Kategorie: Pressemitteilungen

AMD Highlights Future of High-Performance and Adaptive Computing During Opening Keynote of CES 2023

AMD CEO and part­ners inclu­ding Micro­soft, HP, Leno­vo, Magic Leap and Intui­ti­ve Sur­gi­cal show­ca­se AMD tech­no­lo­gies advan­cing AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable computing —

— Unveils new mobi­le CPUs and GPUs, inclu­ding first x86 PC CPU with dedi­ca­ted AI engi­ne and new 3D sta­cked desk­top pro­ces­sors with lea­der­ship gam­ing per­for­mance, and pre­views lea­der­ship AI infe­rence acce­le­ra­tor and data cen­ter APU —

LAS VEGAS, Jan. 04, 2023 (GLOBE NEWSWIRE) — Today at CES 2023AMD (NASDAQ: AMD) Chair and CEO Dr. Lisa Su detail­ed the signi­fi­cant role high-per­for­mance and adap­ti­ve com­pu­ting plays in crea­ting solu­ti­ons to the world’s most important chal­lenges. During her live key­note, Dr. Su show­ca­sed next-gene­ra­ti­on AMD lea­der­ship pro­ducts rede­fi­ning what’s pos­si­ble across the broad mar­kets AMD ser­ves today.

It is an honor to kick off CES 2023 and high­light all the ways AMD is pushing the enve­lo­pe in high-per­for­mance and adap­ti­ve com­pu­ting to help sol­ve the world’s most important chal­lenges,” said Dr. Su.  “Tog­e­ther with our part­ners, we high­ligh­ted how AMD tech­no­lo­gy is advan­cing what is pos­si­ble in AI, hybrid work, gam­ing, health­ca­re, aero­space and sus­tainable com­pu­ting. We also laun­ched mul­ti­ple new mobi­le, gam­ing and AI chips that will make 2023 an exci­ting year for AMD and the indus­try.” (…) Wei­ter­le­sen »

TSMC November 2022 Revenue Report

HSINCHU, Tai­wan, R.O.C. – Dec. 9, 2022 - TSMC (TWSE: 2330, NYSE: TSM) today announ­ced its net reve­nue for Novem­ber 2022: On a con­so­li­da­ted basis, reve­nue for Novem­ber 2022 was appro­xi­m­ate­ly NT$222.71 bil­li­on, an increase of 5.9 per­cent from Octo­ber 2022 and an increase of 50.2 per­cent from Novem­ber 2021. Reve­nue for Janu­ary through Novem­ber 2022 tota­led NT$2,071.33 bil­li­on, an increase of 44.6 per­cent com­pared to the same peri­od in 2021. (…) Wei­ter­le­sen »

TSMC Announces Updates for TSMC Arizona

PHOENIX, Ari­zo­na, Dec. 6, 2022 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that in addi­ti­on to TSMC Arizona’s first fab, which is sche­du­led to begin pro­duc­tion of N4 pro­cess tech­no­lo­gy in 2024, TSMC has also star­ted the con­s­truc­tion of a second fab which is sche­du­led to begin pro­duc­tion of 3nm pro­cess tech­no­lo­gy in 2026. The over­all invest­ment for the­se two fabs will be appro­xi­m­ate­ly US$40 bil­li­on, repre­sen­ting the lar­gest for­eign direct invest­ment in Ari­zo­na histo­ry and one of the lar­gest for­eign direct invest­ments in the histo­ry of the United Sta­tes. (…) Wei­ter­le­sen »

AMD and Viettel Collaborate on 5G Mobile Network Expansion

── Viettel selects Xilinx Zynq MPSoC and RFSoC adaptive platforms to enable its next-generation 5G systems serving more than 130 million mobile customers globally ──

SANTA CLARA, Calif., Dec. 01, 2022 — AMD (NASDAQ: AMD) and Viet­tel High Tech (Mem­ber of Viet­tel Group) today announ­ced the suc­cessful com­ple­ti­on of a 5G mobi­le net­work field tri­al deploy­ment con­duc­ted by Viet­tel and powered by AMD Xilinx Zynq™ UltraS­ca­le+™ MPSoC devices. As the lar­gest tele­com ope­ra­tor in Viet­nam ser­ving more than 130 mil­li­on mobi­le cus­to­mers, Viet­tel High Tech has a rich histo­ry of using AMD radio tech­no­lo­gy with pri­or 4G deploy­ments and is now acce­le­ra­ting new net­works via new 5G remo­te radio heads. Desi­gned to meet the gro­wing capa­ci­ty and per­for­mance requi­re­ments of mobi­le users glo­bal­ly, the Viet­tel 5G mobi­le net­work is expec­ted to be com­ple­ted by the end of 2022.

