Schlagwort: Xilinx

Octavo Systems Releases the OSDZU3-REF Development Platform for the AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous­ton, Texas, United Sta­tes (March 1, 2023) – Octa­vo Sys­tems LLC, a lea­ding pro­vi­der of Sys­tem-in-Packa­ge (SiP) solu­ti­ons, has offi­ci­al­ly released its latest offe­ring, the OSDZU3-REF Deve­lo­p­ment Plat­form. This plat­form gives sys­tem desi­gners a com­pre­hen­si­ve deve­lo­p­ment envi­ron­ment for eva­lua­ting, test­ing, and start­ing pro­duct deve­lo­p­ment using the OSDZU3 Sys­tem-in-Packa­ge (SiP). (…) Wei­ter­le­sen »

AMD Expands 5G Telco Market Leadership with New High-Performance and Adaptive Computing Products and Testing Services at MWC 2023

SANTA CLARA, Calif., Feb. 22, 2023 (GLOBE NEWSWIRE) — Today, AMD (NASDAQ: AMD) announ­ced it will be expan­ding sup­port of its gro­wing 5G part­ner eco­sys­tem span­ning from core to radio access net­works (RAN) appli­ca­ti­ons, deli­ve­ring addi­tio­nal new test capa­bi­li­ties and unvei­ling new 5G pro­ducts. The AMD wire­less tele­com part­ner eco­sys­tem has more than dou­bled in the past year, bols­te­red by the inte­gra­ti­on of the AMD and Xilinx pro­duct lines as well as the crea­ti­on of its new Tel­co Solu­ti­ons test­ing lab in col­la­bo­ra­ti­on with VIAVI (…) Wei­ter­le­sen »

AMD Adaptive Computing Technology Enables Next-Generation DENSO LiDAR System, Delivering 20X Improvement in Resolution

── AMD Xilinx Auto­mo­ti­ve Zynq UltraS­ca­le+ MPSoC in DENSO plat­form pro­vi­des hig­hest point-cloud den­si­ty level of any SPAD LiDAR sys­tem in mar­ket today ──

SANTA CLARA, Calif., Jan. 19, 2023 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that its adap­ti­ve com­pu­ting tech­no­lo­gy is powe­ring lea­ding mobi­li­ty sup­pli­er DENSO Corporation’s next-gene­ra­ti­on LiDAR plat­form. The new plat­form will enable over 20X1 impro­ve­ment in reso­lu­ti­on with extre­me­ly low laten­cy for increased pre­cis­i­on in detec­ting pede­stri­ans, vehic­les, free space and more. The DENSO LiDAR plat­form, tar­ge­ted to begin ship­ping in 2025, will levera­ge the AMD Xilinx Auto­mo­ti­ve (XA) Zynq™ UltraS­ca­le+™ adap­ti­ve SoC and its func­tion­al safe­ty suite of deve­lo­per tools to enable ISO 26262 ASIL‑B cer­ti­fi­ca­ti­on. (…) Wei­ter­le­sen »

AMD and Viettel Collaborate on 5G Mobile Network Expansion

── Viettel selects Xilinx Zynq MPSoC and RFSoC adaptive platforms to enable its next-generation 5G systems serving more than 130 million mobile customers globally ──

SANTA CLARA, Calif., Dec. 01, 2022 — AMD (NASDAQ: AMD) and Viet­tel High Tech (Mem­ber of Viet­tel Group) today announ­ced the suc­cessful com­ple­ti­on of a 5G mobi­le net­work field tri­al deploy­ment con­duc­ted by Viet­tel and powered by AMD Xilinx Zynq™ UltraS­ca­le+™ MPSoC devices. As the lar­gest tele­com ope­ra­tor in Viet­nam ser­ving more than 130 mil­li­on mobi­le cus­to­mers, Viet­tel High Tech has a rich histo­ry of using AMD radio tech­no­lo­gy with pri­or 4G deploy­ments and is now acce­le­ra­ting new net­works via new 5G remo­te radio heads. Desi­gned to meet the gro­wing capa­ci­ty and per­for­mance requi­re­ments of mobi­le users glo­bal­ly, the Viet­tel 5G mobi­le net­work is expec­ted to be com­ple­ted by the end of 2022.

