GLOBALFOUNDRIES Completes Acquisition of IBM Microelectronics Business
Transaction adds differentiating technologies, world-class technologists, and intellectual property
Santa Clara, Calif., July 1 2015: GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.
With the acquisition, GLOBALFOUNDRIES gains differentiated technologies to enhance its product offerings in key growth markets, from mobility and Internet of Things (IoT) to Big Data and high-performance computing. The deal strengthens the company’s workforce, adding decades of experience and expertise in semiconductor development, device expertise, design, and manufacturing. And the addition of more than 16,000 patents and applications makes
GLOBALFOUNDRIES the holder of one of the largest semiconductor patent portfolios in the world.
“Today we have significantly enhanced our technology development capabilities and reinforce our long-term commitment to investing in R&D for technology leadership,” said Sanjay Jha, chief executive officer of GLOBALFOUNDRIES. “We have added world-class technologists and differentiated technologies, such as RF and ASIC, to meet our customers’ needs and accelerate our progress toward becoming a foundry powerhouse.” Through the addition of some of the brightest and most innovative scientists and engineers in the semiconductor industry, GLOBALFOUNDRIES solidifies its path to advanced process technologies at 10nm, 7nm, and beyond.
In RF, GLOBALFOUNDRIES now has technology leadership in wireless front-end module solutions. IBM has developed world-class capabilities in both RF silicon-on-insulator (RFSOI) and high-performance silicon-germanium (SiGe) technologies, which are highly complementary to GLOBALFOUNDRIES’ existing mainstream technology offerings. The company will continue to invest to deliver the next generation of its RFSOI roadmap and looks to capture opportunities in the automotive and home markets.
In ASICs, GLOBALFOUNDRIES now has technology leadership in wired communications. This enables the company to provide the design capabilities and IP necessary to develop these high-performance customized products and solutions. With increased investments, the company plans to develop additional ASIC solutions in areas of storage, printers and networking. The most recent ASIC family, announced in January and built on GLOBALFOUNDRIES’ 14nm-LPP technology, has been well accepted in the marketplace with several design wins.
GLOBALFOUNDRIES increases its manufacturing scale with fabs in East Fishkill, NY and Essex Junction, VT. These facilities will operate as part of the company’s growing global operations, adding capacity and top-notch engineers to better meet the needs of its existing and new customers.
Moreover, the transaction builds on significant investments in the burgeoning Northeast Technology Corridor, which includes GLOBALFOUNDRIES’ leading-edge Fab 8 facility in Saratoga County, NY and joint R&D activities at SUNY Polytechnic Institute’s College of Nanoscale Science and Engineering in Albany, NY. The company’s presence in the northeast now exceeds 8,000 direct employees.
The acquisition includes an exclusive commitment to supply IBM with some of the world’s most advanced semiconductor processor solutions for the next 10 years. GLOBALFOUNDRIES also gets direct access to IBM’s continued investment in world-class semiconductor research, solidifying its path to advanced process geometries at 10nm and beyond.
GLOBALFOUNDRIES is the world’s first full-service semiconductor foundry with a truly global footprint. Launched in March 2009, the company has quickly achieved scale as one of the largest foundries in the world, providing a unique combination of advanced technology and manufacturing to more than 250 customers. With operations in Singapore, Germany and the United States, GLOBALFOUNDRIES is the only foundry that offers the flexibility and security of
manufacturing centers spanning three continents. The company’s 300mm fabs and 200mm fabs provide the full range of process technologies from mainstream to the leading edge. This global manufacturing footprint is supported by major facilities for research, development and design enablement located near hubs of semiconductor activity in the United States, Europe and Asia.