Supermicro Introduces a Number of Density and Power Optimized Edge Platforms for Telco Providers, Based on the New AMD EPYC‚ĄĘ 8004 Series Processor

The New Super¬≠mi¬≠cro H13 WIO Fami¬≠ly Includes Sys¬≠tems that are NEBS Com¬≠pli¬≠ant, Offer AC or DC Power Opti¬≠ons, and Start at Only 80 Watts TDP with Sca¬≠ling Up to 64 Cores ‚ÄĒ Deli¬≠ve¬≠ring Ener¬≠gy Effi¬≠ci¬≠en¬≠cy, Fle¬≠xi¬≠ble Con¬≠fi¬≠gu¬≠ra¬≠ti¬≠ons, and Plat¬≠form Den¬≠si¬≠ty for Intel¬≠li¬≠gent Edge and Tel¬≠co Applications

San Jose, Calif., ‚ÄĒ Sep¬≠tem¬≠ber 18, 2023 ‚Äď Super¬≠mi¬≠cro, Inc. (NASDAQ: SMCI), a Total IT Solu¬≠ti¬≠on Pro¬≠vi¬≠der for Cloud, AI/ML, Sto¬≠rage, and 5G/Edge, is announ¬≠cing the AMD based Super¬≠mi¬≠cro H13 gene¬≠ra¬≠ti¬≠on of WIO Ser¬≠vers, opti¬≠mi¬≠zed to deli¬≠ver strong per¬≠for¬≠mance and ener¬≠gy effi¬≠ci¬≠en¬≠cy for edge and tel¬≠co dat¬≠a¬≠cen¬≠ters powered by the new AMD EPYC‚ĄĘ 8004 Series pro¬≠ces¬≠sors. The new Super¬≠mi¬≠cro H13 WIO and short-depth front I/O sys¬≠tems deli¬≠ver ener¬≠gy-effi¬≠ci¬≠ent sin¬≠gle socket ser¬≠vers that lower ope¬≠ra¬≠ting cos¬≠ts for enter¬≠pri¬≠se, tel¬≠co, and edge appli¬≠ca¬≠ti¬≠ons. The¬≠se sys¬≠tems are desi¬≠gned with a den¬≠se form fac¬≠tor and fle¬≠xi¬≠ble I/O opti¬≠ons for sto¬≠rage and net¬≠wor¬≠king, making the new ser¬≠vers ide¬≠al for deploy¬≠ing in edge networks.

‚ÄúWe are exci¬≠ted to expand our AMD EPYC-based ser¬≠ver offe¬≠rings opti¬≠mi¬≠zed to deli¬≠ver excel¬≠lent TCO and ener¬≠gy effi¬≠ci¬≠en¬≠cy for data cen¬≠ter net¬≠wor¬≠king and edge com¬≠pu¬≠ting,‚ÄĚ said Charles Liang, pre¬≠si¬≠dent and CEO of Super¬≠mi¬≠cro. ‚ÄúAdding to our alre¬≠a¬≠dy indus¬≠try lea¬≠ding edge-to-cloud rack sca¬≠le IT solu¬≠ti¬≠ons, the new Super¬≠mi¬≠cro H13 WIO sys¬≠tems with PCIe 5.0 and DDR5-4800MHz memo¬≠ry show tre¬≠men¬≠dous per¬≠for¬≠mance for edge applications.‚ÄĚ

Learn more about the latest Super¬≠mi¬≠cro H13 pro¬≠duct line.

