Schlagwort: AMD

Supermicro Introduces a Number of Density and Power Optimized Edge Platforms for Telco Providers, Based on the New AMD EPYC™ 8004 Series Processor

The New Super­mi­cro H13 WIO Fami­ly Includes Sys­tems that are NEBS Com­pli­ant, Offer AC or DC Power Opti­ons, and Start at Only 80 Watts TDP with Sca­ling Up to 64 Cores — Deli­ve­ring Ener­gy Effi­ci­en­cy, Fle­xi­ble Con­fi­gu­ra­ti­ons, and Plat­form Den­si­ty for Intel­li­gent Edge and Tel­co Applications

San Jose, Calif., — Sep­tem­ber 18, 2023 – Super­mi­cro, Inc. (NASDAQ: SMCI), a Total IT Solu­ti­on Pro­vi­der for Cloud, AI/ML, Sto­rage, and 5G/Edge, is announ­cing the AMD based Super­mi­cro H13 gene­ra­ti­on of WIO Ser­vers, opti­mi­zed to deli­ver strong per­for­mance and ener­gy effi­ci­en­cy for edge and tel­co dat­a­cen­ters powered by the new AMD EPYC™ 8004 Series pro­ces­sors. The new Super­mi­cro H13 WIO and short-depth front I/O sys­tems deli­ver ener­gy-effi­ci­ent sin­gle socket ser­vers that lower ope­ra­ting cos­ts for enter­pri­se, tel­co, and edge appli­ca­ti­ons. The­se sys­tems are desi­gned with a den­se form fac­tor and fle­xi­ble I/O opti­ons for sto­rage and net­wor­king, making the new ser­vers ide­al for deploy­ing in edge net­works. (…) Wei­ter­le­sen »

AMD Completes 4th Gen EPYC Family with the AMD EPYC 8004 Processors, Purpose Built for Cloud Services, Intelligent Edge and Telco

New processors deliver exceptional energy efficiency and strong performance in an optimized, single-socket package supported by Dell Technologies, Ericsson, Lenovo, Supermicro and others, and validated for Microsoft Azure Stack HCI

SANTA CLARA, Calif., Sept. 18, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced avai­la­bi­li­ty of the new AMD EPYC™ 8004 Series pro­ces­sors, com­ple­ting the 4th Gen AMD EPYC CPU fami­ly of workload-opti­mi­zed pro­ces­sors. The­se new pro­ces­sors bring the “Zen 4c” core into a pur­po­se-built CPU, enab­ling hard­ware pro­vi­ders to crea­te ener­gy effi­ci­ent and dif­fe­ren­tia­ted plat­forms that can power appli­ca­ti­ons from the intel­li­gent edge, such as retail, manu­fac­tu­ring and tel­co, all the way to the data cen­ter for cloud ser­vices, sto­rage and others.

The new EPYC 8004 Series pro­ces­sors extend AMD lea­der­ship in sin­gle socket plat­forms by offe­ring excel­lent CPU ener­gy effi­ci­en­cy in a packa­ge tun­ed to meet the needs of space and power-cons­trai­ned infra­struc­tu­re,” said Dan McNa­ma­ra, seni­or vice pre­si­dent and gene­ral mana­ger, Ser­ver Busi­ness, AMD. “AMD has deli­ver­ed mul­ti­ple gene­ra­ti­ons of data cen­ter pro­ces­sors that pro­vi­de out­stan­ding effi­ci­en­cy, per­for­mance, and inno­va­ti­ve fea­tures. Now with our 4th Gen EPYC CPU port­fo­lio com­ple­te, that lea­der­ship con­ti­nues across a broad set of workloads – from enter­pri­se and cloud, to intel­li­gent edge, tech­ni­cal com­pu­ting and more.” (…) Wei­ter­le­sen »

AMD Shares The Technical Details of Technology Powering Innovative Confidential Computing Leadership Cloud Offerings

SANTA CLARA, Calif., Aug. 30, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced it has published the source code for AMD Secu­re Encrypt­ed Vir­tua­liza­ti­on (SEV) tech­no­lo­gy, the back­bone of AMD EPYC pro­ces­sor-based con­fi­den­ti­al com­pu­ting vir­tu­al machi­nes (VMs) available from cloud ser­vice pro­vi­ders inclu­ding Ama­zon Web Ser­vices (AWS), Goog­le Cloud, Micro­soft Azu­re and Ora­cle Com­pu­te Infra­struc­tu­re (OCI).