(…) Wei­ter­le­sen »

AMD Powers Aisin Next-Generation Automated Parking Assist System

── AMD Zynq UltraScale+ MPSoC automotive platform with deep learning processor advances low-latency, AI-based image processing for automated parking system ──

SANTA CLARA, Calif., Nov. 16, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) announ­ced today that the AMD Xilinx Auto­mo­ti­ve (XA) Zynq® UltraS­ca­le+ MPSoC plat­form has been sel­ec­ted to power the Aisin Auto­ma­ted Par­king-Assist (APA) sys­tem. The high­ly adap­ta­ble XA Zynq UltraS­ca­le+ MPSoC plat­form enables the next-gene­ra­ti­on Aisin APA sys­tem to detect pede­stri­ans, vehic­les and free space effi­ci­ent­ly and at extre­me­ly low laten­cy. The Aisin APA sys­tem will begin ship­ping in model year 2024.

The XA Zynq UltraS­ca­le+ MPSoC plat­form — deploy­ed in the came­ras within the Aisin APA sys­tem — com­bi­nes a high-per­for­mance Arm®-based mul­ti­co­re, mul­tipro­ces­sing sys­tem with ASIC-class pro­gramma­ble logic con­tai­ning cus­tom co-pro­ces­sors that can be opti­mi­zed to meet sys­tem needs, inclu­ding a deep lear­ning pro­ces­sor unit for con­vo­lu­tio­nal neu­ral net­work (CNN) pro­ces­sing. This enables machi­ne lear­ning-based sce­ne seg­men­ta­ti­on and object detec­tion for the Aisin APA sys­tem. The XA Zynq MPSoC plat­form deli­vers maxi­mum pro­ces­sing effi­ci­en­cy and is capa­ble of off­loa­ding cri­ti­cal func­tions, such as gra­phics and video pipe­lining, to dedi­ca­ted pro­ces­sing blocks to enable low-laten­cy image processing.
(…) Wei­ter­le­sen »

AMD Announces Completion of Class B Qualification for First Space-Grade Versal Adaptive SoCs Enabling On-Board AI Processing in Space

— First ship­ments of radia­ti­on-tole­rant Ver­sal AI Core devices deli­ve­ring high-band­width signal pro­ces­sing and AI infe­ren­cing for space appli­ca­ti­ons on track for ear­ly next year —

SANTA CLARA, Calif. 11/15/2022

AMD (NASDAQ: AMD) today announ­ced it has com­ple­ted Class B qua­li­fi­ca­ti­on for the company’s first space-gra­de Ver­sal™ adap­ti­ve SoCs. The XQR Ver­sal™ AI Core XQRVC1902 devices deli­ver full radia­ti­on tole­rance, acce­le­ra­ted AI infe­ren­cing and high-band­width signal pro­ces­sing per­for­mance for satel­li­te and space appli­ca­ti­ons. The com­ple­ti­on of Class B qua­li­fi­ca­ti­on, deri­ved from the US mili­ta­ry spe­ci­fi­ca­ti­on MIL-PRF-38535, allows the devices to begin ship­ping in ear­ly 2023.

