GIGABYTE Unleash AMD X570S Series Motherboards with Extreme Silent Cooling

Inte­gra­ted up to 16 pha­ses direct digi­tal power design with four PCIe 4.0 M.2 for high per­for­mance, silence, and stability

June 17th, 2021 – GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and hard­ware solu­ti­ons announ­ced the launch of the newest X570S AORUS seri­es mother­boards pri­med to unleash the poten­ti­al of the recent­ly released AMD Ryzen™ 5000 seri­es desk­top pro­ces­sors with enhan­ced DrMOS direct power design and 6 lay­ers and abo­ve ultra cool PCB for hig­her sta­bi­li­ty. The who­le seri­es equip with a brand new pas­si­ve chip­set ther­mal design and up to four sets of high ther­mal effi­ci­en­cy armo­red PCIe 4.0 M.2 slots with M.2 Ther­mal Guard III, which ensu­res effec­ti­ve heat dis­si­pa­ti­on of full ope­ra­ti­on on chip­sets and 7000MB/s high speed ope­ra­ting on NVMe SSDs without thrott­ling by over­hea­ting. The brand new X570S seri­es mother­boards kick off the PCIe 4.0 era with exten­si­ve fea­ture sets. The flagship X570S AORUS MASTER mother­board is fit­ted with a 16-pha­se direct digi­tal power design for the more solid power manage­ment and opti­mi­zed over­clo­cking per­for­mance. With advan­ced heat dis­si­pa­ti­on tech­no­lo­gy of Fins-Array II Sta­cked Fins Heat­sink, Direct Touch Heat­pipe II and Smart Fan 6, GIGIABYTE X570S mother­boards can main­tain cool and high per­for­mance under high loading ope­ra­ti­on. Fur­ther­mo­re, GIGABYTE Acti­ve OC Tuner tech­no­lo­gy inte­gra­ted in select mother­boards to pro­vi­de a more fle­xi­ble per­for­mance improvement.

AMD is exci­ted for the launch of new and inno­va­ti­ve X570 mother­boards, brin­ging even more offe­rings to the AMD socket AM4 plat­form,” said Chris Kilburn, cor­po­ra­te vice pre­si­dent and gene­ral mana­ger, cli­ent com­po­nent busi­ness unit, AMD. “The­se new mother­boards will con­ti­nue to show­ca­se the ground­brea­king per­for­mance of the AMD Ryzen™ 5000 Seri­es pro­ces­sors, maxi­mi­zing the poten­ti­al for enthu­si­asts, gamers, and con­tent creators alike.”

The ent­i­re X570S lin­eup inte­gra­tes a 2.5 GbE high speed LAN while select X570S AORUS mother­boards fea­ture WIFI 6 with bla­zing fast 2.4 Gbps con­nec­tion speeds, and even WIFI 6E 802.11ax wire­less net­work, as well as front USB 3.2 Type‑C® inter­face for more con­ve­ni­ent usa­ge. Moreo­ver, select X570S AORUS mother­boards equip USB 3.2 Gen 2x2 Type‑C® for a more spee­dy data trans­fer up to 20 Gbps. GIGABYTE also release X570S AERO G for creators. With built-in the same level power mate­ri­als, ther­mal plan­ning, high-speed net­work, and 4 sets of PCIe 4.0 M.2 inter­faces as other X570S mother­boards, X570S AERO G also fea­tures the Visi­onLINK func­tion that is well-recei­ved by the creators to pro­vi­de them a more effec­ti­ve trans­form from ide­as to creation.

