of CPU resour­ces to help achie­ve cus­to­mers’ sus­taina­bi­li­ty goals.
  • When com­pared with pri­or gene­ra­ti­ons, 4th Gen Xeon cus­to­mers can expect a 2.9x1 avera­ge per­for­mance per watt effi­ci­en­cy impro­ve­ment for tar­ge­ted workloads when uti­li­zing built-in acce­le­ra­tors, up to 70-watt2 power savings per CPU in opti­mi­zed power mode with mini­mal per­for­mance loss for sel­ect workloads and a 52% to 66% lower total cost of owner­ship (TCO)3.

(…) Wei­ter­le­sen »

The Greenest Generation: NVIDIA, Intel and Partners Supercharge AI Computing Efficiency

Acce­le­ra­ted NVIDIA Hop­per sys­tems with 4th Gen Intel Xeon Sca­lable pro­ces­sors — inclu­ding NVIDIA DGX H100 and 60+ sys­tems from NVIDIA part­ners — pro­vi­de 25x more effi­ci­en­cy than tra­di­tio­nal data cen­ter ser­vers to save big on ener­gy costs.
(…) Wei­ter­le­sen »

Microsoft announces acquisition of Fungible to accelerate datacenter innovation

Jan 9, 2023 — Today, Micro­soft is announ­cing the acqui­si­ti­on of Fun­gi­ble Inc., a pro­vi­der of com­posable infra­struc­tu­re aimed at acce­le­ra­ting net­wor­king and sto­rage per­for­mance in dat­a­cen­ters with high-effi­ci­en­cy, low-power data pro­ces­sing units (DPUs).

Fungible’s tech­no­lo­gies help enable high-per­for­mance, sca­lable, dis­ag­gre­ga­ted, sca­led-out dat­a­cen­ter infra­struc­tu­re with relia­bi­li­ty and secu­ri­ty. (…) Wei­ter­le­sen »

AMD Unveils Suite of New Radeon GPUs to Power High-Performance, Power-Efficient Gaming Laptops

AMD Rade­on RX 7000M Series Gra­phics deli­ver out­stan­ding per­for­mance-per-watt, sta­te-of-the-art visu­als and high-frame­ra­te gam­ing, with 26% hig­her per­for­mance on avera­ge than pre­vious gene­ra­ti­on; AMD Rade­on RX 7000S Series Gra­phics rede­fi­ne gam­ing per­for­mance for thin and light laptops

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023, AMD (NASDAQ: AMD) announ­ced the AMD Rade­on™ RX 7000 Series Gra­phics for Lap­tops. Built on the ground­brea­king AMD RDNA™ 3 archi­tec­tu­re, the new GPUs are desi­gned to deli­ver excep­tio­nal ener­gy effi­ci­en­cy and per­for­mance to power 1080p gam­ing at ultra set­tings and advan­ced con­tent crea­ti­on appli­ca­ti­ons on next-gene­ra­ti­on pre­mi­um laptops.

The new GPUs expand the recent­ly announ­ced AMD Rade­on RX 7000 Series Gra­phics fami­ly. The new AMD Rade­on RX 7000M Series Gra­phics offer out­stan­ding per­for­mance-per-watt while deli­ve­ring sta­te-of-the-art visu­als and high-FPS gam­ing, while the new AMD Rade­on RX 7000S Series Gra­phics maxi­mi­ze the effi­ci­en­ci­es of AMD RDNA 3 archi­tec­tu­re to deli­ver out­stan­ding per­for­mance at low power levels ide­al­ly sui­ted for thin and light lap­tops. (…) Wei­ter­le­sen »

AMD Extends its Leadership with the Introduction of its Broadest Portfolio of High-Performance PC Products for Mobile and Desktop

— AMD Ryzen™ 7000X3D Series Desk­top pro­ces­sors bring the power of AMD 3D V‑Cache™ tech­no­lo­gy to gamers and creators —

— AMD Ryzen 7000 Series Mobi­le pro­ces­sors deli­ver unpar­al­le­led per­for­mance for deman­ding workloads with up to 16 powerful “Zen 4” cores and bring new Ryzen AI tech­no­lo­gy to sel­ect lap­top devices—

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023AMD (NASDAQ: AMD) announ­ced a varie­ty of new com­pu­ting pro­ducts across desk­top and mobi­le, brin­ging new levels of per­for­mance for gamers, crea­tors, pro­fes­sio­nals, and main­stream users. AMD is sub­stan­ti­al­ly expan­ding the ran­ge of opti­ons for Socket AM5 users with the new Ryzen 7000X3D Series Desk­top pro­ces­sors and 65W Ryzen 7000 Series Desk­top pro­ces­sors. AMD also announ­ced a new lin­e­up of Ryzen 7000 Series Mobi­le pro­ces­sors, inclu­ding the AMD Ryzen 7045HX Series Mobi­le pro­ces­sors, which deli­ver on avera­ge over 50% more per­for­mance across a wide ran­ge of appli­ca­ti­ons to enable gamers and crea­tors on the go 1. AMD is also intro­du­cing the Ryzen 7040 Series Mobi­le pro­ces­sors, which fea­ture the first dedi­ca­ted arti­fi­ci­al intel­li­gence hard­ware in an x86 pro­ces­sor on sel­ect models. (…) Wei­ter­le­sen »

