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TSMC Offers the Industry’s Most Successful FinFET Technology to Academia

Verfasst vonpipin

HSINCHU, Tai­wan, R.O.C., Feb. 3, 2023 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced the launch of its “TSMC Uni­ver­si­ty Fin­FET Pro­gram”, aimed at deve­lo­ping future IC design talent for the indus­try and empowe­ring aca­de­mic inno­va­ti­on around the world. The pro­gram will pro­vi­de broad edu­ca­tio­nal access for uni­ver­si­ty stu­dents, facul­ty, and aca­de­mic rese­ar­chers to the pro­cess design kit (PDK) of the industry’s most suc­cessful fin field-effect tran­sis­tor (Fin­FET) tech­no­lo­gy at 16nm, brin­ging the IC design lear­ning expe­ri­ence to the advan­ced Fin­FET level. The pro­gram will also pro­vi­de access for lea­ding IC rese­ar­chers in uni­ver­si­ties to both 16nm (N16) and 7nm (N7) sili­con through mul­ti-pro­ject wafer (MPW) ser­vices to acce­le­ra­te impactful rese­arch inno­va­tions towards real-world applications.

Working with ser­vice part­ners in Asia, Euro­pe and North Ame­ri­ca, TSMC is offe­ring uni­ver­si­ties the fol­lo­wing resour­ces – for tea­ching pur­po­ses, and for rese­arch pro­jects lea­ding to sili­con test chips:

  • Design col­la­te­ral for tea­ching is based on TSMC’s N16 pro­cess, and includes tuto­ri­al design cases, trai­ning mate­ri­als and ins­truc­tion­al vide­os, brin­ging stu­dents from the con­ven­tio­nal pla­nar tran­sis­tor struc­tu­re into the Fin­FET era.
  • For impactful rese­arch pro­jects, TSMC is pro­vi­ding both N16 and N7 pro­cess design col­la­te­ral for test chips to be manu­fac­tu­red via MPW. The­se include rese­arch designs in logic, ana­log, and radio fre­quen­cy (RF).

“At TSMC, we are always loo­king towards the future – not only the future rese­arch that will beco­me tomorrow’s tech­no­lo­gy breakth­roughs, but the future talent who will beco­me tomorrow’s inno­va­tors,” said Dr. Kevin Zhang, seni­or vice pre­si­dent of busi­ness deve­lo­p­ment at TSMC. “By offe­ring our 16nm and 7nm tech­no­lo­gy through the TSMC Uni­ver­si­ty Fin­FET Pro­gram, we open a who­le new are­na for rese­ar­chers and stu­dents to explo­re their ide­as, and fuel their curio­si­ty and pas­si­on for the exci­ting and fast-gro­wing field of semiconductors.”

TSMC’s tech­no­lo­gy and manu­fac­tu­ring is sup­port­ed by a vibrant and com­pre­hen­si­ve design ena­blem­ent eco­sys­tem, the Open Inno­va­ti­on Plat­form®. Our eco­sys­tem of ser­vices part­ners is rea­dy to con­nect scho­lars with the TSMC Uni­ver­si­ty Fin­FET Pro­gram, and aca­de­mic insti­tu­ti­ons inte­res­ted in joi­ning the pro­gram are invi­ted to cont­act ser­vice part­ners in their regi­on at https://www.tsmc.com/english/dedicatedFoundry/services/university_program .