Kategorie: Pressemitteilungen

In die­ser Sek­ti­on wer­den Pres­se­mit­tei­lun­gen der Her­stel­ler 1:1 ver­öf­fent­licht. Pla­net 3DNow! über­nimmt weder für die Rich­tig­keit der Anga­ben noch für die Art der For­mu­lie­rung jed­we­de Ver­ant­wor­tung. Die Anga­ben kön­nen sub­jek­tiv sein und geben nicht not­wen­di­ger­wei­se die Mei­nung der auf Pla­net 3DNow! schrei­ben­den Autoren wieder.

AMD Announces Upcoming Events for the Financial Community

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SANTA CLARA, Calif., Aug. 21, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced the fol­lo­wing events for the finan­cial community:

  • Dr. Lisa Su, chair and chief exe­cu­ti­ve offi­cer, will attend the Gold­man Sachs 2023 Com­mu­na­co­pia and Tech­no­lo­gy Con­fe­rence on Tues­day, Sept. 5, 2023, at 11:50 AM EDT/8:50 AM PDT.
  • Jean Hu, exe­cu­ti­ve vice pre­si­dent, chief finan­cial offi­cer and tre­asurer, will attend the Deut­sche Bank Tech­no­lo­gy Con­fe­rence on Thurs­day, Aug. 31, 2023, at 11:00 AM EDT/8:00 AM PDT.

(…) Wei­ter­le­sen »

AMD Showcases Leadership Cloud Performance with New Amazon EC2 Instances Powered by 4th Gen AMD EPYC Processors

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—Ama­zon EC2 M7a ins­tances offer up to 50 per­cent more com­pu­te per­for­mance than M6a ins­tances and bring an even broa­der ran­ge of workloads to AWS—

—Ama­zon EC2 Hpc7a ins­tances, powered by 4th Gen AMD EPYC pro­ces­sors, deli­ver up to 2.5x bet­ter per­for­mance com­pared to Ama­zon EC2 Hpc6a instances—

SANTA CLARA, Calif., Aug. 18, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced Ama­zon Web Ser­vices (AWS) has expan­ded its 4th Gen AMD EPYC™ pro­ces­sor-based offe­rings with the gene­ral avai­la­bi­li­ty of Ama­zon Ela­s­tic Com­pu­te Cloud (EC2) M7a and Ama­zon EC2 Hpc7a ins­tances, which offer next-gene­ra­ti­on per­for­mance and effi­ci­en­cy for appli­ca­ti­ons that bene­fit from high per­for­mance, high through­put and tight­ly cou­pled HPC workloads, respectively.

“For cus­to­mers with incre­asing­ly com­plex and com­pu­te-inten­si­ve workloads, 4th Gen EPYC pro­ces­sor-powered Ama­zon EC2 ins­tances deli­ver a dif­fe­ren­tia­ted offe­ring for cus­to­mers,” said David Brown, vice pre­si­dent of Ama­zon EC2 at AWS. “Com­bi­ned with the power of the AWS Nit­ro Sys­tem, both M7a and Hpc7a ins­tances allow for fast and low-laten­cy inter­node com­mu­ni­ca­ti­ons, advan­cing what our cus­to­mers can achie­ve across our gro­wing fami­ly of Ama­zon EC2 ins­tances.” (…) Wei­ter­le­sen »

AMD Reports Second Quarter 2023 Financial Results

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SANTA CLARA, Calif., Aug. 01, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the second quar­ter of 2023 of $5.4 bil­li­on, gross mar­gin of 46%, ope­ra­ting loss of $20 mil­li­on, net inco­me of $27 mil­li­on and diluted ear­nings per share of $0.02. On a non-GAAP(*) basis, gross mar­gin was 50%, ope­ra­ting inco­me was $1.1 bil­li­on, net inco­me was $948 mil­li­on and diluted ear­nings per share was $0.58.

“We deli­ver­ed strong results in the second quar­ter as 4th Gen EPYC and Ryzen 7000 pro­ces­sors ram­ped signi­fi­cant­ly,” said AMD Chair and CEO Dr. Lisa Su. “Our AI enga­ge­ments increased by more than seven times in the quar­ter as mul­ti­ple cus­to­mers initia­ted or expan­ded pro­grams sup­port­ing future deploy­ments of Instinct acce­le­ra­tors at sca­le. We made strong pro­gress mee­ting key hard­ware and soft­ware mile­sto­nes to address the gro­wing cus­to­mer pull for our data cen­ter AI solu­ti­ons and are on-track to launch and ramp pro­duc­tion of MI300 acce­le­ra­tors in the fourth quarter.”

