Kategorie: Pressemitteilungen

Samsung Electronics and AMD Extend Strategic IP Licensing Agreement to Bring AMD Radeon™ Graphics to Future Mobile Platforms

─ Com­pa­nies broa­den scope of mobi­le gra­phics col­la­bo­ra­ti­on to bring lea­der­ship AMD Rade­on gra­phics tech­no­lo­gy to expan­ded port­fo­lio of Sam­sung Exy­nos SoCs ─

SANTA CLARA, Calif. — April 5, 2023 — Sam­sung Elec­tro­nics Co., Ltd., a world lea­der in advan­ced semi­con­duc­tor tech­no­lo­gy, and AMD (NASDAQ: AMD) today announ­ced they have signed a mul­ti-year agree­ment exten­si­on to bring mul­ti­ple gene­ra­ti­ons of high-per­for­mance, ultra-low-power AMD Rade­on gra­phics solu­ti­ons to an expan­ded port­fo­lio of Sam­sung Exy­nos SoCs. Through the licen­sing exten­si­on, Sam­sung will bring con­so­le-level gra­phics qua­li­ty and opti­mi­zed power con­sump­ti­on to more mobi­le devices, offe­ring an incre­di­bly immersi­ve and long-las­ting gam­ing expe­ri­ence. (…) Wei­ter­le­sen »

AMD Names Jack Huynh Senior Vice President and General Manager, Computing and Graphics

SANTA CLARA, Calif., April 04, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that Jack Huynh has been named seni­or vice pre­si­dent and gene­ral mana­ger of Com­pu­ting and Gra­phics fol­lo­wing the reti­re­ment from AMD of Rick Berg­man, curr­ent­ly the exe­cu­ti­ve vice pre­si­dent of Com­pu­ting and Gra­phics. Berg­man will remain at AMD through the second quar­ter to ensu­re a smooth tran­si­ti­on. Huynh has been at AMD for more than 24 years and was most recent­ly respon­si­ble for lea­ding all aspects of the company’s semi-cus­tom busi­ness. He will report to AMD Chair and CEO Dr. Lisa Su.
(…) Wei­ter­le­sen »

BIOSTAR ANNOUNCES THE BRAND NEW A620MP‑E PRO MOTHERBOARD

BEST AMD MOTHERBOARD FOR HOME AND OFFICE USE
 
1st April 2023 Tai­pei, Tai­wan — BIOSTAR, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and sto­rage devices, today announ­ces the brand new A620MP‑E PRO mother­board desi­gned to offer high-qua­li­ty per­for­mance and sta­bi­li­ty for office and home use.


The A620MP‑E PRO is BIOSTAR’s latest micro-ATX form fac­tor mother­board with cut­ting-edge tech­no­lo­gy that deli­vers out­stan­ding per­for­mance and sta­bi­li­ty, spe­ci­fi­cal­ly desi­gned to sup­port AMD RyzenTM 7000 Series pro­ces­sors with the latest AMD A620 sin­gle-chip archi­tec­tu­re. (…) Wei­ter­le­sen »

AMD to Host Annual Meeting of Stockholders

SANTA CLARA, Calif., March 31, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) will hold its Annu­al Mee­ting of Stock­hol­ders on Thurs­day, May 18, 2023 at 9 a.m. PDT as a vir­tu­al mee­ting acces­si­ble at www.virtualshareholdermeeting.com/AMD2023. For­ward-loo­king and other mate­ri­al infor­ma­ti­on may be dis­cus­sed during the mee­ting. (…) Wei­ter­le­sen »

GIGABYTE A620 Motherboards Bring You the Smartest Choice to Enjoy AM5 Platform

With the opti­mal memo­ry per­for­mance and DIY-fri­end­ly features

March 31th, 2023 — GIGABYTE TECHNOLOGY Co. Ltd, a lea­ding manu­fac­tu­rer of mother­boards, gra­phics cards, and hard­ware solu­ti­ons today unvei­led the latest AMD A620 series mother­boards with opti­mal memo­ry per­for­mance and all-round fea­tures. With the per­fect sup­port of the latest AMD RyzenTM 7000 series pro­ces­sors, GIGABYTE A620 mother­boards deli­ver the most com­pe­ti­ti­ve AM5 plat­form for users to enjoy per­for­mance fle­xi­bly and afford­a­b­ly. (…) Wei­ter­le­sen »

ASRock Launches AMD A620 Motherboards with Outstanding Capability and Affordability