AMD Highlights Future of High-Performance and Adaptive Computing During Opening Keynote of CES 2023

AMD CEO and part­ners inclu­ding Micro­soft, HP, Leno­vo, Magic Leap and Intui­ti­ve Sur­gi­cal show­ca­se AMD tech­no­lo­gies advan­cing AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable computing —

— Unveils new mobi­le CPUs and GPUs, inclu­ding first x86 PC CPU with dedi­ca­ted AI engi­ne and new 3D sta­cked desk­top pro­ces­sors with lea­der­ship gam­ing per­for­mance, and pre­views lea­der­ship AI infe­rence acce­le­ra­tor and data cen­ter APU —

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detail­ed the signi­fi­cant role high-per­for­mance and adap­ti­ve com­pu­ting plays in crea­ting solu­ti­ons to the world’s most important chal­lenges. During her live key­note, Dr. Su show­ca­sed next-gene­ra­ti­on AMD lea­der­ship pro­ducts rede­fi­ning what’s pos­si­ble across the broad mar­kets AMD ser­ves today.

It is an honor to kick off CES 2023 and high­light all the ways AMD is pushing the enve­lo­pe in high-per­for­mance and adap­ti­ve com­pu­ting to help sol­ve the world’s most important chal­lenges,” said Dr. Su.  “Tog­e­ther with our part­ners, we high­ligh­ted how AMD tech­no­lo­gy is advan­cing what is pos­si­ble in AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable com­pu­ting. We also laun­ched mul­ti­ple new mobi­le, gam­ing and AI chips that will make 2023 an exci­ting year for AMD and the indus­try.” (…) Wei­ter­le­sen »

TSMC November 2022 Revenue Report

HSINCHU, Tai­wan, R.O.C. – Dec. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Novem­ber 2022: On a con­so­li­da­ted basis, reve­nue for Novem­ber 2022 was appro­xi­m­ate­ly NT$222.71 bil­li­on, an increase of 5.9 per­cent from Octo­ber 2022 and an increase of 50.2 per­cent from Novem­ber 2021. Reve­nue for Janu­ary through Novem­ber 2022 tota­led NT$2,071.33 bil­li­on, an increase of 44.6 per­cent com­pared to the same peri­od in 2021. (…) Wei­ter­le­sen »

TSMC Announces Updates for TSMC Arizona

PHOENIX, Ari­zo­na, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that in addi­ti­on to TSMC Arizona’s first fab, which is sche­du­led to begin pro­duc­tion of N4 pro­cess tech­no­lo­gy in 2024, TSMC has also star­ted the con­s­truc­tion of a second fab which is sche­du­led to begin pro­duc­tion of 3nm pro­cess tech­no­lo­gy in 2026. The over­all invest­ment for the­se two fabs will be appro­xi­m­ate­ly US$40 bil­li­on, repre­sen­ting the lar­gest for­eign direct invest­ment in Ari­zo­na histo­ry and one of the lar­gest for­eign direct invest­ments in the histo­ry of the United Sta­tes. (…) Wei­ter­le­sen »

AMD and Viettel Collaborate on 5G Mobile Network Expansion

── Viettel selects Xilinx Zynq MPSoC and RFSoC adaptive platforms to enable its next-generation 5G systems serving more than 130 million mobile customers globally ──

SANTA CLARA, Calif., Dec. 01, 2022 — AMD (NASDAQ: AMD) and Viet­tel High Tech (Mem­ber of Viet­tel Group) today announ­ced the suc­cessful com­ple­ti­on of a 5G mobi­le net­work field tri­al deploy­ment con­duc­ted by Viet­tel and powered by AMD Xilinx Zynq™ UltraS­ca­le+™ MPSoC devices. As the lar­gest tele­com ope­ra­tor in Viet­nam ser­ving more than 130 mil­li­on mobi­le cus­to­mers, Viet­tel High Tech has a rich histo­ry of using AMD radio tech­no­lo­gy with pri­or 4G deploy­ments and is now acce­le­ra­ting new net­works via new 5G remo­te radio heads. Desi­gned to meet the gro­wing capa­ci­ty and per­for­mance requi­re­ments of mobi­le users glo­bal­ly, the Viet­tel 5G mobi­le net­work is expec­ted to be com­ple­ted by the end of 2022.

(…) Wei­ter­le­sen »

AMD to Present at Arete’s Tech Conference

SANTA CLARA, Calif., Nov. 30, 2022 — Today, AMD (NASDAQ: AMD) announ­ced that Mark Paper­mas­ter, chief tech­no­lo­gy offi­cer and exe­cu­ti­ve vice pre­si­dent, Tech­no­lo­gy and Engi­nee­ring, will pre­sent at the vir­tu­al Are­te Tech Con­fe­rence (ATC) on Tues­day, Dec. 6 at 10:10 AM ET/7:10 AM PT.

A real-time web­cast of the pre­sen­ta­ti­on can be acces­sed on AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com. A replay of the web­cast can be acces­sed after the con­clu­si­on of the live event and will be available for one year after the conference.
(…) Wei­ter­le­sen »