“We are plea­sed with our second quar­ter exe­cu­ti­on,” said AMD EVP, CFO and Tre­asurer Jean Hu. “Loo­king to the third quar­ter, we expect our Data Cen­ter and Cli­ent seg­ment reve­nues to each grow by a dou­ble-digit per­cen­ta­ge sequen­ti­al­ly dri­ven by incre­asing demand for our EPYC and Ryzen pro­ces­sors, par­ti­al­ly off­set by Gam­ing and Embedded seg­ment decli­nes.” (…) Wei­ter­le­sen »

AMD Announces Plan to Invest Approximately $400 Million Over the Next Five Years to Expand Research, Development and Engineering Operations in India

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— Investment expected to create largest AMD design center with addition of approximately 3,000 engineering roles and new Bangalore campus opening before end of 2023 —

GANDHINAGAR, India, July 28, 2023 (GLOBE NEWSWIRE) — Semi­con­In­dia 2023 — AMD (NASDAQ: AMD) today announ­ced plans for con­tin­ued growth in India through an appro­xi­ma­te $400M invest­ment over the next five years. The plan­ned invest­ment includes a new AMD cam­pus in Banga­lo­re, Kar­na­ta­ka that will ser­ve as the company’s lar­gest design cen­ter, as well as the addi­ti­on of appro­xi­m­ate­ly 3,000 new engi­nee­ring roles by the end of 2028.

The new AMD cam­pus is expec­ted to open befo­re the end of 2023 and will fea­ture exten­si­ve lab space, sta­te-of-the-art col­la­bo­ra­ti­on tools and sea­ting con­fi­gu­ra­ti­ons desi­gned to fos­ter team­work. The invest­ment is sup­port­ed by the various poli­cy initia­ti­ves of the Govern­ment of India focu­sed on the semi­con­duc­tor indus­try. (…) Wei­ter­le­sen »

Intel Reports Second-Quarter 2023 Financial Results

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 Second-quar­ter reve­nue of $12.9 bil­li­on, down 15% year over year (YoY).

  • Second-quar­ter ear­nings per share (EPS) attri­bu­ta­ble to Intel was $0.35; non-GAAP EPS attri­bu­ta­ble to Intel was $0.13.
  • Second-quar­ter results on the top and bot­tom line excee­ded the high end of gui­dance; com­pa­ny con­ti­nues to exe­cu­te stra­tegy with momen­tum across pro­cess and pro­duct tech­no­lo­gy and foundry.
  • Fore­cas­ting third-quar­ter 2023 reve­nue of appro­xi­m­ate­ly $12.9 bil­li­on to $13.9 bil­li­on; expec­ting third-quar­ter EPS attri­bu­ta­ble to Intel of $0.04; non-GAAP EPS attri­bu­ta­ble to Intel of $0.20.

 

SANTA CLARA, Calif., July 27, 2023 – Intel Cor­po­ra­ti­on today repor­ted second-quar­ter 2023 finan­cial results.

“Our Q2 results excee­ded the high end of our gui­dance as we con­ti­nue to exe­cu­te on our stra­te­gic prio­ri­ties, inclu­ding buil­ding momen­tum with our foundry busi­ness and deli­ve­ring on our pro­duct and pro­cess road­maps,” said Pat Gel­sin­ger, Intel CEO. “We are also well-posi­tio­ned to capi­ta­li­ze on the signi­fi­cant growth across the AI con­ti­nu­um by cham­pio­ning an open eco­sys­tem and sili­con solu­ti­ons that opti­mi­ze per­for­mance, cost and secu­ri­ty to demo­cra­ti­ze AI from cloud to enter­pri­se, edge and client.”

David Zins­ner, Intel CFO, said, “Strong exe­cu­ti­on, inclu­ding pro­gress towards our $3 bil­li­on in cost savings in 2023, con­tri­bu­ted to the upsi­de in the quar­ter. We remain focu­sed on ope­ra­tio­nal effi­ci­en­ci­es and our Smart Capi­tal stra­tegy to sup­port sus­tainable growth and finan­cial disci­pli­ne as we impro­ve our mar­gins and cash gene­ra­ti­on and dri­ve share­hol­der value.”

