New Powerful and Ver­sa­ti­le AM4 Mother­boards and ‘Dream PCs’ from Glo­bal SIs High­light Breadth of Part­ner Sup­port for AMD Ryzen™ Pro­ces­sorsLAS VEGAS, NV — (Mar­ket­wired) — 01/04/17 — 2017 Inter­na­tio­nal Con­su­mer Elec­tro­nics Show (CES) – Fol­lo­wing glo­bal exci­te­ment gene­ra­ted by the reve­al of new tech­no­lo­gy and per­for­mance details of upco­ming AMD Ryzen™ high-per­for­mance desk­top pro­ces­sors, AMD (NASDAQ: AMD) today announ­ced 16 cut­ting-edge high-per­for­mance AM4 mother­boards from five manu­fac­tu­r­ers. In addi­ti­on, AMD exhi­bi­ted Ryzen pro­ces­sor-based “extre­me per­for­mance” PC designs from 17 top sys­tem inte­gra­tors across the glo­be as well as inno­va­ti­ve third-par­ty CPU coo­ler designs, demons­t­ra­ting a rea­dy and robust eco­sys­tem for Ryzen CPUs. AMD also expects Ryzen-based designs from all top glo­bal PC OEMs, with more infor­ma­ti­on on sys­tems to be reve­a­led at launch.

“2017 will be an unfor­gettable year for AMD, its tech­no­lo­gy part­ners and the PC indus­try as a who­le, and we’­re thril­led to kick off the year at CES by show­ing wide arrays of high-per­for­mance mother­board and PC designs from our OEM part­ners for whom the future is Ryzen,” said Jim Ander­son, seni­or vice pre­si­dent and gene­ral mana­ger, Com­pu­ting and Gra­phics Group, AMD. “AMD and our part­ners are com­mit­ted to sup­port­ing enthu­si­asts, gamers, and crea­tors with a new gene­ra­ti­on of com­pu­ting inno­va­ti­on and choice through AMD Ryzen pro­ces­sor-based mother­boards, cus­tom-built PCs, and coo­lers built to sup­port the­se impres­si­ve systems.”

New Chip­sets and Motherboards
AMD and its mother­board part­ners today debut­ed a wide array of new mother­boards from ASRock, Asus, Bio­star, Giga­byte, and MSI, all built upon two upco­ming desk­top chip­sets for AMD Ryzen pro­ces­sors: the X370 and X300. X370 chip­set-based mother­boards are desi­gned for tho­se who need the most per­for­mance, cut­ting-edge fea­tures, and supe­ri­or I/O con­nec­ti­vi­ty from their PCs inclu­ding sup­port for over­clo­cking1, and dual gra­phics. For users loo­king for per­for­mance in a more com­pact size, the X300 chip­set also fea­tures an AMD Ryzen-rea­dy AM4 socket while uti­li­zing the mini-ITX size ide­al for small form fac­tor PCs. Both chip­sets take full advan­ta­ge of inno­va­ti­ve tech­no­lo­gy fea­tures including:

• Dual-chan­nel DDR4 memory
• NVMe
• M.2 SATA devices
• USB 3.1 Gen 1 and Gen 2
• PCIe® 3.0 capa­bi­li­ty2

AM4 chip­sets pro­vi­de dedi­ca­ted PCIe lanes for USB, gra­phics, data and other I/O, pro­vi­ding a powerful, sca­lable and relia­ble com­pu­ting expe­ri­ence and brin­ging the bene­fit of future-rea­dy tech­no­lo­gies. Mother­boards on dis­play at CES 2017 include:

• ASRock X370 Tai­chi, ASRock X370 Gam­ing K4, ASRock AB350 Gam­ing K4 & ASRock A320M Pro4
• Asus B350M‑C
• Bio­star X370GT7, Bio­star X350GT5 & Bio­star X350GT3
• Giga­byte GA-AX370-Gam­ing K5, Giga­byte GA-AX370-Gam­ing 5, Giga­byte AB350-Gam­ing 3 & Giga­byte A320M-HD3
• MSI A320M Pro-VD, MSI X370 Xpower Gam­ing Tita­ni­um, MSI B350 Toma­hawk & MSI B350M Mortar

AMD Ryzen pro­ces­sor-based PCs
Exem­pli­fy­ing the goal of brin­ging inno­va­ti­on and com­pe­ti­ti­on back to desk­top PCs, AMD and renow­ned cus­tom-PC buil­ders such as Cyber­power, Main­gear and Ori­gin, among­st others, pre­sen­ted an array of ‘dream PCs’ based on high-per­for­mance AMD Ryzen pro­ces­sors. From exo­tic, cus­tom water-coo­led sys­tems to more refi­ned, prac­ti­cal solu­ti­ons, a myri­ad of PCs incor­po­ra­ting AMD Ryzen pro­ces­sors were on dis­play at CES including:

