AMD Unveils the Most Powerful AMD Radeon PRO Graphics Cards, Offering Unique Features and Leadership Performance to Tackle Heavy to Extreme Professional Workloads

The AMD Rade짯on PRO W7000 Series are the first pro짯fes짯sio짯nal gra짯phics cards built on the advan짯ced AMD chip짯let design, and the first to offer Dis짯play짯Po짯rt 2.1, pro짯vi짯ding 3X the maxi짯mum total data rate com짯pared to Dis짯play짯Po짯rt 1.41 

 Flag짯ship AMD Rade짯on PRO W7900 gra짯phics card deli짯vers 1.5X fas짯ter geo짯me짯an per짯for짯mance2 and pro짯vi짯des 1.5X more memo짯ry than the pre짯vious generation 

SANTA CLARA, Calif., April 13, 2023 (GLOBE NEWSWIRE)  AMD (NASDAQ: AMD) today announ짯ced the AMD Rade짯on꽓 PRO W7000 Series gra짯phics, its most-powerful work짯sta짯tion gra짯phics cards to date. The AMD Rade짯on꽓 PRO W7900 and AMD Rade짯on꽓 PRO W7800 gra짯phics cards are built on ground짯brea짯king AMD RDNA꽓 3 archi짯tec짯tu짯re, deli짯ve짯ring signi짯fi짯cant짯ly hig짯her per짯for짯mance than the pre짯vious gene짯ra짯ti짯on and excep짯tio짯nal per짯for짯mance-per-dol짯lar com짯pared to the com짯pe짯ti짯ti짯ve offe짯ring. The new gra짯phics cards are desi짯gned for pro짯fes짯sio짯nals to crea짯te and work with high-poly짯gon count models seam짯less짯ly, deli짯ver incre짯di짯ble image fide짯li짯ty and color accu짯ra짯cy, and run gra짯phics and com짯pu짯te-based appli짯ca짯ti짯ons con짯curr짯ent짯ly wit짯hout dis짯rup짯ti짯on to workflows.

AMD Rade짯on PRO W7000 Series gra짯phics cards fea짯ture the world셲 first work짯sta짯tion GPU archi짯tec짯tu짯re based on AMD셲 advan짯ced chip짯let design, pro짯vi짯ding real-world mul짯ti-tas짯king per짯for짯mance and incre짯di짯ble power effi짯ci짯en짯cy. The new gra짯phics cards are also the first pro짯fes짯sio짯nal work짯sta짯tion GPUs to offer the new AMD Radi짯ance Dis짯play Engi짯ne꽓 fea짯turing Dis짯play짯Po짯rt꽓 2.1 that deli짯vers a supe짯ri짯or visu짯al expe짯ri짯ence, hig짯her reso짯lu짯ti짯ons and more available colors than ever before.

The AMD Rade짯on PRO W7900 gra짯phics card, desi짯gned for extre짯me workloads, fea짯tures 61 TFLOPS (FP32) peak sin짯gle pre짯cis짯i짯on per짯for짯mance, offe짯ring 1.5X hig짯her geo짯me짯an per짯for짯mance on the SPECview짯perf 2020 bench짯mark. It also includes 48GB of GDDR6 memo짯ry, which is 1.5X lar짯ger memo짯ry capa짯ci짯ty than the 32GB available on the pre짯vious-gene짯ra짯ti짯on gra짯phics card. Crea짯ted for hea짯vy workloads, the AMD Rade짯on PRO W7800 gra짯phics card fea짯tures 45 TFLOPS (FP32) peak sin짯gle pre짯cis짯i짯on per짯for짯mance and 32GB of GDDR6 memory.

The new AMD Rade짯on PRO W7000 Series are the most powerful gra짯phics cards AMD has built to date, pro짯vi짯ding pro짯fes짯sio짯nals, crea짯tors and artists with excep짯tio짯nal per짯for짯mance and value to dri짯ve the most deman짯ding pro짯fes짯sio짯nal design and crea짯ti짯ve appli짯ca짯ti짯ons, said Scott Her짯kel짯man, seni짯or vice pre짯si짯dent and gene짯ral mana짯ger, Gra짯phics Busi짯ness Unit at AMD. 쏷he AMD Rade짯on PRO W7900 and W7800 Series gra짯phics cards are built to deli짯ver incre짯di짯ble per짯for짯mance and relia짯bi짯li짯ty in pro짯fes짯sio짯nal appli짯ca짯ti짯ons, while pro짯vi짯ding color-cri짯ti짯cal accu짯ra짯cy and an incre짯di짯ble visu짯al expe짯ri짯ence. The AMD Rade짯on PRO W7000 Series gra짯phics cards give pro짯fes짯sio짯nals the abili짯ty to tack짯le lar짯ger pro짯jects, ren짯der fas짯ter and crea짯te more com짯plex models loa짯ded with more pixels, more poly짯gons, and more textures.

