Schlagwort: AMD Xilinx

AMD Robotics Starter Kit Kick-Starts the Intelligent Factory of the Future

  • Kria KR260 Star­ter Kit enables rapid deve­lo­p­ment of hard­ware-acce­le­ra­ted appli­ca­ti­ons for robo­tics and indus­tri­al automation —
  • Deli­vers near­ly 5X pro­duc­ti­vi­ty gain, up to 8X bet­ter performance/watt and 3.5X lower laten­cy com­pared to com­pe­ti­ti­ve GPU-based solutions —

SANTA CLARA, Calif., May 17, 2022 — Today AMD (NASDAQ: AMD) announ­ced the Kria™ KR260 Robo­tics Star­ter Kit, the latest addi­ti­on to the Kria port­fo­lio of adap­ti­ve sys­tem-on-modu­les (SOMs) and deve­lo­per kits. A sca­lable and out-of-the-box deve­lo­p­ment plat­form for robo­tics, the Kria KR260 offers a seam­less path to pro­duc­tion deploy­ment with the exis­ting Kria K26 adap­ti­ve SOMs. With nati­ve ROS 2 sup­port, the stan­dard frame­work for robo­tics appli­ca­ti­on deve­lo­p­ment, and pre-built inter­faces for robo­tics and indus­tri­al solu­ti­ons, the new SOM star­ter kit enables rapid deve­lo­p­ment of hard­ware-acce­le­ra­ted appli­ca­ti­ons for robo­tics, machi­ne visi­on and indus­tri­al com­mu­ni­ca­ti­on and con­trol. (…) Wei­ter­le­sen »

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous­ton, Texas, United Sta­tes (March 24, 2022) – Octa­vo Sys­tems, the lea­der in mass mar­ket Sys­tem-in-Packa­ge (SiP) solu­ti­ons, today announ­ced a new fami­ly of SiP devices based on the AMD Xilinx® Zynq® UltraS­ca­le+™ MPSoC Archi­tec­tu­re. The OSDZU3, based on the ZU3, pro­vi­des the bene­fits of Sys­tem-in-Packa­ge while deli­ve­ring the per­for­mance and fle­xi­bi­li­ty expec­ted from the Zynq UltraS­ca­le+ architecture.

The OSDZU3 lever­a­ges Inte­gra­ted Cir­cuit manu­fac­tu­ring tech­no­lo­gy to integrate:

  • AMD-Xilinx Zynq UltraS­ca­le+ MPSoC ZU3
  • A Com­ple­te and Fle­xi­ble Power System
  • LPDDR4
  • EEPROM
  • QSPI
  • MEMS Oscil­la­tors
  • Over one hundred passives
  • All into a sin­gle 20.5mm x 40mm BGA

(…) Wei­ter­le­sen »