Super¬≠mi¬≠cro H13 WIO plat¬≠forms are sin¬≠gle-socket ser¬≠vers powered by AMD EPYC 8004 Series CPUs with up to 64 cores, sup¬≠port¬≠ing the latest PCIe 5.0 x16 slots. The 1U short-depth ver¬≠si¬≠on is desi¬≠gned with front I/O in a com¬≠pact form fac¬≠tor solu¬≠ti¬≠on sup¬≠port¬≠ing 3 PCIe 5.0 slots for expan¬≠si¬≠on. It is quie¬≠ter than tra¬≠di¬≠tio¬≠nal ser¬≠vers and with an ope¬≠ra¬≠ting tem¬≠pe¬≠ra¬≠tu¬≠re of up to 40~55¬įC, depen¬≠ding on the pro¬≠ces¬≠sor core count. The new WIO ser¬≠vers use Tita¬≠ni¬≠um power sup¬≠pli¬≠es, which increa¬≠ses ener¬≠gy effi¬≠ci¬≠en¬≠cy, resul¬≠ting in hig¬≠her performance/watt for the enti¬≠re system.

Regis­ter for the Super­mi­cro and AMD Webinar

‚ÄúWe are exci¬≠ted to work clo¬≠se¬≠ly with Super¬≠mi¬≠cro to deli¬≠ver seve¬≠ral appli¬≠ca¬≠ti¬≠on opti¬≠mi¬≠zed sys¬≠tems that incor¬≠po¬≠ra¬≠te the new AMD EPYC 8004 Series pro¬≠ces¬≠sors. With this latest announce¬≠ment, Super¬≠mi¬≠cro con¬≠ti¬≠nues to deli¬≠ver an impres¬≠si¬≠ve port¬≠fo¬≠lio of sys¬≠tems to mar¬≠ket to address the needs of tel¬≠co ope¬≠ra¬≠tors and ser¬≠vice pro¬≠vi¬≠ders, whe¬≠re per¬≠for¬≠mance, ener¬≠gy effi¬≠ci¬≠en¬≠cy, and sys¬≠tem cost are of utmost importance.‚ÄĚ said Lynn Comp, cor¬≠po¬≠ra¬≠te vice pre¬≠si¬≠dent, Ser¬≠ver Pro¬≠duct and Tech¬≠no¬≠lo¬≠gy Mar¬≠ke¬≠ting, AMD.

The short-depth ver­si­on is desi­gned with front I/O in a com­pact form fac­tor solu­ti­on and is quie­ter than tra­di­tio­nal ser­vers. It is ide­al for tel­co and edge deploy­ments with space and ther­mal limi­ta­ti­ons. The sys­tem also offers AC and DC opti­ons and fea­tures NEBS com­pli­ant design for tel­co-rela­ted ope­ra­ti­ons. Over­all, the AMD EPYC 8004 Series CPU is a powerful and ver­sa­ti­le pro­ces­sor that helps tel­cos impro­ve their net­works’ per­for­mance, effi­ci­en­cy, and security.

AMD EPYC 8004 Series pro¬≠ces¬≠sors bring the ener¬≠gy effi¬≠ci¬≠ent ‚ÄėZen 4c‚Äô core archi¬≠tec¬≠tu¬≠re into a pur¬≠po¬≠se-built CPU to enable ener¬≠gy effi¬≠ci¬≠ent, uni¬≠que plat¬≠forms that can power com¬≠pu¬≠te in intel¬≠li¬≠gent edge and data cen¬≠ter ser¬≠ver deploy¬≠ments. With a lower core count CPU and wide ther¬≠mal ran¬≠ges and TDP ran¬≠ges as low as 80W, with a top TDP of 200W. Uti¬≠li¬≠zing the new SP6 socket, ener¬≠gy-effi¬≠ci¬≠ent ‚ÄėZen 4c‚Äô pro¬≠ces¬≠sor cores, cost-effi¬≠ci¬≠ent sys¬≠tem designs, and ther¬≠mal and acou¬≠stic cha¬≠rac¬≠te¬≠ristics to allow deploy¬≠ment in power-cons¬≠trai¬≠ned, lower den¬≠si¬≠ty data cen¬≠ters as well as in gro¬≠wing ‚Äúout¬≠side the data cen¬≠ter‚ÄĚ uses such as edge, retail, tel¬≠co and more. Advan¬≠ced secu¬≠ri¬≠ty, inclu¬≠ding Secu¬≠re Memo¬≠ry Encryp¬≠ti¬≠on (SME) and Secu¬≠re Nes¬≠ted Paging, helps defend tel¬≠co net¬≠works from cyber¬≠at¬≠tacks. Edge com¬≠pu¬≠ting, which brings pro¬≠ces¬≠sing and sto¬≠rage clo¬≠ser to whe¬≠re the data is gene¬≠ra¬≠ted, will bene¬≠fit from the smal¬≠ler form fac¬≠tor of the Super¬≠mi¬≠cro ser¬≠vers and lower power consumption.

