AMD Mobile 쏞arrizo Family of APUs Designed to Deliver Significant Leap in Performance, Energy Efficiency in 2015

2015 AMD Mobi짯le Road짯map Adds 쏞ar짯ri짯zo and 쏞arrizo멛 SoCs to APU Lineup

SINGAPORE (Mar짯ket짯wired) 11/20/14 AMD (NYSE: AMD) today at its Future of Com짯pu짯te event announ짯ced the addi짯ti짯on of its first high per짯for짯mance sys짯tem-on-a-chip (SoC), code짯na짯med 쏞ar짯ri짯zo, and a main짯stream SoC code짯na짯med 쏞arrizo멛 as part of the company셲 2015 AMD Mobi짯le APU fami짯ly road짯map. In col짯la짯bo짯ra짯ti짯on with hard짯ware and soft짯ware part짯ners, the짯se new 2015 AMD Mobi짯le APUs are desi짯gned as com짯ple짯te solu짯ti짯ons for gam짯ing, pro짯duc짯ti짯vi짯ty appli짯ca짯ti짯ons, and ultra high-defi짯ni짯ti짯on 4K expe짯ri짯en짯ces. With sup짯port for Micro짯soft DirectX 12, Open짯CL 2.0, AMD셲 Man짯t짯le API, AMD Free짯Sync and sup짯port for Microsoft셲 upco짯ming Win짯dows 10 ope짯ra짯ting sys짯tem, the 2015 AMD Mobi짯le APU fami짯ly enables the expe짯ri짯en짯ces con짯su짯mers expect.

We con짯ti짯nue to inno짯va짯te and build upon our exis짯ting IP to deli짯ver gre짯at pro짯ducts for our cus짯to짯mers, said John Byr짯ne, seni짯or vice pre짯si짯dent and gene짯ral mana짯ger, Com짯pu짯ting and Gra짯phics busi짯ness group, AMD. AMD셲 com짯mit짯ment to gra짯phics and com짯pu짯te per짯for짯mance, as expres짯sed by our goal to impro짯ve APU ener짯gy effi짯ci짯en짯cy 25x by 2020, com짯bi짯nes with the latest indus짯try stan짯dards and fresh inno짯va짯ti짯on to dri짯ve the design of the 2015 AMD Mobi짯le APU fami짯ly. We are exci짯ted about the expe짯ri짯en짯ces the짯se new APUs will bring and look for짯ward to sha짯ring more details in the first half of next year.

The flag짯ship 쏞ar짯ri짯zo pro짯ces짯sor will inte짯gra짯te the new x86 CPU core code짯na짯med 쏣xcava짯tor with next gene짯ra짯ti짯on AMD Rade짯on꽓 gra짯phics in the world셲 first Hete짯ro짯ge짯neous Sys짯tems Archi짯tec짯tu짯re (HSA) 1.0 com짯pli짯ant SoC. The 쏞arrizo멛 SoC inte짯gra짯tes the CPU code짯na짯med 쏱uma+ with AMD Rade짯on꽓 R멣eries GCN GPUs and is inten짯ded for main짯stream con짯fi짯gu짯ra짯ti짯ons. In addi짯ti짯on, an AMD Secu짯re Pro짯ces짯sor will be inte짯gra짯ted into the 쏞ar짯ri짯zo and 쏞arrizo멛 APUs, enab짯ling ARM Trust짯Zo짯ne across the enti짯re fami짯ly for the secu짯ri짯ty com짯mer짯cial cus짯to짯mers and con짯su짯mers expect. Uti짯li짯zing a sin짯gle packa짯ge infra짯struc짯tu짯re for 쏞ar짯ri짯zo and 쏞arrizo멛, the 2015 AMD Mobi짯le APU fami짯ly sim짯pli짯fies part짯ner designs across a broad ran짯ge of com짯mer짯cial and con짯su짯mer mobi짯le systems.

