Supermicro Introduces a Number of Density and Power Optimized Edge Platforms for Telco Providers, Based on the New AMD EPYC™ 8004 Series Processor

The New Super­mi­cro H13 WIO Fami­ly Includes Sys­tems that are NEBS Com­pli­ant, Offer AC or DC Power Opti­ons, and Start at Only 80 Watts TDP with Sca­ling Up to 64 Cores — Deli­ve­ring Ener­gy Effi­ci­en­cy, Fle­xi­ble Con­fi­gu­ra­ti­ons, and Plat­form Den­si­ty for Intel­li­gent Edge and Tel­co Applications

San Jose, Calif., — Sep­tem­ber 18, 2023 – Super­mi­cro, Inc. (NASDAQ: SMCI), a Total IT Solu­ti­on Pro­vi­der for Cloud, AI/ML, Sto­rage, and 5G/Edge, is announ­cing the AMD based Super­mi­cro H13 gene­ra­ti­on of WIO Ser­vers, opti­mi­zed to deli­ver strong per­for­mance and ener­gy effi­ci­en­cy for edge and tel­co dat­a­cen­ters powered by the new AMD EPYC™ 8004 Series pro­ces­sors. The new Super­mi­cro H13 WIO and short-depth front I/O sys­tems deli­ver ener­gy-effi­ci­ent sin­gle socket ser­vers that lower ope­ra­ting cos­ts for enter­pri­se, tel­co, and edge appli­ca­ti­ons. The­se sys­tems are desi­gned with a den­se form fac­tor and fle­xi­ble I/O opti­ons for sto­rage and net­wor­king, making the new ser­vers ide­al for deploy­ing in edge networks.

We are exci­ted to expand our AMD EPYC-based ser­ver offe­rings opti­mi­zed to deli­ver excel­lent TCO and ener­gy effi­ci­en­cy for data cen­ter net­wor­king and edge com­pu­ting,” said Charles Liang, pre­si­dent and CEO of Super­mi­cro. “Adding to our alre­a­dy indus­try lea­ding edge-to-cloud rack sca­le IT solu­ti­ons, the new Super­mi­cro H13 WIO sys­tems with PCIe 5.0 and DDR5-4800MHz memo­ry show tre­men­dous per­for­mance for edge applications.”

Learn more about the latest Super­mi­cro H13 pro­duct line.

Super­mi­cro H13 WIO plat­forms are sin­gle-socket ser­vers powered by AMD EPYC 8004 Series CPUs with up to 64 cores, sup­port­ing the latest PCIe 5.0 x16 slots. The 1U short-depth ver­si­on is desi­gned with front I/O in a com­pact form fac­tor solu­ti­on sup­port­ing 3 PCIe 5.0 slots for expan­si­on. It is quie­ter than tra­di­tio­nal ser­vers and with an ope­ra­ting tem­pe­ra­tu­re of up to 40~55°C, depen­ding on the pro­ces­sor core count. The new WIO ser­vers use Tita­ni­um power sup­pli­es, which increa­ses ener­gy effi­ci­en­cy, resul­ting in hig­her performance/watt for the enti­re system.

Regis­ter for the Super­mi­cro and AMD Webinar

We are exci­ted to work clo­se­ly with Super­mi­cro to deli­ver seve­ral appli­ca­ti­on opti­mi­zed sys­tems that incor­po­ra­te the new AMD EPYC 8004 Series pro­ces­sors. With this latest announce­ment, Super­mi­cro con­ti­nues to deli­ver an impres­si­ve port­fo­lio of sys­tems to mar­ket to address the needs of tel­co ope­ra­tors and ser­vice pro­vi­ders, whe­re per­for­mance, ener­gy effi­ci­en­cy, and sys­tem cost are of utmost importance.” said Lynn Comp, cor­po­ra­te vice pre­si­dent, Ser­ver Pro­duct and Tech­no­lo­gy Mar­ke­ting, AMD.