The radia­ti­on-tole­rant XQR Ver­sal AI Core XQRVC1902 devices repre­sent a major leap for­ward in enab­ling sophisti­ca­ted on-board data pro­ces­sing and AI infe­ren­cing appli­ca­ti­ons in space. Until now, high­ly com­plex AI appli­ca­ti­ons could only be per­for­med with cus­tom-desi­gned ASICs, which are pro­hi­bi­tively expen­si­ve for most space pro­grams. (…) Wei­ter­le­sen »

Samsung Electronics Develops Second-Generation SmartSSD Computational Storage Drive With Upgraded Processing Functionality

Cuts pro­ces­sing time by over 50%, ener­gy con­sump­ti­on by up to 70% and CPU uti­liza­ti­on by up to 97% com­pared to con­ven­tio­nal SSD drives

Sam­sung Elec­tro­nics, the world lea­der in advan­ced memo­ry tech­no­lo­gy, today announ­ced that it has suc­cessful­ly deve­lo­ped a second gene­ra­ti­on of its pio­nee­ring SmartSSD.

The new pro­prie­ta­ry com­pu­ta­tio­nal sto­rage incor­po­ra­tes data pro­ces­sing func­tion­a­li­ty within a high-per­for­mance SSD. Unli­ke exis­ting SSDs, Samsung’s SmartS­SD can pro­cess data direct­ly, ther­eby mini­mi­zing data trans­fers bet­ween the CPU, GPU and RAM. This tech­no­lo­gy can avo­id the bot­t­len­ecks that often occur when moving data bet­ween sto­rage devices and CPUs, resul­ting in mark­ed­ly impro­ved sys­tem per­for­mance and much hig­her ener­gy effi­ci­en­cy. (…) Wei­ter­le­sen »

AMD Powers Real-Time AI Processing at the Edge for Revolutionary Canon Free Viewpoint Video System, Transforming Live Sports Broadcasts

— Canon camera systems using Versal AI Core series to enable game-changing immersive viewing experiences for live broadcasts at premier sports venues around the world —

SANTA CLARA, Calif., June 28, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that the Ver­sal™ AI Core series, with AMD AI Engi­ne tech­no­lo­gy, has been sel­ec­ted by Canon for its Free View­point Video Sys­tem expec­ted to revo­lu­tio­ni­ze the vie­w­ing expe­ri­ence for live sport broad­casts and web­casts. Ver­sal AI Core devices deli­ver powerful machi­ne lear­ning (ML)-based video pro­ces­sing at the edge for Canon came­ra systems.

The Canon Free View­point video sys­tem con­sists of a ring of high-reso­lu­ti­on came­ras that sur­round a sta­di­um or are­na to allow broad­cast view­ers to see the action on the field from any posi­ti­on or ang­le in the sta­di­um. The revo­lu­tio­na­ry tech­no­lo­gy dra­ma­ti­cal­ly chan­ges how sports are view­ed, put­ting view­ers in the midd­le of the action. The Canon Free View­point sys­tem is expec­ted to be deploy­ed at mul­ti­ple pro­fes­sio­nal bas­ket­ball are­nas in the U.S. and other pre­mier sports venues around the world. (…) Wei­ter­le­sen »

AMD Enables 4G/5G Radio Access Network Solutions to Support Meta Connectivity Evenstar Program

Effi­ci­ent, adap­ta­ble radio units to expand glo­bal mobi­le net­work infra­struc­tu­re and acce­le­ra­te Open RAN adop­ti­on for meta­ver­se-rea­dy networks

SANTA CLARA, Calif. 05/11/2022 AMD (NASDAQAMD) today announ­ced that its Xilinx® Zynq® UltraS­ca­le+™ RFSoC has enab­led the deve­lo­p­ment of mul­ti­ple Even­star radio units (RUs) to expand 4G/5G glo­bal mobi­le net­work infra­struc­tu­re. As the demand for inter­net con­nec­ti­vi­ty con­ti­nues to grow at a rapid pace, the infra­struc­tu­re that sup­ports it needs to keep pace and impro­ve. The Even­star pro­gram led by Meta Con­nec­ti­vi­ty is a col­la­bo­ra­ti­ve initia­ti­ve bet­ween ope­ra­tors and tech­no­lo­gy part­ners to build adap­ta­ble, effi­ci­ent, and meta­ver­se-rea­dy radio access net­work (RAN) refe­rence designs for 4G and 5G net­works in the Open RAN eco­sys­tem. (…) Wei­ter­le­sen »

