Schlagwort: TSMC

TSMC Reports Third Quarter EPS of NT$6.03

Hsin­chu, Tai­wan, R.O.C., Oct. 14, 2021TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$414.67 bil­li­on, net inco­me of NT$156.26 bil­li­on, and dilu­t­ed ear­nings per share of NT$6.03 (US$1.08 per ADR unit) for the third quar­ter ended Sep­tem­ber 30, 2021.

Year-over-year, third quar­ter reve­nue incre­a­sed 16.3% while net inco­me and dilu­t­ed EPS both incre­a­sed 13.8%. Com­pa­red to second quar­ter 2021, third quar­ter results repre­sen­ted a 11.4% incre­a­se in reve­nue and a 16.3% incre­a­se in net inco­me. All figu­res were pre­pa­red in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, third quar­ter reve­nue was $14.88 bil­li­on, which incre­a­sed 22.6% year-over-year and incre­a­sed 12.0% from the pre­vious quarter.

Gross mar­gin for the quar­ter was 51.3%, ope­ra­ting mar­gin was 41.2%, and net pro­fit mar­gin was 37.7%. (…) Wei­ter­le­sen »

TSMC September 2021 Revenue Report

Hsin­chu, Tai­wan, R.O.C. – Oct. 8, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Sep­tem­ber 2021: On a con­so­li­da­ted basis, reve­nue for Sep­tem­ber 2021 was appro­xi­mate­ly NT$152.69 bil­li­on, an incre­a­se of 11.1 per­cent from August 2021 and an incre­a­se of 19.7 per­cent from Sep­tem­ber 2020. Reve­nue for Janu­a­ry through Sep­tem­ber 2021 tota­led NT$1,149.23 bil­li­on, an incre­a­se of 17.5 per­cent com­pa­red to the same peri­od in 2020.
(…) Wei­ter­le­sen »

TSMC Reports First Quarter EPS of NT$5.39

Hsin­chu, Tai­wan, R.O.C., Apr. 15, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$362.41 bil­li­on, net inco­me of NT$139.69 bil­li­on, and dilu­t­ed ear­nings per share of NT$5.39 (US$0.96 per ADR unit) for the first quar­ter ended March 31, 2021.

Year-over-year, first quar­ter reve­nue incre­a­sed 16.7% while net inco­me and dilu­t­ed EPS both incre­a­sed 19.4%. Com­pa­red to fourth quar­ter 2020, first quar­ter results repre­sen­ted a 0.2% incre­a­se in reve­nue and a 2.2% decre­a­se in net inco­me. All figu­res were pre­pa­red in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, first quar­ter reve­nue was $12.92 bil­li­on, which incre­a­sed 25.4% year-over-year and incre­a­sed 1.9% from the pre­vious quar­ter. (…) Wei­ter­le­sen »

Gerücht: AMD Zen 4 mit abermals +25 Prozent IPC-Zuwachs? Zen 3+, Zen 5…

Die für Leaks und Gerüch­te bekann­te Web­sei­te Chips and Cheese hat einen inter­es­san­ten Arti­kel über AMDs CPU-Wer­de­gang ver­öf­fent­licht, der die schwie­ri­gen Jah­re mit Bull­do­zer bis hin zu kom­men­den Chips abdeckt und Bekann­tes wie Neu­es zu den kom­men­den CPUs Zen 3+, Zen 4 und Zen 5 zum Bes­ten gibt. (…) Wei­ter­le­sen »

MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences

MediaTek also announces Dimensity 1100 5G chipset to give device makers even more design flexibility

HSINCHU, Tai­wan – Janu­a­ry 20, 2021 – Media­Tek today unvei­led its new Dimen­si­ty 1200 and Dimen­si­ty 1100 5G smart­pho­ne chip­sets with unri­va­led AI, came­ra and mul­ti­me­dia fea­tures for power­ful 5G expe­ri­en­ces. The addi­ti­on of the 6nm Dimen­si­ty 1200 and 1100 chip­sets to MediaTek’s 5G port­fo­lio gives device makers a gro­wing suite of opti­ons to design high­ly capa­ble 5G smart­pho­nes with top of the line came­ra fea­tures, gra­phics, con­nec­ti­vi­ty enhan­ce­ments and more.“MediaTek con­ti­nues to expand its 5G port­fo­lio with high­ly inte­gra­ted solu­ti­ons for a ran­ge of devices from the high-end to the mid-tier,” said JC Hsu, Cor­po­ra­te Vice Pre­si­dent and Gene­ral Mana­ger of MediaTek’s Wire­less Com­mu­ni­ca­ti­ons Busi­ness Unit. “Our new Dimen­si­ty 1200 stands out with its impres­si­ve 200MP came­ra sup­port and advan­ced AI capa­bi­li­ties, in addi­ti­on to its inno­va­ti­ve con­nec­ti­vi­ty, dis­play, audio and gaming enhan­ce­ments.” (…) Wei­ter­le­sen »