• Case­king
• CSL — Computer
• Cyber­Power PC
• Cyber­tron PC
• Ico­da (Korea)
• IBUYPOWER
• iPa­son Wuhan
• Kom­plett
• LDLC
• Main­gear
• Mayn Wuhan
• Medi­on AG
• Mind­fac­to­ry
• Oldi (Rus­sia)
• Ori­gin PC
• Over­clo­ckers UK
• PC Spe­cia­list

New 3rd Par­ty Ther­mal Solutions
For enthu­si­asts and PC buil­ders focu­sed on a pre­mi­um, quiet, and effec­ti­ve coo­ling solu­ti­on or wis­hing to over­clock, AMD is working with 15 top coo­ler manu­fac­tu­r­ers and ven­dors to crea­te an array of after­mar­ket CPU coo­lers for AM4 pro­ces­sors. For ultra-quiet air coo­ling, Noc­tua will offer both its NH-D15 and its slim­mer coun­ter­part the NH-U12S. In, addi­ti­on, EKWB will offer AM4 sup­port for its cus­tom water coo­ling solutions.

AMD Ryzen pro­ces­sor-based PCs, AM4 mother­boards, and com­pa­ti­ble coo­ling solu­ti­ons are expec­ted to be available in Q1 2017.

Sup­port­ing Resources

• Learn more about AMD Ryzen pro­ces­sors at AMD.com/Ryzen
• Learn more about the “Zen” core archi­tec­tu­re at AMD.com/Zen
• Learn more about AMD Pro­ducts, Solu­ti­ons, and Inno­va­tions
• Beco­me a fan of AMD on Facebook
• Fol­low AMD on Twit­ter @AMD

About AMD
For more than 45 years, AMD has dri­ven inno­va­ti­on in high-per­for­mance com­pu­ting, gra­phics, and visua­liza­ti­on tech­no­lo­gies — the buil­ding blocks for gam­ing, immersi­ve plat­forms, and the dat­a­cen­ter. Hundreds of mil­li­ons of con­su­mers, lea­ding For­tu­ne 500 busi­nesses, and cut­ting-edge sci­en­ti­fic rese­arch faci­li­ties around the world rely on AMD tech­no­lo­gy dai­ly to impro­ve how they live, work, and play. AMD employees around the world are focu­sed on buil­ding gre­at pro­ducts that push the boun­da­ries of what is pos­si­ble. For more infor­ma­ti­on about how AMD is enab­ling today and inspi­ring tomor­row, visit the AMD (NASDAQ: AMD) web­site, blog, Face­book and Twit­ter pages.

AMD, the AMD Arrow logo, Ryzen and com­bi­na­ti­ons the­reof, are trade­marks of Advan­ced Micro Devices, Inc. PCIe is a regis­tered trade­mark of PCI-SIG Cor­po­ra­ti­on. Other names are for infor­ma­tio­nal pur­po­ses only and may be trade­marks of their respec­ti­ve owners.

