Hsin­chu, Tai­wan R.O.C., Oct 7, 2019 – TSMC (TWSE: 2330, NYSE: TSM) today announ­ced that its seven-nano­me­ter plus (N7+), the industry’s first com­mer­ci­al­ly available Extre­me Ultra­vio­let (EUV) litho­gra­phy tech­no­lo­gy, is deli­ve­ring cus­to­mer pro­ducts to mar­ket in high volu­me. The N7+ pro­cess with EUV tech­no­lo­gy is built on TSMC’s suc­cessful 7nm node and paves the way for 6nm and more advan­ced technologies.

The N7+ volu­me pro­duc­tion is one of the fas­test on record. N7+, which began volu­me pro­duc­tion in the second quar­ter of 2019, is matching yields simi­lar to the ori­gi­nal N7 pro­cess that has been in volu­me pro­duc­tion for more than one year.

N7+ is also pro­vi­ding impro­ved over­all per­for­mance. When com­pared to the N7 pro­cess, N7+ pro­vi­des 15% to 20% more den­si­ty and impro­ved power con­sump­ti­on, making it an incre­asing­ly popu­lar choice for the industry’s next-wave pro­ducts. TSMC has been quick­ly deploy­ing capa­ci­ty to meet N7+ demand that is being dri­ven by mul­ti­ple customers.

EUV tech­no­lo­gy enables TSMC to keep dri­ving chip sca­ling as the shorter wave­length of EUV light is bet­ter able to print the nano­me­ter-sca­le fea­tures of advan­ced tech­no­lo­gy designs. TSMC’s EUV tools have rea­ched pro­duc­tion matu­ri­ty, with tool avai­la­bi­li­ty rea­ching tar­get goals for high-volu­me pro­duc­tion, and out­put power of grea­ter than 250 watts for day-to-day operations.

“With AI and 5G unlo­cking so many new ways for ICs to impro­ve our lives, our cus­to­mers are full of inno­va­ti­ve lea­ding-edge design ide­as, and they are rely­ing on TSMC’s tech­no­lo­gy and manu­fac­tu­ring to make them real,” said Dr. Kevin Zhang, TSMC Vice Pre­si­dent of Busi­ness Deve­lo­p­ment. “Our suc­cess in EUV is ano­ther gre­at exam­p­le of how TSMC not only makes tho­se lea­ding-edge designs pos­si­ble, but also deli­vers in high volu­me with our manu­fac­tu­ring excellence.”

Buil­ding on its suc­cessful expe­ri­ence, N7+ sets a path for future advan­ced pro­cess technologies.

TSMC will bring N6 tech­no­lo­gy into risk pro­duc­tion in the first quar­ter of 2020 for volu­me pro­duc­tion by the end of the year. With fur­ther appli­ca­ti­on of EUV, N6 will offer 18% hig­her logic den­si­ty over N7, and design rules ful­ly com­pa­ti­ble with N7 enable cus­to­mers to great­ly shor­ten time-to-market.

About TSMC
TSMC pio­nee­red the pure-play foundry busi­ness model when it was foun­ded in 1987, and has been the world’s lar­gest dedi­ca­ted semi­con­duc­tor foundry ever sin­ce. The com­pa­ny sup­ports a thri­ving eco­sys­tem of glo­bal cus­to­mers and part­ners with the industry’s lea­ding pro­cess tech­no­lo­gy and port­fo­lio of design ena­blem­ent solu­ti­ons to unleash inno­va­ti­on for the glo­bal semi­con­duc­tor industry.

TSMC ser­ves its cus­to­mers with glo­bal capa­ci­ty of more than 12 mil­li­on 12-inch equi­va­lent wafers per year in 2019, and pro­vi­des the broa­dest ran­ge of tech­no­lo­gies from 0.5 micron plus all the way to foundry’s most advan­ced pro­ces­ses, which is 7‑nanometer today. TSMC is the first foundry to pro­vi­de 7‑nanometer pro­duc­tion capa­bi­li­ties, and is head­quar­te­red in Hsin­chu, Tai­wan. For more infor­ma­ti­on about TSMC plea­se visit http://www.tsmc.com.