Hous­ton, Texas, United Sta­tes (March 24, 2022) – Octa­vo Sys­tems, the lea­der in mass mar­ket Sys­tem-in-Packa­ge (SiP) solu­ti­ons, today announ­ced a new fami­ly of SiP devices based on the AMD Xilinx® Zynq® UltraS­ca­le+™ MPSoC Archi­tec­tu­re. The OSDZU3, based on the ZU3, pro­vi­des the bene­fits of Sys­tem-in-Packa­ge while deli­ve­ring the per­for­mance and fle­xi­bi­li­ty expec­ted from the Zynq UltraS­ca­le+ architecture.

The OSDZU3 lever­a­ges Inte­gra­ted Cir­cuit manu­fac­tu­ring tech­no­lo­gy to integrate:

AMD-Xilinx Zynq UltraS­ca­le+ MPSoC ZU3 A Com­ple­te and Fle­xi­ble Power System LPDDR4 EEPROM QSPI MEMS Oscil­la­tors Over one hundred passives All into a sin­gle 20.5mm x 40mm BGA

(…) Wei­ter­le­sen »