This release from AMD will dri­ve grea­ter trans­pa­ren­cy for the secu­ri­ty indus­try and pro­vi­de cus­to­mers the oppor­tu­ni­ty to tho­rough­ly review the tech­no­lo­gy behind con­fi­den­ti­al com­pu­ting VMs powered by AMD EPYC pro­ces­sors. (…) Wei­ter­le­sen »

New AMD Radeon RX 7800 XT and Radeon RX 7700 XT Graphics Cards Deliver High-Performance, Visually Stunning 1440p Gaming Experiences and Superior Performance-Per-Dollar

– Next-gen AMD FidelityFX Super Resolution 3 designed to offer massive performance boosts with incredible image quality in supported games across a wide range of platforms –

COLOGNE, Ger­ma­ny, Aug. 25, 2023 (GLOBE NEWSWIRE) — Today at Games­com, AMD (NASDAQ: AMD) unvei­led new enthu­si­ast-class gra­phics cards, the AMD Rade­on™ RX 7800 XT and Rade­on RX 7700 XT. The new gra­phics cards are opti­mi­zed to deli­ver incre­di­bly high-per­for­mance, high-refresh 1440p gam­ing expe­ri­en­ces for today’s and tomorrow’s deman­ding AAA and esports titles. AMD also announ­ced avai­la­bi­li­ty of AMD Fide­li­ty­FX™ Super Reso­lu­ti­on 3, the next gene­ra­ti­on of the popu­lar ups­ca­ling tech­no­lo­gy that is desi­gned to offer mas­si­ve per­for­mance boosts in sup­port­ed games.

Built on the ground­brea­king AMD RDNA™ 3 archi­tec­tu­re, the new gra­phics cards pro­vi­de cut­ting-edge hard­ware and soft­ware fea­tures desi­gned to deli­ver ful­ly immersi­ve 1440p game­play at 60+ FPS and signi­fi­cant­ly bet­ter per­for­mance-per-dol­lar com­pared to the com­pe­ti­ti­on across sel­ect titles. The AMD Rade­on RX 7800 XT and Rade­on RX 7700 XT gra­phics cards also offer 16GB and 12GB of high-speed GDDR6 VRAM, respec­tively, and up to 50% hig­her memo­ry band­width than the com­pe­ti­ti­on for high-reso­lu­ti­on gam­ing. They also sup­port advan­ced fea­tures that take per­for­mance and visu­al fide­li­ty to the next level, inclu­ding the all-new AMD HYPR-RX tech­no­lo­gy. (…) Wei­ter­le­sen »

AMD Showcases How Innovation and Partnerships Advance Corporate Responsibility

Energy-efficient, high-performance AMD products and deep collaborations help solve the most important global challenges

SANTA CLARA, Calif., Aug. 24, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today released its annu­al Cor­po­ra­te Respon­si­bi­li­ty (CR) Report, detail­ing pro­gress toward goals span­ning envi­ron­men­tal sus­taina­bi­li­tydigi­tal impactsup­p­ly chain respon­si­bi­li­ty; and diver­si­ty, belon­ging and inclu­si­on. For 28 years AMD has repor­ted on its CR pro­grams and initia­ti­ves, and this is the company’s first report incor­po­ra­ting envi­ron­men­tal and social data from recent acquisitions.

