Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous짯ton, Texas, United Sta짯tes (March 24, 2022)  Octa짯vo Sys짯tems, the lea짯der in mass mar짯ket Sys짯tem-in-Packa짯ge (SiP) solu짯ti짯ons, today announ짯ced a new fami짯ly of SiP devices based on the AMD Xilinx짰 Zynq짰 UltraS짯ca짯le+꽓 MPSoC Archi짯tec짯tu짯re. The OSDZU3, based on the ZU3, pro짯vi짯des the bene짯fits of Sys짯tem-in-Packa짯ge while deli짯ve짯ring the per짯for짯mance and fle짯xi짯bi짯li짯ty expec짯ted from the Zynq UltraS짯ca짯le+ architecture.

The OSDZU3 lever짯a짯ges Inte짯gra짯ted Cir짯cuit manu짯fac짯tu짯ring tech짯no짯lo짯gy to integrate:

  • AMD-Xilinx Zynq UltraS짯ca짯le+ MPSoC ZU3
  • A Com짯ple짯te and Fle짯xi짯ble Power System
  • LPDDR4
  • QSPI
  • MEMS Oscil짯la짯tors
  • Over one hundred passives
  • All into a sin짯gle 20.5mm x 40mm BGA

The OSDZU3 is about 60% smal짯ler than an equi짯va짯lent sys짯tem design with dis짯crete com짯pon짯ents. 쏷he inte짯gra짯ti짯on not only makes the OSDZU3 per짯fect for any짯bo짯dy con짯cer짯ned about the Size, Weight, and Power (SWaP) of their pro짯duct, it is also ide짯al for any짯bo짯dy loo짯king to move quick짯ly through their design, says Greg Sher짯i짯dan, VP Stra짯tegy and Mar짯ke짯ting at Octa짯vo Sys짯tems. 쏳emo짯ving the need to design com짯pli짯ca짯ted power sys짯tems or DDR has saved our cus짯to짯mers upwards of 9 months of design.

The OSDZU3 pro짯vi짯des access to all the inter짯faces and fea짯tures on the ZU3. The 1mm pitch 600 pin ball map pro짯vi짯des access to every I/O on the ZU3 in just 2 PCB lay짯ers using low-cost design rules. The power sys짯tem also allows the desi짯gner to levera짯ge all the power modes the ZU3 supports.

OSDZU3 2 Lay짯er Escape Top Layer
OSDZU3 2 Lay짯er Escape Bot짯tom Layer

Sys짯tem-level solu짯ti짯ons are incre짯asing짯ly important to our cus짯to짯mers, as they seek to deploy cut짯ting-edge embedded com짯pu짯ting and machi짯ne lear짯ning capa짯bi짯li짯ties within incre짯asing짯ly com짯pres짯sed deve짯lo짯p짯ment time짯frames, said Han짯ne짯ke Kre짯kels, vice pre짯si짯dent of Core Ver짯ti짯cal Mar짯kets, Adap짯ti짯ve & Embedded Com짯pu짯ting Group, AMD. 쏧n-line with the짯se objec짯ti짯ves, we have work짯ed clo짯se짯ly with Octa짯vo Sys짯tems to bring the first Sys짯tem-in-Packa짯ge solu짯ti짯on based on the powerful Zynq UltraS짯ca짯le+ MPSoC. This offe짯ring enables our users to acce짯le짯ra짯te inno짯va짯ti짯on and sim짯pli짯fy sys짯tem design for the most size cons짯trai짯ned applications.

The OSDZU3 is com짯pa짯ti짯ble with the AMD-Xilinx deve짯lo짯p짯ment tools, Xilinx Viv짯a짯do Design Suite and Xilinx Vitis uni짯fied soft짯ware plat짯form. Octa짯vo Sys짯tems work짯ed clo짯se짯ly with Design짯Linx, an AMD-Xilinx Pre짯mier Design Ser짯vice Part짯ner, to deve짯lop the base soft짯ware plat짯form nee짯ded to ensu짯re the SiP inte짯gra짯tes into the stan짯dard AMD-Xilinx tool flow. 쏬ever짯aging our deep know짯ledge of FPGA and Embedded Soft짯ware design, we work짯ed with Octa짯vo to ensu짯re the OSDZU3 works seam짯less짯ly in the stan짯dard AMD-Xilinx deve짯lo짯p짯ment flows. This enables users to take advan짯ta짯ge of the SiP in an envi짯ron짯ment they are com짯for짯ta짯ble with. This expe짯ri짯ence allows us to acce짯le짯ra짯te our mutu짯al customer셲 pro짯grams using the OSDZU3 SiP, says Bri짯an Mul짯hearn, Direc짯tor of Embedded Solu짯ti짯ons, DesignLinx.

Accom짯pany짯ing the OSDZU3 Sys짯tem-in-Packa짯ge, Octa짯vo Sys짯tems will be releasing the OSDZU3-REF refe짯rence plat짯form. It fea짯tures popu짯lar inter짯faces like USB멌, USB 3.0, SATA Host, 1Gb Ether짯net, and an FMC LP Con짯nec짯tor. It also sup짯ports dis짯plays through Dis짯play Port and a LVDS touch dis짯play con짯nec짯tor. It will ship with a Peta짯Li짯nux Dis짯tri짯bu짯ti짯on and demos that are also deve짯lo짯ped by DesignLinx.

Octa짯vo Sys짯tems has also fran짯chised Avnet as a glo짯bal dis짯tri짯bu짯tor to sup짯port the roll out and adop짯ti짯on of the new OSDZU3 System-in-Package.


Octa짯vo Sys짯tems has Engi짯nee짯ring Samples available today through their Beta Pro짯gram. Design engi짯neers who are inte짯res짯ted in gai짯ning access to the Beta pro짯gram can cont짯act their local Avnet, Octa짯vo Sys짯tems, or AMD-Xilinx sales representative.

The refe짯rence plat짯form will be available to the gene짯ral mar짯ket in Q3 CY2022 and the OSDZU3 will be in pro짯duc짯tion by the end of CY2022.