SANTA CLARA, Calif., April 20, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced the avai­la­bi­li­ty of its high-per­for­mance AMD Ryzen™ Embedded 5000 Series, a new solu­ti­on for cus­to­mers requi­ring power-effi­ci­ent pro­ces­sors opti­mi­zed for “always on” net­wor­king fire­walls, net­work-atta­ched sto­rage sys­tems and other secu­ri­ty appli­ca­ti­ons. The Ryzen Embedded 5000 Series rounds out the “Zen 3”-based AMD embedded pro­ces­sor port­fo­lio which also includes the Ryzen Embedded V3000 and EPYC™ Embedded 7000 series families.

Built on 7nm tech­no­lo­gy with plan­ned five-year manu­fac­tu­ring avai­la­bi­li­ty, and equip­ped with 6, 8, 12 or 16 cores and 24 lanes of PCIe® Gen4 con­nec­ti­vi­ty, Ryzen Embedded 5000 Series pro­ces­sors are desi­gned for enter­pri­se relia­bi­li­ty to sup­port the con­sis­tent uptime requi­re­ments nee­ded by secu­ri­ty and net­wor­king cus­to­mers. Ryzen Embedded 5000 Series pro­ces­sors include robust relia­bi­li­ty, avai­la­bi­li­ty and ser­vicea­bi­li­ty (RAS) fea­tures, inclu­ding an ECC-sup­port­ed memo­ry sub­sys­tem. With a ther­mal design power (TDP) pro­fi­le ran­ging from 65W to 105W, Ryzen Embedded 5000 pro­ces­sors enable the reduc­tion of over­all sys­tem coo­ling foot­print for space-cons­trai­ned and cost-sen­si­ti­ve applications.

“Ryzen Embedded 5000 pro­ces­sors deli­ver the ide­al com­bi­na­ti­on of per­for­mance and relia­bi­li­ty requi­red for 24x7 secu­ri­ty and net­wor­king appli­ca­ti­ons,” said Raj­nee­sh Gaur, cor­po­ra­te vice pre­si­dent & gene­ral mana­ger, Embedded Solu­ti­ons Group, AMD. “This expan­si­on of our embedded pro­duct port­fo­lio offers a mid-ran­ge solu­ti­on that fills the gap bet­ween our low-power BGA Ryzen Embedded and our world-class EPYC embedded fami­ly for cus­to­mers requi­ring both high per­for­mance and sca­la­bi­li­ty of up to 16 cores.”

“AMD’s suc­cess in the embedded mar­ket is built on offe­ring dif­fe­ren­tia­ted and sca­lable offe­rings that address a wide ran­ge of appli­ca­ti­ons with dif­fe­rent power, per­for­mance and envi­ron­men­tal requi­re­ments,” said Kevin Kre­well, prin­ci­pal ana­lyst at TIRIAS Rese­arch. “The AMD Ryzen Embedded 5000 strikes an opti­mal balan­ce of power and per­for­mance for appli­ca­ti­ons ran­ging from small-form fac­tor embedded sys­tems to sto­rage, secu­ri­ty, and net­wor­king sys­tems, sui­ting the broa­dest ran­ge of cus­to­mers and use cases.”

Ryzen Embedded 5000 Series pro­ces­sors offer:

• Sca­la­bi­li­ty up to 16 cores and 32 threads
• Up to 64MB of shared L3 CPU Cache
• Ener­gy effi­ci­ent TDP from 65W to 105W
• ECC-sup­port­ed memo­ry and secu­ri­ty features
• 24 lanes of PCIe® 4 con­nec­ti­vi­ty (expan­da­ble I/O up to 36 lanes with AMD X570 chipset)
• Opti­mi­zed per­for­mance for enter­pri­se reliability

Ryzen Embedded 5000 Series Pro­ces­sor Pro­duct Chart

¹Max boost for Ryzen Embedded 5000 pro­ces­sors is the maxi­mum fre­quen­cy achie­va­ble by any sin­gle core on the pro­ces­sor under nor­mal ope­ra­ting con­di­ti­ons for enter­pri­se systems.
²Ryzen Embedded 5800E pro­ces­sor sup­ports con­fi­gura­ble Ther­mal Design Power (cTDP) from 65W to 100W.
³Ryzen Embedded 5000 pro­ces­sors sup­port a total of 24 lanes of PCIe® Gen4. Optio­nal­ly pai­red with the AMD X570 Chip­set, up to 36 lanes of PCIe® Gen4 can be supported.

AMD Ryzen Embedded 5000 Series pro­ces­sors are curr­ent­ly in pro­duc­tion with five-year plan­ned manu­fac­tu­ring availability.

Sup­port­ing Resources

• Read more about the AMD “Zen 3” Core Architecture
• Learn more about the AMD Ryzen Embedded Family
• Fol­low AMD on Twit­ter
• Con­nect with AMD on Lin­ke­dIn

About AMD
For more than 50 years AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics and visua­liza­ti­on tech­no­lo­gies. Bil­li­ons of peo­p­le, lea­ding For­tu­ne 500 busi­nesses and cut­ting-edge sci­en­ti­fic rese­arch insti­tu­ti­ons around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work and play. AMD employees are focu­sed on buil­ding lea­der­ship high-per­for­mance and adap­ti­ve pro­ducts that push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ: AMD) web­site, blog, Lin­ke­dIn and Twit­ter pages.