At AMD, Cor­po­ra­te Respon­si­bi­li­ty is an inte­gral part of our busi­ness stra­tegy, cul­tu­re and the rela­ti­onships we fos­ter with our cus­to­mers and part­ners,” said Sus­an Moo­re, cor­po­ra­te vice pre­si­dent of Cor­po­ra­te Respon­si­bi­li­ty and Inter­na­tio­nal Govern­ment Affairs at AMD and pre­si­dent of the AMD Foun­da­ti­on. “Tog­e­ther with our employees, part­ners and cus­to­mers, we are focu­sed on respon­si­bly desig­ning and deli­ve­ring high-per­for­mance and adap­ti­ve com­pu­ting solu­ti­ons for a more con­nec­ted, sus­tainable and inclu­si­ve world.” (…) Wei­ter­le­sen »

AMD Announces Upcoming Events for the Financial Community

SANTA CLARA, Calif., Aug. 21, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced the fol­lo­wing events for the finan­cial community:

  • Dr. Lisa Su, chair and chief exe­cu­ti­ve offi­cer, will attend the Gold­man Sachs 2023 Com­mu­na­co­pia and Tech­no­lo­gy Con­fe­rence on Tues­day, Sept. 5, 2023, at 11:50 AM EDT/8:50 AM PDT.
  • Jean Hu, exe­cu­ti­ve vice pre­si­dent, chief finan­cial offi­cer and tre­asurer, will attend the Deut­sche Bank Tech­no­lo­gy Con­fe­rence on Thurs­day, Aug. 31, 2023, at 11:00 AM EDT/8:00 AM PDT.

(…) Wei­ter­le­sen »

AMD Showcases Leadership Cloud Performance with New Amazon EC2 Instances Powered by 4th Gen AMD EPYC Processors

—Ama­zon EC2 M7a ins­tances offer up to 50 per­cent more com­pu­te per­for­mance than M6a ins­tances and bring an even broa­der ran­ge of workloads to AWS

—Ama­zon EC2 Hpc7a ins­tances, powered by 4th Gen AMD EPYC pro­ces­sors, deli­ver up to 2.5x bet­ter per­for­mance com­pared to Ama­zon EC2 Hpc6a instances—

SANTA CLARA, Calif., Aug. 18, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced Ama­zon Web Ser­vices (AWS) has expan­ded its 4th Gen AMD EPYC pro­ces­sor-based offe­rings with the gene­ral avai­la­bi­li­ty of Ama­zon Ela­s­tic Com­pu­te Cloud (EC2) M7a and Ama­zon EC2 Hpc7a ins­tances, which offer next-gene­ra­ti­on per­for­mance and effi­ci­en­cy for appli­ca­ti­ons that bene­fit from high per­for­mance, high through­put and tight­ly cou­pled HPC workloads, respectively.

For cus­to­mers with incre­asing­ly com­plex and com­pu­te-inten­si­ve workloads, 4th Gen EPYC pro­ces­sor-powered Ama­zon EC2 ins­tances deli­ver a dif­fe­ren­tia­ted offe­ring for cus­to­mers,” said David Brown, vice pre­si­dent of Ama­zon EC2 at AWS. “Com­bi­ned with the power of the AWS Nit­ro Sys­tem, both M7a and Hpc7a ins­tances allow for fast and low-laten­cy inter­node com­mu­ni­ca­ti­ons, advan­cing what our cus­to­mers can achie­ve across our gro­wing fami­ly of Ama­zon EC2 ins­tances.” (…) Wei­ter­le­sen »

AMD Reports Second Quarter 2023 Financial Results

SANTA CLARA, Calif., Aug. 01, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ:AMD) today announ­ced reve­nue for the second quar­ter of 2023 of $5.4 bil­li­on, gross mar­gin of 46%, ope­ra­ting loss of $20 mil­li­on, net inco­me of $27 mil­li­on and diluted ear­nings per share of $0.02. On a non-GAAP(*) basis, gross mar­gin was 50%, ope­ra­ting inco­me was $1.1 bil­li­on, net inco­me was $948 mil­li­on and diluted ear­nings per share was $0.58.