(…) Wei­ter­le­sen »

BIOSTAR UNVEILS THE A620MT MOTHERBOARD: MAXIMIZED PERFORMANCE FOR HOME, OFFICE, AND SYSTEM INTEGRATION

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July 24th, 2023, TAIPEI, Tai­wan, BIOSTAR, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and sto­rage devices, proud­ly unveils the A620MT mother­board, desi­gned to run the latest AMD Ryzen™ 7000 Series pro­ces­sors. (…) Wei­ter­le­sen »

TSMC Reports Second Quarter EPS of NT$7.01

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HSINCHU, Tai­wan, R.O.C., Jul. 20, 2023 — TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$480.84 bil­li­on, net inco­me of NT$181.80 bil­li­on, and diluted ear­nings per share of NT$7.01 (US$1.14 per ADR unit) for the second quar­ter ended June 30, 2023.

Year-over-year, second quar­ter reve­nue decreased 10.0% while net inco­me and diluted EPS both decreased 23.3%. Com­pared to first quar­ter 2023, second quar­ter results repre­sen­ted a 5.5% decrease in reve­nue and a 12.2% decrease in net inco­me. All figu­res were pre­pared in accordance with TIFRS on a con­so­li­da­ted basis. (…) Wei­ter­le­sen »

Breakthrough DDR5 XMP 8000 with the latest BIOS on GIGABYTE X670 & B650 Motherboards

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July 19, 2023 –GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and hard­ware solu­ti­ons, proud­ly announ­ced the ulti­ma­te memo­ry per­for­mance of DDR5 XMP 8000 is achie­ved with the X670E AORUS MASTER mother­board based on the latest AMD AGESA BIOS code at a SOC vol­ta­ge of 1.3V.

GIGABYTE always works clo­se­ly with AMD to ensu­re our mother­board designs pro­vi­de supre­me per­for­mance and relia­bi­li­ty, par­ti­cu­lar­ly on the opti­mum memo­ry per­for­mance by exclu­si­ve­ly advan­ced memo­ry lay­out design. Mean­while, GIGABYTE is releasing a new beta BIOS for the X670 and B650 AORUS/AERO series mother­boards for the most remar­kab­le memo­ry per­for­mance on the AM5 plat­form. The new BIOS will be available at the end of July in suc­ces­si­on. (…) Wei­ter­le­sen »

AMD to Report Fiscal Second Quarter 2023 Financial Results

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SANTA CLARA, Calif., July 18, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that it will report fis­cal second quar­ter 2023 finan­cial results on Tues­day, August 1, 2023, after the clo­se of mar­ket. Manage­ment will con­duct a con­fe­rence call to dis­cuss the­se results at 5:00 p.m. EDT / 2:00 p.m. PDT. Inte­res­ted par­ties are invi­ted to lis­ten to the web­cast of the con­fe­rence call via AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.

(…) Wei­ter­le­sen »

Lighter! Better! ASRock Launches Taichi Lite Series Motherboards

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July 13, 2023 — Tai­chi Lite series is here! Based on the exis­ting Z790/B650E Tai­chi mother­board, the Tai­chi Lite kept the ori­gi­nal specs & fea­tures but with less RGB & simp­ler exte­ri­or design. Tai­chi Lite series mother­board will be focu­sing purely on the func­tion­a­li­ty, per­for­mance and dura­bi­li­ty, and with the new sim­pli­fied design con­cept, ASRock has brought the long awai­ted afforda­ble high end mother­board final­ly back to the mar­ket! (…) Wei­ter­le­sen »

AMD EPYC CPUs Now Power SAP Applications Hosted on Google Cloud

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Cri­ti­cal SAP Busi­ness Suite workloads now run on AMD EPYC pro­ces­sor-powered Goog­le Cloud N2D offe­ring, deli­ve­ring impres­si­ve per­for­mance and ener­gy efficiency

SANTA CLARA, Calif., July 11, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced that SAP has cho­sen AMD EPYC™ pro­ces­sor-powered Goog­le Cloud N2D vir­tu­al machi­nes (VMs) to run its cloud ERP deli­very ope­ra­ti­ons for RISE with SAP; fur­ther incre­asing adop­ti­on of AMD EPYC for cloud-based workloads. As enter­pri­ses look toward digi­tal moder­niza­ti­on, many are adop­ting cloud-first archi­tec­tures to com­ple­ment their on-pre­mi­ses data cen­ters. AMD, Goog­le Cloud and SAP can help cus­to­mers achie­ve their most strin­gent per­for­mance goals while deli­ve­ring on ener­gy effi­ci­en­cy, sca­la­bi­li­ty and resour­ce uti­liza­ti­on needs.