AMD Receives All Necessary Approvals for Proposed Acquisition of Xilinx

Tran­sac­tion expec­ted to clo­se on or about Febru­ary 14, 2022
SILICON VALLEY, Calif., Feb. 10, 2022 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) today announ­ced that it has recei­ved appr­oval from all neces­sa­ry aut­ho­ri­ties to pro­ceed with the acqui­si­ti­on of Xilinx, Inc. (NASDAQ: XLNX).

With the excep­ti­on of the remai­ning cus­to­ma­ry clo­sing con­di­ti­ons, all con­di­ti­ons to the tran­sac­tion clo­sing have been satis­fied and the com­pa­ny expects the tran­sac­tion to clo­se on or about Febru­ary 14, 2022 (…) Wei­ter­le­sen »

Übernahme von Xilinx durch AMD vor Vollzug

Bereits in der letz­ten Woche hat mit der chi­ne­si­schen Sta­te Admi­nis­tra­ti­on for Mar­ket Regu­la­ti­on (SAMR) die letz­te Regu­lie­rungs­be­hör­de unter Auf­la­gen der Über­nah­me von Xilinx durch AMD zuge­stimmt. Nun ste­hen dem Voll­zug nur noch tech­ni­sche Regu­la­ri­en ent­ge­gen, so dass die Über­nah­me aller Vor­aus­sicht nach spä­tes­tens nach Ablauf des 9. Febru­ars geneh­migt wird. (…) Wei­ter­le­sen »

Xilinx Reports Record Revenue of $1.01 Billion in Fiscal Third Quarter

  • Record reve­nue of $1,011 mil­li­on, repre­sen­ting 8% sequen­ti­al growth and 26% year-over-year growth, despi­te ongo­ing indus­try-wide sup­p­ly constraints
  • Data Cen­ter Group (DCG) achie­ved record reve­nue with sequen­ti­al growth of 28% and 81% year-over-year, dri­ven by Com­pu­te and Net­wor­king strength
  • Aero­space & Defen­se, Indus­tri­al and Test, Mea­su­re­ment & Emu­la­ti­on (AIT) reve­nue was also a record, incre­asing 21% sequen­ti­al­ly and 28% year-over-year, dri­ven by record A&D reve­nue and con­tin­ued strength in ISM and TME end markets
  • Auto­mo­ti­ve, Broad­cast and Con­su­mer (ABC) reve­nue in the quar­ter decreased 4% sequen­ti­al­ly coming off a record Q2 and lar­ge­ly in-line with expec­ta­ti­ons; reve­nue increased 28% year-over-year
  • Wired and Wire­less Group (WWG) reve­nue decreased 18% sequen­ti­al­ly and increased 1% year-over-year as sup­p­ly cons­traints had a signi­fi­cant impact on busi­ness in the quarter
  • Plat­form trans­for­ma­ti­on con­ti­nues with total Adap­ti­ve SoC reve­nue, which includes Zynq and Ver­sal plat­forms, up 5% sequen­ti­al­ly and 30% year-over-year, and repre­sen­ting 28% of total revenue

SAN JOSE, Calif.–(BUSINESS WIRE)–Jan. 26, 2022– Xilinx, Inc. (Nasdaq: XLNX), the lea­der in adap­ti­ve com­pu­ting, today announ­ced record reve­nues of $1,011 mil­li­on for the fis­cal third quar­ter, up 8% over the pre­vious quarter.

GAAP net inco­me for the fis­cal third quar­ter was $300 mil­li­on, or $1.19 per diluted share. Non-GAAP net inco­me for the quar­ter was $325 mil­li­on, or $1.29 per diluted share.

