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In dieser Sektion des Forums werden Pressemitteilungen der Hersteller 1:1 veröffentlicht. Planet 3DNow! übernimmt weder für die Richtigkeit der Angaben noch für die Art der Formulierung jedwede Verantwortung. Oft sind Pressemitteilungen mit typischen Marketing-Floskeln wie "einer der bedeutendsten Herstellern von XY" versetzt. Diese Aussagen sind subjektiv und geben nicht notwendigerweise die Meinung der auf Planet 3DNow! schreibenden Autoren wieder.
Pressemitteilung
Hinweis: Dieser Inhalt ist eine Pressemitteilung des Herstellers. Planet 3DNow! prüft weder die Richtigkeit der Angaben noch die Art der Formulierung. Pressemitteilungen können subjektiv sein und geben nicht notwendigerweise die Meinung der auf Planet 3DNow! schreibenden Autoren wieder.Consortium Growth Enables Further Advancement of Industry’s Highest Performance
Interconnect Technology
SUNNYVALE, Calif., October 16, 2007 – Demonstrating on-going support for the industry’s highest
performance interconnect technology, the HyperTransport™ Technology Consortium today announced
that five new companies have joined its commercial membership base. The companies represent a wide
range of industries including test equipment, electronic interconnect systems, printed-circuit board (PCB)
technology, memory appliances, and design and manufacturing services. New members include
Advantest, Compunetics, eSilicon, Samtec and Violin Memory.
“We welcome these additional commercial members and look forward to collaborating with them as they
develop new products leveraging HyperTransport technology,” said Mario Cavalli, general manager of the
HyperTransport Consortium. “The continued growth of our membership base indicates the rising demand
for interconnect solutions that can satisfy the high-bandwidth, low-latency requirements of a broad range
of systems and applications. Furthermore, increased participation in the Consortium reinforces our
technology leadership in the industry.”
New Members Endorse HyperTransport Technology
“Advantest’s industry-leading test technology is well-suited for testing fast, innovative interfaces such as
HyperTransport, and our knowledge and experience will enable us to make significant technological
contributions to the Consortium,” said R. Keith Lee, chief executive officer and president of Advantest
America, Inc. “We value a collaborative partnership to advance the industry and sustain a healthy
business environment, and look forward to our participation as a member of the HyperTransport
Consortium.” Advantest Corporation is a leading supplier of automatic test equipment (ATE), integrated
circuit handlers, and ATE-handler interfaces to the semiconductor industry, and its products are
integrated into some of the most advanced semiconductor fabrication lines in the world.
“With the increasing adoption and benefits of HyperTransport technology, many of our customers are
interested in integrating HyperTransport IP into their designs,” said Hugh Durdan, vice president of
marketing at eSilicon Corporation. “As a company that designs, productizes and manufactures chips on
behalf of our customers, our membership in the Consortium will help eSilicon monitor and influence
developments in this space, so we can quickly address market requirements.” eSilicon, a pioneering
semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization
and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production. The
company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor
companies who serve a wide variety of markets including the consumer, computer, communications and
industrial segments. eSilicon – Enabling Your Silicon Success™.
“Our NovaSpeed™ glass fabric is a breakthrough glass fiber reinforcement PCB technology that
significantly enhances signal integrity and propagation in digital designs operating in multi-GigaHertz
clock rate space”, said Russell Dudek, technology specialist at Compunetics, Inc., a world-class leader
in the fabrication of highly complex printed circuit boards. “The HyperTransport Consortium ecosystem of
high-performance technology suppliers represents a tremendous test bed and window of opportunities for
our state-of-the-art PCB technology.” NovaSpeed™ technology is produced by Dielectric Solutions, LLC,
a global supplier of electrical glass fabric. Compunetics recently formed a strategic alliance with Dielectric
Solutions to facilitate bringing this advanced glass fabric technology to market.
“As a maker of high-speed interconnection products, Samtec believes that membership in the
HyperTransport Consortium better enables us to support our most technically demanding customers,”
said David Givens, development manager of Samtec. “Our Consortium membership significantly
expands Samtec’s ability to advise industry-leading system designers with a critical eye on Signal
Integrity and high-density interconnection.” Samtec is a globally recognized manufacturer of electronic
interconnect systems, including board-to-board, rugged/power, micro-pitch, panel & I/O, and cable
assemblies. Samtec is the acknowledged service leader in the interconnect industry, with manufacturing
locations and sales offices on six continents.
“HyperTransport will enable tighter integration into computing environments for our Memory Appliance
products and technologies,” said DonPaul Stephens, president and founder of Violin Memory, Inc. “We
look forward to working with the Consortium on our next-generation products.” Violin Memory, Inc. is the
leading innovator in scalable memory appliances and technology. With support for both DRAM and Flash,
highly scalable capacity and extreme data reliability, Violin Memory products deliver outstanding
performance for large dataset applications that demand very high IOPS and low latency.
About the HyperTransport™ Technology Consortium
The HyperTransport Technology Consortium is a membership-based, non-profit organization that
licenses, manages and promotes HyperTransport Technology. The HyperTransport Consortium
was founded in 2001 by leading technology innovators like Advanced Micro Devices, Apple,
Broadcom, Cisco, NVIDIA, PMC-Sierra and Sun Microsystems and counts on more than
50 industry-leading member companies worldwide, including Dell, HP and IBM. Membership is based on
a yearly fee and it is open to companies interested in licensing the royalty-free use of HyperTransport
technology and intellectual property. Consortium members have full access to the HyperTransport
technical documents database, they may attend Consortium meetings and events and may benefit from a
variety of technical and marketing services, including the new, member-driven web portal, whose
business benefits are part of a wide array of services offered by the Consortium free of charge to member
companies. To learn more about member benefits and how to become a Consortium member, please
visit the Consortium Web site at www.hypertransport.org.