AMD Rade짯on PRO W7000 Series work짯sta짯tion gra짯phics cards are desi짯gned to help pro짯fes짯sio짯nals meet high-pres짯su짯re dead짯lines under incre짯asing짯ly tight bud짯gets while deli짯ve짯ring world-class results. Key fea짯tures include:

  • AMD RDNA 3 Archi짯tec짯tu짯re  New com짯pu짯te units share resour짯ces bet짯ween ren짯de짯ring, AI, and ray짯tra짯cing to make the most effec짯ti짯ve use of each tran짯sis짯tor, offe짯ring appro짯xi짯m짯ate짯ly 50% more ray짯tra짯cing per짯for짯mance per com짯pu짯te unit than the pre짯vious gene짯ra짯ti짯on3. AMD RDNA 3 archi짯tec짯tu짯re also fea짯tures opti짯miza짯ti짯ons for AEC, D&M, and M&E work짯flows for ren짯de짯ring, video editing, and mul짯ti짯tas짯king.
  • Advan짯ced Chip짯let Design  The world셲 first work짯sta짯tion GPUs with a chip짯let design pro짯vi짯de hig짯her per짯for짯mance and grea짯ter effi짯ci짯en짯cy than the pre짯vious gene짯ra짯ti짯on. It includes the new 5nm Gra짯phics Com짯pu짯te Die (GCD) that pro짯vi짯des the core GPU func짯tion짯a짯li짯ty. It also includes six new 6nm Memo짯ry Cache Die (MCD), each with second-gene짯ra짯ti짯on AMD Infi짯ni짯ty Cache꽓 technology.
  • Dedi짯ca짯ted AI Acce짯le짯ra짯ti짯on and Second-Gene짯ra짯ti짯on Ray짯tra짯cing  New AI ins짯truc짯tions and increased AI through짯put deli짯ver over 2X more per짯for짯mance than the pre짯vious AMD RDNA 2 archi짯tec짯tu짯re4, while second-gene짯ra짯ti짯on ray짯tra짯cing tech짯no짯lo짯gy deli짯vers signi짯fi짯cant짯ly hig짯her per짯for짯mance than the pre짯vious gene짯ra짯ti짯on5.
  • Up To 48 GDDR6 Memo짯ry  Allows pro짯fes짯sio짯nals and crea짯tors to work with the lar짯gest 3D models and envi짯ron짯ments, edit and lay짯er com짯plex time짯lines using the latest digi짯tal cine짯ma came짯ras for짯mats and ren짯der pho짯to짯rea짯li짯stic, ray짯tra짯ced images with unpar짯al짯le짯led qua짯li짯ty. Pro짯fes짯sio짯nal appli짯ca짯ti짯ons that can take advan짯ta짯ge of the lar짯ger frame짯buf짯fer include Ado짯be Pre짯mie짯re짰 Pro & After Effects짰, Auto짯desk 3ds Max짰 & Maya짰, Blen짯der짰, Boris FX짰 Sap짯phi짯re꽓, Das짯sault Sys짯t챔짯mes짰 SOLIDWORKS짰 Visua짯li짯ze, DaVin짯ci짰 Resol짯ve, Lumion꽓, Maxon짰 Reds짯hift꽓, and many more.
  • AMD Radi짯ance Dis짯play Engi짯ne with Dis짯play짯Po짯rt 2.1  Sup짯ports the hig짯hest reso짯lu짯ti짯ons and over 68 bil짯li짯on colors, and offers sup짯port for hig짯her refresh rate dis짯plays com짯pared to AMD RDNA 2 archi짯tec짯tu짯re and cur짯rent com짯pe짯ti짯ti짯ve offe짯rings. Dis짯play out짯puts sup짯port next-gene짯ra짯ti짯on dis짯plays and mul짯ti-moni짯tor con짯fi짯gu짯ra짯ti짯on opti짯ons, crea짯ting an ultra-immersi짯ve visu짯al environment.
  • AV1 Encode/Decode  Dual encode/decode media engi짯nes unlock new mul짯ti-media expe짯ri짯en짯ces with full AV1 encode/decode sup짯port desi짯gned for high reso짯lu짯ti짯ons, wide color gamut, and high-dyna짯mic ran짯ge enhance짯ments6.
  • Excep짯tio짯nal Work짯sta짯tion Per짯for짯mance  The AMD Rade짯on PRO W7000 Series gra짯phics cards com짯pli짯ment the AMD Ryzen꽓 Thre짯ad짯rip짯per꽓 PRO pro짯ces짯sors by pro짯vi짯ding the hor짯se짯power neces짯sa짯ry to hand짯le deman짯ding crea짯ti짯ve, pro짯duc짯tion and visua짯liza짯ti짯on workloads quick짯ly and effi짯ci짯ent짯ly. AMD Rade짯on PRO Series work짯sta짯tion gra짯phics and Ryzen Thre짯ad짯rip짯per PRO pro짯ces짯sors pro짯vi짯de excep짯tio짯nal per짯for짯mance, relia짯bi짯li짯ty, and sta짯bi짯li짯ty to power mis짯si짯on-cri짯ti짯cal pro짯fes짯sio짯nal applications.
  • Opti짯mi짯zed Dri짯ver Per짯for짯mance  All AMD Rade짯on PRO work짯sta짯tion gra짯phics are sup짯port짯ed by AMD Soft짯ware: PRO Edi짯ti짯on, which pro짯vi짯des a modern and intui짯ti짯ve user inter짯face. Rade짯on PRO Image Boost ren짯ders visu짯als hig짯her than a display셲 nati짯ve reso짯lu짯ti짯on to opti짯mi짯ze image qua짯li짯ty and reso짯lu짯ti짯on, while Rade짯on PRO View짯port Boost dyna짯mi짯cal짯ly adjus짯ts view짯port reso짯lu짯ti짯on, boos짯ting frame짯ra짯tes and navi짯ga짯ti짯on per짯for짯mance in sel짯ect appli짯ca짯ti짯ons7.
  • Cer짯ti짯fied for lea짯ding pro짯fes짯sio짯nal appli짯ca짯ti짯ons  AMD con짯ti짯nues to work with lea짯ding pro짯fes짯sio짯nal soft짯ware appli짯ca짯ti짯on ven짯dors on a com짯pre짯hen짯si짯ve appli짯ca짯ti짯on cer짯ti짯fi짯ca짯ti짯on pro짯gram, and to ensu짯re AMD Rade짯on꽓 PRO gra짯phics cards are built for deman짯ding 24/7 envi짯ron짯ments and tes짯ted to meet excep짯tio짯nal stan짯dards, deli짯ve짯ring the ide짯al balan짯ce of per짯for짯mance and sta짯bi짯li짯ty. The list of cer짯ti짯fied appli짯ca짯ti짯ons can be found on the AMD web짯site

