Schlagwort: SIP

Octavo Systems Announces AMD-Xilinx Zynq UltraScale+ MPSoC System-in-Package

Hous짯ton, Texas, United Sta짯tes (March 24, 2022)  Octa짯vo Sys짯tems, the lea짯der in mass mar짯ket Sys짯tem-in-Packa짯ge (SiP) solu짯ti짯ons, today announ짯ced a new fami짯ly of SiP devices based on the AMD Xilinx짰 Zynq짰 UltraS짯ca짯le+꽓 MPSoC Archi짯tec짯tu짯re. The OSDZU3, based on the ZU3, pro짯vi짯des the bene짯fits of Sys짯tem-in-Packa짯ge while deli짯ve짯ring the per짯for짯mance and fle짯xi짯bi짯li짯ty expec짯ted from the Zynq UltraS짯ca짯le+ architecture.

The OSDZU3 lever짯a짯ges Inte짯gra짯ted Cir짯cuit manu짯fac짯tu짯ring tech짯no짯lo짯gy to integrate:

  • AMD-Xilinx Zynq UltraS짯ca짯le+ MPSoC ZU3
  • A Com짯ple짯te and Fle짯xi짯ble Power System
  • LPDDR4
  • EEPROM
  • QSPI
  • MEMS Oscil짯la짯tors
  • Over one hundred passives
  • All into a sin짯gle 20.5mm x 40mm BGA

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