(…) Wei­ter­le­sen »

AMD to Present at Arete’s Tech Conference

SANTA CLARA, Calif., Nov. 30, 2022 — Today, AMD (NASDAQ: AMD) announ­ced that Mark Paper­mas­ter, chief tech­no­lo­gy offi­cer and exe­cu­ti­ve vice pre­si­dent, Tech­no­lo­gy and Engi­nee­ring, will pre­sent at the vir­tu­al Are­te Tech Con­fe­rence (ATC) on Tues­day, Dec. 6 at 10:10 AM ET/7:10 AM PT.

A real-time web­cast of the pre­sen­ta­ti­on can be acces­sed on AMD’s Inves­tor Rela­ti­ons web­site ir.amd.com. A replay of the web­cast can be acces­sed after the con­clu­si­on of the live event and will be available for one year after the conference.
(…) Wei­ter­le­sen »

AMD and Analog Devices Resolve Patent Infringement Lawsuits

SANTA CLARA, Calif., Nov. 17, 2022
AMD (NASDAQ: AMD) and Ana­log Devices, Inc. (NASDAQ: ADI) today announ­ced that they have resol­ved all their ongo­ing patent liti­ga­ti­ons, based on mutual­ly agreed upon terms. As part of this reso­lu­ti­on, the two com­pa­nies have com­mit­ted to pur­sue tech­no­lo­gy col­la­bo­ra­ti­ons to bring next gene­ra­ti­on solu­ti­ons to their com­mu­ni­ca­ti­ons and data cen­ter customers.

(…) Wei­ter­le­sen »

AMD Announces Retirement of John Caldwell from Board of Directors and Appointment of Nora Denzel as Lead Independent Director

SANTA CLARA, Calif., Nov. 16, 2022 — AMD (NASDAQ: AMD) announ­ced that John Cald­well is reti­ring from the AMD board of direc­tors after 16 years of ser­vice. Nora Den­zel will suc­ceed Cald­well as lead inde­pen­dent direc­tor, effec­ti­ve immediately.

Cald­well joi­n­ed the AMD board of direc­tors in 2006. He ser­ved as chair­man from 2016 to 2022 and was named lead inde­pen­dent direc­tor ear­lier this year. He held a varie­ty of com­mit­tee posi­ti­ons throug­hout his ten­ure, inclu­ding chair of the com­pen­sa­ti­on and lea­der­ship resour­ces com­mit­tee and ser­ving on the nomi­na­ting and cor­po­ra­te gover­nan­ce com­mit­tee. (…) Wei­ter­le­sen »

AMD Powers Aisin Next-Generation Automated Parking Assist System

── AMD Zynq UltraScale+ MPSoC automotive platform with deep learning processor advances low-latency, AI-based image processing for automated parking system ──

SANTA CLARA, Calif., Nov. 16, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that the AMD Xilinx Auto­mo­ti­ve (XA) Zynq® UltraS­ca­le+ MPSoC plat­form has been sel­ec­ted to power the Aisin Auto­ma­ted Par­king-Assist (APA) sys­tem. The high­ly adap­ta­ble XA Zynq UltraS­ca­le+ MPSoC plat­form enables the next-gene­ra­ti­on Aisin APA sys­tem to detect pede­stri­ans, vehic­les and free space effi­ci­ent­ly and at extre­me­ly low laten­cy. The Aisin APA sys­tem will begin ship­ping in model year 2024.