We deli­ver­ed strong results in the second quar­ter as 4th Gen EPYC and Ryzen 7000 pro­ces­sors ram­ped signi­fi­cant­ly,” said AMD Chair and CEO Dr. Lisa Su. “Our AI enga­ge­ments increased by more than seven times in the quar­ter as mul­ti­ple cus­to­mers initia­ted or expan­ded pro­grams sup­port­ing future deploy­ments of Instinct acce­le­ra­tors at sca­le. We made strong pro­gress mee­ting key hard­ware and soft­ware mile­sto­nes to address the gro­wing cus­to­mer pull for our data cen­ter AI solu­ti­ons and are on-track to launch and ramp pro­duc­tion of MI300 acce­le­ra­tors in the fourth quarter.”

We are plea­sed with our second quar­ter exe­cu­ti­on,” said AMD EVP, CFO and Tre­asurer Jean Hu. “Loo­king to the third quar­ter, we expect our Data Cen­ter and Cli­ent seg­ment reve­nues to each grow by a dou­ble-digit per­cen­ta­ge sequen­ti­al­ly dri­ven by incre­asing demand for our EPYC and Ryzen pro­ces­sors, par­ti­al­ly off­set by Gam­ing and Embedded seg­ment decli­nes.” (…) Wei­ter­le­sen »

AMD Announces Plan to Invest Approximately $400 Million Over the Next Five Years to Expand Research, Development and Engineering Operations in India

— Investment expected to create largest AMD design center with addition of approximately 3,000 engineering roles and new Bangalore campus opening before end of 2023 —

GANDHINAGAR, India, July 28, 2023 (GLOBE NEWSWIRE) — Semi­con­In­dia 2023 — AMD (NASDAQ: AMD) today announ­ced plans for con­tin­ued growth in India through an appro­xi­ma­te $400M invest­ment over the next five years. The plan­ned invest­ment includes a new AMD cam­pus in Banga­lo­re, Kar­na­ta­ka that will ser­ve as the company’s lar­gest design cen­ter, as well as the addi­ti­on of appro­xi­m­ate­ly 3,000 new engi­nee­ring roles by the end of 2028.

The new AMD cam­pus is expec­ted to open befo­re the end of 2023 and will fea­ture exten­si­ve lab space, sta­te-of-the-art col­la­bo­ra­ti­on tools and sea­ting con­fi­gu­ra­ti­ons desi­gned to fos­ter team­work. The invest­ment is sup­port­ed by the various poli­cy initia­ti­ves of the Govern­ment of India focu­sed on the semi­con­duc­tor indus­try. (…) Wei­ter­le­sen »

BIOSTAR UNVEILS THE A620MT MOTHERBOARD: MAXIMIZED PERFORMANCE FOR HOME, OFFICE, AND SYSTEM INTEGRATION

July 24th, 2023, TAIPEI, Tai­wan, BIOSTAR, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and sto­rage devices, proud­ly unveils the A620MT mother­board, desi­gned to run the latest AMD Ryzen™ 7000 Series pro­ces­sors. (…) Wei­ter­le­sen »

Breakthrough DDR5 XMP 8000 with the latest BIOS on GIGABYTE X670 & B650 Motherboards

July 19, 2023 –GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and hard­ware solu­ti­ons, proud­ly announ­ced the ulti­ma­te memo­ry per­for­mance of DDR5 XMP 8000 is achie­ved with the X670E AORUS MASTER mother­board based on the latest AMD AGESA BIOS code at a SOC vol­ta­ge of 1.3V.

