AMD Bolsters Embedded Portfolio with New Ryzen Embedded 5000 Series Processors for Networking Solutions

SANTA CLARA, Calif., April 20, 2023 (GLOBE NEWSWIRE)  AMD (NASDAQ: AMD) today announ짯ced the avai짯la짯bi짯li짯ty of its high-per짯for짯mance AMD Ryzen꽓 Embedded 5000 Series, a new solu짯ti짯on for cus짯to짯mers requi짯ring power-effi짯ci짯ent pro짯ces짯sors opti짯mi짯zed for 쏿lways on net짯wor짯king fire짯walls, net짯work-atta짯ched sto짯rage sys짯tems and other secu짯ri짯ty appli짯ca짯ti짯ons. The Ryzen Embedded 5000 Series rounds out the 쏾en 3-based AMD embedded pro짯ces짯sor port짯fo짯lio which also includes the Ryzen Embedded V3000 and EPYC꽓 Embedded 7000 series families.

Built on 7nm tech짯no짯lo짯gy with plan짯ned five-year manu짯fac짯tu짯ring avai짯la짯bi짯li짯ty, and equip짯ped with 6, 8, 12 or 16 cores and 24 lanes of PCIe짰 Gen4 con짯nec짯ti짯vi짯ty, Ryzen Embedded 5000 Series pro짯ces짯sors are desi짯gned for enter짯pri짯se relia짯bi짯li짯ty to sup짯port the con짯sis짯tent uptime requi짯re짯ments nee짯ded by secu짯ri짯ty and net짯wor짯king cus짯to짯mers. Ryzen Embedded 5000 Series pro짯ces짯sors include robust relia짯bi짯li짯ty, avai짯la짯bi짯li짯ty and ser짯vicea짯bi짯li짯ty (RAS) fea짯tures, inclu짯ding an ECC-sup짯port짯ed memo짯ry sub짯sys짯tem. With a ther짯mal design power (TDP) pro짯fi짯le ran짯ging from 65W to 105W, Ryzen Embedded 5000 pro짯ces짯sors enable the reduc짯tion of over짯all sys짯tem coo짯ling foot짯print for space-cons짯trai짯ned and cost-sen짯si짯ti짯ve applications.

Ryzen Embedded 5000 pro짯ces짯sors deli짯ver the ide짯al com짯bi짯na짯ti짯on of per짯for짯mance and relia짯bi짯li짯ty requi짯red for 24x7 secu짯ri짯ty and net짯wor짯king appli짯ca짯ti짯ons, said Raj짯nee짯sh Gaur, cor짯po짯ra짯te vice pre짯si짯dent & gene짯ral mana짯ger, Embedded Solu짯ti짯ons Group, AMD. 쏷his expan짯si짯on of our embedded pro짯duct port짯fo짯lio offers a mid-ran짯ge solu짯ti짯on that fills the gap bet짯ween our low-power BGA Ryzen Embedded and our world-class EPYC embedded fami짯ly for cus짯to짯mers requi짯ring both high per짯for짯mance and sca짯la짯bi짯li짯ty of up to 16 cores.

AMD셲 suc짯cess in the embedded mar짯ket is built on offe짯ring dif짯fe짯ren짯tia짯ted and sca짯lable offe짯rings that address a wide ran짯ge of appli짯ca짯ti짯ons with dif짯fe짯rent power, per짯for짯mance and envi짯ron짯men짯tal requi짯re짯ments, said Kevin Kre짯well, prin짯ci짯pal ana짯lyst at TIRIAS Rese짯arch. 쏷he AMD Ryzen Embedded 5000 strikes an opti짯mal balan짯ce of power and per짯for짯mance for appli짯ca짯ti짯ons ran짯ging from small-form fac짯tor embedded sys짯tems to sto짯rage, secu짯ri짯ty, and net짯wor짯king sys짯tems, sui짯ting the broa짯dest ran짯ge of cus짯to짯mers and use cases.

Ryzen Embedded 5000 Series pro짯ces짯sors offer:

  • Sca짯la짯bi짯li짯ty up to 16 cores and 32 threads
  • Up to 64MB of shared L3 CPU Cache
  • Ener짯gy effi짯ci짯ent TDP from 65W to 105W
  • ECC-sup짯port짯ed memo짯ry and secu짯ri짯ty features
  • 24 lanes of PCIe짰 4 con짯nec짯ti짯vi짯ty (expan짯da짯ble I/O up to 36 lanes with AMD X570 chipset)
  • Opti짯mi짯zed per짯for짯mance for enter짯pri짯se reliability