Car짯ri짯zo and 쏞arrizo멛, are sche짯du짯led to ship in 1H 2015, with lap짯top and All-in-One sys짯tems based on the 2015 AMD Mobi짯le APU fami짯ly expec짯ted in mar짯ket by mid-year 2015.

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About AMD
AMD (NYSE: AMD) designs and inte짯gra짯tes tech짯no짯lo짯gy that powers mil짯li짯ons of intel짯li짯gent devices, inclu짯ding per짯so짯nal com짯pu짯ters, tablets, game con짯so짯les and cloud ser짯vers that defi짯ne the new era of sur짯round com짯pu짯ting. AMD solu짯ti짯ons enable peo짯p짯le ever짯y짯whe짯re to rea짯li짯ze the full poten짯ti짯al of their favo짯ri짯te devices and appli짯ca짯ti짯ons to push the boun짯da짯ries of what is pos짯si짯ble. For more infor짯ma짯ti짯on, visit

AMD, the AMD Arrow logo and Rade짯on are trade짯marks of Advan짯ced Micro Devices, Inc. Other names are for infor짯ma짯tio짯nal pur짯po짯ses only and may be trade짯marks of their respec짯ti짯ve owners. ARM and Trust짯Zo짯ne are regis짯tered trade짯marks of ARM Limi짯t짯ed in the EU and other count짯ries. Open짯CL and the Open짯CL logo are trade짯marks of Apple Inc. used by per짯mis짯si짯on by Khro짯nos. DirectX and Win짯dows are trade짯marks of Micro짯soft Cor짯po짯ra짯ti짯on in the US and other jurisdictions.

