TYAN’s Tem­pest EX mother­boards to address data ana­ly­tics in mixed-cri­ti­cal­i­ty envi­ron­ments with com­pact size, sca­la­bi­li­ty, and ease of deployment

Nurem­berg, Ger­ma­ny – Embedded World 2020 – Febru­ary 25, 2020 –TYAN®, an indus­try-lea­ding ser­ver plat­form design manu­fac­tu­rer and a sub­si­dia­ry of MiT­AC Com­pu­ting Tech­no­lo­gy Cor­po­ra­ti­on, is exhi­bi­ting their latest embedded mother­boards opti­mi­zed for the intel­li­gent edge to ser­vice a wide ran­ge of ver­ti­cal mar­kets inclu­ding secu­ri­ty, indus­tri­al auto­ma­ti­on, com­mu­ni­ca­ti­on and net­wor­king at Embedded World 2020 from Febru­ary 25th~27th, booth 2–311in Nurem­berg, Germany.

“Based on the Intel® Xeon® E‑2200 pro­ces­sor and 9th Gene­ra­ti­on Intel® Core™ i3/i5/i7 series pro­ces­sor, TYAN’s embedded mother­boards demons­tra­te how stan­dard-based plat­forms powered by robust pro­ces­sors effi­ci­ent­ly meet the demands of data ana­ly­tics at the IoT edge,” said Dan­ny Hsu, Vice Pre­si­dent of MiT­AC Com­pu­ting Tech­no­lo­gy Corporation’s TYAN Busi­ness Unit. Hsu added, “With key fea­tures inclu­ding com­pact form fac­tors, a wide ran­ge of ope­ra­ting tem­pe­ra­tures, and long pro­duct sup­p­ly life­time, our Tem­pest EX mother­boards are the ide­al choice to build up edge sys­tems that can bridge com­pu­te, sto­rage, and net­wor­king resources.”

TYAN’s embedded pro­ducts pro­vi­de 7‑year sup­p­ly life­cy­cle, wide ope­ra­ting tem­pe­ra­tu­re ran­ge of 0–55°C and optio­nal EMC Class B cer­ti­fi­ca­ti­on on sel­ec­ted boards, which are high­ly requi­red for most embedded IoT appli­ca­ti­ons. The Tem­pest EX S5550-EX is equip­ped with up to four 1000Base‑T LAN ports, three stan­dard PCIe slots, eight SATA 6G ports, HD audio and dis­play port inter­faces in Micro-ATX form fac­tor; the Tem­pest EX S5552-EX sup­ports four 1000Base‑T LAN ports, 8‑port SAS 12G con­trol­ler, four stan­dard PCIe and an optio­nal 32-bit lega­cy PCI slot in ATX form fac­tor. Both S5550-EX and S5552-EX boards are well sui­ted for indus­tri­al auto­ma­ti­on ser­ver appli­ca­ti­ons. The Tem­pest EX S5555-EX with two dis­play ports, one DVI‑D port, and 7.1 chan­nel high defi­ni­ti­on audio in Micro-ATX form fac­tor is ide­al for embedded work­sta­tion applications.

The Tem­pest EX S5557 fea­tures two 1000Base‑T LAN ports, 12V DC power input and two dis­play ports in Thin Mini-ITX form fac­tor. The ultra-slim embedded mother­board is a per­fect fit for IoT appli­ance deploy­ment. Moreo­ver, the Thun­der CX GX38-B5550 is a 1U sin­gle-socket Intel Xeon E‑2200 pro­ces­sor-based com­pact ser­ver with shal­low chas­sis for IoT and edge com­pu­ting. Fea­turing up 4 DDR4 DIMM slots, up to 4 onboard GbE LAN ports, 1 PCIe x8 slot and two 3.5″ inter­nal SATA 6G dri­ve bays within a 15” deep chas­sis, Thun­der CX GX38-B5550 makes it a top choice for dat­a­cen­ters with space constraints.