As per­mit­ted by the terms of the Mer­ger Agree­ment bet­ween Xilinx and Advan­ced Micro Devices, Inc. (AMD), the Xilinx Board of Direc­tors voted unani­mously to decla­re a cash divi­dend of $0.37 per out­stan­ding share of com­mon stock paya­ble on Febru­ary 14, 2022 to all stock­hol­ders of record at the clo­se of busi­ness on Febru­ary 7, 2022. The divi­dend is con­di­tio­ned upon and will only be paya­ble if the mer­ger has not clo­sed on or befo­re the record date for such divi­dend. (…) Wei­ter­le­sen »

AMD and Xilinx Provide Update Regarding Expected Timing of Acquisition Close

SILICON VALLEY, Calif., Dec. 30, 2021 (GLOBE NEWSWIRE) — AMD (NASDAQ: AMD) and Xilinx, Inc. (NASDAQ: XLNX) today released the fol­lo­wing state­ment rela­ted to the sta­tus of glo­bal regu­la­to­ry appr­ovals for AMD’s pro­po­sed acqui­si­ti­on of Xilinx.

We con­ti­nue making good pro­gress on the requi­red regu­la­to­ry appr­ovals to clo­se our tran­sac­tion. While we had pre­vious­ly expec­ted that we would secu­re all appr­ovals by the end of 2021, we have not yet com­ple­ted the pro­cess and we now expect the tran­sac­tion to clo­se in the first quar­ter of 2022. Our con­ver­sa­ti­ons with regu­la­tors con­ti­nue to pro­gress pro­duc­tively, and we expect to secu­re all requi­red appr­ovals.” (…) Wei­ter­le­sen »

Teamredminer ermöglicht nun Ethereum-Mining via Xilinx FPGAs

Eigent­lich woll­te die Kryp­to­wäh­rung Ethe­re­um, die zweit­größ­te nach Bit­co­in, längst von Pro­of-of-Work (PoW) auf Pro­of-of-Sta­ke (PoS) umge­stellt haben, doch das wird so schnell nichts wer­den, was schlecht ist für den Gra­fik­kar­ten-Markt. Inter­es­sant in die­sem Zusam­men­hang ist ein neu­es Release der Team­red­mi­ner-Ent­wick­ler: Major new release now adding sup­port for FPGA ethash mining. (…) Wei­ter­le­sen »

Xilinx Launches Alveo U55C, Its Most Powerful Accelerator Card Ever, Purpose-Built for HPC and Big Data Workloads

Breakthrough HPC clustering solution and simplified programmability enable massive scale-out of cutting-edge compute across existing customer infrastructure and network

ST. LOUIS–(BUSINESS WIRE)–SC21  Xilinx, Inc. (NASDAQ: XLNX), the lea­der in adap­ti­ve com­pu­ting, today at the SC21 super­com­pu­ting con­fe­rence intro­du­ced the Alveo™ U55C data cen­ter acce­le­ra­tor card and a new stan­dards-based, API-dri­ven clus­te­ring solu­ti­on for deploy­ing FPGAs at mas­si­ve sca­le. The Alveo U55C acce­le­ra­tor brings supe­ri­or per­for­mance-per-watt to high per­for­mance com­pu­ting (HPC) and data­ba­se workloads and easi­ly sca­les through the Xilinx® HPC clus­te­ring solution.

Pur­po­se-built for HPC and big data workloads, the new Alveo U55C card is the company’s most powerful Alveo acce­le­ra­tor card ever, offe­ring the hig­hest com­pu­te den­si­ty and HBM capa­ci­ty in the Alveo acce­le­ra­tor port­fo­lio. Tog­e­ther with the new Xilinx RoCE v2-based clus­te­ring solu­ti­on, a broad spec­trum of cus­to­mers with lar­ge-sca­le com­pu­te workloads can now imple­ment powerful FPGA-based HPC clus­te­ring using their exis­ting data cen­ter infra­struc­tu­re and net­work. (…) Wei­ter­le­sen »