GIGABYTE always works clo­se­ly with AMD to ensu­re our mother­board designs pro­vi­de supre­me per­for­mance and relia­bi­li­ty, par­ti­cu­lar­ly on the opti­mum memo­ry per­for­mance by exclu­si­ve­ly advan­ced memo­ry lay­out design. Mean­while, GIGABYTE is releasing a new beta BIOS for the X670 and B650 AORUS/AERO series mother­boards for the most remar­kab­le memo­ry per­for­mance on the AM5 plat­form. The new BIOS will be available at the end of July in suc­ces­si­on. (…) Wei­ter­le­sen »

AMD to Report Fiscal Second Quarter 2023 Financial Results

SANTA CLARA, Calif., July 18, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that it will report fis­cal second quar­ter 2023 finan­cial results on Tues­day, August 1, 2023, after the clo­se of mar­ket. Manage­ment will con­duct a con­fe­rence call to dis­cuss the­se results at 5:00 p.m. EDT / 2:00 p.m. PDT. Inte­res­ted par­ties are invi­ted to lis­ten to the web­cast of the con­fe­rence call via AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com.

(…) Wei­ter­le­sen »

AMD EPYC CPUs Now Power SAP Applications Hosted on Google Cloud

Cri­ti­cal SAP Busi­ness Suite workloads now run on AMD EPYC pro­ces­sor-powered Goog­le Cloud N2D offe­ring, deli­ve­ring impres­si­ve per­for­mance and ener­gy efficiency

SANTA CLARA, Calif., July 11, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced that SAP has cho­sen AMD EPYC™ pro­ces­sor-powered Goog­le Cloud N2D vir­tu­al machi­nes (VMs) to run its cloud ERP deli­very ope­ra­ti­ons for RISE with SAP; fur­ther incre­asing adop­ti­on of AMD EPYC for cloud-based workloads. As enter­pri­ses look toward digi­tal moder­niza­ti­on, many are adop­ting cloud-first archi­tec­tures to com­ple­ment their on-pre­mi­ses data cen­ters. AMD, Goog­le Cloud and SAP can help cus­to­mers achie­ve their most strin­gent per­for­mance goals while deli­ve­ring on ener­gy effi­ci­en­cy, sca­la­bi­li­ty and resour­ce uti­liza­ti­on needs.

AMD EPYC pro­ces­sors offer excep­tio­nal per­for­mance as well as robust secu­ri­ty fea­tures, and ener­gy effi­ci­ent solu­ti­ons for enter­pri­se workloads in the cloud. RISE with SAP helps maxi­mi­ze cus­to­mer invest­ments in cloud infra­struc­tu­re and, pai­red with AMD EPYC pro­ces­sors and Goog­le Cloud N2D VMs, aims to moder­ni­ze cus­to­mer data cen­ters and trans­form data into actionable insights, faster.

(…) Wei­ter­le­sen »

AMD Appoints Phil Guido as Chief Commercial Officer

SANTA CLARA, Calif., July 10, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that Exe­cu­ti­ve Vice Pre­si­dent and Chief Sales Offi­cer Dar­ren Gras­by will tran­si­ti­on into a new role as exe­cu­ti­ve vice pre­si­dent, stra­te­gic part­ner­ships and that Phil Gui­do has joi­n­ed the com­pa­ny as exe­cu­ti­ve vice pre­si­dent and chief com­mer­cial offi­cer. Gui­do will be respon­si­ble for lea­ding the AMD world­wi­de sales orga­niza­ti­on with a focus on fur­ther acce­le­ra­ting adop­ti­on of the company’s lea­der­ship pro­ducts with com­mer­cial and data cen­ter customers.

I am exci­ted to wel­co­me Phil to our lea­der­ship team as we take the next steps in our jour­ney to make AMD the com­mer­cial and data cen­ter com­pu­te part­ner of choice,” said AMD Chair and CEO, Dr. Lisa Su. “Phil brings exten­si­ve enter­pri­se and sales expe­ri­ence that will be incre­di­bly valuable as we focus on deepe­ning our enter­pri­se part­ner­ships and acce­le­ra­ting our growth in the data cen­ter, embedded and com­mer­cial mar­kets. I also want to thank Dar­ren for his trans­for­ma­tio­nal lea­der­ship as chief sales offi­cer over the last eight years, and I look for­ward to lever­aging his signi­fi­cant indus­try expe­ri­ence to lead stra­te­gic part­ner­ships in his new role.” (…) Wei­ter­le­sen »