Pro짯duct Specifications

Models Workloads Com짯pu짯te Units TFLOPS
(Peak Sin짯gle Precision)
Memo짯ry Bandwidth Memo짯ry Interface Dis짯play Outputs
(up to 80 Gbit/s
max total bandwidth)
AMD Rade짯on PRO W7900 Extre짯me 96 61 (FP32) 48GB up to 864 GB/s 384-bit 3X Dis짯play짯Po짯rt꽓 2.1
1 mini-Dis짯play짯Po짯rt꽓 2.1
AMD Rade짯on PRO W7800 Hea짯vy 70 45 (FP32) 32GB up to 576 GB/s 256-bit 3X Dis짯play짯Po짯rt꽓 2.1
1 Mini-Dis짯play짯Po짯rt꽓 2.1

Pri짯cing and Availability

The AMD Rade짯on PRO W7900 fea짯tures an SEP of $3,999 USD. The AMD Rade짯on PRO W7800 fea짯tures an SEP of $2,499 USD. The AMD Rade짯on PRO W7000 Series work짯sta짯tion gra짯phics cards are expec짯ted to be available from lea짯ding etailers/retailers start짯ing in Q2, 2023. Pro짯duct avai짯la짯bi짯li짯ty in OEM and SI sys짯tems is expec짯ted in 2H 2023.

The AMD Rade짯on PRO W7000 Series work짯sta짯tion gra짯phics cards will be on dis짯play from April 16 to 19 in booth #N2158 (North Hall) at The NAB Show 2023, Las Vegas Con짯ven짯ti짯on Cen짯ter, Las Vegas, Nevada.