Ryzen Embedded 5000 Series Pro짯ces짯sor Pro짯duct Chart

Model CPU Cores Threads count CPU Base Freq (GHz) CPU 1T Boost Freq (up to GHz1) L3 CPU Cache (MB) Nomi짯nal TDP (W) DDR4 Chan짯nels Max DDR4 rate (MT/s) (1DPC) PCIe짰 Gen 43 Lanes Socket
5950E 16 32 3.05 3.4 64 105 2 3200 24 AM4
5900E 12 24 3.35 3.7 64 105 2 3200 24 AM4
5800E 8 16 3.4 3.7 32 1002 2 3200 24 AM4
5600E 6 12 3.3 3.6 32 65 2 3200 24 AM4

1Max boost for Ryzen Embedded 5000 pro짯ces짯sors is the maxi짯mum fre짯quen짯cy achie짯va짯ble by any sin짯gle core on the pro짯ces짯sor under nor짯mal ope짯ra짯ting con짯di짯ti짯ons for enter짯pri짯se systems.
2Ryzen Embedded 5800E pro짯ces짯sor sup짯ports con짯fi짯gura짯ble Ther짯mal Design Power (cTDP) from 65W to 100W.
3Ryzen Embedded 5000 pro짯ces짯sors sup짯port a total of 24 lanes of PCIe짰 Gen4. Optio짯nal짯ly pai짯red with the AMD X570 Chip짯set, up to 36 lanes of PCIe짰 Gen4 can be supported.

AMD Ryzen Embedded 5000 Series pro짯ces짯sors are curr짯ent짯ly in pro짯duc짯tion with five-year plan짯ned manu짯fac짯tu짯ring availability.

Sup짯port짯ing Resources

About AMD
For more than 50 years AMD has dri짯ven inno짯va짯ti짯on in high-per짯for짯mance com짯pu짯ting, gra짯phics and visua짯liza짯ti짯on tech짯no짯lo짯gies. Bil짯li짯ons of peo짯p짯le, lea짯ding For짯tu짯ne 500 busi짯nesses and cut짯ting-edge sci짯en짯ti짯fic rese짯arch insti짯tu짯ti짯ons around the world rely on AMD tech짯no짯lo짯gy dai짯ly to impro짯ve how they live, work and play. AMD employees are focu짯sed on buil짯ding lea짯der짯ship high-per짯for짯mance and adap짯ti짯ve pro짯ducts that push the boun짯da짯ries of what is pos짯si짯ble. For more infor짯ma짯ti짯on about how AMD is enab짯ling today and inspi짯ring tomor짯row, visit the AMD (NASDAQ: AMDweb짯siteblogLin짯ke짯dIn and Twit짯ter pages.