The XA Zynq UltraS­ca­le+ MPSoC plat­form — deploy­ed in the came­ras within the Aisin APA sys­tem — com­bi­nes a high-per­for­mance Arm®-based mul­ti­co­re, mul­tipro­ces­sing sys­tem with ASIC-class pro­gramma­ble logic con­tai­ning cus­tom co-pro­ces­sors that can be opti­mi­zed to meet sys­tem needs, inclu­ding a deep lear­ning pro­ces­sor unit for con­vo­lu­tio­nal neu­ral net­work (CNN) pro­ces­sing. This enables machi­ne lear­ning-based sce­ne seg­men­ta­ti­on and object detec­tion for the Aisin APA sys­tem. The XA Zynq MPSoC plat­form deli­vers maxi­mum pro­ces­sing effi­ci­en­cy and is capa­ble of off­loa­ding cri­ti­cal func­tions, such as gra­phics and video pipe­lining, to dedi­ca­ted pro­ces­sing blocks to enable low-laten­cy image processing.
(…) Wei­ter­le­sen »

TYAN Introduces HPC, Cloud and Storage Server Platforms Featuring 4th Gen AMD EPYC™ Processors at SC22

New 2‑GPU pedestal design, high-density with front I/O and all-flash storage servers maximize performance and energy efficiency for the data center

[cap­ti­on id=“attachment_67032” align=“aligncenter” width=“900”] Pro­ducts : S8050 FT65TB8050 GC68AB8056 TS70AB8056 TS70B8056[/caption]

Dal­las, Texas – Super­com­pu­ting 2022 – Nov 15, 2022 – TYAN®, an indus­try-lea­ding ser­ver plat­form design manu­fac­tu­rer and a MiT­AC Com­pu­ting Tech­no­lo­gy Cor­po­ra­ti­on sub­si­dia­ry, brings the latest HPC, cloud and sto­rage plat­forms powered by AMD EPYC™ 9004 Series pro­ces­sors for the next gene­ra­ti­on ser­ver archi­tec­tu­re and ener­gy effi­ci­en­cy at SC22, Booth #2000 in the Kay Bai­ley Hut­chison Con­ven­ti­on Cen­ter Dal­las on Novem­ber 14–17.

Facing the post-COVID eco­no­my world, data cen­ters are requi­red to build on more envi­ron­men­tal­ly fri­end­ly, secu­re and fle­xi­ble fea­tures to respond to the gro­wing of tele­wor­king, video strea­ming, IoT and 5G,” said Dan­ny Hsu, Vice Pre­si­dent of MiT­AC Com­pu­ting Tech­no­lo­gy Corporation’s Ser­ver Infra­struc­tu­re BU. “TYAN’s new ser­ver plat­forms, powered by 4th Gen AMD EPYC pro­ces­sors, effi­ci­ent­ly enable data cen­ters by doing more tasks with the same num­ber of ser­vers.” (…) Wei­ter­le­sen »

AMD Drives Leadership Performance and Energy Efficiency in Supercomputing

AMD EPYC pro­ces­sors and AMD Instinct acce­le­ra­tors powered 101 super­com­pu­ters in the latest Top500 list, a 38% increase year-over-year —

SANTA CLARA, 11/15/2022

At the Super­com­pu­ting Con­fe­rence 2022 (SC22)AMD (NASDAQ: AMD) show­ca­sed its con­tin­ued momen­tum and domi­na­ting pre­sence within the high per­for­mance com­pu­ting (HPC) indus­try. AMD EPYC™ CPUs and AMD Instinct™ acce­le­ra­tors con­ti­nue to be the pro­ces­sors of choice for the most deman­ding HPC workloads powe­ring the most com­plex simu­la­ti­ons and mode­ling tools.

Inno­va­ti­on in high per­for­mance com­pu­ting has a dra­ma­tic impact on socie­ty, advan­cing ground­brea­king rese­arch that has the poten­ti­al to vast­ly impro­ve qua­li­ty of life for peo­p­le ever­y­whe­re,” said For­rest Nor­rod, seni­or vice pre­si­dent and gene­ral mana­ger, Data Cen­ter Solu­ti­ons Group, AMD. “AMD is con­stant­ly inno­vat­ing and evol­ving our EPYC pro­ces­sors and Instinct acce­le­ra­tors to ensu­re sci­en­tists and rese­ar­chers working on sol­ving the world’s toug­hest chal­lenges have the most cut­ting-edge tools for their rese­arch.” (…) Wei­ter­le­sen »