 

For more infor¬≠ma¬≠ti¬≠on, plea¬≠se visit the Super¬≠mi¬≠cro Aplus website

 

About Super Micro Com¬≠pu¬≠ter, Inc.

Super¬≠mi¬≠cro (NASDAQ: SMCI) is a glo¬≠bal lea¬≠der in Appli¬≠ca¬≠ti¬≠on-Opti¬≠mi¬≠zed Total IT Solu¬≠ti¬≠ons. Foun¬≠ded and ope¬≠ra¬≠ting in San Jose, Cali¬≠for¬≠nia, Super¬≠mi¬≠cro is com¬≠mit¬≠ted to deli¬≠ve¬≠ring first to mar¬≠ket inno¬≠va¬≠ti¬≠on for Enter¬≠pri¬≠se, Cloud, AI, and 5G Telco/Edge IT Infra¬≠struc¬≠tu¬≠re. We are trans¬≠forming into a Total IT Solu¬≠ti¬≠ons pro¬≠vi¬≠der with ser¬≠ver, AI, sto¬≠rage, IoT, and switch sys¬≠tems, soft¬≠ware, and ser¬≠vices while deli¬≠ve¬≠ring advan¬≠ced high-volu¬≠me mother¬≠board, power, and chas¬≠sis pro¬≠ducts. The pro¬≠ducts are desi¬≠gned and manu¬≠fac¬≠tu¬≠red in-house (in the US, Tai¬≠wan, and the Net¬≠her¬≠lands), lever¬≠aging glo¬≠bal ope¬≠ra¬≠ti¬≠ons for sca¬≠le and effi¬≠ci¬≠en¬≠cy and opti¬≠mi¬≠zed to impro¬≠ve TCO and redu¬≠ce envi¬≠ron¬≠men¬≠tal impact (Green Com¬≠pu¬≠ting). The award-win¬≠ning port¬≠fo¬≠lio of Ser¬≠ver Buil¬≠ding Block Solu¬≠ti¬≠ons¬ģ allows cus¬≠to¬≠mers to opti¬≠mi¬≠ze for their exact workload and appli¬≠ca¬≠ti¬≠on by sel¬≠ec¬≠ting from a broad fami¬≠ly of sys¬≠tems built from our fle¬≠xi¬≠ble and reusable buil¬≠ding blocks that sup¬≠port a com¬≠pre¬≠hen¬≠si¬≠ve set of form fac¬≠tors, pro¬≠ces¬≠sors, memo¬≠ry, GPUs, sto¬≠rage, net¬≠wor¬≠king, power, and coo¬≠ling solu¬≠ti¬≠ons (air-con¬≠di¬≠tio¬≠ned, free air coo¬≠ling or liquid cooling).

Super¬≠mi¬≠cro, Ser¬≠ver Buil¬≠ding Block Solu¬≠ti¬≠ons, and We Keep IT Green are trade¬≠marks and/or regis¬≠tered trade¬≠marks of Super Micro Com¬≠pu¬≠ter, Inc.

AMD, the AMD arrow logo, EPYC and com­bi­na­ti­ons the­reof are trade­marks of Advan­ced Micro Devices, Inc.

All other brands, names, and trade­marks are the pro­per­ty of their respec­ti­ve owners.