Sup짯port짯ing Resources

About AMD
For more than 50 years AMD has dri짯ven inno짯va짯ti짯on in high-per짯for짯mance com짯pu짯ting, gra짯phics and visua짯liza짯ti짯on tech짯no짯lo짯gies. Bil짯li짯ons of peo짯p짯le, lea짯ding For짯tu짯ne 500 busi짯nesses and cut짯ting-edge sci짯en짯ti짯fic rese짯arch insti짯tu짯ti짯ons around the world rely on AMD tech짯no짯lo짯gy dai짯ly to impro짯ve how they live, work and play. AMD employees are focu짯sed on buil짯ding lea짯der짯ship high-per짯for짯mance and adap짯ti짯ve pro짯ducts that push the boun짯da짯ries of what is pos짯si짯ble. For more infor짯ma짯ti짯on about how AMD is enab짯ling today and inspi짯ring tomor짯row, visit the AMD (NASDAQ:AMDweb짯siteblogLin짯ke짯dIn and Twit짯ter pages. 

This press release con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning Advan짯ced Micro Devices, Inc. (AMD) such as the fea짯tures, func짯tion짯a짯li짯ty, per짯for짯mance, avai짯la짯bi짯li짯ty, timing and expec짯ted bene짯fits of AMD pro짯ducts inclu짯ding the AMD Rade짯on꽓 PRO W7000 series gra짯phics cards, which are made pur짯su짯ant to the Safe Har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act of 1995. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐗ould, 쐌ay, 쐃xpects, 쐀elie짯ves, 쐏lans, 쐇ntends, 쐏ro짯jects and other terms with simi짯lar mea짯ning. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this press release are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this press release and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Such state짯ments are sub짯ject to cer짯tain known and unknown risks and uncer짯tain짯ties, many of which are dif짯fi짯cult to pre짯dict and gene짯ral짯ly bey짯ond AMD셲 con짯trol, that could cau짯se actu짯al results and other future events to dif짯fer mate짯ri짯al짯ly from tho짯se expres짯sed in, or impli짯ed or pro짯jec짯ted by, the for짯ward-loo짯king infor짯ma짯ti짯on and state짯ments. Mate짯ri짯al fac짯tors that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons include, wit짯hout limi짯ta짯ti짯on, the fol짯lo짯wing: Intel Corporation셲 domi짯nan짯ce of the micro짯pro짯ces짯sor mar짯ket and its aggres짯si짯ve busi짯ness prac짯ti짯ces; glo짯bal eco짯no짯mic uncer짯tain짯ty; cycli짯cal natu짯re of the semi짯con짯duc짯tor indus짯try; mar짯ket con짯di짯ti짯ons of the indus짯tries in which AMD pro짯ducts are sold; loss of a signi짯fi짯cant cus짯to짯mer; impact of the COVID-19 pan짯de짯mic on AMD셲 busi짯ness, finan짯cial con짯di짯ti짯on and results of ope짯ra짯ti짯ons; com짯pe짯ti짯ti짯ve mar짯kets in which AMD셲 pro짯ducts are sold; quar짯ter짯ly and sea짯so짯nal sales pat짯terns; AMD셲 abili짯ty to ade짯qua짯te짯ly pro짯tect its tech짯no짯lo짯gy or other intellec짯tu짯al pro짯per짯ty; unfa짯vorable cur짯ren짯cy exch짯an짯ge rate fluc짯tua짯tions; abili짯ty of third par짯ty manu짯fac짯tu짯r짯ers to manu짯fac짯tu짯re AMD셲 pro짯ducts on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve tech짯no짯lo짯gies; avai짯la짯bi짯li짯ty of essen짯ti짯al equip짯ment, mate짯ri짯als, sub짯stra짯tes or manu짯fac짯tu짯ring pro짯ces짯ses; abili짯ty to achie짯ve expec짯ted manu짯fac짯tu짯ring yields for AMD셲 pro짯ducts; AMD셲 abili짯ty