Cau짯tio짯na짯ry Statement
This docu짯ment con짯ta짯ins for짯ward-loo짯king state짯ments con짯cer짯ning Advan짯ced Micro Devices, Inc. (AMD or the 쏞om짯pa짯ny) inclu짯ding, among other things, the timing, avai짯la짯bi짯li짯ty, fea짯tures and func짯tion짯a짯li짯ty of the AMD 쏞ar짯ri짯zo APU, AMD 쏞arrizo멛 SoC and AMD 쏞arrizo-based note짯books; and AMD셲 com짯mit짯ment to a 25x ener짯gy effi짯ci짯en짯cy impro짯ve짯ment by 2020 which are made pur짯su짯ant to the safe har짯bor pro짯vi짯si짯ons of the Pri짯va짯te Secu짯ri짯ties Liti짯ga짯ti짯on Reform Act. For짯ward-loo짯king state짯ments are com짯mon짯ly iden짯ti짯fied by words such as 쐗ould, 쐌ay, 쐃xpects, 쐀elie짯ves, 쐏lans, 쐇ntends, 쐏ro짯jects, and other terms with simi짯lar mea짯ning. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this press release are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this press release and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Inves짯tors are cau짯tio짯ned that the for짯ward-loo짯king state짯ments in this docu짯ment are based on cur짯rent beliefs, assump짯ti짯ons and expec짯ta짯ti짯ons, speak only as of the date of this docu짯ment and invol짯ve risks and uncer짯tain짯ties that could cau짯se actu짯al results to dif짯fer mate짯ri짯al짯ly from cur짯rent expec짯ta짯ti짯ons. Risks include the pos짯si짯bi짯li짯ty that Intel Corporation셲 pri짯cing, mar짯ke짯ting and reba짯ting pro짯grams, pro짯duct bund짯ling, stan짯dard set짯ting, new pro짯duct intro짯duc짯tions or other acti짯vi짯ties may nega짯tively impact AMD셲 plans; that AMD will requi짯re addi짯tio짯nal fun짯ding and may be unable to rai짯se suf짯fi짯ci짯ent capi짯tal on favorable terms, or at all; that cus짯to짯mers stop buy짯ing AMD셲 pro짯ducts or mate짯ri짯al짯ly redu짯ce their ope짯ra짯ti짯ons or demand for AMD셲 pro짯ducts; that AMD may be unable to deve짯lop, launch and ramp new pro짯ducts and tech짯no짯lo짯gies in the volu짯mes that are requi짯red by the mar짯ket at matu짯re yields on a time짯ly basis; that AMD셲 third-par짯ty foundry sup짯pli짯ers will be unable to tran짯si짯ti짯on AMD셲 pro짯ducts to advan짯ced manu짯fac짯tu짯ring pro짯cess tech짯no짯lo짯gies in a time짯ly and effec짯ti짯ve way or to manu짯fac짯tu짯re AMD셲 pro짯ducts on a time짯ly basis in suf짯fi짯ci짯ent quan짯ti짯ties and using com짯pe짯ti짯ti짯ve pro짯cess tech짯no짯lo짯gies; that AMD will be unable to obtain suf짯fi짯ci짯ent manu짯fac짯tu짯ring capa짯ci짯ty or com짯pon짯ents to meet demand for its pro짯ducts or will not ful짯ly uti짯li짯ze its pro짯jec짯ted manu짯fac짯tu짯ring capa짯ci짯ty needs at GLOBALFOUNDRIES, Inc. (GF) micro짯pro짯ces짯sor manu짯fac짯tu짯ring faci짯li짯ties; that AMD셲 requi짯re짯ments for wafers will be less than the fixed num짯ber of wafers that it agreed to purcha짯se from GF or GF encoun짯ters pro짯blems that signi짯fi짯cant짯ly redu짯ce the num짯ber of func짯tion짯al die it recei짯ves from each wafer; that AMD is unable to suc짯cessful짯ly imple짯ment its long-term busi짯ness stra짯tegy; that the com짯ple짯ti짯on and impact of the 2014 Res짯truc짯tu짯ring Plan and AMD셲 trans짯for짯ma짯ti짯on initia짯ti짯ves could adver짯se짯ly affect AMD; that AMD inac짯cu짯ra짯te짯ly esti짯ma짯tes the quan짯ti짯ty or type of pro짯ducts that its cus짯to짯mers will want in the future or will ulti짯m짯ate짯ly end up purcha짯sing, resul짯ting in excess or obso짯le짯te inven짯to짯ry; that AMD is unable to mana짯ge the risks rela짯ted to the use of its third-par짯ty dis짯tri짯bu짯tors and add-in-board (AIB) part짯ners or offer the appro짯pria짯te incen짯ti짯ves to focus them on the sale of AMD셲 pro짯ducts; that AMD may be unable to main짯tain the level of invest짯ment in rese짯arch and deve짯lo짯p짯ment that is requi짯red to remain com짯pe짯ti짯ti짯ve; that the짯re may be unex짯pec짯ted varia짯ti짯ons in mar짯ket growth and demand for AMD셲 pro짯ducts and tech짯no짯lo짯gies in light of the pro짯duct mix that it may have available at any par짯ti짯cu짯lar time; that glo짯bal busi짯ness and eco짯no짯mic con짯di짯ti짯ons will not impro짯ve or will wor짯sen; that PC mar짯ket con짯di짯ti짯ons will not impro짯ve or will wor짯sen; that PC mar짯ket con짯di짯ti짯ons will not impro짯ve or will wor짯sen; that demand for com짯pu짯ters will be lower than curr짯ent짯ly expec짯ted; and the effect of poli짯ti짯cal or eco짯no짯mic insta짯bi짯li짯ty, dome짯sti짯cal짯ly or inter짯na짯tio짯nal짯ly, on AMD셲 sales or sup짯p짯ly chain. Inves짯tors are urged to review in detail the risks and uncer짯tain짯ties in the Company셲 Secu짯ri짯ties and Exch짯an짯ge Com짯mis짯si짯on filings, inclu짯ding but not limi짯t짯ed to the Quar짯ter짯ly Report on Form 10멡 for the quar짯ter ended Sep짯tem짯ber 27, 2014.