Cau­tio­na­ry Statement
This press release con­ta­ins for­ward-loo­king state­ments con­cer­ning Advan­ced Micro Devices, Inc. (AMD) inclu­ding the fea­tures, func­tion­a­li­ty, expec­ta­ti­ons, timing and avai­la­bi­li­ty of future AMD Ryzen pro­ces­sor-based mother­boards, cus­tom-built PCs, and coo­ling solu­ti­ons; and the expec­ted bene­fits from working with AMD’s tech­no­lo­gy part­ners, which are made pur­su­ant to the Safe Har­bor pro­vi­si­ons of the Pri­va­te Secu­ri­ties Liti­ga­ti­on Reform Act of 1995. For­ward-loo­king state­ments are com­mon­ly iden­ti­fied by words such as “would,” “may,” “expects,” “belie­ves,” “plans,” “intends,” “pro­jects” and other terms with simi­lar mea­ning. Inves­tors are cau­tio­ned that the for­ward-loo­king state­ments in this docu­ment are based on cur­rent beliefs, assump­ti­ons and expec­ta­ti­ons, speak only as of the date of this press release and invol­ve risks and uncer­tain­ties that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons. Such state­ments are sub­ject to cer­tain known and unknown risks and uncer­tain­ties, many of which are dif­fi­cult to pre­dict and gene­ral­ly bey­ond AMD’s con­trol, that could cau­se actu­al results and other future events to dif­fer mate­ri­al­ly from tho­se expres­sed in, or impli­ed or pro­jec­ted by, the for­ward-loo­king infor­ma­ti­on and state­ments. Mate­ri­al fac­tors that could cau­se actu­al results to dif­fer mate­ri­al­ly from cur­rent expec­ta­ti­ons include, wit­hout limi­ta­ti­on, the fol­lo­wing: Intel Corporation’s domi­nan­ce of the micro­pro­ces­sor mar­ket and its aggres­si­ve busi­ness prac­ti­ces may limit AMD’s abili­ty to com­pe­te effec­tively; AMD is par­ty to a wafer sup­p­ly agree­ment with GLOBALFOUNDRIES Inc. (GF) with obli­ga­ti­ons to manu­fac­tu­re pro­ducts at GF with cer­tain excep­ti­ons. If GF is not able to satis­fy AMD’s manu­fac­tu­ring requi­re­ments, its busi­ness could be adver­se­ly impac­ted; AMD reli­es on third par­ties to manu­fac­tu­re its pro­ducts, and if they are unable to do so on a time­ly basis in suf­fi­ci­ent quan­ti­ties and using com­pe­ti­ti­ve tech­no­lo­gies, AMD’s busi­ness could be mate­ri­al­ly adver­se­ly affec­ted; fail­ure to achie­ve expec­ted manu­fac­tu­ring yields for AMD’s pro­ducts could nega­tively impact its finan­cial results; the suc­cess of AMD’s busi­ness is depen­dent upon its abili­ty to intro­du­ce pro­ducts on a time­ly basis with fea­tures and per­for­mance levels that pro­vi­de value to its cus­to­mers while sup­port­ing and coin­ci­ding with signi­fi­cant indus­try tran­si­ti­ons; if AMD can­not gene­ra­te suf­fi­ci­ent reve­nue and ope­ra­ting cash flow or obtain exter­nal finan­cing, it may face a cash short­fall and be unable to make all of its plan­ned invest­ments in rese­arch and deve­lo­p­ment or other stra­te­gic invest­ments; the loss of a signi­fi­cant cus­to­mer may have a mate­ri­al adver­se effect on AMD; AMD’s receipt of reve­nue from its semi-cus­tom SoC pro­ducts is depen­dent upon its tech­no­lo­gy being desi­gned into third-par­ty pro­ducts and the suc­cess of tho­se pro­ducts; glo­bal eco­no­mic uncer­tain­ty may adver­se­ly impact AMD’s busi­ness and ope­ra­ting results; the mar­kets in which AMD’s pro­ducts are sold are high­ly com­pe­ti­ti­ve; AMD may not be able to gene­ra­te suf­fi­ci­ent cash to ser­vice its debt obli­ga­ti­ons or meet its working capi­tal requi­re­ments; AMD has a sub­stan­ti­al amount of indeb­ted­ness which could adver­se­ly affect its finan­cial posi­ti­on and pre­vent it from imple­men­ting its stra­tegy or ful­fil­ling its con­trac­tu­al obli­ga­ti­ons; the agree­ments gover­ning AMD’s notes and the secu­red revol­ving line of cre­dit (Secu­red Revol­ving Line of Cre­dit) impo­se rest­ric­tions on AMD that may adver­se­ly affect its abili­ty to ope­ra­te its busi­ness; uncer­tain­ties invol­ving the orde­ring and ship­ment of AMD’s pro­ducts could mate­ri­al­ly adver­se­ly affect it; the demand for AMD’s pro­ducts depends in part on the mar­ket con­di­ti­ons in the indus­tries into which they are sold. Fluc­tua­tions in demand for AMD’s pro­ducts or a mar­ket decli­ne in any of the­se indus­tries could have a mate­ri­al adver­se effect on its results of ope­ra­ti­ons; AMD’s abili­ty to design and intro­du­ce new pro­ducts in a time­ly man­ner is depen­dent upon third-par­ty intellec­tu­al pro­per­ty; AMD depends on third-par­ty com­pa­nies for the design, manu­fac­tu­re and sup­p­ly of mother­boards, soft­ware and other com­pu­ter plat­form com­pon­ents to sup­port its busi­ness; if AMD loses Micro­soft Corporation’s sup­port for its pro­ducts or other soft­ware ven­dors do not design and deve­lop soft­ware to run on AMD’s pro­ducts, its abili­ty to sell its pro­ducts could be mate­ri­al­ly adver­se­ly affec­ted; and AMD’s reli­ance on third-par­ty dis­tri­bu­tors and Add-in-Board part­ners sub­jects it to cer­tain risks. Inves­tors are urged to review in detail the risks and uncer­tain­ties in AMD’s Secu­ri­ties and Exch­an­ge Com­mis­si­on filings, inclu­ding but not limi­t­ed to AMD’s Quar­ter­ly Report on Form 10‑Q for the quar­ter ended Sep­tem­ber 24, 2016.

1 AMD’s pro­duct war­ran­ty does not cover dama­ges cau­sed by over­clo­cking, even when over­clo­cking is enab­led via AMD hard­ware and/or soft­ware. GD-26
2 Pen­ding PCIe® certification