TAIPEI, Tai­wan, March 31th, 2023 –Lea­ding glo­bal mother­board manu­fac­tu­rer ASRock proud­ly announ­ces its new series of AMD A620 mother­boards. The latest AMD A620 plat­form aims at a more bud­get-fri­end­ly mar­ket while still offe­ring a wide varie­ty of fea­tures, such as DDR5 memo­ry sup­port, mul­ti­ple M.2 slots for NVMe sto­rage devices, and WiFi 6E for dai­ly tasks as well as gam­ing. (…) Wei­ter­le­sen »

Giga Computing Announces Entry-Level AMD Ryzen-based Servers by GIGABYTE

March 23, 2023 ─ Giga Com­pu­ting, a sub­si­dia­ry of GIGABYTE and an indus­try lea­der in high-per­for­mance ser­vers, ser­ver mother­boards, and work­sta­tions, today announ­ced new GIGABYTE ser­vers for the AMD Ryzen™ 7000 series pro­ces­sor that are high­ly cost-effec­ti­ve, high per­forming, and enter­pri­se fea­ture rich. The line that sepa­ra­ted data cen­ters from per­so­nal users is not so clear becau­se modern desk­top pro­ces­sors have a respec­ta­ble CPU core count and impres­si­ve mul­ti-thre­a­ding per­for­mance, lay­ing the foun­da­ti­on for infra­struc­tu­re that is high­ly mana­geable, sca­lable, and effi­ci­ent. Instal­ling a con­su­mer CPU plat­form into an enter­pri­se rack solu­ti­on pro­vi­des a low-cost bar­ri­er to ent­ry-level ser­vers that are typi­cal­ly used for dedi­ca­ted hos­ting, cloud gam­ing, code deve­lo­p­ment, and con­tent crea­ti­on. (…) Wei­ter­le­sen »

AIC Collaborates with AMD to Introduce Its New Edge Server Powered By 4th Gen AMD EPYC™ Embedded Processors

AIC today announ­ced its EB202-CP is rea­dy to sup­port new­ly laun­ched 4th Gen AMD EPYC™ Embedded 9004 pro­ces­sors. By lever­aging the five-year pro­duct lon­ge­vi­ty sup­port­ed by AMD EPYC™ Embedded pro­ces­sors, EB202-CP pro­vi­des cus­to­mers with sta­ble and long-term sup­port. AIC and AMD will join forces to show­ca­se EB202-CP at Embedded World in AMD stand No. 2–411 from 14 to 16 March, 2023 in Nurem­berg, Ger­ma­ny. (…) Wei­ter­le­sen »

AMD Brings World-Class Performance of 4th Gen AMD EPYC™ Processors to Embedded Networking, Security, Storage and Industrial Systems

New ener­gy-effi­ci­ent EPYC Embedded 9004 Series com­bi­nes embedded sys­tem-opti­mi­zed fea­tures, enhan­ced secu­ri­ty and sca­la­bi­li­ty up to 96 cores —

Sie­mens and Advan­tech are initi­al cus­to­mers deploy­ing solu­ti­ons based on EPYC Embedded 9004 Series —

NÜRNBERG, Ger­ma­ny, March 14, 2023 (GLOBE NEWSWIRE) — Embedded World 2023 (Hall 2, Stand 2–411) — AMD (NASDAQ: AMD) today announ­ced it is brin­ging world-class per­for­mance and ener­gy effi­ci­en­cy to embedded sys­tems with AMD EPYC™ Embedded 9004 Series pro­ces­sors. The new 4th gene­ra­ti­on EPYC Embedded pro­ces­sors powered by “Zen 4” archi­tec­tu­re pro­vi­de tech­no­lo­gy and fea­tures for embedded net­wor­king, security/firewall and sto­rage sys­tems in cloud and enter­pri­se com­pu­ting as well as indus­tri­al edge ser­vers for the fac­to­ry flo­or (…) Wei­ter­le­sen »

AMD Announces Appointment of New Corporate Fellows

Five indus­try inno­va­tors reco­gni­zed for out­stan­ding tech­ni­cal contributions

SANTA CLARA, Calif., March 13, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the appoint­ment of five tech­ni­cal lea­ders to the role of AMD Cor­po­ra­te Fel­low. The­se appoint­ments reco­gni­ze each leader’s signi­fi­cant impact on semi­con­duc­tor inno­va­ti­on across various are­as, from gra­phics archi­tec­tu­re to advan­ced pack­a­ging (…) Wei­ter­le­sen »

