Schlagwort: Octavo Systems

Octavo Systems Releases the OSDZU3-REF Development Platform for the AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Verfasst vonpipin

Hous­ton, Texas, United Sta­tes (March 1, 2023) – Octa­vo Sys­tems LLC, a lea­ding pro­vi­der of Sys­tem-in-Packa­ge (SiP) solu­ti­ons, has offi­ci­al­ly released its latest offe­ring, the OSDZU3-REF Deve­lo­p­ment Plat­form. This plat­form gives sys­tem desi­gners a com­pre­hen­si­ve deve­lo­p­ment envi­ron­ment for eva­lua­ting, test­ing, and start­ing pro­duct deve­lo­p­ment using the OSDZU3 Sys­tem-in-Packa­ge (SiP). (…) Wei­ter­le­sen »

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Verfasst vonpipin

Hous­ton, Texas, United Sta­tes (March 24, 2022) – Octa­vo Sys­tems, the lea­der in mass mar­ket Sys­tem-in-Packa­ge (SiP) solu­ti­ons, today announ­ced a new fami­ly of SiP devices based on the AMD Xilinx® Zynq® UltraS­ca­le+™ MPSoC Archi­tec­tu­re. The OSDZU3, based on the ZU3, pro­vi­des the bene­fits of Sys­tem-in-Packa­ge while deli­ve­ring the per­for­mance and fle­xi­bi­li­ty expec­ted from the Zynq UltraS­ca­le+ architecture.

The OSDZU3 lever­a­ges Inte­gra­ted Cir­cuit manu­fac­tu­ring tech­no­lo­gy to integrate:

  • AMD-Xilinx Zynq UltraS­ca­le+ MPSoC ZU3
  • A Com­ple­te and Fle­xi­ble Power System
  • LPDDR4
  • EEPROM
  • QSPI
  • MEMS Oscil­la­tors
  • Over one hundred passives
  • All into a sin­gle 20.5mm x 40mm BGA

(…) Wei­ter­le­sen »