TSMC Reports Fourth Quarter EPS of NT$5.51

Hsin­chu, Tai­wan, R.O.C., Janu­a­ry 14, 2021 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$361.53 bil­li­on, net inco­me of NT$142.77 bil­li­on, and dilu­t­ed ear­nings per share of NT$5.51 (US$0.97 per ADR unit) for the fourth quar­ter ended Decem­ber 31, 2020. Year-over-year, fourth quar­ter reve­nue incre­a­sed 14.0% while net inco­me and dilu­t­ed EPS both incre­a­sed 23.0%. Com­pa­red (…) Wei­ter­le­sen »

TSMC hebt Umsatzprognosen erneut an — HPC ist Wachtumstreiber

Im Rah­men sei­nes Rekord­um­sat­zes von 12,1 Mil­li­ar­den US-Dol­lar und den Zah­len des drit­ten Quar­tals hat der Auf­trags­fer­ti­ger TSMC sei­ne Umsatz­pro­gno­se für das lau­fen­de Jahr erneut ange­ho­ben. Der Umsatz soll nun im Ver­gleich zum Jahr 2019 sogar um 30 Pro­zent stei­gen, vor 3 Mona­ten war man noch von 20 Pro­zent aus­ge­gan­gen. Gleich­zei­tig will man in die­sem Jahr ins­ge­samt 17 Mil­li­ar­den US-Dol­lar in Fer­ti­gungs­tech­ni­ken und Aus­rüs­tung inves­tie­ren. (…) Wei­ter­le­sen »

TSMC Reports Third Quarter EPS of NT$5.30

Hsin­chu, Tai­wan, R.O.C., Oct. 15, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced con­so­li­da­ted reve­nue of NT$356.43 bil­li­on, net inco­me of NT$137.31 bil­li­on, and dilu­t­ed ear­nings per share of NT$5.30 (US$0.90 per ADR unit) for the third quar­ter ended Sep­tem­ber 30, 2020.

Year-over-year, third quar­ter reve­nue incre­a­sed 21.6% while net inco­me and dilu­t­ed EPS both incre­a­sed 35.9%. Com­pa­red to second quar­ter 2020, third quar­ter results repre­sen­ted a 14.7% incre­a­se in reve­nue and a 13.6% incre­a­se in net inco­me. All figu­res were pre­pa­red in accordance with TIFRS on a con­so­li­da­ted basis.

In US dol­lars, third quar­ter reve­nue was $12.14 bil­li­on, which incre­a­sed 29.2% year-over-year and incre­a­sed 16.9% from the pre­vious quar­ter (…) Wei­ter­le­sen »

TSMC September 2020 Revenue Report

Hsin­chu, Tai­wan, R.O.C. – Oct. 8, 2020 — TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nues for Sep­tem­ber 2020: On a con­so­li­da­ted basis, reve­nues for Sep­tem­ber 2020 were appro­xi­mate­ly NT$127.59 bil­li­on, an incre­a­se of 3.8 per­cent from August 2020 and an incre­a­se of 24.9 per­cent from Sep­tem­ber 2019. Reve­nues for Janu­a­ry through Sep­tem­ber 2020 tota­led NT$977.72 bil­li­on, an incre­a­se of 29.9 per­cent com­pa­red to the same peri­od in 2019. (…) Wei­ter­le­sen »

Samsung angeblich mit Yield-Problemen bei 8‑nm — wechselt Nvidia zurück zu TSMC?

Nach­dem Nvi­dia vor­ges­tern Lie­fer­eng­päs­se bei der GeFor­ce RTX 3080 und 3090 bis hin­ein ins nächs­te Jahr auf Grund einer enor­men Nach­fra­ge bestä­tig­te (Tom’s Hard­ware), führt ein Bericht der chi­ne­si­schen Digi­Ti­mes nun an, dass Sam­sung bei der 8‑nm-Fer­ti­gung angeb­lich Pro­ble­me mit der Aus­beu­te an funk­ti­ons­fä­hi­gen Chips (Yield) hat und man bei Nvi­dia nun wohl über einen Wech­sel zu TSMC nach­den­ken würde.
(…) Wei­ter­le­sen »

Synopsys and TSMC Accelerate 2.5D/3DIC Designs with CoWoS‑S and Integrated Fan-Out Certified Design Flows