AMD Announces Completion of Class B Qualification for First Space-Grade Versal Adaptive SoCs Enabling On-Board AI Processing in Space

— First ship­ments of radia­ti­on-tole­rant Ver­sal AI Core devices deli­ve­ring high-band­width signal pro­ces­sing and AI infe­ren­cing for space appli­ca­ti­ons on track for ear­ly next year —

SANTA CLARA, Calif. 11/15/2022

AMD (NASDAQ: AMD) today announ­ced it has com­ple­ted Class B qua­li­fi­ca­ti­on for the company’s first space-gra­de Ver­sal™ adap­ti­ve SoCs. The XQR Ver­sal™ AI Core XQRVC1902 devices deli­ver full radia­ti­on tole­rance, acce­le­ra­ted AI infe­ren­cing and high-band­width signal pro­ces­sing per­for­mance for satel­li­te and space appli­ca­ti­ons. The com­ple­ti­on of Class B qua­li­fi­ca­ti­on, deri­ved from the US mili­ta­ry spe­ci­fi­ca­ti­on MIL-PRF-38535, allows the devices to begin ship­ping in ear­ly 2023.

The radia­ti­on-tole­rant XQR Ver­sal AI Core XQRVC1902 devices repre­sent a major leap for­ward in enab­ling sophisti­ca­ted on-board data pro­ces­sing and AI infe­ren­cing appli­ca­ti­ons in space. Until now, high­ly com­plex AI appli­ca­ti­ons could only be per­for­med with cus­tom-desi­gned ASICs, which are pro­hi­bi­tively expen­si­ve for most space pro­grams. (…) Wei­ter­le­sen »

SiPearl and AMD collaborate to address exascale supercomputing in Europe

SiPearl, the com­pa­ny desig­ning the high-per­for­mance, low-power micro­pro­ces­sor for Euro­pean super­com­pu­ters, is col­la­bo­ra­ting with AMD to address the needs of exas­ca­le super­com­pu­ting in Euro­pe. Com­bi­ning SiPearl’s Rhea micro­pro­ces­sor with AMD Instinct™ acce­le­ra­tors, the two com­pa­nies will help Euro­pe to meet stra­te­gic, sci­en­ti­fic, socie­tal, and indus­tri­al challenges.

Mai­sons-Laf­fit­te (France), 14th Novem­ber 2022 – SiPearl, the com­pa­ny desig­ning the high­per­for­mance, low-power micro­pro­ces­sor for Euro­pean super­com­pu­ters, has ente­red into a busi­ness col­la­bo­ra­ti­on agree­ment with AMD to pro­vi­de a joint offe­ring for exas­ca­le super­com­pu­ting sys­tems, com­bi­ning SiPearl’s HPC micro­pro­ces­sor, Rhea, with AMD Instinct™ accelerators.

Initi­al­ly, AMD and SiPearl will joint­ly assess the inter­ope­ra­bi­li­ty of the AMD ROCm™ open soft­ware with the SiPearl Rhea micro­pro­ces­sor and build an opti­mi­zed soft­ware solu­ti­on that would streng­then the capa­bi­li­ties of a SiPearl micro­pro­ces­sor com­bi­ned with an AMD InstinctTM acce­le­ra­tor. This joint work tar­gets port­ing and opti­miza­ti­on acti­vi­ties of the AMD HIP backend, openMP com­pi­lers and libra­ri­es, will enable sci­en­ti­fic appli­ca­ti­ons to bene­fit from both tech­no­lo­gies. (…) Wei­ter­le­sen »

ASUS Announces AMD EPYC 9004-Powered Rack Servers and Liquid-Cooling Solutions

Over 90%-lower fan power con­sump­ti­on for huge saving on data cen­ter ope­ra­ti­on Supe­ri­or liquid-coo­­ling solu­ti­ons: Over 90%-lower fan power con­sump­ti­on for huge saving on data-cen­­­ter ope­ra­ti­ons New ther­mal design: Hard-dri­­ve tray design with 44%-wider ven­ti­la­ti­on holes, plus opti­mi­zed lay­out to mini­mi­ze impe­dance and enhan­ce air­flow No. 1 Bench­mark: World-record-set­­ting per­for­mance with 24 results on the latest SPEC CPU2017 (…) Wei­ter­le­sen »