AMD Introduces World’s Largest FPGA-Based Adaptive SoC for Emulation and Prototyping

 AMD Ver­sal Pre­mi­um VP1902 adap­ti­ve SoC offers 2X the capa­ci­ty of pre­vious-gene­ra­ti­on FPGAs, pro­vi­ding chip­ma­kers with the tools to bring new ASIC and SoC designs to mar­ket fas­ter 

 Col­la­bo­ra­ti­on with EDA lea­ders Cadence, Sie­mens and Syn­op­sys helps ensu­re chip desi­gners have access to sca­lable eco­sys­tem of ful­ly-fea­tured solu­ti­ons 

SANTA CLARA, Calif., June 27, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the AMD Ver­sal™ Pre­mi­um VP1902 adap­ti­ve sys­tem-on-chip (SoC), the world’s lar­gest1 adap­ti­ve SoC. The VP1902 adap­ti­ve SoC is an emu­la­ti­on-class, chip­let-based device desi­gned to stream­li­ne the veri­fi­ca­ti­on of incre­asing­ly com­plex semi­con­duc­tor designs. Offe­ring 2X2 the capa­ci­ty over the pri­or gene­ra­ti­on, desi­gners can con­fi­dent­ly inno­va­te and vali­da­te appli­ca­ti­on-spe­ci­fic inte­gra­ted cir­cuits (ASICs) and SoC designs to help bring next gene­ra­ti­on tech­no­lo­gies to mar­ket faster.
AI workloads are dri­ving increased com­ple­xi­ty in chip­ma­king, requi­ring next-gene­ra­ti­on solu­ti­ons to deve­lop the chips of tomor­row. FPGA-based emu­la­ti­on and pro­to­ty­p­ing pro­vi­des the hig­hest level of per­for­mance, allo­wing fas­ter sili­con veri­fi­ca­ti­on and enab­ling deve­lo­pers to shift left in the design cycle and begin soft­ware deve­lo­p­ment well befo­re sili­con tape-out. AMD, through Xilinx, brings over 17 years of lea­der­ship and six gene­ra­ti­ons of the industry’s hig­hest capa­ci­ty emu­la­ti­on devices, which have near­ly dou­bled in capa­ci­ty each gene­ra­ti­on3.
“Deli­ve­ring foun­da­tio­nal com­pu­te tech­no­lo­gy to enable our cus­to­mers is a top prio­ri­ty. In emu­la­ti­on and pro­to­ty­p­ing, that means deli­ve­ring the hig­hest capa­ci­ty and per­for­mance pos­si­ble,” said Kirk Saban, cor­po­ra­te vice pre­si­dent, Pro­duct, Soft­ware, & Solu­ti­ons Mar­ke­ting, Adap­ti­ve and Embedded Com­pu­ting Group, AMD. “Chip desi­gners can con­fi­dent­ly emu­la­te and pro­to­ty­pe next-gene­ra­ti­on pro­ducts using our VP1902 adap­ti­ve SoC, acce­le­ra­ting tomorrow’s inno­va­tions in AI, auto­no­mous vehic­les, Indus­try 5.0 and other emer­ging technologies.”

Con­fi­dent­ly Emu­la­te and Pro­to­ty­pe Next-Gene­ra­ti­on Designs
As com­ple­xi­ty grows in ASIC and SoC designs, espe­ci­al­ly with the rapid advance­ment of AI and ML-based chips, exten­si­ve veri­fi­ca­ti­on of both sili­con and soft­ware befo­re tape-out is a must.
The VP1902 deli­vers indus­try lea­ding capa­ci­ty and con­nec­ti­vi­ty, deli­ve­ring 18.5M logic cells for 2X2 hig­her pro­gramma­ble logic den­si­ty and 2X4 aggre­ga­te I/O band­width com­pared to the pre­vious gene­ra­ti­on Vir­tex™ UltraS­ca­le+™ VU19P FPGA. (…) Wei­ter­le­sen »