This press release con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning Advan짯ced Micro Devices, Inc. (AMD) inclu짯ding the five-year plan짯ned manu짯fac짯tu짯ring avai짯la짯bi짯li짯ty of the AMD RyzenTM Embedded 5000 Series pro짯ces짯sors, which are made pur짯su짯ant to the Safe Har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act of 1995. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐗ould, 쐌ay, 쐃xpects, 쐀elie짯ves, 쐏lans, 쐇ntends, 쐏ro짯jects and other terms with simi짯lar mea짯ning. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this press release are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this press release and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Such state짯ments are sub짯ject to cer짯tain known and unknown risks and uncer짯tain짯ties, many of which are dif짯fi짯cult to pre짯dict and gene짯ral짯ly bey짯ond AMD셲 con짯trol, that could cau짯se actu짯al results and other future events to dif짯fer mate짯ri짯al짯ly from tho짯se expres짯sed in, or impli짯ed or pro짯jec짯ted by, the for짯ward-loo짯king infor짯ma짯ti짯on and state짯ments. Mate짯ri짯al fac짯tors that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons include, wit짯hout limi짯ta짯ti짯on, the fol짯lo짯wing: Intel Corporation셲 domi짯nan짯ce of the micro짯pro짯ces짯sor mar짯ket and its aggres짯si짯ve busi짯ness prac짯ti짯ces; glo짯bal eco짯no짯mic uncer짯tain짯ty; cycli짯cal natu짯re of the semi짯con짯duc짯tor indus짯try; mar짯ket con짯di짯ti짯ons of the indus짯tries in which AMD pro짯ducts are sold; loss of a signi짯fi짯cant cus짯to짯mer; impact of the COVID-19 pan짯de짯mic on AMD셲 busi짯ness, finan짯cial con짯di짯ti짯on and results of ope짯ra짯ti짯ons; com짯pe짯ti짯ti짯ve mar짯kets in which AMD셲 pro짯ducts are sold; quar짯ter짯ly and sea짯so짯nal sales pat짯terns; AMD셲 abili짯ty to ade짯qua짯te짯ly pro짯tect its tech짯no짯lo짯gy or other intellec짯tu짯al pro짯per짯ty; unfa짯vorable cur짯ren짯cy exch짯an짯ge rate fluc짯tua짯tions; abili짯ty of third par짯ty manu짯fac짯tu짯r짯ers to manu짯fac짯tu짯re AMD셲 pro짯ducts on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve tech짯no짯lo짯gies; avai짯la짯bi짯li짯ty of essen짯ti짯al equip짯ment, mate짯ri짯als, sub짯stra짯tes or manu짯fac짯tu짯ring pro짯ces짯ses; abili짯ty to achie짯ve expec짯ted manu짯fac짯tu짯ring yields for AMD셲 pro짯ducts; AMD셲 abili짯ty to intro짯du짯ce pro짯ducts on a time짯ly basis with expec짯ted fea짯tures and per짯for짯mance levels; AMD셲 abili짯ty to gene짯ra짯te reve짯nue from its semi-cus짯tom SoC pro짯ducts; poten짯ti짯al secu짯ri짯ty vul짯nerabi짯li짯ties; poten짯ti짯al secu짯ri짯ty inci짯dents inclu짯ding IT outa짯ges, data loss, data brea짯ches and cyber-attacks; poten짯ti짯al dif짯fi짯cul짯ties in upgrading and ope짯ra짯ting AMD셲 new enter짯pri짯se resour짯ce plan짯ning sys짯tem; uncer짯tain짯ties invol짯ving the orde짯ring and ship짯ment of AMD셲 pro짯ducts; AMD셲 reli짯ance on third-par짯ty intellec짯tu짯al pro짯per짯ty to design and intro짯du짯ce new pro짯ducts in a time짯ly man짯ner; AMD셲 reli짯ance on third-par짯ty com짯pa짯nies for design, manu짯fac짯tu짯re and sup짯p짯ly of mother짯boards, soft짯ware and other com짯pu짯ter plat짯form com짯pon짯ents; AMD셲 reli짯ance on Micro짯soft and other soft짯ware ven짯dors sup짯port to design and deve짯lop soft짯ware to run on AMD셲 pro짯ducts; AMD셲 reli짯ance on third-par짯ty dis짯tri짯bu짯tors and add-in-board part짯ners; impact of modi짯fi짯ca짯ti짯on or inter짯rup짯ti짯on of AMD셲 inter짯nal busi짯ness pro짯ces짯ses and infor짯ma짯ti짯on sys짯tems; com짯pa짯ti짯bi짯li짯ty of AMD셲 pro짯ducts with some or all indus짯try-stan짯dard soft짯ware and hard짯ware; cos짯ts rela짯ted to defec짯ti짯ve pro짯ducts; effi짯ci짯en짯cy of AMD셲 sup짯p짯ly chain; AMD셲 abili짯ty to rely on third par짯ty sup짯p짯ly-chain logi짯stics func짯tions; AMD셲 abili짯ty to effec짯tively con짯trol sales of its pro짯ducts on the gray mar짯ket; impact of govern짯ment actions and regu짯la짯ti짯ons such as export admi짯nis짯tra짯ti짯on regu짯la짯ti짯ons, tariffs and trade pro짯tec짯tion mea짯su짯res; AMD셲 abili짯ty to rea짯li짯ze its defer짯red tax assets; poten짯ti짯al tax lia짯bi짯li짯ties; cur짯rent and future claims and liti짯ga짯ti짯on; impact of envi짯ron짯men짯tal laws, con짯flict mine짯rals-rela짯ted pro짯vi짯si짯ons and other laws or regu짯la짯ti짯ons; impact of acqui짯si짯ti짯ons, joint ven짯tures and/or invest짯ments on AMD셲 busi짯ness and AMD셲 abili짯ty to inte짯gra짯te acqui짯red busi짯nesses; impact of any impair짯ment of the com짯bi짯ned company셲 assets on the com짯bi짯ned company셲 finan짯cial posi짯ti짯on and results of ope짯ra짯ti짯on; rest짯ric짯tions impo짯sed by agree짯ments gover짯ning AMD셲 notes, the gua짯ran짯tees of Xilinx셲 notes and the revol짯ving cre짯dit faci짯li짯ty; AMD셲 indeb짯ted짯ness; AMD셲 abili짯ty to gene짯ra짯te suf짯fi짯ci짯ent cash to meet its working capi짯tal requi짯re짯ments or gene짯ra짯te suf짯fi짯ci짯ent reve짯nue and ope짯ra짯ting cash flow to make all of its plan짯ned R&D or stra짯te짯gic invest짯ments; poli짯ti짯cal, legal, eco짯no짯mic risks and natu짯ral dis짯as짯ters; future impairm짯ents of good짯will and tech짯no짯lo짯gy licen짯se purcha짯ses; AMD셲 abili짯ty to attract and retain qua짯li짯fied per짯son짯nel; AMD셲 stock pri짯ce vola짯ti짯li짯ty; and world짯wi짯de poli짯ti짯cal con짯di짯ti짯ons. Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in AMD셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to AMD셲 most recent reports on Forms 10멚 and 10멡.