Offering Unmatched Performance, Leadership Energy Efficiency and Next-Generation Architecture, AMD Brings 4th Gen AMD EPYC™ Processors to The Modern Data Center

—New AMD EPYC™ pro­ces­sors are the world’s fas­test and most ener­gy effi­ci­ent, allo­wing cus­to­mers to moder­ni­ze their data cen­ters to dri­ve actionable insights for bet­ter busi­ness results— 

AMD EPYC™ pro­ces­sors are sup­port­ed by a com­ple­te cloud, enter­pri­se, hard­ware and soft­ware ecosystem—

SANTA CLARA, Calif., Nov. 10, 2022 (GLOBE NEWSWIRE) — Today, at the “tog­e­ther we advance_data cen­ters” event, AMD (NASDAQ: AMD) announ­ced the gene­ral avai­la­bi­li­ty of the 4th Gen AMD EPYC™ pro­ces­sors; with unmat­ched per­for­mance for cri­ti­cal workloads across cloudi, enter­pri­seii and high per­for­mance com­pu­tingiii.

The 4th Gen AMD EPYC pro­ces­sors bring next-gene­ra­ti­on archi­tec­tu­re, tech­no­lo­gy, and fea­tures to the modern data cen­ter. Built on the “Zen 4” core, the hig­hest per­for­mance core ever from AMDiv, the pro­ces­sors deli­ver lea­der­ship per­for­mance, ener­gy effi­ci­en­cyv and help cus­to­mers acce­le­ra­te data cen­ter moder­niza­ti­on for grea­ter appli­ca­ti­on through­put and more actionable insights.

Choo­sing the right data cen­ter pro­ces­sor is more important than ever, and 4th Gen EPYC pro­ces­sors deli­ver lea­der­ship in every dimen­si­on,” said Dr. Lisa Su, Chair and CEO, AMD. “The data cen­ter repres­ents the lar­gest growth oppor­tu­ni­ty and most stra­te­gic prio­ri­ty for AMD, and we are com­mit­ted to making AMD the part­ner of choice by offe­ring the industry’s broa­dest port­fo­lio of high-per­for­mance and adap­ti­ve com­pu­ting engi­nes. We have built the best data cen­ter CPU road­map in the indus­try, and with 4th Gen EPYC we deli­ver ano­ther major step for­ward in per­for­mance and effi­ci­en­cy to make the best ser­ver pro­ces­sor road­map even bet­ter. With a signi­fi­cant­ly expan­ded set of solu­ti­ons on-track to launch from our eco­sys­tem of part­ners, cus­to­mers sel­ec­ting 4th Gen EPYC to power their data cen­ters can impro­ve per­for­mance, con­so­li­da­te their infra­struc­tu­re, and lower ener­gy costs.”

Acce­le­ra­ting Results and Dri­ving Actionable Insights for Businesses

4th Gen AMD EPYC pro­ces­sors are desi­gned to deli­ver opti­miza­ti­ons across mar­ket seg­ments and appli­ca­ti­ons, while hel­ping busi­nesses free data cen­ter resour­ces to crea­te addi­tio­nal workload pro­ces­sing and acce­le­ra­te output.
With 4th Gen AMD EPYC pro­ces­sors, busi­nesses can:

(…) Wei­ter­le­sen »

Cloud Hypervisor Project welcomes AMD as a Member of the Advisory Board

As a mem­ber of the Advi­so­ry Board, AMD will help dri­ve open source col­la­bo­ra­ti­on and deve­lo­p­ment in the Cloud Hyper­vi­sor community.

SAN FRANCISCO, Novem­ber 8, 2022 – The Cloud Hyper­vi­sor Pro­ject, a lea­ding vir­tu­al machi­ne moni­tor (VMM) for run­ning modern cloud workloads, is exci­ted to wel­co­me AMD to their Advi­so­ry Board. The Linux Foun­da­ti­on and the foun­ding mem­bers of the Cloud Hyper­vi­sor Pro­ject would like to wel­co­me AMD and look for­ward to working with them to fos­ter an envi­ron­ment of open source col­la­bo­ra­ti­on. (…) Wei­ter­le­sen »