Pro­vi­ding users with the best pro­duct has always been Gigabyte’s mis­si­on, while the top-qua­li­ty AMD plat­form mother­boards with excel­lent com­pa­ti­bi­li­ty, high effi­ci­en­cy and low tem­pe­ra­tu­re demons­tra­tes our strong strength in the deve­lo­p­ment of AMD mother­boards. “said Jack­son Hsu, Direc­tor of the GIGABYTE Chan­nel Solu­ti­ons Pro­duct Deve­lo­p­ment Divi­si­on. “ GIGABYTE’s X570S seri­es mother­boards are deve­lo­ped by gamers and pro­fes­sio­nal desi­gners who pur­sue per­for­mance, and are enhan­ced by the fea­tures of 16-pha­se direct digi­tal power design, advan­ced VRM ther­mal design, silent coo­ling design without chip­set fan, several PCIe 4.0 inter­faces, bla­zing fast LAN, updated BIOS, and R&D’s adjus­t­ment. This seri­es defi­ni­te­ly impress the per­for­mance cha­ser by the per­for­mance and sta­bi­li­ty and beco­me the per­fect choice for high-end users who plans to assem­ble AMD platforms. ”

Silent Ther­mal Design Demons­tra­tes The Strong Hard­ware Design Power
With opti­mi­zed hard­ware lay­outs design, GIGABYTE X570S mother­boards equip with enlar­ged-sur­face chip­set heat­sink which enab­le the lin­eup upgrading to pas­si­ve ther­mal design while main­tain the same heat dis­si­pa­ti­on effi­ci­en­cy. This pas­si­ve ther­mal design sol­ve the noi­se pro­blem of the X570 chip­set fan, and fur­ther avoid dus­ting of the coo­ling fan which pro­ves again GIGABYTE’s lea­ding role in the indus­try. The X570S mother­boards fea­tures several opti­mi­zed ther­mal designs of Fins-Array­II, Direct Touch Heat­pipe II, exclu­si­ve M.2 Ther­mal Guard III with dou­bled-thic­kness and dou­ble-sided heigh­ten heat­sinks on the M.2 SSD, which can boost ther­mal per­for­mance in a silent way. Fur­ther enhan­ced by Hybrid fans, mul­ti­ple tem­pe­ra­tu­re detec­tions, dual fan cur­ves of 7‑phase adjus­t­ment modes, and smart fan con­trol of Smart Fan 6 Tech­no­lo­gy, pro­mi­sing the pro­ces­sor, VRM, chip­set, or even the hig­hest speed of 7000MB/s Gen4 M.2 SSD with no thrott­ling or per­for­mance redu­ce by overheating.

Enhan­ced Sta­bi­li­ty Of Power Sup­ply And The Con­ve­ni­en­ce Of Dyna­mic Overclocking
In addi­ti­on to the impro­ve­ments on ther­mal design, GIGABYTE also great­ly enhan­ced the power sup­ply design of the X570S mother­boards to per­fect­ly release the ulti­ma­te per­for­mance of AMD Ryzen™ 5000 seri­es pro­ces­sors. GIGABYTE packs at least 14 pha­ses digi­tal power design on each ATX board in X570S AORUS Seri­es. App­ly­ing to dif­fe­rent requests of power con­sump­ti­on, GIGABYTE uses MOS­FETs of upmost 90A Smart Power Sta­ge or DrMOS to ensu­re a more sta­ble cur­rent flow, bet­ter power and ther­mal manage­ment while the CPU is run­ning at its full poten­ti­al, which can per­fect­ly unleash the extre­me per­for­mance and over­clo­cking power of processors.

The high-end model X570S AORUS MASTER boasts a 16-pha­se direct digi­tal power design with each Power Sta­ge pha­se capa­ble of mana­ging up to 70A for lower impe­dance and impro­ved loading balan­ce of power pha­ses, just like the flagship model X570 AORUS XTREME mother­board. With 16-pha­se to work with, the power demand is even­ly pro­ces­sed by each pha­se to avoid long-time high loading ope­ra­ti­on of one sin­gle pha­se with fur­ther reduc­tion of the heat and power con­sump­ti­on. This impro­ve the over­all power effi­ci­en­cy, dura­bi­li­ty and ser­vice life of the mother­board, which enab­ling users to maxi­mi­ze the over­clo­cking poten­ti­al on the AMD Ryzen™ 5000 desk­top pro­ces­sors without the con­cerns of over­clo­cking fail­u­res or dimi­nis­hed per­for­mance cau­sed by unsta­ble or over­hea­ted power supply.