CAUTIONARY STATEMENT

This press release con­ta­ins for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) inclu­ding the five-year plan­ned manu­fac­tu­ring avai­la­bi­li­ty of the AMD Ryzen^TM Embedded 5000 Series pro­ces­sors, which are made pur­su­ant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this press release are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this press release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or impli­ed or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons include, wit­hout limi­ta­ti­on, the fol­lo­wing: Intel Corporation’s domi­nan­ce of the micro­pro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­ti­ces; glo­bal eco­no­mic uncer­tain­ty; cycli­cal natu­re of the semi­con­duc­tor indus­try; mar­ket con­di­ti­ons of the indus­tries in which AMD pro­ducts are sold; loss of a signi­fi­cant cus­to­mer; impact of the COVID-19 pan­de­mic on AMD’s busi­ness, finan­cial con­di­ti­on and results of ope­ra­ti­ons; com­pe­ti­ti­ve mar­kets in which AMD’s pro­ducts are sold; quar­ter­ly and sea­so­nal sales pat­terns; AMD’s abili­ty to ade­qua­te­ly pro­tect its tech­no­lo­gy or other intellec­tu­al pro­per­ty; unfa­vorable cur­ren­cy exch­an­ge rate fluc­tua­tions; abili­ty of third par­ty manu­fac­tu­r­ers to manu­fac­tu­re AMD’s pro­ducts on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies; avai­la­bi­li­ty of essen­ti­al equip­ment, mate­ri­als, sub­stra­tes or manu­fac­tu­ring pro­ces­ses; abili­ty to achie­ve expec­ted manu­fac­tu­ring yields for AMD’s pro­ducts; AMD’s abili­ty to intro­du­ce pro­ducts on a time­ly basis with expec­ted fea­tures and per­for­mance levels; AMD’s abili­ty to gene­ra­te reve­nue from its semi-cus­tom SoC pro­ducts; poten­ti­al secu­ri­ty vul­nerabi­li­ties; poten­ti­al secu­ri­ty inci­dents inclu­ding IT outa­ges, data loss, data brea­ches and cyber-attacks; poten­ti­al dif­fi­cul­ties in upgrading and ope­ra­ting AMD’s new enter­pri­se resour­ce plan­ning sys­tem; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­ducts; AMD’s reli­ance on third-par­ty intellec­tu­al pro­per­ty to design and intro­du­ce new pro­ducts in a time­ly man­ner; AMD’s reli­ance on third-par­ty com­pa­nies for design, manu­fac­tu­re and sup­p­ly of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents; AMD’s reli­ance on Micro­soft and other soft­ware ven­dors’ sup­port to design and deve­lop soft­ware to run on AMD’s pro­ducts; AMD’s reli­ance on third-par­ty dis­tri­bu­tors and add-in-board part­ners; impact of modi­fi­ca­ti­on or inter­rup­ti­on of AMD’s inter­nal busi­ness pro­ces­ses and infor­ma­ti­on sys­tems; com­pa­ti­bi­li­ty of AMD’s pro­ducts with some or all indus­try-stan­dard soft­ware and hard­ware; cos­ts rela­ted to defec­ti­ve pro­ducts; effi­ci­en­cy of AMD’s sup­p­ly chain; AMD’s abili­ty to rely on third par­ty sup­p­ly-chain logi­stics func­tions; AMD’s abili­ty to effec­tively con­trol sales of its pro­ducts on the gray mar­ket; impact of govern­ment actions and regu­la­ti­ons such as export admi­nis­tra­ti­on regu­la­ti­ons, tariffs and trade pro­tec­tion mea­su­res; AMD’s abili­ty to rea­li­ze its defer­red tax assets; poten­ti­al tax lia­bi­li­ties; cur­rent and future claims and liti­ga­ti­on; impact of envi­ron­men­tal laws, con­flict mine­rals-rela­ted pro­vi­si­ons and other laws or regu­la­ti­ons; impact of acqui­si­ti­ons, joint ven­tures and/or invest­ments on AMD’s busi­ness and AMD’s abili­ty to inte­gra­te acqui­red busi­nesses; impact of any impair­ment of the com­bi­ned company’s assets on the com­bi­ned company’s finan­cial posi­ti­on and results of ope­ra­ti­on; rest­ric­tions impo­sed by agree­ments gover­ning AMD’s notes, the gua­ran­tees of Xilinx’s notes and the revol­ving cre­dit faci­li­ty; AMD’s indeb­ted­ness; AMD’s abili­ty to gene­ra­te suf­fi­ci­ent cash to meet its working capi­tal requi­re­ments or gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow to make all of its plan­ned R&D or stra­te­gic invest­ments; poli­ti­cal, legal, eco­no­mic risks and natu­ral dis­as­ters; future impairm­ents of good­will and tech­no­lo­gy licen­se purcha­ses; AMD’s abili­ty to attract and retain qua­li­fied per­son­nel; AMD’s stock pri­ce vola­ti­li­ty; and world­wi­de poli­ti­cal con­di­ti­ons. Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to AMD’s most recent reports on Forms 10‑K and 10‑Q.