Interconnect Technology
SUNNYVALE, Calif., October 16, 2007 – Demonstrating on-going support for the industry’s highest
performance interconnect technology, the HyperTransport™ Technology Consortium today announced
that five new companies have joined its commercial membership base. The companies represent a wide
range of industries including test equipment, electronic interconnect systems, printed-circuit board (PCB)
technology, memory appliances, and design and manufacturing services. New members include
Advantest, Compunetics, eSilicon, Samtec and Violin Memory.
“We welcome these additional commercial members and look forward to collaborating with them as they
develop new products leveraging HyperTransport technology,” said Mario Cavalli, general manager of the
HyperTransport Consortium. “The continued growth of our membership base indicates the rising demand
for interconnect solutions that can satisfy the high-bandwidth, low-latency requirements of a broad range
of systems and applications. Furthermore, increased participation in the Consortium reinforces our
technology leadership in the industry.”
New Members Endorse HyperTransport Technology
“Advantest’s industry-leading test technology is well-suited for testing fast, innovative interfaces such as
HyperTransport, and our knowledge and experience will enable us to make significant technological
contributions to the Consortium,” said R. Keith Lee, chief executive officer and president of Advantest
America, Inc. “We value a collaborative partnership to advance the industry and sustain a healthy
business environment, and look forward to our participation as a member of the HyperTransport
Consortium.” Advantest Corporation is a leading supplier of automatic test equipment (ATE), integrated
circuit handlers, and ATE-handler interfaces to the semiconductor industry, and its products are
integrated into some of the most advanced semiconductor fabrication lines in the world.
“With the increasing adoption and benefits of HyperTransport technology, many of our customers are
interested in integrating HyperTransport IP into their designs,” said Hugh Durdan, vice president of
marketing at eSilicon Corporation. “As a company that designs, productizes and manufactures chips on
behalf of our customers, our membership in the Consortium will help eSilicon monitor and influence
developments in this space, so we can quickly address market requirements.” eSilicon, a pioneering
semiconductor Value Chain Producer (VCP), provides a comprehensive suite of design, productization
and manufacturing services, enabling a flexible, low-cost, lower-risk path to volume production. The
company delivers chips to system original equipment manufacturers (OEMs) and fabless semiconductor
companies who serve a wide variety of markets including the consumer, computer, communications and
industrial segments. eSilicon – Enabling Your Silicon Success™.
“Our NovaSpeed™ glass fabric is a breakthrough glass fiber reinforcement PCB technology that
significantly enhances signal integrity and propagation in digital designs operating in multi-GigaHertz
clock rate space”, said Russell Dudek, technology specialist at Compunetics, Inc., a world-class leader
in the fabrication of highly complex printed circuit boards. “The HyperTransport Consortium ecosystem of
high-performance technology suppliers represents a tremendous test bed and window of opportunities for
our state-of-the-art PCB technology.” NovaSpeed™ technology is produced by Dielectric Solutions, LLC,
a global supplier of electrical glass fabric. Compunetics recently formed a strategic alliance with Dielectric
Solutions to facilitate bringing this advanced glass fabric technology to market.
“As a maker of high-speed interconnection products, Samtec believes that membership in the
HyperTransport Consortium better enables us to support our most technically demanding customers,”
said David Givens, development manager of Samtec. “Our Consortium membership significantly
expands Samtec’s ability to advise industry-leading system designers with a critical eye on Signal
Integrity and high-density interconnection.” Samtec is a globally recognized manufacturer of electronic
interconnect systems, including board-to-board, rugged/power, micro-pitch, panel & I/O, and cable
assemblies. Samtec is the acknowledged service leader in the interconnect industry, with manufacturing
locations and sales offices on six continents.
“HyperTransport will enable tighter integration into computing environments for our Memory Appliance
products and technologies,” said DonPaul Stephens, president and founder of Violin Memory, Inc. “We
look forward to working with the Consortium on our next-generation products.” Violin Memory, Inc. is the
leading innovator in scalable memory appliances and technology. With support for both DRAM and Flash,
highly scalable capacity and extreme data reliability, Violin Memory products deliver outstanding
performance for large dataset applications that demand very high IOPS and low latency.
About the HyperTransport™ Technology Consortium
The HyperTransport Technology Consortium is a membership-based, non-profit organization that
licenses, manages and promotes HyperTransport Technology. The HyperTransport Consortium
was founded in 2001 by leading technology innovators like Advanced Micro Devices, Apple,
Broadcom, Cisco, NVIDIA, PMC-Sierra and Sun Microsystems and counts on more than
50 industry-leading member companies worldwide, including Dell, HP and IBM. Membership is based on
a yearly fee and it is open to companies interested in licensing the royalty-free use of HyperTransport
technology and intellectual property. Consortium members have full access to the HyperTransport
technical documents database, they may attend Consortium meetings and events and may benefit from a
variety of technical and marketing services, including the new, member-driven web portal, whose
business benefits are part of a wide array of services offered by the Consortium free of charge to member
companies. To learn more about member benefits and how to become a Consortium member, please
visit the Consortium Web site at www.hypertransport.org.
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Was will ne Speicherfirma mit Hypertransport anstellen ? Da fällt mir auf dem ersten Blick nur G3MX ein, aber das ist doch auch schon mehr oder weniger fertig ...
ciao
Alex
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