to intro짯du짯ce pro짯ducts on a time짯ly basis with expec짯ted fea짯tures and per짯for짯mance levels; AMD셲 abili짯ty to gene짯ra짯te reve짯nue from its semi-cus짯tom SoC pro짯ducts; poten짯ti짯al secu짯ri짯ty vul짯nerabi짯li짯ties; poten짯ti짯al secu짯ri짯ty inci짯dents inclu짯ding IT outa짯ges, data loss, data brea짯ches and cyber-attacks; poten짯ti짯al dif짯fi짯cul짯ties in upgrading and ope짯ra짯ting AMD셲 new enter짯pri짯se resour짯ce plan짯ning sys짯tem; uncer짯tain짯ties invol짯ving the orde짯ring and ship짯ment of AMD셲 pro짯ducts; AMD셲 reli짯ance on third-par짯ty intellec짯tu짯al pro짯per짯ty to design and intro짯du짯ce new pro짯ducts in a time짯ly man짯ner; AMD셲 reli짯ance on third-par짯ty com짯pa짯nies for design, manu짯fac짯tu짯re and sup짯p짯ly of mother짯boards, soft짯ware and other com짯pu짯ter plat짯form com짯pon짯ents; AMD셲 reli짯ance on Micro짯soft and other soft짯ware ven짯dors sup짯port to design and deve짯lop soft짯ware to run on AMD셲 pro짯ducts; AMD셲 reli짯ance on third-par짯ty dis짯tri짯bu짯tors and add-in-board part짯ners; impact of modi짯fi짯ca짯ti짯on or inter짯rup짯ti짯on of AMD셲 inter짯nal busi짯ness pro짯ces짯ses and infor짯ma짯ti짯on sys짯tems; com짯pa짯ti짯bi짯li짯ty of AMD셲 pro짯ducts with some or all indus짯try-stan짯dard soft짯ware and hard짯ware; cos짯ts rela짯ted to defec짯ti짯ve pro짯ducts; effi짯ci짯en짯cy of AMD셲 sup짯p짯ly chain; AMD셲 abili짯ty to rely on third par짯ty sup짯p짯ly-chain logi짯stics func짯tions; AMD셲 abili짯ty to effec짯tively con짯trol sales of its pro짯ducts on the gray mar짯ket; impact of govern짯ment actions and regu짯la짯ti짯ons such as export admi짯nis짯tra짯ti짯on regu짯la짯ti짯ons, tariffs and trade pro짯tec짯tion mea짯su짯res; AMD셲 abili짯ty to rea짯li짯ze its defer짯red tax assets; poten짯ti짯al tax lia짯bi짯li짯ties; cur짯rent and future claims and liti짯ga짯ti짯on; impact of envi짯ron짯men짯tal laws, con짯flict mine짯rals-rela짯ted pro짯vi짯si짯ons and other laws or regu짯la짯ti짯ons; impact of acqui짯si짯ti짯ons, joint ven짯tures and/or invest짯ments, inclu짯ding acqui짯si짯ti짯ons of Xilinx and Pen짯san짯do, on AMD셲 busi짯ness and AMD셲 abili짯ty to inte짯gra짯te acqui짯red busi짯nesses; impact of any impair짯ment of the com짯bi짯ned company셲 assets on the com짯bi짯ned company셲 finan짯cial posi짯ti짯on and results of ope짯ra짯ti짯on; rest짯ric짯tions impo짯sed by agree짯ments gover짯ning AMD셲 notes, the gua짯ran짯tees of Xilinx셲 notes and the revol짯ving cre짯dit faci짯li짯ty; AMD셲 indeb짯ted짯ness; AMD셲 abili짯ty to gene짯ra짯te suf짯fi짯ci짯ent cash to meet its working capi짯tal requi짯re짯ments or gene짯ra짯te suf짯fi짯ci짯ent reve짯nue and ope짯ra짯ting cash flow to make all of its plan짯ned R&D or stra짯te짯gic invest짯ments; poli짯ti짯cal, legal, eco짯no짯mic risks and natu짯ral dis짯as짯ters; future impairm짯ents of good짯will and tech짯no짯lo짯gy licen짯se purcha짯ses; AMD셲 abili짯ty to attract and retain qua짯li짯fied per짯son짯nel; AMD셲 stock pri짯ce vola짯ti짯li짯ty; and world짯wi짯de poli짯ti짯cal con짯di짯ti짯ons. Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in AMD셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to AMD셲 most recent reports on Forms 10멚 and 10멡.