X570S AORUS MASTER, AORUS PRO AX and AERO G models are par­ti­cu­lar­ly equip­ped with GIGABYTE’s new­ly deve­lo­ped the Acti­ve OC Tuner acti­ve over­clo­cking tech­no­lo­gy. The CPU over­clo­cking fre­quen­cy and the num­ber of ope­ra­ting cores can be dyna­mi­cal­ly swit­ched bet­ween the default pre­cise-over­clo­cking func­tion PBO (Pre­cisi­on Boost Over­dri­ve) and manu­al over­clo­cking accord­ing to dif­fe­rent requi­re­ments of cur­rent con­fi­gu­ra­ti­on and cha­rac­te­ris­tics of run­ning app­li­ca­ti­ons. This tech­no­lo­gy allows user to exe­cu­te cor­re­spon­ding app­li­ca­ti­on by fre­quen­cy and core num­bers to enjoy the maxi­mum per­for­mance. Users have no need to con­firm the loading or whe­ther it requi­res mul­ti-cores befo­re run­ning dif­fe­rent app­li­ca­ti­ons then strugg­le in the BIOS to switch bet­ween PBO and manu­al over­clo­cking. With GIGABYTE Acti­ve OC Tuner acti­ve over­clo­cking tech­no­lo­gy, users can have it both ways once they acti­va­te this func­tion to enjoy the advan­ta­ges of opti­mi­zed auto­ma­tic over­clo­cking set­tings and an more enjoya­ble sys­tem ope­ra­ti­on with ease.

Sto­rage Per­for­mance Boost By Advan­ced PCIe 4.0 Interface
GIGABYTE X570S AORUS mother­boards boast the per­for­mance poten­ti­al of PCIe 4.0 and refi­ne the design of its mother­boards to ele­va­te the per­for­mance of peri­pheral com­pon­ents. Design fea­tures such as 6‑layer and abo­ve, 2x cop­per PCBs with lower induc­tance, and a PCIe 4.0 B‑CLK IC on select model to maxi­mi­ze the PCIe band­width with incre­a­sing the data trans­mis­si­on capa­ci­ty on PCIe sto­rage devices and boos­ting over­clo­cking per­for­mance from CPUs and memo­ry. The mother­boards unlock hid­den per­for­mance poten­ti­al on peri­pheral com­pon­ents, allowing for bla­zing fast trans­mis­si­on speeds on the­se devices. GIGABYTE X570S lin­eup makes capi­tal out of the PCIe 4.0 inter­face from the CPU and X570 chip­sets, with four PCIe 4.0 M.2 slots on select models, four sets of AORUS 7000S SSDs can ope­ra­te syn­chro­ni­ze­ly by buil­ding a RAID array for impres­si­ve sto­rage per­for­mance. Enhan­ced M.2 Ther­mal Guards III also suc­cess­ful­ly redu­ce the chan­ces of ther­mal thrott­ling and allow users to ful­ly take advan­ta­ge of the new PCIe 4.0 interface.

More Fle­xi­ble Ether­net and WIFI Net­work With Easier High-Speed Trans­fer Expansions
The ent­i­re X570S lin­eup offers a 2.5 Gbps Ether­net con­nec­tion speeds for gamers to have the fas­ter and more sta­ble wired net­work con­nec­ti­vi­ty. All WIFI enab­led models in the lin­eup fea­ture the Intel® Wi-Fi 6 802.11ax stan­dard which deli­vers bla­zing fast 2.4 Gbps con­nec­tion speeds that almost rival the 2.5 Gbps Ether­net con­nec­tion speeds. X570S AORUS MASTER fur­ther builds in Intel® Wi-Fi 6E 802.11ax net­work with 6 GHz fre­quen­cy bands for a smoot­her con­nec­tions. With both high-speed Ether­net and WIFI, users have extra fle­xi­bi­li­ty and ridi­cu­lous­ly fast con­nec­tion speeds. X570S lin­eup also inte­gra­tes front USB 3.2 Type‑C® inter­face for enhan­ced con­ve­ni­en­ce while select AORUS X570S seri­es mother­boards adopt USB 3.2 Gen 2x2 Type‑C® with up to 20 Gbps band­width for ultra­fast trans­fer speed. With GIGABYTE VISION DRIVE 1TB exter­nal SSD, users can get the full bene­fit from this high-speed transmission.