The short-depth ver­si­on is desi­gned with front I/O in a com­pact form fac­tor solu­ti­on and is quie­ter than tra­di­tio­nal ser­vers. It is ide­al for tel­co and edge deploy­ments with space and ther­mal limi­ta­ti­ons. The sys­tem also offers AC and DC opti­ons and fea­tures NEBS com­pli­ant design for tel­co-rela­ted ope­ra­ti­ons. Over­all, the AMD EPYC 8004 Series CPU is a powerful and ver­sa­ti­le pro­ces­sor that helps tel­cos impro­ve their net­works’ per­for­mance, effi­ci­en­cy, and security.

AMD EPYC 8004 Series pro­ces­sors bring the ener­gy effi­ci­ent ‘Zen 4c’ core archi­tec­tu­re into a pur­po­se-built CPU to enable ener­gy effi­ci­ent, uni­que plat­forms that can power com­pu­te in intel­li­gent edge and data cen­ter ser­ver deploy­ments. With a lower core count CPU and wide ther­mal ran­ges and TDP ran­ges as low as 80W, with a top TDP of 200W. Uti­li­zing the new SP6 socket, ener­gy-effi­ci­ent ‘Zen 4c’ pro­ces­sor cores, cost-effi­ci­ent sys­tem designs, and ther­mal and acou­stic cha­rac­te­ristics to allow deploy­ment in power-cons­trai­ned, lower den­si­ty data cen­ters as well as in gro­wing “out­side the data cen­ter” uses such as edge, retail, tel­co and more. Advan­ced secu­ri­ty, inclu­ding Secu­re Memo­ry Encryp­ti­on (SME) and Secu­re Nes­ted Paging, helps defend tel­co net­works from cyber­at­tacks. Edge com­pu­ting, which brings pro­ces­sing and sto­rage clo­ser to whe­re the data is gene­ra­ted, will bene­fit from the smal­ler form fac­tor of the Super­mi­cro ser­vers and lower power consumption.

 

For more infor­ma­ti­on, plea­se visit the Super­mi­cro Aplus website

 

About Super Micro Com­pu­ter, Inc.

Super­mi­cro (NASDAQ: SMCI) is a glo­bal lea­der in Appli­ca­ti­on-Opti­mi­zed Total IT Solu­ti­ons. Foun­ded and ope­ra­ting in San Jose, Cali­for­nia, Super­mi­cro is com­mit­ted to deli­ve­ring first to mar­ket inno­va­ti­on for Enter­pri­se, Cloud, AI, and 5G Telco/Edge IT Infra­struc­tu­re. We are trans­forming into a Total IT Solu­ti­ons pro­vi­der with ser­ver, AI, sto­rage, IoT, and switch sys­tems, soft­ware, and ser­vices while deli­ve­ring advan­ced high-volu­me mother­board, power, and chas­sis pro­ducts. The pro­ducts are desi­gned and manu­fac­tu­red in-house (in the US, Tai­wan, and the Net­her­lands), lever­aging glo­bal ope­ra­ti­ons for sca­le and effi­ci­en­cy and opti­mi­zed to impro­ve TCO and redu­ce envi­ron­men­tal impact (Green Com­pu­ting). The award-win­ning port­fo­lio of Ser­ver Buil­ding Block Solu­ti­ons® allows cus­to­mers to opti­mi­ze for their exact workload and appli­ca­ti­on by sel­ec­ting from a broad fami­ly of sys­tems built from our fle­xi­ble and reusable buil­ding blocks that sup­port a com­pre­hen­si­ve set of form fac­tors, pro­ces­sors, memo­ry, GPUs, sto­rage, net­wor­king, power, and coo­ling solu­ti­ons (air-con­di­tio­ned, free air coo­ling or liquid cooling).

Super­mi­cro, Ser­ver Buil­ding Block Solu­ti­ons, and We Keep IT Green are trade­marks and/or regis­tered trade­marks of Super Micro Com­pu­ter, Inc.

AMD, the AMD arrow logo, EPYC and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc.

All other brands, names, and trade­marks are the pro­per­ty of their respec­ti­ve owners.