TSMC Offers the Industry’s Most Successful FinFET Technology to Academia

HSINCHU, Tai¬≠wan, R.O.C., Feb. 3, 2023 ‚Äď TSMC (TWSE: 2330, NYSE: TSM) today announ¬≠ced the launch of its ‚ÄúTSMC Uni¬≠ver¬≠si¬≠ty Fin¬≠FET Pro¬≠gram‚ÄĚ, aimed at deve¬≠lo¬≠ping future IC design talent for the indus¬≠try and empowe¬≠ring aca¬≠de¬≠mic inno¬≠va¬≠ti¬≠on around the world. The pro¬≠gram will pro¬≠vi¬≠de broad edu¬≠ca¬≠tio¬≠nal access for uni¬≠ver¬≠si¬≠ty stu¬≠dents, facul¬≠ty, and aca¬≠de¬≠mic rese¬≠ar¬≠chers to the pro¬≠cess design kit (PDK) of the industry‚Äôs most suc¬≠cessful fin field-effect tran¬≠sis¬≠tor (Fin¬≠FET) tech¬≠no¬≠lo¬≠gy at 16nm, brin¬≠ging the IC design lear¬≠ning expe¬≠ri¬≠ence to the advan¬≠ced Fin¬≠FET level. The pro¬≠gram will also pro¬≠vi¬≠de access for lea¬≠ding IC rese¬≠ar¬≠chers in uni¬≠ver¬≠si¬≠ties to both 16nm (N16) and 7nm (N7) sili¬≠con through mul¬≠ti-pro¬≠ject wafer (MPW) ser¬≠vices to acce¬≠le¬≠ra¬≠te impactful rese¬≠arch inno¬≠va¬≠tions towards real-world applications.

Working with ser¬≠vice part¬≠ners in Asia, Euro¬≠pe and North Ame¬≠ri¬≠ca, TSMC is offe¬≠ring uni¬≠ver¬≠si¬≠ties the fol¬≠lo¬≠wing resour¬≠ces ‚Äď for tea¬≠ching pur¬≠po¬≠ses, and for rese¬≠arch pro¬≠jects lea¬≠ding to sili¬≠con test chips:

  • Design col¬≠la¬≠te¬≠ral for tea¬≠ching is based on TSMC‚Äôs N16 pro¬≠cess, and includes tuto¬≠ri¬≠al design cases, trai¬≠ning mate¬≠ri¬≠als and ins¬≠truc¬≠tion¬≠al vide¬≠os, brin¬≠ging stu¬≠dents from the con¬≠ven¬≠tio¬≠nal pla¬≠nar tran¬≠sis¬≠tor struc¬≠tu¬≠re into the Fin¬≠FET era.
  • For impactful rese¬≠arch pro¬≠jects, TSMC is pro¬≠vi¬≠ding both N16 and N7 pro¬≠cess design col¬≠la¬≠te¬≠ral for test chips to be manu¬≠fac¬≠tu¬≠red via MPW. The¬≠se include rese¬≠arch designs in logic, ana¬≠log, and radio fre¬≠quen¬≠cy (RF).

‚ÄúAt TSMC, we are always loo¬≠king towards the future ‚Äď not only the future rese¬≠arch that will beco¬≠me tomorrow‚Äôs tech¬≠no¬≠lo¬≠gy breakth¬≠roughs, but the future talent who will beco¬≠me tomorrow‚Äôs inno¬≠va¬≠tors,‚ÄĚ said Dr. Kevin Zhang, seni¬≠or vice pre¬≠si¬≠dent of busi¬≠ness deve¬≠lo¬≠p¬≠ment at TSMC. ‚ÄúBy offe¬≠ring our 16nm and 7nm tech¬≠no¬≠lo¬≠gy through the TSMC Uni¬≠ver¬≠si¬≠ty Fin¬≠FET Pro¬≠gram, we open a who¬≠le new are¬≠na for rese¬≠ar¬≠chers and stu¬≠dents to explo¬≠re their ide¬≠as, and fuel their curio¬≠si¬≠ty and pas¬≠si¬≠on for the exci¬≠ting and fast-gro¬≠wing field of semiconductors.‚ÄĚ

TSMC‚Äôs tech¬≠no¬≠lo¬≠gy and manu¬≠fac¬≠tu¬≠ring is sup¬≠port¬≠ed by a vibrant and com¬≠pre¬≠hen¬≠si¬≠ve design ena¬≠blem¬≠ent eco¬≠sys¬≠tem, the Open Inno¬≠va¬≠ti¬≠on Plat¬≠form¬ģ. Our eco¬≠sys¬≠tem of ser¬≠vices part¬≠ners is rea¬≠dy to con¬≠nect scho¬≠lars with the TSMC Uni¬≠ver¬≠si¬≠ty Fin¬≠FET Pro¬≠gram, and aca¬≠de¬≠mic insti¬≠tu¬≠ti¬≠ons inte¬≠res¬≠ted in joi¬≠ning the pro¬≠gram are invi¬≠ted to cont¬≠act ser¬≠vice part¬≠ners in their regi¬≠on at https://www.tsmc.com/english/dedicatedFoundry/services/university_program .