 

Fan favo­ri­te and well-recei­ved fea­tures make their return to GIGABYTE X570S mother­boards. Sleek aes­the­tics design, RGB Fusi­on LED ligh­t­ing, Ultra dura­ble qua­li­ty, Hi-Fi audio, and many more trade­mark fea­tures have been fur­ther refi­ned and added to the mix with AMD’s built-in fea­tures. The ent­i­re X570S lin­eup comes with the newest ver­si­on of Q‑Flash Plus Tech­no­lo­gy. Users can easi­ly update the BIOS without even instal­ling a pro­ces­sor, memo­ry, gra­phics cards, or boo­ting up the PC so they can flash the BIOS and have no worries about not being able to boot up the sys­tem due to an unsup­por­ted BIOS version.

The Inno­va­ti­ve X570S AERO G For Creators
GIGABYTE inte­gra­ted the AERO and VISION pro­ducts for creators into the AERO seri­es to inte­gra­te pro­duct seri­es names and incre­a­se mar­ket focus, as well as maxi­mi­zing brand manage­ment and con­su­mer pro­duct mar­ke­ting stra­te­gies. Star­ting from the AMD plat­form, X570S AERO G will be released con­cur­r­ent­ly as X570S seri­es, and the VISION seri­es will beco­me a part of AERO.

The new X570S AERO G adopts 14 pha­ses all-digi­tal power sup­ply of high-qua­li­ty Inter­sil PWM con­trol­ler with 60 Amps per pha­se DrMOS design, and equips with the new ful­ly cove­r­ed heat sink of twice heat dis­si­pa­ti­on area to pro­vi­de more sta­ble and ultra cool power sup­ply. X570S AERO G fea­tures full func­tions exclu­si­ve for creators, with four sets of ther­mal-armo­red PCIe 4.0 M.2 slots, pro­mi­sing no thrott­ling under the over­heat by hea­vy ope­ra­ti­on. X570S AERO G also adopts renow­ned Visi­onLINK tech­no­lo­gy, which allows for data and video trans­mis­si­on based on USB Type‑C® cable and pro­vi­des pen dis­plays power deli­very up to 60W. Visi­onLINK tech­no­lo­gy brings the bene­fit of easy data trans­fer and con­ve­ni­ent power char­ging to creators without cable clut­ter, which save them more time and effort for the con­tent crea­ti­on. Mean­while, the fea­tures of 2.5 GbE Ether­net, Intel® Wi-Fi 6 802.11ax wire­less net­work, USB 3.2 Gen 2x2 Type‑C®, front Type‑C® inter­face, and Acti­ve OC Tuner tech­no­lo­gy enab­le a gre­at impro­ve­ment on work effi­ci­en­cy for creators.

GIGABYTE X570S seri­es mother­boards use only the finest com­pon­ents rein­for­ced by GIGABYTE Ultra Dura­ble™ Tech­no­lo­gy with com­pre­hen­si­ve func­tions. This seri­es beco­me the excel­lent choice for users see­king to build a high-end PC sys­tem and enjoy the GIGABYTE’s exclu­si­ve tech­no­lo­gies have to offer. Inte­res­ted in lear­ning more about the X570S lin­eup? Plea­se visit the offi­cial web­site for more infor­ma­ti­on! https://www.gigabyte.com/tw/Motherboard/Socket-AM4

For more infor­ma­ti­on and news on GIGABYTE pro­ducts, plea­se visit the offi­cial GIGABYTE web­site: http://www.gigabyte.com

Durch die weitere Nutzung der Seite stimmst du der Verwendung von Cookies zu. Weitere Informationen

Die Cookie-Einstellungen auf dieser Website sind auf "Cookies zulassen" eingestellt, um das beste Surferlebnis zu ermöglichen. Wenn du diese Website ohne Änderung der Cookie-Einstellungen verwendest oder auf "Akzeptieren" klickst, erklärst du dich damit einverstanden.

Schließen