AMD EPYC pro­ces­sors offer excep­tio­nal per­for­mance as well as robust secu­ri­ty fea­tures, and ener­gy effi­ci­ent solu­ti­ons for enter­pri­se workloads in the cloud. RISE with SAP helps maxi­mi­ze cus­to­mer invest­ments in cloud infra­struc­tu­re and, pai­red with AMD EPYC pro­ces­sors and Goog­le Cloud N2D VMs, aims to moder­ni­ze cus­to­mer data cen­ters and trans­form data into actionable insights, faster.

(…) Wei­ter­le­sen »

AMD Appoints Phil Guido as Chief Commercial Officer

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SANTA CLARA, Calif., July 10, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that Exe­cu­ti­ve Vice Pre­si­dent and Chief Sales Offi­cer Dar­ren Gras­by will tran­si­ti­on into a new role as exe­cu­ti­ve vice pre­si­dent, stra­te­gic part­ner­ships and that Phil Gui­do has joi­n­ed the com­pa­ny as exe­cu­ti­ve vice pre­si­dent and chief com­mer­cial offi­cer. Gui­do will be respon­si­ble for lea­ding the AMD world­wi­de sales orga­niza­ti­on with a focus on fur­ther acce­le­ra­ting adop­ti­on of the company’s lea­der­ship pro­ducts with com­mer­cial and data cen­ter customers.

“I am exci­ted to wel­co­me Phil to our lea­der­ship team as we take the next steps in our jour­ney to make AMD the com­mer­cial and data cen­ter com­pu­te part­ner of choice,” said AMD Chair and CEO, Dr. Lisa Su. “Phil brings exten­si­ve enter­pri­se and sales expe­ri­ence that will be incre­di­bly valuable as we focus on deepe­ning our enter­pri­se part­ner­ships and acce­le­ra­ting our growth in the data cen­ter, embedded and com­mer­cial mar­kets. I also want to thank Dar­ren for his trans­for­ma­tio­nal lea­der­ship as chief sales offi­cer over the last eight years, and I look for­ward to lever­aging his signi­fi­cant indus­try expe­ri­ence to lead stra­te­gic part­ner­ships in his new role.” (…) Wei­ter­le­sen »

AMD Introduces World’s Largest FPGA-Based Adaptive SoC for Emulation and Prototyping

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ꟷ AMD Ver­sal Pre­mi­um VP1902 adap­ti­ve SoC offers 2X the capa­ci­ty of pre­vious-gene­ra­ti­on FPGAs, pro­vi­ding chip­ma­kers with the tools to bring new ASIC and SoC designs to mar­ket fas­ter ─

ꟷ Col­la­bo­ra­ti­on with EDA lea­ders Cadence, Sie­mens and Syn­op­sys helps ensu­re chip desi­gners have access to sca­lable eco­sys­tem of ful­ly-fea­tured solu­ti­ons ꟷ

SANTA CLARA, Calif., June 27, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the AMD Ver­sal™ Pre­mi­um VP1902 adap­ti­ve sys­tem-on-chip (SoC), the world’s lar­gest1 adap­ti­ve SoC. The VP1902 adap­ti­ve SoC is an emu­la­ti­on-class, chip­let-based device desi­gned to stream­li­ne the veri­fi­ca­ti­on of incre­asing­ly com­plex semi­con­duc­tor designs. Offe­ring 2X2 the capa­ci­ty over the pri­or gene­ra­ti­on, desi­gners can con­fi­dent­ly inno­va­te and vali­da­te appli­ca­ti­on-spe­ci­fic inte­gra­ted cir­cuits (ASICs) and SoC designs to help bring next gene­ra­ti­on tech­no­lo­gies to mar­ket faster.
AI workloads are dri­ving increased com­ple­xi­ty in chip­ma­king, requi­ring next-gene­ra­ti­on solu­ti­ons to deve­lop the chips of tomor­row. FPGA-based emu­la­ti­on and pro­to­ty­p­ing pro­vi­des the hig­hest level of per­for­mance, allo­wing fas­ter sili­con veri­fi­ca­ti­on and enab­ling deve­lo­pers to shift left in the design cycle and begin soft­ware deve­lo­p­ment well befo­re sili­con tape-out. AMD, through Xilinx, brings over 17 years of lea­der­ship and six gene­ra­ti­ons of the industry’s hig­hest capa­ci­ty emu­la­ti­on devices, which have near­ly dou­bled in capa­ci­ty each gene­ra­ti­on3.
“Deli­ve­ring foun­da­tio­nal com­pu­te tech­no­lo­gy to enable our cus­to­mers is a top prio­ri­ty. In emu­la­ti­on and pro­to­ty­p­ing, that means deli­ve­ring the hig­hest capa­ci­ty and per­for­mance pos­si­ble,” said Kirk Saban, cor­po­ra­te vice pre­si­dent, Pro­duct, Soft­ware, & Solu­ti­ons Mar­ke­ting, Adap­ti­ve and Embedded Com­pu­ting Group, AMD. “Chip desi­gners can con­fi­dent­ly emu­la­te and pro­to­ty­pe next-gene­ra­ti­on pro­ducts using our VP1902 adap­ti­ve SoC, acce­le­ra­ting tomorrow’s inno­va­tions in AI, auto­no­mous vehic­les, Indus­try 5.0 and other emer­ging technologies.”