MOUNTAIN VIEW, Calif., Aug. 25, 2020 — Syn­op­sys, Inc. announ­ced that Syn­op­sys and TSMC have col­la­bo­ra­ted to deli­ver cer­ti­fied design flows for advan­ced pack­a­ging solu­ti­ons using the Syn­op­sys 3DIC Com­pi­ler pro­duct for both sili­con inter­po­ser based Chip-on-Wafer-on-Sub­stra­te (CoWoS‑S) and high-den­si­ty wafer-level RDL-based Inte­gra­ted Fan-Out (InFO‑R) designs. 3DIC Com­pi­ler pro­vi­des pack­a­ging design solu­ti­ons requi­red by today’s com­plex mul­ti-die sys­tems for app­li­ca­ti­ons like high-per­for­mance com­pu­ting (HPC), auto­mo­ti­ve and mobile.

App­li­ca­ti­ons such as AI and 5G net­wor­king incre­a­singly requi­re hig­her levels of inte­gra­ti­on, lower power con­sump­ti­on, smal­ler form fac­tors, and fas­ter time to pro­duc­tion, and this is dri­ving the demand for advan­ced-pack­a­ging tech­no­lo­gies,” said Suk Lee, seni­or direc­tor of the Design Infra­st­ruc­tu­re Manage­ment Divi­si­on at TSMC. “TSMC’s Inno­va­ti­ve 3DIC tech­no­lo­gies such as CoWoS and InFO enab­le cus­to­mer inno­va­ti­on with grea­ter func­tio­n­a­li­ty and enhan­ced sys­tem per­for­mance at incre­a­singly com­pe­ti­ti­ve cos­ts. Our col­la­bo­ra­ti­on with Syn­op­sys pro­vi­des cus­to­mers with a cer­ti­fied solu­ti­on for designing with TSMC’s CoWoS and InFO pack­a­ging tech­no­lo­gies to enab­le high pro­duc­ti­vi­ty and fas­ter time to func­tio­n­al sili­con.” (…) Wei­ter­le­sen »

TSMC: Neue Informationen zur Fertigung in 4 nm (4N) und 3 nm (3N)

Auf einem Tech­no­lo­gy Sym­po­si­um hat TSMC über die eige­nen Fer­ti­gungs­pro­zes­se berich­tet und ein paar neue Anga­ben beson­ders zu N3 (3 nm) gemacht, sowie eini­ge Zeit­an­ga­ben zur Risi­ko- und Mas­sen­pro­duk­ti­on kon­kre­ti­siert. Hard­ware­luxx brach­te uns die neu­es­ten Infor­ma­tio­nen dazu. (…) Wei­ter­le­sen »

TSMC Board of Directors Meeting Resolutions

Hsin­chu, Tai­wan, R.O.C., Aug. 11, 2020 – TSMC (TWSE: 2330, NYSE: TSM) today held a mee­ting of the Board of Direc­tors, which pas­sed the fol­lowing reso­lu­ti­ons: 1. Appro­ved the dis­tri­bu­ti­on of a NT$2.5 per share cash divi­dend for the second quar­ter of 2020, and set Decem­ber 23, 2020 as the record date for com­mon stock share­hol­ders (…) Wei­ter­le­sen »

TSMC July 2020 Revenue Report

Hsin­chu, Tai­wan, R.O.C. – Aug. 10, 2020 — TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nues for July 2020: On a con­so­li­da­ted basis, reve­nues for July 2020 were appro­xi­mate­ly NT$105.96 bil­li­on, a decre­a­se of 12.3 per­cent from June 2020 and an incre­a­se of 25.0 per­cent from July 2019. Reve­nues for Janu­a­ry through July 2020 (…) Wei­ter­le­sen »

Globalfoundries vor Expansion und Beteiligung durch Samsung?

Über Glo­bal­found­ries wur­de bei uns schon län­ger nicht mehr berich­tet, nach­dem AMD immer mehr Chips beim Kon­kur­ren­ten TSMC fer­ti­gen lässt. Die ehe­ma­li­gen Fabri­ken von AMD und IBM und fer­ti­gen heu­te vor allem Chips für AI und Auto­mo­ti­ve-Kun­den. Nach dem 14-nm-Pro­zess wur­de die feins­te Fer­ti­gungs­stu­fe mit 12 nm schon von Sam­sung lizen­siert. Die geplan­te Fer­ti­gung mit einer Struk­tur­brei­te von 7 nm gestri­chen. Damit ver­lor Glo­bal­found­ries vor allem Kun­den in der Pro­zes­sor­fer­ti­gung an den Kon­kur­ren­ten TSMC. (…) Wei­ter­le­sen »

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