TYAN Pro­duct Exhi­bits @ Embedded World 2020

- Tem­pest EX S5550-EX: Sin­gle-socket Intel Xeon E‑2200 pro­ces­sor or 9th Gene­ra­ti­on Intel Core i3 pro­ces­sor-based ser­ver board in Micro-ATX (9.6″ x 9.6″) form fac­tor with 7‑year lon­ge­vi­ty sup­p­ly and wide-ran­ge ope­ra­ting tem­pe­ra­tu­re for embedded and IoT applications
— Tem­pest EX S5552-EX: Sin­gle-socket Intel Xeon E‑2200 pro­ces­sor or 9th Gene­ra­ti­on Intel Core i3 pro­ces­sor-based ser­ver board in ATX (12″ x 9.6″) form fac­tor with 7‑year lon­ge­vi­ty sup­p­ly, wide-ran­ge ope­ra­ting tem­pe­ra­tu­re and EMC class B com­pli­ant for embedded and IoT applications
— Tem­pest EX S5555-EX: 9th Gene­ra­ti­on Intel Core i3/i5/i7 series pro­ces­sor-based work­sta­tion board in Micro-ATX (9.6″ x 9.6″) form fac­tor with 7‑year lon­ge­vi­ty sup­p­ly, wide-ran­ge ope­ra­ting tem­pe­ra­tu­re and EMC class B com­pli­ant for embedded work­sta­tion and IoT applications
— Tem­pest CX S5550:Single-socket Intel Xeon E‑2200 pro­ces­sor or 9th Gene­ra­ti­on Intel Core i3 pro­ces­sor-based ser­ver board in Micro-ATX (9.6″ x 9.6″) form fac­tor for ent­ry ser­ver applications
— Tem­pest CX S5552: Sin­gle-socket Intel Xeon E‑2200 pro­ces­sor­or 9th Gene­ra­ti­on Intel Core i3 pro­ces­sor-based ser­ver board in ATX (12″ x 9.6″) form fac­tor for ser­ver sto­rage applications
— Tem­pest EX S5555-HE: Sin­gle-socket Intel Xeon E‑2200 pro­ces­sor-based work­sta­tion board in Micro-ATX (9.6″ x 9.6″) form fac­tor for embedded work­sta­tion and IoT applications
— Tem­pest EX S5557: 9th Gene­ra­ti­on Intel Core i3/i5/i7 series pro­ces­sor-based ultra-slim mother­board in Thin Mini-ITX (6.7” x 6.7”) form fac­tor for IoT appli­ance deployment
— Thun­der CX GX38-B5550: 1U sin­gle-socket Intel Xeon E‑2200 pro­ces­sor-based ser­ver plat­form with sup­port for up to 4 DDR4 DIMM slots and two 3.5″ inter­nal SATA 6Gb/s drives

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Intel, Xeon and Core are trade­marks or regis­tered trade­marks of Intel Cor­po­ra­ti­on in the United Sta­tes and other countries.

About TYAN
TYAN, as a lea­ding ser­ver brand of MiT­AC Com­pu­ting Tech­no­lo­gy Cor­po­ra­ti­on under the MiT­AC Group (TSE:3706), designs, manu­fac­tures and mar­kets advan­ced x86 and x86-64 server/workstation board tech­no­lo­gy, plat­forms and ser­ver solu­ti­on pro­ducts. Its pro­ducts are sold to OEMs, VARs, Sys­tem Inte­gra­tors and Resel­lers world­wi­de for a wide ran­ge of appli­ca­ti­ons. TYAN enables its cus­to­mers to be tech­no­lo­gy lea­ders by pro­vi­ding sca­lable, high­ly-inte­gra­ted, and relia­ble pro­ducts for a wide ran­ge of appli­ca­ti­ons such as ser­ver appli­ances and solu­ti­ons for HPC, hyper-sca­le/­da­ta cen­ter, ser­ver sto­rage and secu­ri­ty appli­ance mar­kets. For more infor­ma­ti­on, visit MiTAC’s web­site at http://www.mic-holdings.com or TYAN’s web­site at http://www.tyan.com