Con­fi­dent­ly Emu­la­te and Pro­to­ty­pe Next-Gene­ra­ti­on Designs
As com­ple­xi­ty grows in ASIC and SoC designs, espe­ci­al­ly with the rapid advance­ment of AI and ML-based chips, exten­si­ve veri­fi­ca­ti­on of both sili­con and soft­ware befo­re tape-out is a must.
The VP1902 deli­vers indus­try lea­ding capa­ci­ty and con­nec­ti­vi­ty, deli­ve­ring 18.5M logic cells for 2X2 hig­her pro­gramma­ble logic den­si­ty and 2X4 aggre­ga­te I/O band­width com­pared to the pre­vious gene­ra­ti­on Vir­tex™ UltraS­ca­le+™ VU19P FPGA. (…) Wei­ter­le­sen »

AMD EPYC Embedded Series Processors Power New HPE Alletra Storage MP Solution

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— AMD EPYC pro­ces­sors enable HPE to trans­form data life­cy­cle manage­ment with high-per­for­mance sca­le-out block and file sto­rage deli­ver­ed through HPE Green­La­ke —

LAS VEGAS, June 21, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that its AMD EPYC™ Embedded Series pro­ces­sors are powe­ring Hew­lett Packard Enterprise’s new modu­lar, mul­ti-pro­to­col sto­rage solu­ti­on, HPE Alle­tra Sto­rage MP. AMD EPYC Embedded pro­ces­sors pro­vi­de the per­for­mance and ener­gy effi­ci­en­cy requi­red for enter­pri­se-class sto­rage sys­tems with high avai­la­bi­li­ty, resi­li­ence, and indus­try-lea­ding con­nec­ti­vi­ty and longevity.

The HPE Alle­tra Sto­rage MP sup­ports a dis­ag­gre­ga­ted infra­struc­tu­re with mul­ti­ple sto­rage pro­to­cols on the same hard­ware that can sca­le inde­pendent­ly for per­for­mance and capa­ci­ty. Con­fi­gura­ble for block and file stores, HPE Alle­tra Sto­rage MP gives cus­to­mers the abili­ty to deploy, mana­ge, and orchest­ra­te data and sto­rage ser­vices via the HPE Green­La­ke edge-to-cloud plat­form, regard­less of the workload and sto­rage pro­to­col. This eli­mi­na­tes data silos, redu­cing cost and com­ple­xi­ty while impro­ving performance.

(…) Wei­ter­le­sen »

AMD Announces Plan to Invest $135 Million to Expand Adaptive Computing Research, Development and Engineering Operations in Ireland

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— Invest­ment aims to add up to 290 new jobs and fund R&D pro­jects for next gene­ra­ti­on AI, Data Cent­re, Net­wor­king and 6G Com­mu­ni­ca­ti­ons Infrastructure —

DUBLIN, Ire­land, June 21, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced plans for con­tin­ued growth in Ire­land through an invest­ment of up to $135 mil­li­on over four years. The invest­ment is inten­ded to fund seve­ral stra­te­gic R&D pro­jects through the addi­ti­on of up to 290 high­ly skil­led engi­nee­ring and rese­arch posi­ti­ons, as well as a broad ran­ge of addi­tio­nal sup­port roles.

The deve­lo­p­ment is being for­mal­ly announ­ced in Dub­lin today by Minis­ter for Enter­pri­se, Trade and Employ­ment, Simon Cove­ney TD, and Ruth Cot­ter, seni­or vice pre­si­dent, Mar­ke­ting, Com­mu­ni­ca­ti­ons and Human Resour­ces at AMD. The new invest­ment is sup­port­ed by the Irish govern­ment through IDA Ire­land. (…) Wei­ter­le­sen »