Integrated up to 16 phases direct digital power design with four PCIe 4.0 M.2 for high performance, silence, and stability
June 17th, 2021 – GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the launch of the newest X570S AORUS series motherboards primed to unleash the potential of the recently released AMD Ryzen™ 5000 series desktop processors with enhanced DrMOS direct power design and 6 layers and above ultra cool PCB for higher stability. The whole series equip with a brand new passive chipset thermal design and up to four sets of high thermal efficiency armored PCIe 4.0 M.2 slots with M.2 Thermal Guard III, which ensures effective heat dissipation of full operation on chipsets and 7000MB/s high speed operating on NVMe SSDs without throttling by overheating. The brand new X570S series motherboards kick off the PCIe 4.0 era with extensive feature sets. The flagship X570S AORUS MASTER motherboard is fitted with a 16-phase direct digital power design for the more solid power management and optimized overclocking performance. With advanced heat dissipation technology of Fins-Array II Stacked Fins Heatsink, Direct Touch Heatpipe II and Smart Fan 6, GIGIABYTE X570S motherboards can maintain cool and high performance under high loading operation. Furthermore, GIGABYTE Active OC Tuner technology integrated in select motherboards to provide a more flexible performance improvement.
“AMD is excited for the launch of new and innovative X570 motherboards, bringing even more offerings to the AMD socket AM4 platform,” said Chris Kilburn, corporate vice president and general manager, client component business unit, AMD. “These new motherboards will continue to showcase the groundbreaking performance of the AMD Ryzen™ 5000 Series processors, maximizing the potential for enthusiasts, gamers, and content creators alike.” (…) Weiterlesen »