Octavo Systems Releases the OSDZU3-REF Development Platform for the AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous­ton, Texas, United Sta­tes (March 1, 2023) – Octa­vo Sys­tems LLC, a lea­ding pro­vi­der of Sys­tem-in-Packa­ge (SiP) solu­ti­ons, has offi­ci­al­ly released its latest offe­ring, the OSDZU3-REF Deve­lo­p­ment Plat­form. This plat­form gives sys­tem desi­gners a com­pre­hen­si­ve deve­lo­p­ment envi­ron­ment for eva­lua­ting, test­ing, and start­ing pro­duct deve­lo­p­ment using the OSDZU3 Sys­tem-in-Packa­ge (SiP). (…) Wei­ter­le­sen »

Synology enthüllt DiskStation DS1823xs+, eine leistungsstarke Tower-Speicherlösung für bis zu 324 TB

Düs­sel­dorf, Deutsch­land — 1. März 2023 — Syn­o­lo­gy prä­sen­tier­te heu­te die Disk­Sta­ti­on DS1823xs+, eine leis­tungs­star­ke Lösung für die zen­tra­le Daten­spei­che­rung im Desk­top­Form­fak­tor. Mit bis zu 144 TB Brut­to­spei­cher­ka­pa­zi­tät1 vor Erwei­te­rung ist die DS1823xs+ ide­al zum Zusam­men­fas­sen unstruk­tu­rier­ter Daten, für die fir­men­wei­te Siche­rung von End­punk­ten und Ser­vern, das Tei­len und Syn­chro­ni­sie­ren von Datei­en zwi­schen Gerä­ten und Stand­or­ten oder die Ver­wal­tung loka­ler Video­über­wa­chung. Sie kann über­all dort fle­xi­bel ein­ge­setzt wer­den, wo kein eige­nes Ser­ver­rack oder Rechen­zen­trum ver­füg­bar ist. (…) Wei­ter­le­sen »

ASRock Releases New BIOS to support AMD Ryzen™ 7000 Series Processors with AMD 3D V‑Cache™ Technology

TAIPEI, Tai­wan, Febru­ary 28, 2023 – ASRock has released new BIOS to sup­port the latest AMD Ryzen™ 7000 Series Pro­ces­sors with AMD 3D V‑Cache™ Tech­no­lo­gy, with new BIOS on ASRock X670E/B650E/B650 mother­boards, you may enjoy the enhan­ced gam­ing per­for­mance powered by AMD Ryzen™ 7000X3D series pro­ces­sors. (…) Wei­ter­le­sen »

NVIDIA Announces Financial Results for Fourth Quarter and Fiscal 2023

Wed­nes­day, Febru­ary 22, 2023

  • Quar­ter­ly reve­nue of $6.05 bil­li­on, down 21% from a year ago
  • Fis­cal-year reve­nue of $27.0 bil­li­on, flat from a year ago
  • Quar­ter­ly and annu­al return to share­hol­ders of $1.15 bil­li­on and $10.44 bil­li­on, respectively

SANTA CLARA, Calif., Feb. 22, 2023 — NVIDIA (NASDAQ: NVDA) today repor­ted reve­nue for the fourth quar­ter ended Janu­ary 29, 2023, of $6.05 bil­li­on, down 21% from a year ago and up 2% from the pre­vious quarter.

GAAP ear­nings per diluted share for the quar­ter were $0.57, down 52% from a year ago and up 111% from the pre­vious quar­ter. Non-GAAP ear­nings per diluted share were $0.88, down 33% from a year ago and up 52% from the pre­vious quarter.

For fis­cal 2023, reve­nue was $26.97 bil­li­on, flat from a year ago. GAAP ear­nings per diluted share were $1.74, down 55% from a year ago. Non-GAAP ear­nings per diluted share were $3.34, down 25% from a year ago. (…) Wei­ter­le­sen »

AMD Expands 5G Telco Market Leadership with New High-Performance and Adaptive Computing Products and Testing Services at MWC 2023

SANTA CLARA, Calif., Feb. 22, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced it will be expan­ding sup­port of its gro­wing 5G part­ner eco­sys­tem span­ning from core to radio access net­works (RAN) appli­ca­ti­ons, deli­ve­ring addi­tio­nal new test capa­bi­li­ties and unvei­ling new 5G pro­ducts. The AMD wire­less tele­com part­ner eco­sys­tem has more than dou­bled in the past year, bols­te­red by the inte­gra­ti­on of the AMD and Xilinx pro­duct lines as well as the crea­ti­on of its new Tel­co Solu­ti­ons test­ing lab in col­la­bo­ra­ti­on with VIAVI (…) Wei­ter­le­sen »