짤2023 Advan짯ced Micro Devices, Inc. All rights reser짯ved. AMD, the AMD Arrow logo, Rade짯on, AMD Infi짯ni짯ty Cache, AMD RDNA, Ryzen, Thre짯ad짯rip짯per and com짯bi짯na짯ti짯ons the짯reof are trade짯marks of Advan짯ced Micro Devices, Inc. Dis짯play짯Po짯rt꽓 and the Dis짯play짯Po짯rt꽓 logo are trade짯marks owned by the Video Elec짯tro짯nics Stan짯dards Asso짯cia짯ti짯on (VESA짰) in the United Sta짯tes and other count짯ries. SPEC짰 and SPECview짯perf짰 are regis짯tered trade짯marks of the Stan짯dard Per짯for짯mance Eva짯lua짯ti짯on Cor짯po짯ra짯ti짯on. All other pro짯duct names used in this publi짯ca짯ti짯on are for iden짯ti짯fi짯ca짯ti짯on pur짯po짯ses only and may be trade짯marks of their respec짯ti짯ve companies.

The infor짯ma짯ti짯on con짯tai짯ned her짯ein is for infor짯ma짯tio짯nal pur짯po짯ses only and is sub짯ject to chan짯ge wit짯hout noti짯ce. Time짯lines, road짯maps, and/or pro짯duct release dates shown in this Press Release are plans only and sub짯ject to change.

Geor짯ge Millington
AMD Communications
(408) 5477481

Suresh Bhas짯ka짯ran
AMD Inves짯tor Relations
(408) 7492845


1 Dis짯play Port cla짯im Based on VESA Dis짯play짯Po짯rt 2.1 spe짯ci짯fi짯ca짯ti짯ons details.RPW-426
2 1.5x fas짯ter cla짯im Test짯ing as of Febru짯ary 16, 2023 by AMD Per짯for짯mance Labs on a test sys짯tem com짯pri짯sed of an AMD Ryzen Thre짯ad짯rip짯per PRO 5975WX, 64GB DDR4-2133Mhz RAM, Win짯dows짰 11 Pro build 22621, 64-bit, AMD Rade짯on꽓 PRO Soft짯ware 31.0.14001.45012 with AMD Rade짯on꽓 PRO W7900, W6800 at 1920x1080 dis짯play reso짯lu짯ti짯on. Bench짯mark Appli짯ca짯ti짯on: SPECview짯perf 2020 V3.1 (Geo짯me짯an across 3ds짯max-07, catia6, creo-03, ener짯gy-03, maya-06, medi짯cal-03, snx-04, solidworks-07)Additional infor짯ma짯ti짯on about the SPEC bench짯marks can be found at짰 and SPECview짯perf짰 are regis짯tered trade짯marks of the Stan짯dard Per짯for짯mance Eva짯lua짯ti짯on Cor짯po짯ra짯ti짯on. Results may vary.RPW-413
3 50% more RAYTRACING per짯for짯mance per CU Based on Novem짯ber 2022 AMD inter짯nal per짯for짯mance lab mea짯su짯re짯ment of rays with indi짯rect calls on W7900 GPU vs. W6800 GPU. RPW-428
4 RPW-429: 쐕p to 2.7x AI acce짯le짯ra짯ti짯on Based on AMD inter짯nal mea짯su짯re짯ments, Novem짯ber 2022, com짯pa짯ring the Rade짯on PRO W7900 at 2.5GHz boost clock with 96 CUs issuing 2X the Bfloat16 math ope짯ra짯ti짯ons per clocks vs. the W6800 GPU at 2.25 GHz boost clock and 80 Cus issue 1X the Bfloat16 math ope짯ra짯ti짯ons per clock.
5 RPW-428: 50% more RAYTRACING per짯for짯mance per CU Based on Novem짯ber 2022 AMD inter짯nal per짯for짯mance lab mea짯su짯re짯ment of rays with indi짯rect calls on W7900 GPU vs. W6800 GPU.
6 GD-176: Video codec acce짯le짯ra짯ti짯on (inclu짯ding at least the HEVC (H.265), H.264, VP9, and AV1 codecs) is sub짯ject to and not ope짯ra짯ble wit짯hout inclusion/installation of com짯pa짯ti짯ble media play짯ers. GD-176
7 AMD Rade짯on꽓 View짯port Boost is curr짯ent짯ly com짯pa짯ti짯ble with Auto짯desk 3ds Max짰, Auto짯desk Revit짰, and Epic Twin짯mo짯ti짯on짰 pro짯ducts, in Win짯dows 10. Other pro짯fes짯sio짯nal soft짯ware pro짯ducts to be announ짯ced. Hard짯ware com짯pa짯ti짯bi짯li짯ty curr짯ent짯ly includes Rade짯on PRO gra짯phics cards WX 2100, 3100, 3200, 4100, 5100, 7100, 9200, W5500, W5700, W6600, W6800, W7800, and W7900.